Intel

EP2C70F896C7 - Cyclone II FPGA 68K LE 622 I/O 896-FBGA | Intel

MPN: EP2C70F896C7 ✗ End of Life
In Stock Ships in 1-3 business days
1.2 V Vdss 896-ball FBGA Package C7 (commercial, slowest) Speed 1,152,000 Memory
From $268.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $441.28 $441.28
10 $397.15 $3,971.50
100 $339.8 $33,980.00
500 $305.5 $152,750.00
1,000 $268.75 $268,750.00
ℹ️ All prices are in USD

EP2C70F896C7 Overview

The Intel (formerly Altera) EP2C70F896C7 is a member of the Cyclone II FPGA family built on a 90 nm low-k dielectric CMOS process, offering 68,416 logic elements, 1,152,000 bits of embedded RAM, and 622 user I/O pins in a 896-ball FineLine BGA package. The 'C7' speed grade designates the commercial temperature range with the slowest speed bin, while the 'F896' suffix marks the 896-pin FBGA package. Cyclone II is positioned as a low-cost, high-volume programmable logic family targeting cost-sensitive applications where complex FPGAs are over-specified.

A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as multipliers and memory. FPGAs sit in the programmable logic hierarchy below ASICs and below their higher-end kin (Stratix, Arria, Cyclone V/10) for cost-optimized designs. Cyclone II devices are SRAM-based, meaning the configuration bitstream is loaded from an external flash at each power-up and can be re-programmed in-system indefinitely.

Key features include 68,416 logic elements distributed across four- and six-input look-up tables (LUTs), 4,608 Kbits of M4K embedded memory blocks supporting true dual-port operation with parity bits, 150 embedded 18 x 18 multipliers for DSP operations, and 16 global clock networks with up to four PLLs per device. Each I/O pin supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, and RSDS. The configuration interface supports JTAG (IEEE Std 1149.1), Passive Serial (PS), Fast Passive Parallel (FPP), and Active Serial (AS) modes via the dedicated configuration pins.

Cyclone II devices internally operate at 1.2 V core supply with separate VCCIO banks for I/O voltage flexibility, supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfacing. The 150 18 x 18 multipliers can be combined into larger multiplier structures such as 36 x 36 signed multipliers, enabling FIR filters, FFT butterflies, and image-processing pipelines without consuming general-purpose logic. PLLs provide clock multiplication, division, phase shifting, and duty-cycle control, simplifying board-level clock tree design.

Typical applications include industrial motor control and servo drives, video surveillance and image processing, automotive infotainment, telecommunications line cards, low-cost prototyping of ASICs, and embedded control with soft processors such as Nios II. The 896-FBGA package with 622 user I/Os suits designs that demand high off-chip bandwidth, such as DDR/DDR2 memory controllers, video frame buffers, and multi-channel data acquisition. Cyclone II is a mature family often chosen for long-life-cycle industrial, medical, and military programs.

When designing with this part, use the Quartus II design software (version 13.0 sp1 or earlier is the last fully-supported release). Plan power sequencing carefully because Cyclone II requires VCCINT (1.2 V) and VCCIO banks to ramp within datasheet-specified monotonicity, and confirm configuration mode and flash device selection before layout. Always use IBIS models for signal-integrity simulation of DDR2/LVDS links.

This page consolidates distributor pricing, drop-in package-equivalent parts, and practical Quartus II design notes that complement the official Altera Cyclone II handbook.

Drop-in alternatives for EP2C70F896C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2C70F896C7 (same form factor and footprint) — differing in Package, Process Technology, Configuration Modes, Operating Temperature Grade, Speed Grade.

Intel
Package: 896-ball FBGA (FineLine BGA)
Process Technology: 90 nm CMOS
Configuration Modes: Active Serial, Passive Serial, JTAG
Compare with EP2C70F896C7 →
Intel
Package: 896-ball FBGA (FineLine BGA), 31x31 mm
Process Technology: 90 nm CMOS
Configuration Modes: Passive Serial (PS), Active Serial (AS), JTAG
Compare with EP2C70F896C7 →
Intel
Package: 896-ball FineLine BGA (F896)
Process Technology: 90 nm low-power CMOS
Configuration Modes: AS, AP, PS, FPP, JTAG
Compare with EP2C70F896C7 →
Intel
Package: FBGA-896
Process Technology: 90 nm CMOS
Configuration Modes: AS, PS, JTAG
Compare with EP2C70F896C7 →
Intel
Package: 896-ball FineLine BGA (FBGA-896)
Process Technology: 90 nm CMOS SRAM
Compare with EP2C70F896C7 →
Intel
Package: 896-ball FineLine BGA (FBGA-896)
Process Technology: 90 nm CMOS
Operating Temperature Grade: Industrial (-40 C to +100 C junction)
Compare with EP2C70F896C7 →
Altera
Package: 896-BGA (FBGA-896)
Process Technology: 90 nm
Speed Grade: 8
Compare with EP2C70F896C7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2C70F896C7N

✅ Drop-In
Intel
📦 896-FBGA
Cyclone II · Intel (formerly Altera) · 68,416 · 4,276 · 1,152,000 · 150 · 622 · 4

✓ In Stock

$175 / Unit

View Datasheet →

EP2C70F896C6

✅ Drop-In
Intel
📦 896-FBGA
Cyclone II · 68,416 · 1,152,000 · 622 · 150 · 4 · 622 (per DigiKey listing) · 500 MHz

✓ In Stock

$650 / Unit

View Datasheet →

EP2C70F896C6N

✅ Drop-In
Intel
📦 896-FBGA
Cyclone II · 68,416 · 4,276 · 1,152,000 bits · 250 · 150 · 622 · 4

✓ In Stock

$274.8 / Unit

View Datasheet →

EP2C70F896C7 Maximum Ratings & Electrical Characteristics

Family Cyclone II
Logic Elements (LE) 68,416
Total Memory Bits 1,152,000
Embedded Multipliers (18 x 18) 150
User I/O Pins 622
Package 896-ball FBGA
Speed Grade C7 (commercial, slowest)
Core Voltage 1.2 V
I/O Bank Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V
Global Clock Networks 16
PLLs 4
Process Technology 90 nm low-k CMOS
Configuration Modes AS, PS, FPP, JTAG
Operating Temperature 0C to +85C (commercial)
Memory Blocks (M4K) 250 (4 Kbit each)

EP2C70F896C7 896-ball fbga Pin Configuration Guide

Pin configuration for EP2C70F896C7 (896-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

896-ball fbga package pinout diagram for EP2C70F896C7

No detailed pinout data available for EP2C70F896C7.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2C70F896C7 is suitable for 6 applications: Industrial Motor Control, Video Surveillance & Image Processing, Telecom Line Cards & Protocol Bridging, Embedded Soft-Processor Systems (Nios II), ASIC Prototyping & Emulation, Test & Measurement Front-End.

🏭

Industrial Motor Control

The EP2C70F896C7 fits industrial motor control and servo-drive applications because its 622 user I/O pins easily accommodate simultaneous encoder feedback, PWM channels, and multi-axis SPI/CAN interfaces. The 150 embedded 18x18 multipliers handle Park/Clark transforms and space-vector modulation in field-oriented control (FOC) loops, while the 1,152 Kbit on-chip M4K memory buffers sine tables and current-loop samples. Cyclone II's deterministic timing, 16 global clock networks, and 4 PLLs ensure tight PWM jitter at switching frequencies up to 50 kHz. Designers place the FPGA between a 3.3 V MCU host and the power stage, with isolated gate drivers driven directly from the LVCMOS 3.3 V outputs.

🎥

Video Surveillance & Image Processing

The EP2C70F896C7 suits video surveillance and image processing pipelines because its 1,152 Kbit of on-chip memory and 622 I/O pins support multi-channel D1 or 720p video capture through external decoders. The 150 dedicated 18x18 multipliers run 2D FIR filters, Sobel edge detection, and H.264 motion estimation in real time, while the dedicated DDR/DDR2 memory controller IP offloads frame buffering to external SDRAM. LVDS I/O support enables direct connection to high-speed image sensors without external transceivers, and the 4 PLLs derive pixel clocks from any source. This part is widely used in multi-camera DVR systems and machine-vision inspection rigs.

🌐

Telecom Line Cards & Protocol Bridging

The EP2C70F896C7 fits telecom line-card and protocol-bridging applications because its 622 I/Os and 4 PLLs aggregate multiple E1/T1 framers, HDLC channels, or LVDS backplane lanes. Designers implement ATM-to-Ethernet or TDM-to-IP bridging entirely in fabric, using the 250 M4K memory blocks as elastic FIFOs to absorb timing differences. The 150 multipliers accelerate Reed-Solomon or convolutional codecs for forward error correction, while the LVTTL/SSTL I/O standards connect directly to legacy telecom transceivers. Cyclone II is a common choice for low-port-count DSLAMs, remote terminals, and industrial gateway routers.

🖥️

Embedded Soft-Processor Systems (Nios II)

The EP2C70F896C7 supports embedded soft-processor systems using the Nios II /f core, where the 622 user I/Os handle Ethernet MAC, USB ULPI, SD-card, and LCD interfaces simultaneously. The 1,152 Kbit of on-chip M4K memory holds instruction cache, data cache, and tightly-coupled SRAM for deterministic interrupt latency. With 68,416 logic elements, designers fit a Nios II /f (32-bit) plus custom peripherals such as UART, SPI, and GPIO in fewer than 8,000 LEs, leaving headroom for application logic. The 4 PLLs and 16 global clocks allow precise timing for SDRAM and multi-bus interfaces.

🧩

ASIC Prototyping & Emulation

The EP2C70F896C7 serves as a low-cost ASIC prototyping vehicle for designs up to approximately 500,000 ASIC gates. Engineers partition the ASIC into clock domains and map each partition into one Cyclone II, using the 622 I/Os as prototype chip-to-chip interconnect at LVCMOS 2.5 V/3.3 V. The 150 embedded multipliers and 1,152 Kbit memory allow cycle-accurate modeling of DSP and SRAM macros, while JTAG-based configuration permits rapid compile-test-debug cycles. Quartus II 13.0 sp1 with Synopsys Design Compiler back-end flow is the typical prototyping flow for ASIC tape-out validation.

🔧

Test & Measurement Front-End

The EP2C70F896C7 suits digital test and measurement front-ends because its 622 I/Os connect directly to multi-channel data-acquisition ADCs, logic-analyzer probes, and protocol-analyzer pods. The 4 PLLs derive multiple clock domains for sample-rate conversion and trigger logic, while 1,152 Kbit of M4K memory implements deep capture buffers with markers. Engineers run pattern-generation and bit-error-rate test (BERT) cores entirely in fabric, with LVDS I/O pairs supporting high-speed serial test patterns up to 805 Mbps. The 150 multipliers support real-time FFT-based spectrum analysis for signal-integrity test equipment.

What is the EP2C70F896C7?
The EP2C70F896C7 is a Cyclone II FPGA manufactured by Intel (formerly Altera) using 90 nm CMOS technology. According to the Altera Cyclone II Family datasheet, it contains 68,416 logic elements, 1,152,000 RAM bits, 150 18x18 multipliers, and 622 user I/O pins housed in a 896-ball FBGA package with C7 commercial speed grade. It is a legacy part now in Not Recommended for New Designs (NRND) status but still widely used in long-life industrial, military, and medical programs.
Where can I buy EP2C70F896C7 online?
The EP2C70F896C7 is available through major distributors including DigiKey (datasheet URL https://www.digikey.com/en/products/detail/altera/EP2C70F896C7/817584), Mouser, and authorized brokers such as Heisener, JAK Electronics, and Vyrian. As of 2026-09-08, lead time from Heisener is roughly 1-2 weeks. Because the part is NRND, buyers should confirm RoHS compliance and factory date code with the supplier.
What is the price of EP2C70F896C7?
The EP2C70F896C7 unit price is approximately USD 441.28 at quantity 1 as of 2026-09-08, dropping to USD 268.75 at quantity 1000. Pricing varies across distributors - JAK Electronics lists USD 812.64 at single-piece SPQ pricing, while Heisener shows USD 441.28 at qty 1. Always request a current quote because the part is NRND and spot-market prices fluctuate significantly.
What is the lead time for EP2C70F896C7?
Lead time for the EP2C70F896C7 is typically 2-4 weeks through authorized distributors as of 2026-09-08. Heisener estimates delivery within 1-2 weeks, while Octopart aggregates stock across 16 distributors where you can find inventory immediately. Because Cyclone II is NRND, longer-term orders should include buffer stock or a last-time-buy clause.
Is EP2C70F896C7 in stock?
Yes, the EP2C70F896C7 is currently in stock at multiple distributors as of 2026-09-08. Heisener reports 5,008 pieces, Wolfchip reports 10,560 pieces updated April 2026, and Intel-branded stock at 4,288 pieces. Total Octopart-aggregated inventory across 16 channels is robust because Cyclone II remains a legacy high-volume part.
EP2C70F896C7 vs EP2C70F896C7N - what is the difference?
According to the FindIC comparison page, the EP2C70F896C7 and EP2C70F896C7N share the same silicon die, 896-FBGA package, and 68,416 logic-element architecture. The 'N' suffix typically indicates lead-free and/or Pb-free terminal finish compliant with current environmental directives, while the standard 'C7' part may carry older terminal plating. Both are pin-compatible drop-ins for the same FBGA footprint.
How does EP2C70F896C7 compare to EP2C70F896C6?
The EP2C70F896C7 differs from the EP2C70F896C6 by speed grade only: C7 is the slowest speed bin and C6 is one step faster. Both share the same 68,416 LE count, 1,152 Kbit RAM, 622 user I/Os, and the 896-FBGA package. Engineers choosing between them balance timing margin against price; C6 typically costs 15-25% more than C7.
When should I choose EP2C70F896C7 over EP2C50F896C7?
The EP2C70F896C7 is the larger sibling of the EP2C50F896C7 family with 68,416 LEs versus 50,560 LEs, plus more M4K memory and additional multipliers. Choose the EP2C70 when your design requires 80-95% logic utilization at the 50K part, needs extra DSP/multiplier blocks, or requires wider memory bandwidth for video buffering. Otherwise the EP2C50 delivers equivalent I/O and timing margin at lower cost.
What is the best drop-in replacement for EP2C70F896C7?
The best drop-in replacement for EP2C70F896C7 on the same 896-FBGA footprint is the EP2C70F896C7N, which is the lead-free version of the same die. The EP2C70F896C6N is another drop-in option offering a faster C6 speed grade in the identical package. Both share 68,416 LEs, 1,152 Kbit RAM, and 622 I/Os, allowing PCB reuse without re-layout.
Can a Cyclone IV or Cyclone V device replace EP2C70F896C7?
No, Cyclone IV (EP4CE) and Cyclone V (5CE) FPGAs are NOT drop-in compatible with the EP2C70F896C7. They require different footprints, different power rails (1.0 V core vs 1.2 V), different configuration schemes, and a different Quartus toolchain. To migrate from Cyclone II to Cyclone IV/V you must perform a full re-design and PCB re-layout.
Where can I download the EP2C70F896C7 datasheet PDF?
The official Altera Cyclone II handbook is available at https://www.altera.com/literature/hb/cyc2/cyc2_cii51008.pdf and contains the complete electrical, timing, and pinout specifications for the EP2C70F896C7. For IBIS and BSDL models, use the Altera mySupport download center. The Cyclone II device family datasheet is the recommended reference for new designs.
Where can I find the EP2C70F896C7 pinout?
The full EP2C70F896C7 pinout for the 896-ball FBGA package is published in the Cyclone II Device Handbook, Chapter 7. The pinout PDF lists each of the 896 balls (622 user I/O, plus power, ground, configuration, and JTAG balls). Use the Quartus II Pin Planner tool (version 13.0 sp1) to view the pinout interactively and export CSV files.
What configuration modes does EP2C70F896C7 support?
The EP2C70F896C7 supports four configuration modes: Active Serial (AS) loading from a serial flash, Passive Serial (PS) loading by an external host, Fast Passive Parallel (FPP) using an 8-bit parallel host, and JTAG (IEEE 1149.1) for boundary-scan and in-system programming. According to the Cyclone II handbook, configuration is performed from an external non-volatile memory at every power-up because the SRAM configuration cells are volatile.
What is the lifecycle status of EP2C70F896C7?
The EP2C70F896C7 is currently classified as Not Recommended for New Designs (NRND) as of 2026-09-08. Intel continues to ship existing orders but discourages new platform adoptions. Existing designs in industrial, medical, and military long-life-cycle programs continue to receive support and last-time-buy windows.
How many embedded multipliers does EP2C70F896C7 have?
The EP2C70F896C7 includes 150 dedicated 18 x 18 hardware multipliers that can be combined to implement 36 x 36 signed multipliers. According to the Cyclone II family datasheet, these multipliers support DSP functions such as FIR filters, FFT butterflies, and image convolution at up to 250 MHz in the -8 speed grade, delivering up to 75 GMACs of fixed-point throughput without consuming general-purpose logic.
Hey Google, what power supply does the EP2C70F896C7 need?
The EP2C70F896C7 requires a 1.2 V core supply (VCCINT) and 8 separate VCCIO banks that can be independently set to 1.5 V, 1.8 V, 2.5 V, or 3.3 V. According to the Cyclone II handbook, the device also needs a 2.5 V VCCPD supply for the configuration I/O and PLL analog VCCA (2.5 V) plus VCCD_PLL (1.2 V) for each PLL. Power sequencing must ramp VCCINT before VCCPD per datasheet rules.
Is there a cross-brand equivalent for EP2C70F896C7?
No cross-brand (e.g., Xilinx, Lattice, Microchip) drop-in alternative exists for the EP2C70F896C7 because the 896-FBGA pinout, ball assignments, configuration pins, and JTAG chain are Altera/Intel proprietary. Engineering-equivalent parts from other vendors are Xilinx Spartan-6 or Lattice ECP5, but they use different footprints, different configuration schemes, and different bitstream formats, requiring full PCB re-layout.

Engineering reference data for EP2C70F896C7 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP2C70F896C7 when you need a Cyclone II FPGA with the slowest speed grade and prefer lowest-cost spot-market pricing for high-volume legacy production. Switch to EP2C70F896C7N if your assembly process requires lead-free terminal finish (N suffix) per RoHS. Upgrade to EP2C70F896C6 or EP2C70F896C6N when timing closure fails on the C7 speed grade - C6 silicon offers roughly 15% faster Fmax at modest cost premium. All four parts share the same 896-FBGA footprint, allowing PCB reuse. Do not migrate to Cyclone IV (EP4CE) or Cyclone V (5CE) unless a full PCB re-layout is planned, because those families use different footprints, different core voltages (1.0 V vs 1.2 V), and different configuration schemes.

Comparison with Alternatives

Parameter This Product EP2C70F896C7N EP2C70F896C6 EP2C70F896C6N
Package 896-FBGA 896-FBGA - same 896-FBGA - same 896-FBGA - same
Brand Intel Intel Intel Intel
Speed Grade C7 (slowest) C7 C6 (~15% faster Fmax) C6 (~15% faster Fmax)
Logic Elements 68,416 68,416 68,416 68,416
User I/O 622 622 622 622
Embedded RAM 1,152 Kbit 1,152 Kbit 1,152 Kbit 1,152 Kbit
18 x 18 Multipliers 150 150 150 150
Lead-Free Terminal Finish Not specified Yes (N suffix) Not specified Yes (N suffix)
Lifecycle Status NRND NRND NRND NRND

Key Differentiators

  • Same silicon die with lead-free finish (vs EP2C70F896C7N)
  • ~15% higher Fmax in same package (vs EP2C70F896C6)
  • Lead-free finish plus faster speed grade (vs EP2C70F896C6N)

Design Notes

Cyclone II requires four power rails: VCCINT (1.2 V core), VCCIO (eight banks, 1.5/1.8/2.5/3.3 V), VCCPD (2.5 V for configuration I/O), and VCCA_PLL + VCCD_PLL (analog supplies for each PLL). Power sequencing must ramp VCCINT stable before VCCPD per datasheet rules. Estimated: at 100 MHz toggle rate and 70% utilization, the EP2C70 dissipates approximately 2.5-3.5 W through VCCINT alone; budget at least 5 W total including I/O switching.

The 896-FBGA package has a theta_JA of approximately 14 C/W with a JEDEC JESD51 4-layer test board. Estimated: at 5 W total dissipation, junction temperature rise is about 70 C above ambient. Place thermal vias in the FBGA land pattern to a large inner-plane copper pour for a theta_JA reduction toward 8-10 C/W. For industrial applications, derate ambient to 60 C maximum to stay below the 125 C junction limit.

Use at least 6 PCB layers for the EP2C70F896C7 with dedicated ground and 1.2 V power planes beneath the FPGA. Place 0.1 uF decoupling caps every 20-30 I/O balls and bulk 100 uF caps at each power-pin cluster. Route LVDS pairs with 100 ohm differential impedance and length-matching within 50 mils. Reference the Altera Cyclone II handbook chapter on board design for the complete via-in-pad and microvia guidance specific to the 896-FBGA ball pitch.

Do not assume JTAG configuration is the only mode - the EP2C70's MSEL pins (set during PCB layout) choose Active Serial, Passive Serial, Fast Passive Parallel, or JTAG mode. A wrong MSEL strapping leaves the device un-configured at power-up. Use Quartus II 13.0 sp1 (last supported release) and select a configuration flash compatible with the AS mode (EPCS4/EPCS16/EPCS64) before finalizing the BOM. Always verify pull-up/pull-down resistors on nCE, nCONFIG, and nSTATUS.

For DDR2 interfaces, route address/command with 50 ohm controlled impedance and length-match DQ/DQS within +/-25 mils. Cyclone II PLLs can deskew DQS groups, but the FPGA-internal deskew chain has limited granularity. Always run IBIS simulation with the Altera-provided EP2C70 IBIS model and use HyperLynx or SiSoft QCD for SSO analysis on heavily-loaded synchronous buses.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance status not explicitly stated in retrieved web data. Part is NRND. The 'N' suffix variants (EP2C70F896C7N, EP2C70F896C6N) are typically lead-free per Altera's historical nomenclature. Confirm with supplier CoC.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP2C70F896C7 EP2C70F896C7N EP2C70F896C6 EP2C70F896C6N Cyclone II FPGA Field Programmable Gate Array logic element 896-FBGA FineLine BGA M4K memory block 18 x 18 multiplier PLL 1.2 V core voltage Quartus II Nios II JTAG Active Serial configuration RoHS REACH AEC-Q100 ASIC prototyping industrial motor control video surveillance embedded soft processor DDR2 memory controller
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