EP2AGZ350HF40I4N - Arria II GZ FPGA 350K LE | Intel
MPN: EP2AGZ350HF40I4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2710 | $27,100.00 |
| 25 | $2580 | $64,500.00 |
| 100 | $2410 | $241,000.00 |
| 250 | $2280 | $570,000.00 |
EP2AGZ350HF40I4N Overview
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, interconnect fabric, and I/O cells that engineers can configure after manufacture. FPGAs occupy a unique tier in the semiconductor hierarchy - between general-purpose CPUs/DSPs and fixed-function ASICs - offering hardware-level parallelism, deterministic latency, and post-silicon design revision. Modern high-density FPGAs such as the Arria II GZ family add embedded transceivers, hard PCIe IP blocks, and dedicated DSP slices, positioning them as mid-range platforms between cost-optimized Cyclone series and high-end Stratix devices.
The Arria II GZ family combines 8.5 Gbps transceivers, up to 12.5 Mbits of MLAB memory, and hard IP for PCIe Gen2 and external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). Its transceivers support backplane, chip-to-chip, and SFP+/XFP optical interconnect with adaptive equalization and pre-emphasis, making the EP2AGZ350HF40I4N well suited to broadband wireless, broadcast video, and 40G/100G line-card prototyping.
The 40 nm low-power (LP) process enables static power approximately 40% lower than prior 65 nm nodes, while preserving full transceiver and DSP performance. The 1517-ball flip-chip BGA provides abundant high-speed signal routing with controlled impedance, suitable for 8-lane Gen2 PCIe plus multiple DDR3 memory channels.
Typical applications include 40G/100G Ethernet line cards, wireless backhaul baseband processing, broadcast video processing (3G-SDI, HD-SDI), ASIC prototyping, and high-performance DSP for medical imaging. The device also appears in defense radar signal processing and high-frequency trading acceleration.
When designing with this part, follow Intel pin-out guidelines for flip-chip BGA decoupling, maintain 1.0 V core supply sequencing, and use the Quartus II design suite (13.0 or later) for synthesis. The 'I4' speed grade and industrial temperature range (-40C to +100C) ensure robust operation in harsh environments.
This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes not consolidated in the manufacturer datasheet, giving engineers a single source for sourcing, replacement, and reference design decisions.
Drop-in alternatives for EP2AGZ350HF40I4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ350HF40I4N (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Operating Temperature, Logic Elements.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ350HF40I4G
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View Datasheet βEP2AGZ350HF40I3N
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View Datasheet βEP2AGZ350HF40C4N
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View Datasheet βEP2AGZ350HF40C4G
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View Datasheet βEP2AGZ350HF40I4N Maximum Ratings & Electrical Characteristics
| Series | Arria II GZ |
| Logic Elements (LE) | 348,500 |
| Logic Array Blocks (LABs) | 13,940 |
| Embedded Memory (Bits) | 21,270,528 |
| Maximum User I/O | 734 |
| Operating Frequency (max) | 500 MHz |
| Process Node | 40 nm |
| Core Voltage | 0.9 V |
| Transceiver Data Rate (max) | 8.5 Gbps |
| Package | 1517-ball FC-FBGA (HF40) |
| Speed Grade | I4 |
| Operating Temperature Range | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / RoHS | Lead-Free / RoHS Compliant |
| Hard IP Blocks | PCIe Gen2, DDR2/DDR3/QDRII+/RLDRAM II memory controllers |
| Design Software | Quartus II (13.0 or later) |
EP2AGZ350HF40I4N 1517-ball fc-fbga (hf40) Pin Configuration Guide
Pin configuration for EP2AGZ350HF40I4N (1517-ball fc-fbga (hf40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ350HF40I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ350HF40I4N is suitable for 7 applications: 40G/100G Ethernet Line Cards, Wireless Backhaul Baseband, Broadcast Video Processing, ASIC Prototyping, Medical Imaging DSP, Defense Radar Signal Processing, High-Frequency Trading Acceleration.
40G/100G Ethernet Line Cards
The EP2AGZ350HF40I4N's 348,500 logic elements and 8.5 Gbps transceivers make it well suited for 40G and 100G Ethernet line-card prototyping. Up to 24 transceiver channels support 4x10G, 10x10G, or 2x40G configurations with adaptive equalization for backplane and direct-attach copper links. The 734 user I/O accommodate multiple 10G SFP+ cages plus a QSFP+ cage, while hard PCIe Gen2 IP allows direct attachment to a system host CPU without burning fabric logic.
Recommended
Wireless Backhaul Baseband
Wireless backhaul base stations require high DSP performance plus multiple high-speed serial links. The EP2AGZ350HF40I4N provides hundreds of 18x18 multipliers and 21 Mbit of embedded memory to handle 4G/LTE and small-cell PHY layers while the 8.5 Gbps transceivers connect to CPRI or OBSAI fronthaul/backhaul links. The industrial temperature range ensures reliable operation in outdoor-mounted base-station enclosures from -40C to +100C.
Recommended
Broadcast Video Processing
Broadcast video systems benefit from the EP2AGZ350HF40I4N's high logic density and abundant transceivers for SDI (SMPTE 259M/292M/424M) ingest/egress plus parallel processing of multiple HD or 4K streams. Embedded memory supports frame-line buffers for de-interlacing, scaling, and chroma-keying, while 8.5 Gbps serial links handle 3G-SDI and emerging 12G-SDI signals without external serializer chips. Quartus II video IP cores shorten development time for new broadcast platforms.
Recommended
ASIC Prototyping
ASIC prototyping demands high logic density to map complex SoC designs partition-by-partition. The EP2AGZ350HF40I4N's 348,500 LEs can emulate substantial portions of mid-complexity ASICs before tape-out, and 21 Mbit of on-chip memory supports cache and register-file emulation. Multiple FPGA boards using this device can be cascaded via the 8.5 Gbps transceivers to emulate million-gate ASICs, with Quartus II providing partition compile and debug flow integration.
Recommended
Medical Imaging DSP
Medical imaging systems (CT, MRI, ultrasound) require high-throughput DSP with deterministic latency. The EP2AGZ350HF40I4N's dedicated DSP blocks and 18x18 multipliers accelerate FFT, FIR filtering, and beam-forming computations in real time, while the 21 Mbit of embedded memory supports line buffers for image reconstruction. Industrial temperature grade and high reliability fit medical equipment deployed in imaging labs and operating theaters.
Recommended
Defense Radar Signal Processing
Defense radar systems require wideband ADC interfaces, real-time DSP, and deterministic latency. The EP2AGZ350HF40I4N provides high LVDS I/O count plus 8.5 Gbps transceivers to interface with modern ADC/DAC front ends, while embedded DSP blocks implement pulse compression, MTI, and CFAR detection algorithms. Industrial temperature range supports field-deployable and aerospace ground-station applications per the Arria II GZ family datasheet.
Recommended
High-Frequency Trading Acceleration
High-frequency trading platforms rely on sub-microsecond decision latency. The EP2AGZ350HF40I4N's 500 MHz fabric, deterministic routing, and parallel DSP blocks accelerate order-book matching and risk calculations. The 8.5 Gbps transceivers connect directly to market-data feeds (ITCH, OUCH) and 10G Ethernet, while PCIe Gen2 hard IP links the FPGA to host CPU for co-processing. Industrial temperature and robust BGA package suit latency-sensitive co-located servers.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ350HF40I4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ350HF40I4G | EP2AGZ350HF40I3N | EP2AGZ350HF40I3G | EP2AGZ350HF40C4N | EP2AGZ350HF40C4G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FC-FBGA (HF40) | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same |
| Logic Elements | 348,500 | 348,500 | 348,500 | 348,500 | 348,500 | 348,500 |
| LABs | 13,940 | 13,940 | 13,940 | 13,940 | 13,940 | 13,940 |
| Embedded Memory (bits) | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 |
| User I/O | 734 | 734 | 734 | 734 | 734 | 734 |
| Speed Grade | I4 | I4 | I3 (slower) | I3 (slower) | C4 (commercial) | C4 (commercial) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lead-Free / RoHS | Compliant (N suffix indicates standard finish) | Yes (G suffix) | Standard | Yes (G suffix) | Standard | Yes (G suffix) |
Key Differentiators
- High-density Arria II GZ with 8.5 Gbps transceivers (vs EP2AGZ300HF40I4N (300K LE variant))
- Industrial temperature range with I4 speed grade (vs EP2AGZ350HF40C4N (commercial temp, same die))
- Standard finish designation (N suffix) for legacy programs (vs EP2AGZ350HF40I4G (lead-free G suffix variant))
Design Notes
The 1517-ball FC-FBGA package concentrates heat dissipation into a 40x40 mm area. Estimated: at 0.9 V core, full transceiver utilization, and typical Arria II GZ dynamic power around 8-12 W, a minimum 8-layer PCB with at least 2 inner ground/power planes and a thermal via array under the BGA is required. Junction-to-ambient thermal resistance depends heavily on PCB stack-up and airflow; refer to the Arria II GZ thermal management application note.
The Arria II GZ requires at least four independent supply rails: 0.9 V core (VCC), 1.1 V auxiliary (VCCAUX), 1.5/1.8 V transceiver analog (VCCT_GXB), and user I/O supply (VCCIO). Use a power-on reset controller to enforce proper rail sequencing - VCCAUX and VCCIO must ramp before or simultaneously with VCC to avoid latch-up. Decoupling: place 0.1 uF and 10 uF ceramic capacitors within 100 mil of each BGA power pin.
Route 8.5 Gbps transceiver differential pairs with 100 ohm differential impedance and matched length to within 5 mil across each channel. Use the Intel-provided HF40 pin-out file from Quartus II to identify GXB channels - adjacent channels may share power filtering and require shielding vias to minimize crosstalk. Avoid routing signals under the BGA field; escape routes should fan out into adjacent breakout layers.
Do not confuse the HF40 (1517-ball FC-FBGA) package with the FH29 (780-ball) or FF35 (1152-ball) packages - the pinouts are not compatible and incorrect package selection bricks the design. Speed grade I4 must be specified explicitly in the Quartus II device selection dialog; default speed grades may differ between -I and -C variants, and timing closure requires the correct grade to be locked during compilation.
Compliance Information
Lead-free and RoHS compliant per Intel/Altera Arria II GZ family datasheet. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Industrial temperature grade available with I suffix; commercial grade with C suffix.
