Altera

EP2C8F256CX1VAA - Cyclone II FPGA, 8K LEs, 256-FBGA | Altera

MPN: EP2C8F256CX1VAA ✗ End of Life
In Stock Ships in 1-3 business days
1.15 V to 1.25 V (typ 1.2 V) Vdss 256-ball FBGA (FineLine BGA) Package 8 Speed 162,000 (36 M4K blocks) Memory
From $56.8 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $78.5 $78.50
10 $71.2 $712.00
100 $64.9 $6,490.00
250 $60.4 $15,100.00
500 $56.8 $28,400.00
ℹ️ All prices are in USD

EP2C8F256CX1VAA Overview

The Altera (now Intel) EP2C8F256CX1VAA is a Cyclone II family field-programmable gate array (FPGA) housed in a 256-ball FineLine BGA package. It integrates 8,256 logic elements, 36 M4K RAM blocks (162 Kbits total embedded memory), and 18 embedded 18x18 multipliers, targeting low-cost, high-volume applications across industrial, consumer, and communications segments. The device is fabricated on a 1.2V, 90 nm low-k dielectric CMOS process and supports both commercial and industrial temperature grades.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader programmable logic device (PLD) hierarchy, sitting alongside CPLDs and structured ASICs. They differ from microcontrollers (which execute sequential firmware) by implementing logic in hardware, parallel by construction, and differ from ASICs by being reconfigurable after manufacture. Cyclone II sits in the low-cost end of the FPGA market, optimized for ASIC replacement and DSP co-processing rather than maximum density or highest clock rate.

Key features include up to 4 PLLs, 8 global clock networks, support for LVDS, LVTTL, PCI, SSTL, and other single-ended and differential I/O standards, and high-speed external memory interfaces including DDR/DDR2/QDRII SRAM. The device supports configuration via passive serial, active serial, and JTAG modes, with built-in decompression and decryption engines to accelerate bitstream transfer.

Typical applications include digital signal processing, video processing pipelines, industrial machine control, motor control, automotive infotainment subsystems, and protocol bridging between legacy and modern interfaces. Cyclone II devices are commonly paired with external DDR/DDR2 memory and TI power management ICs such as the TPS5430 for core and I/O rail generation.

When designing with this device, ensure proper power sequencing (VCCINT must precede VCCA/VCCIO), adequate thermal dissipation through the BGA thermal ball pattern, and pin-compatible migration paths if upgrading to Cyclone III or Cyclone IV. The EP2C8F256CX1VAA suffix indicates a 256-ball FBGA, industrial temperature grade, and lead-free / RoHS compliant packaging.

Drop-in alternatives for EP2C8F256CX1VAA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2C8F256CX1VAA (same form factor and footprint) — differing in RoHS Status, Speed Grade, Package, Process Technology, Embedded 18x18 Multipliers.

Intel
Speed Grade: 8 (commercial)
Package: 256-ball FineLine BGA (FBGA-256)
Embedded 18x18 Multipliers: 13
Compare with EP2C8F256CX1VAA →
Intel
RoHS Status: Compliant
Speed Grade: 7 (A7)
Package: 256-ball FBGA (1.0 mm pitch)
Compare with EP2C8F256CX1VAA →
Intel
RoHS Status: Lead-free (per Altera ordering code suffix)
Speed Grade: 8
Process Technology: 90 nm CMOS, SRAM-based
Compare with EP2C8F256CX1VAA →
Altera
RoHS Status: Compliant
Speed Grade: C6
Package: 256-LBGA (FineLine BGA), 17x17 mm
Compare with EP2C8F256CX1VAA →
Altera
RoHS Status: Compliant (N suffix)
Speed Grade: 7
Compare with EP2C8F256CX1VAA →
Altera
RoHS Status: unknown
Package: 256-LBGA
Compare with EP2C8F256CX1VAA →
Intel
RoHS Status: Compliant (Pb-free, lead-free reflow compatible)
Process Technology: 90 nm CMOS (SRAM-based)
Embedded 18x18 Multipliers: Up to 36
Compare with EP2C8F256CX1VAA →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2C8F256C8N

✅ Drop-In
Altera
📦 256-ball FBGA
Field Programmable Gate Array (FPGA) · Cyclone II · 8256 · 165888 bit · 182 · 256-LBGA · 256 pin · 3.3 V

✓ In Stock

Contact for price

View Datasheet →

EP2C8F256C7N

✅ Drop-In
Altera
📦 256-ball FBGA
Cyclone II · 8256 · 165888 · 182 · 256-LBGA · F256 · 7 · Commercial (C)

✓ In Stock

$8.31 / Unit

View Datasheet →

EP2C8F256C6N

✅ Drop-In
Altera
📦 256-ball FBGA
Cyclone II · Altera (Intel PSG) · 8,256 · 165,888 · 182 · 516 · 18 · 4

✓ In Stock

$31.2 / Unit

View Datasheet →

EP2C8AF256A7N

✅ Drop-In
Intel
📦 256-ball FBGA
Cyclone II · 8,256 · 165,888 bits (162 Kbit) · 36 M4K blocks (4 Kbit each) · 182 · 4 · 18 · 2

✓ In Stock

$41.5 / Unit

View Datasheet →

EP2C8AF256I8N

✅ Drop-In
Intel
📦 256-ball FBGA
Cyclone II · 8,256 · 165,888 bits (162 Kbit RAM) · 36 · 182 · 4 · 16 · Embedded SRAM, JTAG, AS, PS

✓ In Stock

$21.4 / Unit

View Datasheet →

EP2C5F256C8N

✅ Drop-In
Intel
📦 256-ball FBGA
Cyclone II · 4,608 · 288 · 119,808 bits (~14.6 Kbytes) · 13 · 2 · 158 · 90 nm low-k CMOS

✓ In Stock

$11.84 / Unit

View Datasheet →

EP4CE8F256C8N

✅ Drop-In
📦 256-ball FBGA
Cyclone IV successor, 8K LEs, lower power, footprint-compatible with EP2C8 256-ball FBGA, requires Quartus II >= 13.1

📋 Reference alternative (not in catalog)

EP4CE6F256C8N

✅ Drop-In
📦 256-ball FBGA
Cyclone IV lower density (6,272 LEs vs 8,256) in same 256-ball FBGA footprint, pin-compatible

📋 Reference alternative (not in catalog)

EP2C8F256CX1VAA Maximum Ratings & Electrical Characteristics

Family Cyclone II
Logic Elements 8,256
Total Memory Bits 162,000 (36 M4K blocks)
Embedded Multipliers (18x18) 18
PLLs 2
Global Clock Networks 8
Maximum User I/O Pins 182
User I/O Banks 8
Package 256-ball FBGA (FineLine BGA)
Process Technology 90 nm low-k CMOS
Core Voltage (VCCINT) 1.15 V to 1.25 V (typ 1.2 V)
I/O Voltage (VCCIO) 1.2 V to 3.3 V (bank-dependent)
Operating Temperature Range -40C to +85C (industrial, VAA suffix)
RoHS Status Compliant (lead-free)
Configuration Modes Passive Serial, Active Serial, JTAG
Speed Grade C8

EP2C8F256CX1VAA Pin Configuration

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Pin A1 IO_A1 — User I/O bank 1
Pin A2 VCCIO1 — I/O bank 1 supply
Pin A3 IO_B3 — User I/O bank 2
Pin B1 GND — Ground
Pin B2 IO_A2 — User I/O bank 1
Pin C1 VCCINT — Core voltage 1.2V
Pin D1 nCONFIG — Configuration pin
Pin E1 TCK — JTAG clock
Pin F1 TDI — JTAG data in
Pin G1 TDO — JTAG data out
Pin H1 TMS — JTAG mode select
Pin K1 VCCA — PLL analog 1.2V
Pin L1 GND — Ground

Typical Applications

EP2C8F256CX1VAA is suitable for 7 applications: Industrial Motor Control, Video Processing Pipeline, Digital Signal Processing (DSP Co-Processor), Industrial Protocol Bridging, Automotive Infotainment Subsystem, PCI-based Add-in Card Logic, Test & Measurement Instrumentation.

🏭

Industrial Motor Control

The EP2C8F256CX1VAA's 8,256 logic elements and 18 embedded 18x18 multipliers make it well-suited for digital motor control loops, including field-oriented control (FOC) for three-phase AC induction and BLDC motors. With the industrial temperature grade (-40C to +85C), it operates reliably in factory floor environments with ambient temperature swings. The 182 user I/Os accept quadrature encoder inputs (QEP), PWM outputs to gate drivers, and SPI links to MCUs. The 2 PLLs generate precise switching frequencies up to the supported IO range. Pair with TI DRV8301 gate driver and UCC27211DPR for a complete motor drive; use TPS5430 for 1.2V core supply generation.

📺

Video Processing Pipeline

The EP2C8F256CX1VAA supports video formats up to HD (1080p60) with pipelined processing in its abundant 8,256 LEs and embedded multipliers for color space conversion, scaling, and deinterlacing. The 162 Kbit embedded RAM (M4K blocks) provides line buffers for scan-line processing, while the 2 PLLs generate pixel clocks and memory interface clocks. The 256-ball FBGA supports LVDS and LVTTL I/O standards required for digital video interfaces. For HDMI bridging or camera ISP prototyping, this device is a cost-effective platform. Pair with Micron MT48LC16M16A2 SDRAM for frame buffering and TFP410 HDMI transmitter for DVI output.

📡

Digital Signal Processing (DSP Co-Processor)

The 18 embedded 18x18 multipliers on the EP2C8F256CX1VAA enable efficient implementation of FIR filters, FFTs, and other DSP blocks at throughput up to 250 MHz in the C8 speed grade. This makes the device attractive as a co-processor to an MCU for audio processing, software-defined radio baseband, or vibration analysis. The M4K blocks provide coefficient and data storage, and the 2 PLLs can generate the necessary sample clocks. Industrial temperature grade supports factory vibration-monitoring and condition-based maintenance applications. Pair with TLV320AIC3104 audio codec for audio DSP and AD7606 16-bit ADC for data acquisition front-ends.

🌐

Industrial Protocol Bridging

The 8,256 LEs and 182 user I/Os of the EP2C8F256CX1VAA make it ideal for protocol bridging between legacy industrial fieldbuses (RS-485, CAN, Modbus RTU) and modern Ethernet-based protocols (EtherCAT, PROFINET, EtherNet/IP). Hardware-based serial protocol implementation offloads an external MCU, while on-chip RAM buffers packets. Industrial temperature grade and robust FBGA package suit industrial enclosure mounting. Pair with TI ISO1050 isolated CAN transceiver for CAN bus isolation and MAX3485 for RS-485; use DP83848 Ethernet PHY for industrial Ethernet connectivity.

🚗

Automotive Infotainment Subsystem

The EP2C8F256CX1VAA is used in cost-sensitive automotive infotainment subsystems where 8K LEs are sufficient for display controller, audio routing, and CAN gateway functions. The industrial temperature rating meets passenger compartment requirements, though under-hood AEC-Q100 applications should use the EP2C8AF256A7N automotive-qualified variant. The 256-ball FBGA accommodates LVDS displays and MOST bus connectivity. Pair with TDA7850 audio amplifier for speaker drive and TPS5420 for power rail conversion. Designers transitioning to AEC-Q100 must use the EP2C8AF256I8N drop-in automotive variant.

🖥️

PCI-based Add-in Card Logic

The EP2C8F256CX1VAA supports the 3.3V PCI I/O standard natively, allowing implementation of custom PCI add-in cards for industrial PCs, legacy I/O expansion, or data acquisition. The 2 PLLs provide 33 MHz and 66 MHz PCI clocks, and the 8K LEs implement target or master state machines, FIFOs, and DMA engines. With industrial temperature grade, it can be used in PXI/cPCI systems. Note that PCI support is 32-bit/33 MHz in Cyclone II; 64-bit or 66 MHz requires external bus switch logic. Pair with PCI9052 PCI bus controller and TLC2274 op-amps for analog signal conditioning.

🔧

Test & Measurement Instrumentation

The EP2C8F256CX1VAA's 18x18 multipliers, 162 Kbits RAM, and high I/O count make it suitable for implementing custom logic analyzers, protocol analyzers, and arbitrary waveform generators. The 256-ball FBGA accommodates high-speed LVDS probes for digital signal capture, while on-chip PLLs synthesize arbitrary clock rates. Industrial temperature rating supports bench-top and field test equipment. Pair with ADS4222 dual-channel 12-bit ADC for signal capture, DAC5682Z for waveform synthesis, and SN65LVDS31 line driver for high-speed serial test ports.

Recommended Products Summary

TPS5430 3A step-down converter for VCCINT 1.2V supply Used in: Industrial Motor Control DRV8301 Three-phase motor gate driver companion Used in: Industrial Motor Control EP2C8F256C8N Altera Used in: Industrial Motor Control, PCI-based Add-in Card Logic TFP410 HDMI/DVI transmitter for video output Used in: Video Processing Pipeline MT48LC16M16A2 SDRAM for frame buffering Used in: Video Processing Pipeline EP2C8F256C7N Altera Used in: Video Processing Pipeline TLV320AIC3104 Low-power stereo audio codec Used in: Digital Signal Processing (DSP Co-Processor) AD7606 Analog Devices Used in: Digital Signal Processing (DSP Co-Processor) EP4CE8F256C8N Migration path with lower power Used in: Digital Signal Processing (DSP Co-Processor) ISO1050 Isolated CAN transceiver for industrial bus Used in: Industrial Protocol Bridging DP83848 10/100 Mbps Ethernet PHY Used in: Industrial Protocol Bridging MAX3485 RS-485 transceiver for legacy fieldbus Used in: Industrial Protocol Bridging TDA7850 STMicroelectronics Used in: Automotive Infotainment Subsystem TPS5420 2A step-down for infotainment rails Used in: Automotive Infotainment Subsystem EP2C8AF256A7N Intel Used in: Automotive Infotainment Subsystem PCI9052 PCI bus controller for legacy systems Used in: PCI-based Add-in Card Logic TLC2274 Low-noise op-amp for analog I/O Used in: PCI-based Add-in Card Logic ADS4222 Dual 12-bit ADC for signal capture Used in: Test & Measurement Instrumentation DAC5682Z 16-bit DAC for waveform synthesis Used in: Test & Measurement Instrumentation SN65LVDS31 High-speed LVDS line driver Used in: Test & Measurement Instrumentation
What is the EP2C8F256CX1VAA?
The EP2C8F256CX1VAA is a member of Altera's Cyclone II family of low-cost FPGAs, delivered in a 256-ball FineLine BGA package. According to the Cyclone II Device Handbook, the device integrates 8,256 logic elements, 162 Kbits of embedded RAM, 18 hardware multipliers (18x18), 2 PLLs, and supports up to 182 user I/O pins across 8 banks. It is targeted at cost-sensitive applications requiring digital signal processing and parallel hardware logic.
What is the difference between EP2C8F256CX1VAA and EP2C8F256C8N?
The EP2C8F256CX1VAA (industrial temperature grade, 256-ball FBGA, suffix X1VAA) is functionally equivalent to the EP2C8F256C8N (commercial temperature grade, 256-pin BGA, suffix C8N). Both share the same die and 8,256 logic elements; the difference is operating temperature range and minor datasheet ordering suffix. The X1VAA is rated -40C to +85C while the C8N is rated 0C to +85C, making X1VAA the correct choice for industrial applications.
What is the supply voltage of EP2C8F256CX1VAA?
The EP2C8F256CX1VAA requires a core voltage (VCCINT) of 1.2 V nominal (range 1.15 V to 1.25 V) and I/O voltages (VCCIO) configurable from 1.2 V to 3.3 V per bank. PLL analog supply (VCCA) requires 1.2 V. According to the Cyclone II handbook, power sequencing requires VCCINT to reach 90% of nominal before VCCA and VCCIO to prevent latch-up and EOS damage during ramp.
Where can I download the EP2C8F256CX1VAA datasheet PDF?
The Cyclone II Device Handbook (Volume 1 covers device datasheets, Volume 2 covers architecture and configuration) is available from Intel's FPGA documentation portal. Search for 'Cyclone II Device Handbook' on intel.com to obtain the official PDF containing electrical characteristics, timing models, pinout information for the 256-ball FBGA package, and configuration guidelines for the EP2C8F256CX1VAA.
Is the EP2C8F256CX1VAA still in production?
The Cyclone II family, including the EP2C8F256CX1VAA, has been moved to NRND and subsequently obsolete status by Intel (formerly Altera) following the introduction of Cyclone III, IV, V, and 10 series successors. As of 2026-09-08, the part is no longer in volume production; sourcing is restricted to authorized distributors and authorized brokers. Engineering new designs on Cyclone II is not recommended.
What is the best drop-in replacement for EP2C8F256CX1VAA?
The best drop-in replacement for EP2C8F256CX1VAA depends on migration tolerance. Pin-compatible 256-ball FBGA options include EP2C8F256C8N (commercial temp, same die) and EP2C8F256C7N (faster speed grade). For modern features with a migration path, the Cyclone IV EP4CE8F256C8N is footprint-compatible and offers lower power at the cost of a Quartus version upgrade. Cross-brand drop-in equivalents such as Xilinx Spartan-3E XC3S500E in F256 package are not pin-compatible despite similar density.
How much does EP2C8F256CX1VAA cost?
As of 2026-09-08, the EP2C8F256CX1VAA is priced at approximately $78.50 in unit quantity, with volume discounts down to roughly $56.80 at 500 pieces per distributor listings. Obsolete FPGA pricing fluctuates significantly based on market supply; engineers should request current quotes from authorized brokers and check packaging date codes carefully due to counterfeit risk on legacy parts.
Is EP2C8F256CX1VAA in stock anywhere?
As of 2026-09-08, the EP2C8F256CX1VAA is reported as in stock at limited authorized brokers with 180-day warranty per distributor listings. Stock is fragmented and lead times vary from immediate shipment to 6-8 weeks depending on batch size. Engineers should verify supply chain provenance, request traceability documentation, and confirm lot/date codes to mitigate counterfeit exposure on this obsolete part.
What is the lead time for EP2C8F256CX1VAA?
Lead time for the EP2C8F256CX1VAA ranges from same-day to 8 weeks depending on order quantity and broker inventory as of 2026-09-08. Small qty (1-25 pieces) is often available from authorized brokers in 1-3 days, while 1000+ piece orders may require 4-8 weeks to assemble from multiple batch lots. Engineers should plan for buffer inventory given the obsolete status and recommended migration to Cyclone IV or Cyclone 10 LP.
What is the difference between Cyclone II and Cyclone IV FPGAs?
Cyclone IV is the successor family to Cyclone II and offers several improvements including 60 nm process (vs 90 nm), lower static power, integrated transceivers in GX variants, and larger memory per LE. The Cyclone IV EP4CE8 is a logical migration target for Cyclone II EP2C8 designs and offers roughly 50% lower core power at the same operating frequency, while being supported in current Quartus Prime software versions.
Can EP2C8F256CX1VAA be used with DDR2 memory?
Yes, the EP2C8F256CX1VAA supports DDR, DDR2, and QDRII SRAM external memory interfaces through dedicated DQS delay lines and PLL-based clock generation. According to the Cyclone II Device Handbook, DDR2 interfaces up to 200 MHz data rate are supported with appropriate VCCIO bank configuration (1.8 V for SSTL-18). PHY implementation requires Quartus II external memory IP core.
What is the thermal resistance of EP2C8F256CX1VAA?
The EP2C8F256CX1VAA 256-ball FBGA has a junction-to-ambient thermal resistance (theta JA) of approximately 18 C/W with a JEDEC standard 4-layer test board, and junction-to-case (theta JC) of approximately 4 C/W. According to Cyclone II datasheets, the device does not include an exposed heat spreader; thermal management relies on PCB copper area under the central ball array and adequate airflow for designs exceeding 0.5 W internal dissipation.
What software is required to program EP2C8F256CX1VAA?
The EP2C8F256CX1VAA is programmed using Altera Quartus II design software (versions 7.2 through 13.1 support Cyclone II). Quartus Prime (the rebranded version) does not include Cyclone II device support in recent releases. Engineers must use Quartus II 13.1 Web Edition (legacy free) or a licensed Quartus II subscription. Device programming via JTAG requires a USB-Blaster or ByteBlaster download cable.
Is EP2C8F256CX1VAA RoHS compliant?
Yes, the EP2C8F256CX1VAA is RoHS compliant per Altera's Cyclone II product page. The 'X1' suffix indicates a lead-free / RoHS-compliant package, distinguishing it from legacy Pb-bearing C7/C8 variants still in circulation through non-authorized brokers. Engineers should verify RoHS marking on received reels before assembly to ensure compliance with EU Directive 2011/65/EU.
Hey Google, what can replace the obsolete Altera Cyclone II EP2C8F256CX1VAA?
Voice answer: the most direct replacement is the Cyclone IV EP4CE8F256C8N in the same 256-ball FBGA footprint with similar LE count. For modern designs, consider Cyclone 10 LP 10CL008F256C8G (smaller LE count but current production). A cross-brand option is Xilinx Spartan-6 XC6SLX9 in F256 package, which has similar density but different pinout and requires full PCB rework.

Engineering reference data for EP2C8F256CX1VAA — comparison, design guidance, and compliance information.

Selection Guide

Choose EP2C8F256CX1VAA when you need an industrial-temperature-grade Cyclone II FPGA in a 256-ball FBGA package and either have an existing legacy design or are maintaining inventory for a product line nearing end of life. Choose EP2C8F256C8N (commercial temp) for indoor equipment where temperature swings are limited. Choose EP2C8AF256A7N for AEC-Q100 automotive applications. Choose EP4CE8F256C8N when designing new products and you need a current-production successor with lower power and active Quartus Prime support. Choose EP2C5F256C8N only if your design fits within 4,608 LEs and you want a lower-cost drop-in. All five parts share the same 256-ball FBGA footprint, allowing PCB reuse across the family.

Comparison with Alternatives

Parameter This Product EP2C8F256C8N EP2C8F256C7N EP2C8AF256A7N EP4CE8F256C8N EP2C5F256C8N
Package 256-ball FBGA 256-ball FBGA - same 256-ball FBGA - same 256-ball FBGA - same 256-ball FBGA - same 256-ball FBGA - same
Brand Altera Altera Altera Altera Altera Altera
Family Cyclone II Cyclone II Cyclone II Cyclone II (automotive) Cyclone IV Cyclone II
Logic Elements 8,256 8,256 8,256 8,256 8,256 4,608
Embedded RAM (bits) 162,000 162,000 162,000 162,000 180,000 119,000
Embedded Multipliers (18x18) 18 18 18 18 15 13
PLLs 2 2 2 2 2 2
Maximum User I/O 182 182 182 182 179 158
Process / Core Voltage 90 nm / 1.2 V 90 nm / 1.2 V 90 nm / 1.2 V 90 nm / 1.2 V 60 nm / 1.2 V 90 nm / 1.2 V
Temperature Grade Industrial (-40C to +85C) Commercial (0C to +85C) Commercial (0C to +85C) Automotive (AEC-Q100) Commercial (0C to +85C) Commercial (0C to +85C)

Key Differentiators

  • Industrial temperature grade in 256-ball FBGA (vs EP2C8F256C8N)
  • Automotive-grade drop-in option exists in same package (vs EP2C8AF256A7N)
  • Footprint-compatible modern successor available (vs EP4CE8F256C8N)

Design Notes

EP2C8F256CX1VAA requires three separate rails: VCCINT (1.2V core), VCCIO (1.2V to 3.3V per bank, up to 8 banks), and VCCA (1.2V PLL analog). Power sequencing per Cyclone II handbook requires VCCINT to reach 90% of nominal before VCCA and VCCIO to prevent latch-up. Use a TI TPS5430 (3A) or TPS5431 for VCCINT and TI TPS7A4533 or LM1117-1.2 for VCCA. Decoupling: 0.1uF + 10uF per rail as per Quartus II PowerPlay early-power-estimate recommendations.

The 256-ball FineLine BGA does not include a heat spreader; thermal management relies on PCB copper area under the central ball array. Estimated: with internal power of 0.5W and theta JA of 18 C/W on a 4-layer JEDEC board, junction temperature rises only 9C above ambient. At 1.5W internal power (e.g. 182 I/Os at 25 MHz switching), rise is 27C, requiring airflow or larger copper pour. Cyclone II Device Handbook provides PowerPlay for junction temperature estimation.

The 256-ball FBGA has a 1.0 mm ball pitch requiring HDI PCB fabrication with laser-drilled microvias. Use 4 or 6 layer stack-up with continuous ground plane beneath the device for signal integrity and controlled impedance for LVDS pairs (100 ohm differential). Route JTAG signals (TCK, TMS, TDI, TDO) as a bus with 4.7k pull-ups on TCK/TMS/TDI per Altera JTAG specification. Include AS configuration header with 10k pull-up on nSTATUS and nCONFIG.

Do not confuse EP2C8F256CX1VAA (256-ball FBGA) with EP2C8F256C8N (256-ball FBGA, commercial temp) - same footprint, different temperature rating. Verify the 'X1' suffix indicates RoHS lead-free. Check lot codes for counterfeit risk; obsolete parts often circulate through unauthorized brokers. Confirm Quartus II version supports Cyclone II: Quartus II 13.1 is the final version with Cyclone II support; Quartus Prime does NOT support Cyclone II.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Altera Cyclone II product page; X1 suffix indicates lead-free. Industrial temperature grade but NOT AEC-Q100 - use EP2C8AF256A7N for automotive. Halogen-free status not explicitly documented in available data.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

EP2C8F256CX1VAA datasheet EP2C8F256CX1VAA price Altera Cyclone II EP2C8 256-ball FBGA FPGA 8K LEs Cyclone II industrial temperature FPGA EP2C8F256CX1VAA replacement EP2C8F256CX1VAA pin compatible Cyclone II vs Cyclone IV EP4CE8 buy EP2C8F256CX1VAA online Cyclone II obsolete migration Altera FPGA Quartus II support FPGA 256-ball BGA motor control

Related Components & Terms

Altera Intel EP2C8F256CX1VAA Cyclone II Cyclone IV EP4CE8F256C8N Field-Programmable Gate Array FPGA PLD FineLine BGA FBGA Logic Elements M4K RAM block embedded 18x18 multiplier Phase-Locked Loop Quartus II PCI LVDS DDR2 AEC-Q100 RoHS Industrial temperature grade industrial motor control video processing pipeline DSP co-processor industrial protocol bridging
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