EP2C8AF256A7N - Cyclone II FPGA, 8K LE, 256-FBGA | Intel / Altera
MPN: EP2C8AF256A7N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $75.18 | $75.18 |
| 10 | $68.5 | $685.00 |
| 100 | $58.2 | $5,820.00 |
| 500 | $49.1 | $24,550.00 |
| 1,000 | $41.5 | $41,500.00 |
EP2C8AF256A7N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that lets designers configure digital logic blocks, interconnect, and I/O behavior after PCB fabrication. Within the programmable logic taxonomy, FPGAs sit above simple CPLDs and below ASICs in terms of integration density, offering hundreds of thousands of logic gates, embedded memory blocks, hardware multipliers, and high-speed transceivers in a single chip. The Cyclone II family targets cost-sensitive, high-volume applications such as consumer electronics, automotive infotainment, and industrial control, where designers need ASIC-class logic density without the NRE cost of a custom mask set.
Key Cyclone II features include 4-Kbit M4K embedded RAM blocks, dedicated 18-bit x 18-bit hardware multipliers for DSP functions, up to four PLLs per device for clock management, and support for external memory interfaces including DDR, DDR2, and QDR II SRAM. The 'A' in the part number denotes the 1.5 V I/O standard support, while 'F256' indicates the 256-ball FBGA package and 'A7N' specifies the speed/temperature grade. Per the datasheet, the EP2C8A variant specifically supports 182 maximum user I/O pins across four I/O banks.
Typical applications span digital video processing, automotive driver-assist subsystems, industrial machine control, motor and power conversion controllers, software-defined radio front-ends, and embedded display interfaces. The combination of low unit cost, automotive temperature support, and 1.2 V low-power operation also makes it well suited for portable and battery-powered embedded systems.
When designing with this device, note that the 256-FBGA package requires 1.0 mm ball pitch and a multi-layer PCB with via-in-pad or microvia technology for reliable assembly. Designers should also follow the Altera power sequencing requirements (VCCINT before VCCIO, or use a sequenced supply) to avoid latch-up. For new designs, note that the Cyclone II family is in legacy status and engineers should consider Cyclone IV or Cyclone V for active production programs.
This page synthesizes distributor pricing, automotive-grade variants, and practical design notes for the EP2C8AF256A7N that are not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2C8AF256A7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C8AF256A7N (same form factor and footprint) β differing in Package, Speed Grade, Process Technology, RoHS Status, Core Voltage (VCCINT).
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EP2C8F256A7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2C8AF256C7N
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EP2C8AF256I8N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$21.4 / Unit
View Datasheet βEP2C5AF256A7N
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$9.75 / Unit
View Datasheet βEP2C15AF256I8N
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$17.26 / Unit
View Datasheet βEP2C8AF256A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements (LE) | 8,256 |
| Embedded Memory Bits | 165,888 bits (162 Kbit) |
| Embedded RAM Blocks | 36 M4K blocks (4 Kbit each) |
| Maximum User I/O | 182 |
| I/O Banks | 4 |
| Hardware Multipliers (18x18) | 18 |
| PLLs | 2 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 90 nm TSMC low-k |
| Maximum Internal Frequency | 402.58 MHz |
| Package | 256-ball FBGA (1.0 mm pitch) |
| Operating Temperature Grade | Automotive (A7N) |
| Speed Grade | 7 (A7) |
| RoHS Status | Compliant |
EP2C8AF256A7N 256-ball fbga (1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP2C8AF256A7N (256-ball fbga (1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C8AF256A7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C8AF256A7N is suitable for 6 applications: Automotive Infotainment Systems, Industrial Motor Control, Digital Video Processing, Software-Defined Radio Front-End, Embedded Display Controllers, Power Conversion and Digital Control Loops.
Automotive Infotainment Systems
The EP2C8AF256A7N's 8,256 logic elements and 182 user I/O pins fit automotive infotainment head units where multiple display streams, touch controllers, and audio codecs must be multiplexed. The 'A7N' automotive temperature grade (-40C to +125C) per the Cyclone II datasheet ensures operation across cabin and under-dash thermal environments, while the 'A' 1.5 V I/O support directly interfaces Mobile SDRAM and GPS baseband ICs. The 18 hardware 18x18 multipliers accelerate audio DSP tasks such as MP3/AAC decode and active-noise-cancellation filtering. Total core consumption at 100 MHz with typical logic utilization is well below 1 W, easing thermal design.
Recommended
Industrial Motor Control
The EP2C8AF256A7N is widely used in industrial AC and servo motor drives, where its 2 PLLs generate the high-resolution PWM carrier frequencies (10-50 kHz) and its 18 hardware multipliers implement field-oriented control (FOC) math. With 8,256 LE the part easily fits 3-phase SVPWM, Clarke/Park transforms, and encoder-feedback interfaces. The 1.2 V core on the 90 nm process keeps dissipation low even at full I/O toggle on all 182 pins, while the 256-FBGA package supports four independent I/O banks for mixed 3.3 V/5 V field-side isolation. The automotive temperature grade also handles factory-floor thermal stress.
Recommended
Digital Video Processing
The EP2C8AF256A7N's 36 M4K embedded RAM blocks (165,888 bits total) provide line buffers and frame-store memory for HD video processing pipelines such as scaling, de-interlacing, and color-space conversion. The 18x18 hardware multipliers enable real-time 2D FIR filtering for image sharpening and noise reduction at standard HD frame rates. The 182 user I/O pins accept parallel ITU-R BT.656 / BT.1120 video buses plus auxiliary GPIO, and the 2 PLLs generate the 74.25 MHz / 148.5 MHz pixel clocks directly from a 27 MHz reference. This makes the part a strong fit for surveillance DVRs, broadcast upconverters, and medical imaging capture cards.
Recommended
Software-Defined Radio Front-End
In low-cost software-defined radio (SDR) platforms the EP2C8AF256A7N serves as the digital down-conversion and channelization engine, using its 18 hardware multipliers for digital mixing, decimation, and FFT butterflies. The 2 PLLs generate the high-frequency ADC sample clocks and tune the local oscillator NCO. With 8,256 LE the part can implement narrow-band demodulators, AGC loops, and Manchester decoders for sub-GHz ISM-band receivers. The 1.2 V core keeps noise injection into the ADC supply rail low, and the 256-FBGA exposes sufficient I/O for parallel LVDS ADC interfaces.
Recommended
Embedded Display Controllers
The EP2C8AF256A7N is a popular choice for industrial HMI and instrument-cluster display controllers, where it drives TFT-LCD panels via 24-bit RGB parallel interfaces, performs gamma correction, and overlays touchscreen and bezel graphics. Its 8,256 LE easily handle 800x480 and 1024x600 panels at 60 Hz, while the 36 M4K blocks provide dual-line buffers for partial refresh and screen rotation. The four I/O banks allow direct connection to 1.8 V display memory and 3.3 V touch controllers without external level shifters. The automotive temperature grade supports in-vehicle instrument cluster deployments.
Recommended
Power Conversion and Digital Control Loops
The EP2C8AF256A7N is used in digital-controlled switch-mode power supplies, where its 8,256 LE implement peak-current-mode control, adaptive dead-time insertion, and digital compensation. The 2 PLLs synthesize high-resolution switching frequencies (100 kHz to 2 MHz) and provide phase-shifted clocks for multi-phase VR topologies. With 182 I/O the part can drive 6+ parallel MOSFET half-bridges, monitor 12 ADC channels, and talk to PMBus telemetry, all from a single device. The automotive temperature grade and 1.2 V low-power core suit both industrial UPS systems and 48 V mild-hybrid DC-DC converters.
Recommended
Recommended Products Summary
Engineering reference data for EP2C8AF256A7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C8F256A7N | EP2C8AF256C7N | EP2C8AF256I8N | EP2C5AF256A7N | EP2C15AF256I8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (1.0 mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 4,608 | 14,448 |
| Embedded Memory Bits | 165,888 | 165,888 | 165,888 | 165,888 | 119,808 | 239,616 |
| User I/O (max) | 182 | 182 | 182 | 182 | 158 | 152 |
| Temperature Grade | Automotive -40C to +125C | Automotive -40C to +125C | Commercial 0C to +85C | Industrial -40C to +100C | Automotive -40C to +125C | Industrial -40C to +100C |
| 1.5 V I/O Support | Yes (A suffix) | No | Yes | Yes | Yes | Yes |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- 1.5 V I/O standard support in the 256-FBGA 8K LE class (vs EP2C8F256A7N)
- Automotive -40C to +125C temperature grade at 8K LE density (vs EP2C5AF256A7N)
- Higher logic capacity than the 5K LE option in the same 256-FBGA package (vs EP2C5AF256A7N)
Design Notes
The 256-FBGA package uses a 1.0 mm ball pitch and is not compatible with standard 1.27 mm pitch PCB footprints. Use a 4- or 6-layer PCB with laser-drilled microvias or via-in-pad to escape the inner balls. Follow Altera's FBGA land pattern guidelines, including NSMD (non-solder mask defined) pads with a 0.50 mm diameter and a 0.27 mm via drill. Maintain 0.40 mm clearance between the BGA pad and the inner via pad to prevent solder wicking into the via barrel.
Cyclone II requires a strict power-up sequence: VCCINT (1.2 V core) must reach 1.0 V before VCCIO (per-bank I/O supply) reaches 0.7 V to prevent device latch-up and damage. Use a sequenced power supply IC or an RC delay between the 1.2 V and 3.3 V rails. Decouple each VCCINT pin with one 0.1 uF X7R 0402 ceramic plus one bulk 47 uF tantalum per regulator output, and decouple each VCCIO pin with one 0.1 uF 0402 plus one 10 uF bulk capacitor per I/O bank.
Do not assume JTAG programming works without a 2.5 V or 3.3 V VCCIO on bank 1. The JTAG pins (TCK, TMS, TDI, TDO) live in I/O bank 1 and require VCCIO bank 1 to be powered even when only the JTAG interface is used. Also, the CONF_DONE pin is open-drain and requires an external 10 kohm pull-up to VCCIO. Configuration failures are frequently traced to missing or undersized pull-ups on nCE, nCONFIG, or DCLK lines rather than bitstream corruption.
At full 182-I/O utilization toggling at 100 MHz with a 25 pF load, the EP2C8AF256A7N typically dissipates 0.8-1.2 W on the 1.2 V core. With a theta-JA of approximately 22 C/W (JEDEC EIA/JESD51 still-air, 4-layer board), this gives a 18-26 C rise above ambient, well within the -40C to +125C automotive range. For enclosed industrial enclosures, use a 4-layer PCB with a solid inner ground plane and 1-oz copper pours stitched with thermal vias to drop theta-JA to approximately 10-12 C/W.
Compliance Information
RoHS compliant per Altera/Intel product page. AEC-Q100 not formally qualified per public datasheet; 'A7N' automotive temperature grade meets -40C to +125C operating range per Cyclone II datasheet. Halogen-free status unknown - not explicitly stated in available web data.
