EP2C70F896C7K - Cyclone II FPGA, 68K LEs, 896-BGA | Intel
MPN: EP2C70F896C7K ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $178 | $178,000.00 |
EP2C70F896C7K Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be re-programmed after manufacturing. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs (highest performance, highest NRE) and microcontrollers (lower performance, software-defined). The Cyclone II family in particular targets the low-cost segment, providing a balance of logic density, embedded multipliers, and block RAM for DSP, video, and embedded control designs.
Key features of the EP2C70F896C7K include 68,416 logic elements, 4,488 Kbits (approximately 561 Kbytes) of embedded memory in M4K blocks, 150 embedded 18x18 multipliers, four phase-locked loops, and 622 maximum user I/O pins. The device supports configuration through passive serial, active serial, JTAG, and Altera Fast Passive Parallel modes, giving designers flexibility in production and field programming.
Architecturally, the Cyclone II LE combines a 4-input look-up table (LUT) with a programmable register, feeding into a rich routing fabric with predictable timing. M4K memory blocks can be configured as true dual-port, simple dual-port, or single-port RAM, ROM, or shift registers, while embedded 18x18 multipliers enable single-cycle DSP operations at up to 250 MHz, which is well suited for video processing, motor control, and software-defined radio front ends.
Typical applications include industrial automation controllers, video surveillance and image processing, automotive infotainment, communications infrastructure, and consumer electronics such as flat-panel displays and set-top boxes. The low static and dynamic power consumption of the 90-nm process also makes the EP2C70 a common choice for portable and thermally constrained designs.
When designing with this FPGA, pay attention to I/O bank voltage grouping because mixing incompatible I/O standards in the same bank can cause contention. Plan the configuration scheme (AS, PS, JTAG) early, since the EPCS serial configuration device must be sized for the bitstream of the chosen design. Finally, verify power budgeting using the Altera PowerPlay Early Power Estimator before PCB layout.
Drop-in alternatives for EP2C70F896C7K — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C70F896C7K (same form factor and footprint) — differing in Package, Configuration Modes, Process Technology, Speed Grade, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C70F896C7
✅ Drop-In✓ In Stock
$268.75 / Unit
View Datasheet →EP2C70F896C6
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP2C70F896C6N
✅ Drop-In✓ In Stock
$274.8 / Unit
View Datasheet →EP2C70F896I7
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2C70F896C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$189.55 / Unit
View Datasheet →EP2C70F896C7K Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 68,416 |
| Embedded Memory (M4K blocks) | 4,488 Kbits |
| Embedded Multipliers (18x18) | 150 |
| Maximum User I/O Pins | 622 |
| Phase-Locked Loops (PLLs) | 4 |
| Global Clock Networks | 16 |
| Process Technology | 90 nm low-power CMOS |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Commercial (0C to 85C) |
| Package | 896-ball FineLine BGA (F896) |
| Speed Grade | 7 |
| Configuration Modes | AS, AP, PS, FPP, JTAG |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP2C70F896C7K 896-ball fineline bga (f896) Pin Configuration Guide
Pin configuration for EP2C70F896C7K (896-ball fineline bga (f896) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C70F896C7K.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C70F896C7K is suitable for 6 applications: Industrial Automation and Control, Video Processing and Surveillance, Communications Infrastructure, Automotive Infotainment, Test and Measurement Equipment, Consumer Display and Set-Top Box.
Industrial Automation and Control
The EP2C70F896C7K fits industrial automation because it offers 68,416 logic elements, 150 18x18 multipliers, and 622 user I/O in a single chip, allowing designers to consolidate motor control, encoder feedback, and fieldbus interfaces on one device. The 90-nm low-power process keeps the FPGA within the thermal envelope of a sealed cabinet, while the 1.2 V core simplifies power-supply design. Industrial PLCs, machine vision controllers, and servo drives have used Cyclone II for deterministic multi-axis timing and high-speed ADC interface glue. The F896 ball grid leaves plenty of I/O for parallel data buses, which is critical when interfacing to legacy industrial peripherals.
Recommended
Video Processing and Surveillance
For video processing, the EP2C70F896C7K provides the logic density and on-chip memory to handle multi-channel H.264 encoding, image scaling, and color space conversion in real time. Its 4,488 Kbits of M4K memory acts as line buffers and motion-estimation caches, eliminating external SRAM for many designs. The 150 embedded 18x18 multipliers accelerate DCT, IDCT, and de-interlacing filters. Surveillance DVRs and broadcast video switchers have historically chosen this FPGA for the balance of price, density, and IP-core availability. Designers should pair the device with DDR SDRAM for high-bandwidth frame buffers.
Recommended
Communications Infrastructure
The EP2C70F896C7K supports baseband processing, CPRI/JESD204B-like link aggregation, and protocol bridging in small-cell and access-network equipment. Its 4 PLLs and 16 global clock networks make it straightforward to derive multiple synchronized clocks for radio cards and SerDes interfacing. The 150 embedded 18x18 multipliers handle channelization and filter arithmetic at the rates required for narrow-band radio and digital pre-distortion. Industrial-rated speed grade variants (EP2C70F896I7) are available for outdoor cabinet deployments. For designs upgrading to higher bandwidth, consider the Cyclone IV GX or Cyclone V GT as future-proofing steps.
Recommended
Automotive Infotainment
The EP2C70F896C7K historically powered automotive infotainment head units, dashboard clusters, and rear-seat entertainment systems where multiple video streams and audio channels had to be mixed in real time. Its 622 user I/O is enough to bridge LVDS displays, touch controllers, MOST networks, and AM/FM tuner ICs without external bus switches. The 90-nm process gave an acceptable thermal profile for sealed dashboard enclosures, while the 1.2 V core simplified automotive 12 V power trees. For AEC-Q100 qualified production, engineers typically chose the industrial temperature grade and applied additional supplier PPAP documentation.
Recommended
Test and Measurement Equipment
Benchtop oscilloscopes, logic analyzers, and protocol testers have long used the EP2C70F896C7K as the timing and display engine, because the FPGA can capture up to 622 channels at sample rates set by its PLLs. The 4,488 Kbits of M4K memory acts as deep sample memory for glitch detection, while the 150 embedded 18x18 multipliers run real-time FFT and digital filter math. Engineers appreciate the deterministic timing of the Cyclone II architecture, which simplifies measurement accuracy analysis. The 896-ball BGA also provides enough I/O for high-pin-count logic-analyzer probes without external muxes.
Recommended
Consumer Display and Set-Top Box
The EP2C70F896C7K served as a video-format converter and overlay engine in flat-panel TVs and set-top boxes, where it accepted HDMI, DVI, or component video and re-scaled it to native panel resolution. Its combination of 68K logic elements, M4K memory, and 18x18 multipliers handled de-interlacing, frame-rate conversion, and on-screen display blending on a single device. The 1.2 V core and 90-nm process met cost and power targets for high-volume consumer SKUs. For new designs, the Cyclone IV E family is the recommended functional successor, with the same F896 footprint in many cases.
Recommended
Recommended Products Summary
Engineering reference data for EP2C70F896C7K — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C70F896C7 | EP2C70F896C6 | EP2C70F896C6N | EP2C70F896I7 | EP2C70F896C8N |
|---|---|---|---|---|---|---|
| Package | 896-ball FineLine BGA (F896) | 896-ball FineLine BGA (F896) | 896-ball FineLine BGA (F896) | 896-ball FineLine BGA (F896) | 896-ball FineLine BGA (F896) | 896-ball FineLine BGA (F896) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone II | Cyclone II | Cyclone II | Cyclone II | Cyclone II | Cyclone II |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 |
| Embedded Memory | 4,488 Kbits | 4,488 Kbits | 4,488 Kbits | 4,488 Kbits | 4,488 Kbits | 4,488 Kbits |
| Embedded Multipliers (18x18) | 150 | 150 | 150 | 150 | 150 | 150 |
| Speed Grade | 7 | 7 | 6 (slower) | 6 (slower) | 7 | 8 (faster) |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Industrial (-40C to 100C) | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest density Cyclone II with speed grade 7 (vs EP2C70F896C6)
- Commercial temperature grade optimized for cost (vs EP2C70F896I7)
- Same die as alternate suffixes (vs EP2C70F896C7)
Design Notes
Estimated: at 100% logic utilization, 250 MHz, and 1.2 V core, the EP2C70F896C7K draws roughly 1.5 to 2.0 A on VCCINT. Use a low-noise 1.2 V LDO or DC-DC followed by a ferrite and bulk decoupling, with 100 nF and 10 uF caps within 5 mm of every VCCINT ball. Plan the VCCIO banks independently, because the F896 supports four I/O voltages and shared decoupling will fail EMI.
The 896-ball FineLine BGA uses a 1.0 mm ball pitch, which requires microvia or sub-0.1 mm via-in-pad for reliable breakout. Use a 6+ layer stack-up with dedicated power and ground planes, and escape each bank in fanout order so that I/O standards are not mixed within a bank. Confirm BGA land pattern with the Intel package specification and verify solder paste stencil aperture ratios to avoid tombstoning on small decoupling caps near the BGA perimeter.
Do not mix incompatible I/O standards within a single VCCIO bank, because shared reference voltages will cause contention and unpredictable behavior. Always de-bounce MSEL configuration-mode pins and add external pull-ups on nCE, nCONFIG, and CONF_DONE for stable startup. Quartus II compile reports may differ from real-world timing for the speed grade 7 device, so run TimeQuest timing analysis with the correct SDC and verify hold time on global clocks before sign-off.
Compliance Information
RoHS and lead-free per Intel/Altera Cyclone II product documentation. Not AEC-Q100 qualified - select EP2C70F896I7 for industrial temp range; AEC-Q100 automotive programs typically migrate to Cyclone IV or Cyclone V.
