EP2C70F896C8N - Cyclone II FPGA, 68K LE, 896-FBGA | Intel/Altera
MPN: EP2C70F896C8N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $315.92 | $315.92 |
| 10 | $284.5 | $2,845.00 |
| 100 | $253 | $25,300.00 |
| 500 | $221.4 | $110,700.00 |
| 1,000 | $189.55 | $189,550.00 |
EP2C70F896C8N Overview
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing, sitting within the broader hierarchy of programmable logic devices (PLD) → FPGA → digital semiconductor → integrated circuit. The Cyclone II family was architected to deliver ASIC-like density at ASIC-competitive pricing, displacing gate arrays in cost-sensitive volume applications such as consumer electronics, industrial control, and communications infrastructure.
Key features include up to 250 MHz internal operation, dedicated DSP blocks for high-speed multiply-accumulate operations, and Cyclone II's signature low-power architecture that consumes 50 percent less dynamic power than its Cyclone predecessor. The device also offers up to four PLLs for clock management, supporting frequency synthesis, phase shifting, and zero-delay buffering. The 896-FBGA package supports high-density board designs with extensive I/O access while maintaining a compact 31 mm x 31 mm footprint.
The EP2C70F896C8N utilizes a SRAM-based configuration cell with on-chip configuration memory, requiring an external configuration device such as the EPCS16 or EPCS64 serial flash for standalone operation. Cyclone II devices support the Quartus II design software (version 13.0 and later recommended for legacy support), with IP libraries for DDR/DDR2 SDRAM controllers, PCI, PCI Express, and Ethernet MAC functions. The 90 nm process node and 1.2 V core voltage deliver an optimal balance of performance and power consumption for cost-optimized designs.
Typical applications include video processing and display controllers, industrial Ethernet and fieldbus gateways, motor control and servo drives, low-cost software-defined radio front-ends, and ASIC prototyping for mid-complexity designs. The 622 available user I/Os and 150 DSP blocks make it well-suited for parallel signal processing tasks such as image filtering and digital pre-distortion.
When designing with this device, ensure that the configuration scheme is selected before PCB layout, since the dual-purpose configuration pins differ across AS, PS, and JTAG modes. The 896-FBGA package requires microvia-compatible PCB fabrication and careful power-plane segmentation to maintain signal integrity at 250 MHz.
Drop-in alternatives for EP2C70F896C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C70F896C8N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Configuration Modes, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C70F896C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$225 / Unit
View Datasheet →EP2C70F896C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$175 / Unit
View Datasheet →EP2C70F896I8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP2C70F672C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$239.75 / Unit
View Datasheet →EP2C50F896C8N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4CE75F23C8N
✅ Drop-In✓ In Stock
$42.3 / Unit
View Datasheet →EP2C70F896C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Family Name | Cyclone II |
| Logic Elements | 68,416 |
| Embedded Memory | 1,152,000 bits |
| Number of I/O | 622 |
| Number of Logic Blocks/Elements | 68,416 |
| Embedded Multipliers | 150 (18x18) |
| Number of PLLs | 4 |
| Process Technology | 90 nm low-k CMOS |
| Core Voltage | 1.2 V |
| Operating Temperature | 0C to +85C (Commercial) |
| Package | 896-FBGA (FineLine BGA) |
| Package Dimensions | 31 mm x 31 mm |
| Mounting Type | Surface Mount |
| Speed Grade | 8 |
| RoHS Status | RoHS Compliant |
| Lead Free Status | Lead Free |
| Configuration Method | Passive Serial / Active Serial / JTAG |
| User Flash Memory | 0 (external EPCS required) |
EP2C70F896C8N 31 mm x 31 mm Pin Configuration Guide
Pin configuration for EP2C70F896C8N (31 mm x 31 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C70F896C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C70F896C8N is suitable for 7 applications: Video Processing and Display Controllers, Industrial Ethernet and Fieldbus Gateways, Motor Control and Servo Drives, Software-Defined Radio Front-Ends, ASIC Prototyping for Mid-Complexity Designs, Medical Imaging Pre-Processing, LED Video Wall Display Controllers.
Video Processing and Display Controllers
The EP2C70F896C8N is well-suited for video processing applications such as multi-format video scalers, deinterlacers, and LCD/LED display controllers. The device's 622 user I/Os enable parallel 24-bit RGB or dual-link LVDS video interfaces, while 150 embedded 18x18 multipliers handle real-time color space conversion and 2D filtering operations. The 1,152,000 bits of embedded memory provides line buffers for HD video at 1080p60. Compared to ASIC alternatives, the FPGA's reprogrammability allows late-stage firmware updates for emerging video standards such as HDMI 1.4 or DisplayPort 1.2 without board respins.
Recommended
Industrial Ethernet and Fieldbus Gateways
The EP2C70F896C8N enables multi-protocol industrial gateways supporting PROFINET, EtherCAT, EtherNet/IP, Modbus TCP, and CANopen on a single chip. Its 250 MHz core frequency and 150 dedicated multipliers provide deterministic MAC-layer processing with hardware-accelerated CRC and frame stamping, while the 622 I/Os can host multiple isolated PHY interfaces, RS-485 transceivers, and CAN controllers concurrently. The commercial 0C to +85C temperature range suits factory-floor enclosures with active cooling. For harsh industrial environments, the industrial-temperature EP2C70F896I8N variant delivers -40C to +100C operation in the same package.
Recommended
Motor Control and Servo Drives
In multi-axis servo drives and AC induction motor controllers, the EP2C70F896C8N provides the FPGA fabric for parallel current-loop control of up to six axes. The 150 embedded 18x18 multipliers execute Park/Clarke transforms and space-vector PWM at sub-microsecond latency, while 4 PLLs generate the precisely-phased carrier frequencies for IGBT gate drivers. The 622 I/Os handle quadrature encoder inputs, Hall-effect sensors, and PWM outputs without external logic. Compared to a DSP+ASIC solution, this Cyclone II design consolidates the control loop, communication stack (EtherCAT/CAN), and safety logic on one device, reducing BOM and PCB complexity.
Recommended
Software-Defined Radio Front-Ends
The EP2C70F896C8N supports cost-sensitive SDR front-ends for amateur radio, public-safety, and low-volume cellular applications. Its 150 multipliers handle 16-bit quadrature demodulation, channelization filtering, and DDC (digital down-conversion) at IF bandwidths up to 40 MHz. The 4 PLLs synthesize the sampling clocks for ADCs and DACs, while 1,152,000 bits of embedded memory implement windowing buffers and FFT working storage. The 622 I/Os allow direct interface to high-speed LVDS ADCs such as the AD9228 or AD9645 without external logic.
Recommended
ASIC Prototyping for Mid-Complexity Designs
The EP2C70F896C8N's 68,416 logic elements and 622 I/Os make it a common choice for ASIC RTL prototyping of mid-complexity designs targeting 200K to 500K ASIC gates. Engineers map their synthesizable RTL into the FPGA, validate functional behavior at near-real-time speeds, and then bridge to a real ASIC vendor for tape-out. The Quartus II design flow supports industry-standard HDLs (VHDL, Verilog, SystemVerilog) and provides pin-mapping constraints to align with the final ASIC's I/O ring. The 896-FBGA package with 1.0 mm ball pitch supports the high I/O count typical of prototyping platforms.
Recommended
Medical Imaging Pre-Processing
In ultrasound and endoscopy pre-processing pipelines, the EP2C70F896C8N executes real-time beamforming, envelope detection, and image enhancement at clinical frame rates. The 150 embedded 18x18 multipliers deliver the multiply-accumulate throughput required for phased-array ultrasound beamforming, while the 1,152 Kbits of embedded memory provides per-channel delay-line buffers. The 622 I/Os interface directly to multi-channel AFE5805 or AFE5807 analog front-end ICs from Texas Instruments. While not IEC 60601-qualified itself, the FPGA integrates well into medical imaging subsystems that perform external regulatory compliance at the system level.
Recommended
LED Video Wall Display Controllers
The EP2C70F896C8N drives large LED video walls by aggregating multiple DVI/HDMI/DisplayPort input streams and distributing pixel data across 8 to 16 Gbit/s HUB75E output chains. The 622 I/Os allow direct connection to dozens of LED receiver cards without external line drivers, while the 150 embedded multipliers execute color correction and gamma mapping in real time. The 1,152,000 bits of embedded memory stores frame buffers for seamless transitions between input sources. The 250 MHz fabric comfortably drives 1920x1080 pixel content at 60 Hz refresh rates required by commercial LED wall installations.
Recommended
Recommended Products Summary
Engineering reference data for EP2C70F896C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C70F896C8 | EP2C70F896C7N | EP2C70F896I8N | EP2C50F896C8N |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 896-FBGA | 896-FBGA (same) | 896-FBGA (same) | 896-FBGA (same) | 896-FBGA (same) |
| Logic Elements | 68,416 | 68,416 (same) | 68,416 (same) | 68,416 (same) | 50,528 (-26%) |
| User I/O | 622 | 622 (same) | 622 (same) | 622 (same) | 622 (same) |
| Embedded Memory | 1,152,000 bits | 1,152,000 bits (same) | 1,152,000 bits (same) | 1,152,000 bits (same) | 594,432 bits (-48%) |
| Embedded Multipliers (18x18) | 150 | 150 (same) | 150 (same) | 150 (same) | 86 (-43%) |
| Speed Grade | 8 | 8 (same) | 7 (faster) | 8 (same) | 8 (same) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
| Approx. Unit Price (1 qty) | $315.92 | ~$310.00 | ~$325.00 | ~$385.00 | ~$245.00 |
Key Differentiators
- Highest density Cyclone II with maximum I/O count (vs EP2C50F896C8N)
- Industrial temperature variant available (vs EP2C70F896I8N)
- Speed grade 7 option for higher performance (vs EP2C70F896C7N)
- Drop-in compatibility with EP2C70 family (vs EP2C70F896C8)
Design Notes
The EP2C70F896C8N requires a 1.2 V core supply and a 3.3 V I/O supply, plus a 2.5 V analog PLL supply (VCCA_PLL) for the 4 PLLs. Cyclone II power sequencing requires core voltage to ramp before I/O voltage to avoid I/O latch-up; use a supervisor IC such as the TPS3808 to enforce sequencing. Estimated: at 250 MHz with 80% logic utilization, the device draws approximately 1.0-1.5 A from VCCINT and 0.5-1.0 A from VCCIO. Decouple each VCCINT pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor.
The 896-FBGA uses a 1.0 mm ball pitch with 31 mm x 31 mm body. PCB fabrication must support microvia (laser-drilled) stack-up with minimum 4-6 routing layers to fan out from the inner ball grid. Match all differential pairs to 100 ohm impedance and all single-ended I/O to 50 ohm controlled impedance. Maintain continuous ground planes beneath the device and stitch vias around the BGA perimeter to suppress ground bounce.
The EP2C70F896C8N requires an external configuration memory such as EPCS16, EPCS64, or EPCQ16 for standalone operation. Select configuration mode (AS, PS, or JTAG) via MSEL pins at PCB design time - the choice is not reversible without board rework. For in-system reprogramming, expose the JTAG pins (TCK, TMS, TDI, TDO) to a 10-pin header compatible with the Altera USB-Blaster or Intel FPGA Download Cable.
Common pitfalls include: (1) leaving MSEL pins floating instead of tying to known state; (2) forgetting to enable nCONFIG pull-up; (3) using 2.5 V LVCMOS on I/O banks without checking VCCIO bank voltage; (4) not providing a clean 2.5 V analog PLL supply; (5) designing DDR interfaces without using the dedicated DQS/DQSn pins for byte-level alignment; (6) not running Quartus II TimeQuest timing analysis before board fabrication.
Estimated: at 250 MHz internal operation, source-synchronous interfaces such as DDR SDRAM and LVDS require length-matched traces within 25 mils (0.635 mm) across the byte group. Use series termination resistors on high-speed outputs and minimize via stubs. For DDR2 SDRAM up to 200 MHz, enable Cyclone II's on-chip dynamic phase alignment (DPA) circuitry to ease timing constraints.
Compliance Information
RoHS compliant and lead-free per Alldatasheet.com and DigiKey listings. NRND (Not Recommended for New Designs) lifecycle status as of 2026-09-08. Not AEC-Q100 qualified - this is a commercial FPGA, not an automotive-grade part.
