EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel
MPN: EP2AGZ350HF40C3G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1495 | $747,500.00 |
| 1,000 | $1380 | $1,380,000.00 |
EP2AGZ350HF40C3G Overview
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the programmable logic device (PLD) family and sit hierarchically between ASICs (lower flexibility, lower unit cost) and microcontrollers/MPUs (less parallelism). The Arria II GZ family specifically bridges the gap between the lower-cost Cyclone series and the high-end Stratix series, targeting applications such as high-performance digital signal processing, broadcast video processing, and high-speed serial connectivity.
Key features of the EP2AGZ350HF40C3G include dedicated DSP blocks delivering up to 550 MHz performance, embedded memory supporting dual-port RAM and FIFO configurations, on-chip transceivers operating up to 6.375 Gbps, and integrated PCI Express hard IP blocks. The device also supports external memory interfaces including DDR3, DDR2, and QDR II+ at rates up to 800 MHz, enabling high-bandwidth memory subsystems without external bridge chips. Programmable Power Technology allows unused logic to be dynamically shut down, reducing both static and dynamic power consumption.
Architecturally, the EP2AGZ350HF40C3G implements an adaptive logic module (ALM) that combines traditional LUT-based logic with register chains, providing 8-input fracturable look-up tables and arithmetic capability in a single element. The fabric is paired with 8-input ALMs, variable-precision DSP blocks, and a hierarchical interconnect structure with adaptive routing. The transceiver tiles support multiple protocols including Serial RapidIO, Gigabit Ethernet, XAUI, and CPRI, providing system-level integration that simplifies PCB design.
Typical applications for this device include high-end ASIC prototyping, broadcast and studio-grade video processing equipment, radar and electronic warfare signal processing, wireless baseband processing, and high-performance industrial imaging systems. The combination of high logic density, generous embedded memory, multi-gigabit transceivers, and a large user-I/O count makes it particularly well-suited for systems that previously required multiple mid-range FPGAs or a custom ASIC. The 'C3' speed grade and commercial temperature rating ('0C' suffix segment) suit indoor commercial enclosures without extended thermal stress.
When designing with this part, careful PCB layout is essential due to the 1517-ball FBGA at 1.0 mm pitch. Power integrity analysis must be performed across all rails, and a multi-layer PCB with buried capacitance is recommended. The Quartus II design software (now Quartus Prime) provides the synthesis, place-and-route, and timing analysis tools required to compile bitstreams. Engineers should budget several weeks for initial compilation given the device size.
Drop-in alternatives for EP2AGZ350HF40C3G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ350HF40C3G (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Operating Temperature, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ350HF40C4G
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View Datasheet βEP2AGZ350HF40C2N
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View Datasheet βEP2AGZ350HF40C3N
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View Datasheet βEP2AGZ350HF40I3G
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View Datasheet βEP2AGZ300HF40C3G
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View Datasheet βEP2AGZ225HF40C3G
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View Datasheet βEP2AGZ350HF40C3G Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 350,000 |
| User I/O Pins | 734 |
| Package | 1517-ball FineLine BGA (HF40) |
| Package Pitch | 1.0 mm |
| Process Node | 40 nm |
| Speed Grade | C3 (commercial, -3) |
| Operating Temperature | Commercial (0C to 85C, suffix 0C) |
| External Memory Interfaces | DDR3, DDR2, QDR II+ (up to 800 MHz) |
| PCI Express Hard Blocks | Yes (Gen1/Gen2) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2AGZ350HF40C3G 1.0 mm Pin Configuration Guide
Pin configuration for EP2AGZ350HF40C3G (1.0 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ350HF40C3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ350HF40C3G is suitable for 6 applications: ASIC Prototyping and Emulation, Broadcast Video Processing, Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, High-Performance Industrial Imaging, High-Speed Serial Protocol Bridging.
ASIC Prototyping and Emulation
The EP2AGZ350HF40C3G's 350,000 logic elements and 18 Mbits of embedded memory make it an excellent platform for ASIC prototyping and emulation, where the high logic capacity allows engineers to map multi-million-gate ASICs into a single device. The integrated PCI Express hard IP block allows the FPGA to appear as an endpoint device to a host CPU for co-emulation. Compared with smaller FPGAs, this part reduces partitioning overhead and allows full-chip emulation of larger ASIC designs in fewer devices, accelerating verification.
Recommended
Broadcast Video Processing
With 734 user I/O pins and high on-chip memory bandwidth, the EP2AGZ350HF40C3G is well suited to broadcast and studio-grade video processing equipment such as video format converters, multiviewers, and production switchers. The high I/O count supports multiple SDI/HDMI inputs and outputs at 3G-SDI and 6G-SDI rates without external muxing. Its dedicated DSP blocks deliver real-time scaling, deinterlacing, and color-space conversion at full broadcast frame rates.
Recommended
Wireless Baseband Processing
The EP2AGZ350HF40C3G's combination of high-density logic, embedded DSP blocks, and 6.375 Gbps transceivers makes it well matched to wireless baseband processing in small-cell and picocell base stations. The transceiver channels handle CPRI or OBSAI fronthaul links to remote radio heads, while the DSP fabric implements channel cards, FFT/iFFT, and turbo/LDPC decoding. The large user-I/O count allows multiple radio channels to be processed on a single device, reducing board complexity.
Recommended
Radar and Electronic Warfare Signal Processing
In radar and electronic warfare systems, the EP2AGZ350HF40C3G delivers the DSP throughput and memory bandwidth required for pulse compression, MTI filtering, and direction-of-arrival algorithms. The 734 user I/O pins accommodate wide ADC/DAC interfaces at multi-GSPS sample rates, while the embedded memory holds time-domain capture buffers for real-time FFT analysis. Compared with lower-density FPGAs, the 350K-LE part eliminates external memory accesses for many DSP stages, lowering latency in the processing chain.
Recommended
High-Performance Industrial Imaging
Industrial imaging systems - machine-vision inspection, high-speed line-scan cameras, and 3D profilometers - benefit from the EP2AGZ350HF40C3G's combination of embedded memory, high-speed transceivers, and 734 user I/O pins. The fabric handles Bayer demosaicing, defect detection, and compression algorithms at multi-megapixel per second throughput. The DDR3 external memory interface sustains the high data rates of modern CMOS image sensors without external bridge chips, simplifying the PCB and BOM.
Recommended
High-Speed Serial Protocol Bridging
With up to 6.375 Gbps transceiver channels and PCI Express hard IP, the EP2AGZ350HF40C3G excels at high-speed serial protocol bridging - for example, CPRI to Ethernet, Serial RapidIO to PCI Express, or XAUI aggregation. The protocol-rich transceiver tiles support multiple standards simultaneously, allowing a single FPGA to act as a multi-protocol gateway. Compared with ASSP bridge chips, the FPGA approach is fully reprogrammable for evolving protocol requirements.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ350HF40C3G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ350HF40C4G | EP2AGZ350HF40C2N | EP2AGZ350HF40C3N | EP2AGZ350HF40I3G | EP2AGZ300HF40C3G |
|---|---|---|---|---|---|---|
| Package | 1517-ball FineLine BGA (HF40) | 1517-ball FineLine BGA (HF40) - same | 1517-ball FineLine BGA (HF40) - same | 1517-ball FineLine BGA (HF40) - same | 1517-ball FineLine BGA (HF40) - same | 1517-ball FineLine BGA (HF40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 350,000 LEs | 350,000 LEs | 350,000 LEs | 350,000 LEs | 350,000 LEs | 300,000 LEs |
| Speed Grade | C3 (-3) | C4 (-4, faster) | C2 (-2, slower) | C3 (-3, same) | I3 (-3 industrial) | C3 (-3, same) |
| Operating Temperature | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Industrial (-40C to 100C) | Commercial |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest-density member of the Arria II GZ family at this package size (vs EP2AGZ300HF40C3G)
- Faster speed grade than the C2-tier variant (vs EP2AGZ350HF40C2N)
- Commercial temperature vs industrial variants (vs EP2AGZ350HF40I3G)
Design Notes
The 1517-ball FineLine BGA at 1.0 mm pitch demands a high-density PCB with microvia or via-in-pad construction; a minimum of 8 PCB layers with buried capacitance is recommended for power integrity. Use of low-Df PCB material (e.g., Megtron 6 or equivalent) reduces signal loss on the multi-gigabit transceiver channels. Decoupling capacitors must be placed as close as possible to every power pin, and the FPGA's internal bias network should be referenced to a clean, low-impedance ground plane.
Estimated: At full utilization (350K LEs @ 85% toggle rate, all transceivers active), power consumption for the EP2AGZ350HF40C3G can exceed 15W, requiring active cooling. The 1517-ball BGA exposes a thermal pad to the top of the package; a heatsink with thermal interface material (TIM) is strongly recommended. Without adequate cooling, junction temperature may exceed the 85C commercial limit during extended full-load operation, particularly in enclosed industrial enclosures.
Multi-gigabit transceiver channels require controlled-impedance routing (100 ohm differential) with matched trace lengths within the transceiver channel group. Length matching tolerance of 5 mils (0.13 mm) is typical for 6.375 Gbps signals. AC-coupling capacitors must be placed near the transmitter side of each lane, and reference plane continuity is essential to prevent impedance discontinuities. Pre-emphasis and equalization settings in the Quartus II transceiver toolkit should be tuned to the actual PCB channel response.
Common pitfalls when designing with the EP2AGZ350HF40C3G include: (1) failing to provide a clean reference clock to the transceiver PLLs, which causes data errors even when the fabric appears healthy; (2) neglecting to enable the Programmable Power Technology feature in Quartus II, which can reduce dynamic power by 30-40%; (3) ignoring the JTAG chain configuration, which can cause the device to fail in-system programming; (4) under-budgeting compilation time - the design can take 4-8 hours for one full place-and-route iteration at 80% logic utilization.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified (industrial or military-grade variants exist in the same family for harsher environments). Lead-free per the 'G' suffix in the part number indicating Pb-free terminal finish.
