EP2C70F896C7N - Cyclone II FPGA, 68K LE, 896-BGA | Intel
MPN: EP2C70F896C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $175 | $175,000.00 |
EP2C70F896C7N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement custom digital logic, DSP blocks, and memory interfaces after PCB fabrication. FPGAs sit in the broader semiconductor hierarchy as programmable logic between fixed-function ASICs and CPLDs (Complex Programmable Logic Devices), offering higher logic density than CPLDs and lower NRE cost than ASICs. The Cyclone II family introduced embedded 18x18 multipliers and M4K memory blocks, which made it suitable for digital signal processing, video processing, and embedded control applications.
Key features of the EP2C70F896C7N include 622 maximum user I/O pins, 150 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, support for external memory interfaces including DDR, DDR2, SDR SDRAM, and QDRII SRAM, and configuration via passive serial (PS), active serial (AS), and JTAG modes. The 896-ball FBGA package supports high I/O count with fine-pitch ball grid for high-density board layouts, and the device is lead-free / RoHS compliant.
Typical applications span industrial motor control, video surveillance, image processing, automotive infotainment, and communications infrastructure. The Cyclone II family has been a workhorse for cost-sensitive mid-range designs since 2004, and the EP2C70F896C7N continues to ship into long-lifecycle industrial and embedded products.
When designing with this FPGA, engineers must use the Quartus II (legacy) or Quartus Prime design toolchain for synthesis, place-and-route, and bitstream generation. Power estimation, signal integrity analysis for LVDS links, and DDR2 memory interface timing closure are the three areas that require the most attention during board design.
This page synthesizes distributor pricing, package-compatible same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2C70F896C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C70F896C7N (same form factor and footprint) — differing in Package, Process Technology, Configuration Modes, Speed Grade, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C70F896C7
✅ Drop-In✓ In Stock
$268.75 / Unit
View Datasheet →EP2C70F896C7K
✅ Drop-In✓ In Stock
$178 / Unit
View Datasheet →EP2C70F896C6N
✅ Drop-In✓ In Stock
$274.8 / Unit
View Datasheet →EP2C70F896C6
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP2C70F896C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 68,416 |
| Configurable Logic Blocks (CLB) | 4,276 |
| Total Memory Bits | 1,152,000 |
| Embedded Multipliers (18x18) | 150 |
| Maximum User I/O | 622 |
| PLLs | 4 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 450 MHz |
| Package | FBGA-896 |
| Lead-Free / RoHS | Yes (compliant) |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Configuration Modes | AS, PS, JTAG |
EP2C70F896C7N fbga-896 Pin Configuration Guide
Pin configuration for EP2C70F896C7N (fbga-896 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C70F896C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C70F896C7N is suitable for 6 applications: Industrial Motor Control, Video Surveillance / Image Processing Pipelines, Automotive Infotainment and Driver Assistance, Communications Infrastructure (TDM / Bridging / Aggregation), Test and Measurement Instrumentation, Medical Imaging Pre-Processing.
Industrial Motor Control
The EP2C70F896C7N fits industrial motor control because its 150 embedded 18x18 multipliers implement field-oriented control (FOC) algorithms, SVPWM modulators, and encoder interfaces in a single device. The 622 user I/Os connect to multi-axis power stage feedback, while the four PLLs derive the high-resolution PWM carrier clocks needed for low-ripple torque. The 90nm CMOS core at 1.2V balances logic density and thermal headroom for enclosed industrial cabinets. Compared to a DSP + CPLD partition, the Cyclone II unifies control logic, commutation, and supervisory state machine on one die.
Recommended
Video Surveillance / Image Processing Pipelines
The EP2C70F896C7N's 1,152,000 embedded M4K memory bits buffer video lines for scaling, de-interlacing, and motion detection pipelines. Its 150 DSP multipliers accelerate Sobel edge detection, color space conversion, and JPEG/MJPEG encode pre-processing. The 622 I/Os connect to BT.656, BT.1120, and parallel CMOS sensor interfaces simultaneously, while DDR/DDR2 controllers buffer raw Bayer frames. For multi-channel DVR designs, the Cyclone II's combination of memory and multipliers outperforms legacy CPLD plus DSP solutions on cost-per-channel.
Recommended
Automotive Infotainment and Driver Assistance
Although commercial temperature grade, the EP2C70F896C7N has been widely used in aftermarket automotive infotainment head units, rear-seat entertainment, and ADAS camera pre-processing where 0-85C operating range is acceptable. The DDR2 memory interface drives TFT-LCD framebuffers, while the 150 multipliers implement H.264 decode assist and noise reduction. The 896-ball FBGA supports multi-display LVDS output channels. Designers requiring AEC-Q100 grade should consider the EP2C70F896I7N industrial variant (-40C to +100C) as a drop-in upgrade.
Recommended
Communications Infrastructure (TDM / Bridging / Aggregation)
The EP2C70F896C7N aggregates T1/E1, E3/DS3, and low-rate Ethernet streams in legacy telecom access equipment, with the four PLLs generating 8 kHz frame clocks and serial bit clocks for multiple framers. The 622 I/Os handle dozens of TDM timeslots without external bus switches, and the 1,152,000 memory bits implement jitter buffers. Long-lifecycle telecom designs benefit from the Cyclone II's stable supply and stable Quartus II tool support that prevents re-validation churn.
Recommended
Test and Measurement Instrumentation
The EP2C70F896C7N is deployed in mid-range oscilloscopes, logic analyzers, and protocol testers where its 622 I/Os fan out to multiple front-end ADCs and DACs, and the four PLLs generate the sample clocks. The 150 18x18 multipliers implement FFT, FIR filtering, and digital down-conversion for signal analysis firmware. The 1,152,000 embedded memory bits serve as deep capture buffers. Test equipment vendors value the Cyclone II's deterministic timing and long-term silicon availability for the 10+ year product lifecycles typical in this market.
Recommended
Medical Imaging Pre-Processing
The EP2C70F896C7N performs ultrasound beamforming, endoscope image preprocessing, and patient monitor signal conditioning in mid-range medical devices. Its 150 hardware multipliers execute beam delay-and-sum and Doppler processing for cart-based ultrasound systems. The four PLLs synchronize multi-channel ADC sampling, while DDR2 memory interfaces buffer raw RF frames. The commercial temperature grade suits controlled clinical environments; portable or in-ambulance applications should select the EP2C70F896I7N industrial grade on the same footprint.
Recommended
Recommended Products Summary
Engineering reference data for EP2C70F896C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C70F896C7 | EP2C70F896C7K | EP2C70F896C6N | EP2C70F896C6 | EP2C70F672C8N |
|---|---|---|---|---|---|---|
| Package | FBGA-896 | FBGA-896 (same) | FBGA-896 (same) | FBGA-896 (same) | FBGA-896 (same) | FBGA-672 (different) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 |
| Speed Grade | 7 | 7 | 7 | 6 (faster) | 6 (faster) | 8 (slower) |
| Maximum User I/O | 622 | 622 | 622 | 622 | 622 | 450 |
| Embedded Multipliers | 150 | 150 | 150 | 150 | 150 | 150 |
| Embedded Memory (bits) | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 |
| RoHS / Lead-Free | Yes (N suffix) | No (leaded) | Yes (K suffix) | Yes (N suffix) | No (leaded) | Yes (N suffix) |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
Key Differentiators
- Same-die drop-in with full pin compatibility on the 896-ball FBGA footprint (vs EP2C70F896C7)
- Faster speed grade available on identical die for timing-critical designs (vs EP2C70F896C6N)
- Smaller-package same-die option for cost reduction when I/O count permits (vs EP2C70F672C8N)
Design Notes
The EP2C70F896C7N requires a low-noise 1.2 V core supply capable of delivering up to 1.5 A during configuration and high-utilization operation. Intel recommends the LTM4628 or similar point-of-load regulator placed within 25 mm of the BGA core balls to minimize IR drop and switching noise. A separate 2.5 V or 3.3 V VCCIO supply per bank must be decoupled with 100 nF X7R ceramics as close to each ball as practical. Estimated: at 50% logic utilization and 200 MHz, expect core current near 1.0 A.
The 896-ball FBGA requires a 4-layer to 8-layer PCB stackup with matched 50 ohm single-ended and 100 ohm differential impedances. Use 1 oz copper on outer layers and 0.5 oz on inner layers with a 0.20 mm to 0.25 mm dielectric to hit the 0.8 mm ball pitch. Via-in-pad with filled-and-capped micro-vias is recommended for BGA breakout. DDR2 traces must be length-matched within 50 mil to 100 mil across the byte lanes; failure to do so corrupts the data-eye during memory read/write.
Estimated: at 1.2 V core with 1.0 A core current and 25% toggle rate, the EP2C70F896C7N dissipates approximately 1.2 W internal power. With a 0.5 m/s airflow and a JEDEC JESD51-7 4-layer test board, the theta_JA is around 15 C/W, giving a 18C junction-to-ambient rise. Enclosed industrial cabinets without airflow should size the thermal relief copper pour to 1 square inch minimum to keep junction below 100C. The device does not have an internal thermal diode, so use the on-chip TEMP_SENSE primitive for monitoring.
Do not connect MSEL[2:0] configuration mode pins to the wrong logic level; the EP2C70F896C7N supports AS, PS, and JTAG modes only, and incorrect MSEL strapping causes configuration failure. The nCE (chip enable) and nCONFIG pins must be held high during normal operation; floating these pins triggers an unwanted reconfiguration. The 1.2 V VCCINT ramp must be monotonic and reach 1.0 V within 100 ms; slow or oscillating ramps risk the POR circuit not releasing the device into user mode.
Compliance Information
RoHS compliant per 'N' suffix designation in MPN. Lead-free balls. AEC-Q100 not qualified - commercial temperature grade (0C to +85C) only. For industrial temperature grade (-40C to +100C), consider the EP2C70F896I7N on the same FBGA-896 footprint.
