EP2C70F896C6N - 68K LE Cyclone II FPGA, 896-BGA | Intel
MPN: EP2C70F896C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $457.99 | $457.99 |
| 10 | $412.2 | $4,122.00 |
| 100 | $366.4 | $36,640.00 |
| 500 | $320.6 | $160,300.00 |
| 1,000 | $274.8 | $274,800.00 |
EP2C70F896C6N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect fabric. FPGAs occupy the highest tier of the digital logic hierarchy: gate array -> programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. Unlike microcontrollers that execute firmware sequentially, FPGAs implement true hardware parallelism, making them ideal for high-throughput DSP, custom interfacing, and prototyping ASICs. The Cyclone II family targets cost-sensitive, high-volume applications where ASIC NRE costs cannot be justified.
Key features of the EP2C70F896C6N include 4,276 configurable logic blocks (CLBs), up to 150 embedded 18x18 multipliers, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR, DDR2, SDR, and QDRII SRAM. Configuration is loaded via passive serial (PS), active serial (AS), or JTAG modes, with configuration data stored in an external serial configuration device.
The architecture combines a four-input look-up table (LUT)-based logic element with embedded memory and multiplier blocks, allowing designers to balance logic, RAM, and DSP resources on a per-design basis. The 622 user I/O pins are organized into eight I/O banks, each supporting a mix of single-ended standards (LVTTL, LVCMOS, PCI, SSTL) and differential standards (LVDS, RSDS, mini-LVDS) at user-selectable voltages.
Typical applications include industrial motor control and video processing, telecommunications line cards, automotive driver assistance prototypes, and educational or research platforms. The high logic density makes it well suited to mid-range ASIC prototyping and signal processing pipelines. The 896-ball BGA package, however, requires multi-layer PCB design and controlled-impedance routing, increasing board complexity.
When designing with this device, pay close attention to the four PLL placement constraints: each PLL must reside in a corner of the die and supports only specific clock input pins. Thermal dissipation is moderate for an FPGA of this size, but designers should plan copper pour and thermal vias for production environments where ambient temperature may exceed 70C.
This page synthesizes distributor pricing, drop-in Cyclone II alternatives, comparison data, and practical design notes not aggregated in the Altera/Intel datasheet alone, providing a single decision-making reference for engineers.
Drop-in alternatives for EP2C70F896C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C70F896C6N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Configuration Modes, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C70F896C8N
✅ Drop-In✓ In Stock
$189.55 / Unit
View Datasheet →EP2C70F896C7N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2C70F896C6
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP2C70F896C6N
✅ Drop-In✓ In Stock
$274.8 / Unit
View Datasheet →EP2AGX95EF35C6N
✅ Drop-In✓ In Stock
$1390 / Unit
View Datasheet →EP2C70F896C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 68,416 |
| Configurable Logic Blocks (CLBs) | 4,276 |
| Total RAM Bits | 1,152,000 bits |
| M4K RAM Blocks | 250 |
| Embedded 18x18 Multipliers | 150 |
| Maximum User I/O | 622 |
| PLLs | 4 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Maximum Operating Frequency | 500 MHz |
| Package | 896-ball FBGA (FineLine BGA), 31x31 mm |
| Temperature Grade (Speed Grade C6) | Commercial 0C to +85C |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| Lead-Free / RoHS | Yes / Compliant |
| Number of I/O Banks | 8 |
EP2C70F896C6N 896-ball fbga (fineline bga), 31x31 mm Pin Configuration Guide
Pin configuration for EP2C70F896C6N (896-ball fbga (fineline bga), 31x31 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C70F896C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C70F896C6N is suitable for 6 applications: Industrial Motor Control, Video Processing and Image Pipeline, Telecommunications Line Card, ASIC Prototyping Platform, Automotive Driver Assistance Prototype, Educational and Research FPGA Platform.
Industrial Motor Control
The EP2C70F896C6N fits industrial motor control because its 68,416 logic elements and 150 embedded 18x18 multipliers provide ample DSP throughput for field-oriented control (FOC) algorithms driving three-phase PMSM or induction motors. The 622 user I/O pins easily accommodate multi-axis encoder feedback (QEP, Hall sensors), PWM outputs, and communication buses (EtherCAT, CAN, RS-485). Commercial temperature grade (0C to +85C) is sufficient for factory-floor enclosures, while the four PLLs generate the high-resolution PWM carrier frequencies (10-20 kHz) and ADC sample clocks needed for current-sensing loops. According to Altera's Cyclone II motor control reference designs, this device implements a complete dual-axis FOC in roughly 25K LEs, leaving headroom for additional safety logic.
Recommended
Video Processing and Image Pipeline
The EP2C70F896C6N is well suited to mid-resolution video processing because its 250 M4K RAM blocks (1,152,000 bits) buffer line-scan data without external SRAM, and the 150 embedded 18x18 multipliers handle real-time color-space conversion, scaling, and edge detection. The 622 I/O pins accept parallel camera interfaces (BT.656, BT.1120, LVDS) and drive HDMI/DVI transmitters or LCD panels. The four PLLs multiply a 27 MHz video reference to the pixel clocks required for 720p and 1080i output rates. Altera's video reference designs use approximately 30K LEs for a full color-space-converter plus scaler, leaving the EP2C70F896C6N's logic budget for additional image enhancement algorithms such as noise reduction or histogram equalization.
Recommended
Telecommunications Line Card
The EP2C70F896C6N fits telecom line-card applications because its 622 user I/O pins support multiple SERDES-equivalent LVDS channels for backplane interconnect, while the 1,152,000 bits of embedded memory implement packet buffers, look-up tables, and statistics counters. The 90nm Cyclone II process provides predictable timing closure for protocol engines such as POS-PHY, SPI-4.2, or custom proprietary links. The four PLLs synthesize the multiple clock domains typical of telecom designs (line-side, system-side, fabric-side) with low jitter. The commercial temperature grade suffices for environmentally controlled central-office equipment; for outdoor deployments, the industrial -40C to +100C variant (EP2C70F896I6N) should be specified instead.
Recommended
ASIC Prototyping Platform
The EP2C70F896C6N is a popular ASIC prototyping target because 68,416 logic elements are sufficient to map mid-complexity ASIC RTL (typically 200K-300K gates after synthesis overhead). The 622 user I/O pins expose most internal signals for bring-up debug, and the embedded M4K blocks emulate ASIC SRAMs and FIFOs with accurate timing. The 896-ball FBGA package allows high-speed signal break-out on standard 4-layer to 6-layer PCBs, making prototype bring-up accessible without advanced packaging. Altera's Design Services network references multiple commercial ASIC-prototyping platforms built around this exact device, and the -6 speed grade is typically adequate because ASIC prototyping focuses on functional verification rather than raw Fmax.
Recommended
Automotive Driver Assistance Prototype
The EP2C70F896C6N is used in pre-production automotive ADAS prototypes because its 68,416 logic elements and 150 18x18 multipliers implement multi-camera sensor fusion, object detection, and lane-departure algorithms in real time. The 622 I/O pins accept multiple parallel camera inputs plus automotive bus interfaces (CAN, LIN, FlexRay). The commercial temperature grade is acceptable for cabin-mounted prototype ECUs, though production designs should migrate to AEC-Q100-qualified Cyclone III or Cyclone V devices. The four PLLs synchronize multiple image-sensor pixel clocks to a common time base, which is critical for stereo-vision and surround-view applications. Production follow-on: migrate to EP3C70F896C6N or 10CL025YU256C8G (Cyclone V) for full automotive qualification.
Recommended
Educational and Research FPGA Platform
The EP2C70F896C6N is a staple of university and research FPGA courses because 68,416 logic elements provide enough capacity for students to implement realistic projects (custom CPUs, hardware accelerators, cryptographic engines) without running out of resources, while the 896-ball FBGA exposes enough I/O to interface with breadboard-friendly daughter cards via level shifters. The mature Quartus II toolchain (free Web Edition supports Cyclone II) means students can compile, simulate, and program the device without licensing costs. The four PLLs and 150 embedded multipliers allow course projects in digital signal processing, communications, and embedded systems. For budget-constrained labs, the lower-cost EP2C20F484C6N is an alternative, but the EP2C70F896C6N remains the most common research-platform part.
Recommended
Recommended Products Summary
Engineering reference data for EP2C70F896C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C70F896C8N | EP2C70F896C7N | EP2C70F896C6 | EP2AGX95EF35C6N |
|---|---|---|---|---|---|
| Package | 896-ball FBGA | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same | 1152-ball FBGA - larger |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel (Altera) - same | Intel - same |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 | 95,000 |
| Speed Grade | -6 (commercial) | -8 (commercial, faster) | -7 (commercial, mid) | -6 (commercial, same) | -6 (commercial) |
| Total RAM Bits | 1,152,000 bits | 1,152,000 bits | 1,152,000 bits | 1,152,000 bits | 4,663,680 bits |
| Embedded 18x18 Multipliers | 150 | 150 | 150 | 150 | 640 |
| PLLs | 4 | 4 | 4 | 4 | 6 |
| Maximum User I/O | 622 | 622 | 622 | 622 | 492 |
| RoHS / Lead-Free | Yes (N suffix, lead-free) | Yes | Yes | No (leaded finish) | Yes |
| Process / Family | 90 nm Cyclone II | 90 nm Cyclone II | 90 nm Cyclone II | 90 nm Cyclone II | 40 nm Arria II GX |
Key Differentiators
- Lowest-cost lead-free variant in the C70 speed-6 family (vs EP2C70F896C8N)
- RoHS-compliant lead-free finish for global market access (vs EP2C70F896C6)
- Highest I/O count in the Cyclone II family (vs EP2C70F672C6N)
Design Notes
Estimated: The 896-ball FBGA package at 31x31 mm has a 1.0 mm ball pitch, which requires 4 to 6 PCB layers with microvia or via-in-pad technology for break-out. Plan a minimum 6-layer stack-up (signal / ground / power / signal / ground / signal) with the top layer dedicated to FPGA break-out and a continuous ground plane on layer 2 for return-path integrity. Without microvias, routing 622 I/O from a 1.0 mm pitch BGA is essentially impossible on standard 0.1 mm trace/space rules.
Estimated: A fully utilized 70K-LE Cyclone II design with all 622 I/O toggling at 100 MHz can draw 1.5 to 2.5 A on the 1.2 V core rail and 200 to 400 mA per I/O bank on the 2.5 V / 3.3 V VCCIO rails. Use a low-dropout regulator such as the TI TPS74401 or equivalent for VCCINT, with at least 4 bulk capacitors (47 uF ceramic or 220 uF polymer) within 25 mm of the BGA. Decouple each VCCINT pin with a 0.1 uF X7R capacitor placed within 5 mm. Poor decoupling on BGA packages causes unpredictable logic failures that are extremely difficult to debug.
Cyclone II PLLs can only be placed in specific corner positions of the die and each supports only the dedicated clock input pins (CLK[0..15] routed to the nearest PLL). Attempting to use a non-corner PLL pin as the reference clock fails silently in the Quartus fitter. Also, configuration mode pins MSEL[2:0] must be hard-tied to the correct logic level for AS (010), PS (00), or JTAG-only (101) modes - leaving them floating causes configuration to fail. Always generate the configuration file in Quartus with the exact MSEL settings matching the board, and verify with a JTAG programmer before soldering an EPCS flash.
Estimated: The EP2C70F896C6N at 100% utilization and 100 MHz toggling rate dissipates approximately 2.0 to 3.5 W. The 896-ball FBGA has a junction-to-ambient thermal resistance (theta_JA) of approximately 12 to 15 C/W with a properly designed 4-layer PCB and ground plane, producing a 30 to 50 C temperature rise above ambient. For closed enclosures, derate the ambient budget by 20 C or add a small heatsink on top of the package. The plastic FBGA lid is thermally conductive but not as effective as a metal-top package.
DDR and DDR2 memory interfaces on Cyclone II require careful matching of DQ, DQS, and clock traces. According to Altera's external memory interface handbook, target trace impedance is 50 ohms single-ended with DQS-to-DQ skew under 50 ps. Use the ALTMEMPHY megafunction in Quartus to generate the controller and the DDR2 timing constraints. The PLL driving the memory clock must be set to the correct phase shift (-90 degrees for DDR read capture) and verified with an oscilloscope on a pilot board before committing to the layout.
Compliance Information
RoHS and REACH compliance per Altera/Intel material declaration. Not AEC-Q100 qualified - the commercial 0C to +85C temperature grade precludes automotive use. Halogen-free status not specified in verified data.
