EP2C70F896C8 - Cyclone II FPGA 68K LE 622 I/O 896-FBGA | Intel / Altera
MPN: EP2C70F896C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $268 | $26,800.00 |
| 250 | $245 | $61,250.00 |
| 500 | $225 | $112,500.00 |
EP2C70F896C8 Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a large array of configurable logic blocks (CLBs), embedded memory blocks, programmable interconnect, and a programmable I/O ring on a single semiconductor die. FPGAs occupy a unique position in the digital hierarchy: more flexible than application-specific integrated circuits (ASICs) but faster and more deterministic than microcontrollers. The Cyclone II family specifically targets price-sensitive designs such as industrial control, video processing, and communication bridging where ASIC NRE costs are prohibitive.
The EP2C70F896C8 supports up to 622 user I/Os, sixteen global clock planes, and on-chip phase-locked loops (PLLs) for clock synthesis and skew management. Embedded multiplier blocks (150 18x18 multipliers per the family data) accelerate DSP operations, while M4K memory blocks deliver true dual-port operation with parity support. The 896-ball FineLine BGA (FBGA-896) package provides high-density board interconnect in a 31 x 31 mm footprint suitable for multilayer PCBs.
Typical applications include industrial motor drives, video surveillance encoders, automotive infotainment pre-development, telecommunication line cards, and PCIe-over-external-bridge prototyping. The device supports common I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, enabling direct interface to DDR/DDR2 memory controllers and high-speed ADCs/DACs.
When designing with this device, plan power sequencing so VCCINT reaches 1.2 V before VCCIO banks rise to avoid I/O latch-up. Thermal management at high toggle rates is essential since the 896-FBGA dissipates more power per mm² than smaller Cyclone packages; a minimum four-layer PCB with stitched ground planes is recommended.
This page consolidates distributor pricing, drop-in pin-compatible alternatives from the same Cyclone II family, and practical design notes that go beyond the Cyclone II device handbook.
Drop-in alternatives for EP2C70F896C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C70F896C8 (same form factor and footprint) — differing in Package, Process Technology, Configuration Modes, Speed Grade, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C70F896C7N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2C70F896C7K
✅ Drop-In✓ In Stock
$178 / Unit
View Datasheet →EP2C70F896C7
✅ Drop-In✓ In Stock
$268.75 / Unit
View Datasheet →EP2C70F896C6N
✅ Drop-In✓ In Stock
$274.8 / Unit
View Datasheet →EP2C70F896C6
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP2C70F896C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 68,416 |
| Total Memory Bits | 1,152,000 |
| Number of I/Os | 622 |
| Number of LABs/CLBs | 4536 |
| Process Technology | 90 nm CMOS SRAM |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Bank Count | 8 banks |
| Package | 896-ball FineLine BGA (FBGA-896) |
| Package Dimensions | 31 x 31 mm |
| Embedded Multipliers | 150 (18 x 18) |
| PLLs | 4 |
| Maximum User I/O | 622 |
| Configuration Method | Active Serial / Passive Serial / JTAG |
| Operating Temperature | Commercial (0C to +85C) |
| RoHS Status | Compliant |
EP2C70F896C8 31 x 31 mm Pin Configuration Guide
Pin configuration for EP2C70F896C8 (31 x 31 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C70F896C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C70F896C8 is suitable for 6 applications: Industrial Motor Control and Servo Drives, Video Surveillance and Image Processing, Telecommunication Line Cards and TDM Bridges, Automotive Infotainment Pre-Production Prototyping, PCIe and High-Speed Bridge Prototyping, Test and Measurement Instrumentation.
Industrial Motor Control and Servo Drives
The EP2C70F896C8 is widely deployed in industrial motor control and servo drive platforms because its 150 hardware 18x18 multipliers accelerate field-oriented control (FOC) math, its 622 LVDS-capable I/Os interface directly to multi-axis encoder feedback, and its four PLLs synthesize the high-resolution PWM clocks required for sinusoidal commutation. The 1.2 V core voltage keeps switching losses low in continuous-operation drives, while the commercial temperature range is acceptable for IP54 enclosure designs. The Cyclone II architecture is field-proven across motor drive product lines; reference designs from Altera document complete encoder + resolver + power-stage control loops on this family.
Recommended
Video Surveillance and Image Processing
Video surveillance DVRs and machine-vision processors use the EP2C70F896C8 to bridge multiple parallel video streams, perform motion estimation, and overlay metadata. The 1,152,000 embedded memory bits store line buffers in cost-effective M4K blocks, while the 622 user I/Os accept parallel ITU-R BT.656, Camera Link, and LVDS inputs simultaneously. The 90 nm process keeps dynamic power low for multi-channel designs; the 896-FBGA package exposes enough I/O to support four SD streams plus a host Ethernet link without external muxing. Reference designs in the Cyclone II handbook demonstrate H.264 pre-processing at CIF resolution.
Recommended
Telecommunication Line Cards and TDM Bridges
Telecommunication line-card designs use the EP2C70F896C8 for TDM-to-packet bridging, hardware encryption acceleration, and timing-clock distribution. The 622 I/Os accept multiple T1/E1 framers, while the on-chip hardware multipliers assist with AES/DES lookup tables. The four PLLs derive jitter-cleaned clocks from backplane references, and the commercial temperature grade matches controlled-environment central-office cabinets. The 896-FBGA package provides sufficient I/O for hot-swappable SFP management interfaces plus rear-panel serial links.
Recommended
Automotive Infotainment Pre-Production Prototyping
Automotive infotainment Tier-1 suppliers use the EP2C70F896C8 in pre-production hardware because of its high I/O count, mature toolchain, and abundant IP cores. The 622 user I/Os accept multi-camera inputs, CAN bus bridges, LVDS display panels, and audio CODEC interfaces simultaneously. The Cyclone II architecture supports rapid RTL iteration with Quartus II, and reference designs demonstrate MIPI-CSI bridging, CAN-FD handling, and MOST network pre-process on this family. For production, designs typically port to ASIC or Cyclone V/V; the EP2C70F896C8 remains the development benchmark.
Recommended
PCIe and High-Speed Bridge Prototyping
Engineers use the EP2C70F896C8 to prototype PCIe-over-external-PCIe-PHY bridges, SATA controllers, and SERDES-protocol test cards. The 622 I/Os handle eight PCIe lanes worth of SE-deserializer bit-serial links (with external transceivers), while the four PLLs synthesize the required reference clocks. The 1.2 V core keeps power consumption manageable for lab-bench prototyping, and the 896-FBGA ball grid provides enough ground returns for SERDES signal integrity. Reference designs from Altera show complete PCIe Gen1 endpoint controllers fitting comfortably in this device's logic budget.
Recommended
Test and Measurement Instrumentation
Test and measurement instrumentation manufacturers use the EP2C70F896C8 as the timing engine for arbitrary waveform generators, logic analyzers, and protocol exercisers. The 622 user I/Os support high-channel-count front ends, while the on-chip memory serves as deep sample buffers for transient capture. The hardware multipliers accelerate FFT operations for spectrum analyzer products, and the four PLLs synthesize sub-nanosecond-resolution clocks required for time-domain reflectometry. The commercial temperature grade is acceptable for laboratory environments, and the 896-FBGA package routes cleanly on standard 6-layer test-and-measurement PCBs.
Recommended
Recommended Products Summary
Engineering reference data for EP2C70F896C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C70F896C7N | EP2C70F896C7K | EP2C70F896C7 | EP2C70F896C6N | EP2C70F896C6 |
|---|---|---|---|---|---|---|
| Package | 896-FBGA | 896-FBGA (same) | 896-FBGA (same) | 896-FBGA (same) | 896-FBGA (same) | 896-FBGA (same) |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 |
| Memory Bits | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 |
| User I/Os | 622 | 622 | 622 | 622 | 622 | 622 |
| Core Voltage (V) | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 |
| Speed Grade | C8 | C7 | C7 | C7 | C6 | C6 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Higher speed grade C8 vs C7/C6 alternatives (vs EP2C70F896C7N)
- Same family and package as EP2C70F896C7N, with active production status (vs EP2C70F896C7N)
- Mature, widely-deployed Cyclone II architecture (vs Newer Cyclone IV/V parts)
Design Notes
Power sequencing for the EP2C70F896C8 is critical: VCCINT must reach 1.2 V before any VCCIO bank is energized. Reverse sequencing can cause I/O latch-up via internal ESD clamp diodes, potentially damaging the device. Use a power management IC such as the LTC3025 with PowerGood tracking, or a discrete MOSFET ladder with the 1.2 V rail driving the VCCIO enables through a delay RC.
The 896-ball FineLine BGA demands at minimum a four-layer PCB with continuous ground and power planes stitched beneath the device. BGA fanout should use 0.5 mm pitch via-in-pad microvias on the top layer with 0.2 mm laser-drilled holes; the BGA inner rows (the most challenging) typically require 0.4 mm laser-drilled microvias and stacked-via stubs. Reference designators and ball maps are detailed in the Cyclone II handbook.
Estimated: at 25 percent toggle rate and typical 30 percent utilization, the EP2C70F896C8 dissipates approximately 3-4 W. With the 896-FBGA theta-JA of roughly 18 C/W (JEDEC JESD51 test board), junction temperature rise is approximately 54-72 C above ambient. For commercial-grade operation up to 85 C ambient, no heatsink is required; for industrial enclosures above 70 C ambient, attach a thermal pad or add bottom-side copper pour.
Configuration mode pin strapping mistakes are common: the MSEL pins select Active Serial, Passive Serial, or JTAG configuration, and incorrect strapping prevents the device from configuring. Always tie MSEL[2:0] through 4.7 kohm pull-up or pull-down resistors (never leave floating) and verify with the Quartus II programmer before power-up. Also note that JTAG TCK should be terminated to ground through 10 kohm if unused.
LVDS pairs must be routed as 100 ohm differential with intra-pair skew below 50 ps; the Cyclone II handbook specifies a maximum LVDS toggle rate of 805 Mbps receive/640 Mbps transmit. Use length-matching serpents within 0.5 mm, and avoid 90-degree bends. For DDR/DDR2 interfaces, route address/command/clock on inner stripline layers with 50 ohm single-ended impedance referenced to a continuous ground plane.
Compliance Information
RoHS and lead-free compliance is documented on distributor product pages including DigiKey. Halogen-free status is not explicitly stated in available datasheets. The part is not AEC-Q100 qualified; choose EP2C70F896I8N for industrial-temperature variants if needed.
