EP2S130F780C4 - Stratix II FPGA 132K LE 534 I/O FBGA | Intel / Altera
MPN: EP2S130F780C4 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7707.63 | $7,707.63 |
| 10 | $7500 | $75,000.00 |
| 100 | $7100 | $710,000.00 |
| 500 | $6800 | $3,400,000.00 |
| 1,000 | $6500 | $6,500,000.00 |
EP2S130F780C4 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as block RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs occupy the highest tier of the programmable logic hierarchy, above CPLDs (smaller, non-volatile, simpler architecture) and below ASICs (custom-fabricated, lowest per-unit cost at scale). Within Altera's Stratix product tree, the Stratix II family specifically targets high-end DSP, telecom, and high-throughput data-pipeline applications using an adaptive logic module (ALM) architecture that delivers higher effective logic density than previous-generation 4-input LUT designs.
The EP2S130F780C4's headline feature is its very large embedded memory and DSP multiplier count, which together enable designers to implement wide, parallel data paths without external memory. The device also integrates dedicated high-speed serial interfaces suited to backplane and chip-to-chip links, and its 780-pin FC-FBGA package provides sufficient I/O for parallel memory buses and multiple standard interfaces. The 'C4' speed grade and 'F' package code designate the commercial temperature range and the flip-chip BGA pinout, respectively.
Typical applications include high-speed digital signal processing (radar, software-defined radio, video transcoding), ASIC prototyping, telecom line-card glue logic, high-throughput data acquisition, and embedded computing platforms that require parallel compute resources. Designers usually pair the device with external DDR/DDR2 memory and dedicated PHY companions to exploit its on-chip memory bandwidth.
When designing with this FPGA, plan power-rail sequencing carefully - the 1.2 V core typically requires a multi-phase buck regulator, while the I/O and auxiliary supplies need separate rails. Thermal management is critical at full utilization: ensure adequate airflow or a heatsink attached to the 40 x 40 mm substrate, since FC-FBGA packages rely primarily on the PCB for heat dissipation.
This page synthesizes distributor pricing, drop-in Stratix II alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement decisions, and PCB-level implementation guidance.
Drop-in alternatives for EP2S130F780C4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F780C4 (same form factor and footprint) β differing in Package, RoHS Status, Family, Logic Elements, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S130F780C5
β Drop-Inβ In Stock
$2295 / Unit
View Datasheet βEP2S130F780C4N
β Drop-Inβ In Stock
$1095 / Unit
View Datasheet βEP2S130F780C5N
β Drop-Inβ In Stock
$2150 / Unit
View Datasheet βEP2S130F780I4
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2S130F780C3
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2S130F780I5
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2S130F780C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| User I/O Pins | 534 |
| Internal Frequency (max) | 717 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Package | 780-ball FC-FBGA (flip-chip) |
| Package Code | F (FBGA-780) |
| Package Body Size | 40 x 40 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | C4 (commercial) |
| Terminal Form | Ball (BGA) |
| Mounting Type | Surface Mount |
| RoHS Status | Lead-free (per datasheet) |
EP2S130F780C4 40 x 40 mm Pin Configuration Guide
Pin configuration for EP2S130F780C4 (40 x 40 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130F780C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130F780C4 is suitable for 6 applications: High-Speed Digital Signal Processing, ASIC Prototyping, Telecom Line-Card Glue Logic, High-Throughput Data Acquisition, Video Transcoding and Image Processing, Embedded Computing Platforms.
High-Speed Digital Signal Processing
The EP2S130F780C4 is ideally matched to high-throughput DSP applications because its 132,540 logic elements, 717 MHz internal Fmax, and dedicated DSP blocks enable very wide parallel datapaths. In radar, software-defined radio, and baseband signal processing, the FPGA typically implements FFT cores, FIR filters, and channelizers at sample rates that exceed the capability of general-purpose DSPs. The 534 user I/Os allow direct connection to multiple ADC/DAC channels without external muxing. Designers pair the device with high-speed DDR2 memory for coefficient storage and large sample buffers. Power dissipation at full utilization can exceed 20 W, so a multi-phase buck regulator plus thermal management on the 40 x 40 mm FC-FBGA substrate is essential.
Recommended
ASIC Prototyping
The Stratix II EP2S130F780C4 is widely used as an ASIC prototyping vehicle because its 132K logic elements, embedded memory, and high I/O count can emulate large SoC designs. Engineers map ASIC RTL to the FPGA using Quartus II and verify functional and timing behavior before committing to silicon. The 534 user I/Os allow prototyping of wide external buses (32- or 64-bit) and multi-port memory interfaces. Multiple FPGAs are typically co-packaged on a prototyping board to scale capacity beyond one device. The device's 90 nm process and 1.2 V core are reasonably representative of modern ASIC geometries, giving meaningful correlation between prototype timing and final silicon.
Recommended
Telecom Line-Card Glue Logic
In telecom line-card applications, the EP2S130F780C4 serves as high-density glue logic between network processors, SERDES framer ICs, and packet classifiers. Its dedicated high-speed serial transceivers support backplane links at multi-gigabit rates, while the 534 user I/Os handle parallel SPI/SCI bus connections to PHY and timing-card devices. The device integrates well with TDM fabrics and ATM/Packet-over-Sonet bridges. Designers typically run the FPGA as a flexible traffic manager or OAM (Operations, Administration, Maintenance) controller with on-chip memory for lookup tables. Industrial-temperature variants (e.g. EP2S130F780I4) are preferred for outdoor-cabinet line cards.
Recommended
High-Throughput Data Acquisition
The EP2S130F780C4's combination of 534 user I/Os and embedded memory makes it a strong fit for parallel-channel data acquisition systems such as medical imaging (CT, MRI), ultrasound beamforming, and instrumentation digitizers. Each FPGA can sink data from multiple 12-/14-/16-bit ADCs running at 100-250 MSPS, buffer into block RAM, then forward packets over a high-speed serial link to a host processor. The 717 MHz internal Fmax is more than sufficient for digital down-conversion (DDC), FIR decimation, and I/Q demodulation in software-defined receivers. The 780-ball FC-FBGA provides the package density required to route 16-32 matched differential pairs to adjacent ADCs without signal-integrity compromise.
Recommended
Video Transcoding and Image Processing
Broadcast and pro-video equipment uses the EP2S130F780C4 for real-time video format conversion, color-space translation, and overlay compositing at 1080p/60 or 4K rates. The 132K logic elements support multi-stream HD-SDI processing paths, deinterlacing, and frame-rate conversion in parallel, while the embedded DSP blocks accelerate motion-compensated algorithms. The 534 user I/Os connect to multiple SDI/HDMI transceiver ICs, frame buffers, and DDR2 memory for line buffering. Designers typically run the FPGA in a video pipeline where latency is critical, accepting higher power dissipation for deterministic real-time behavior.
Recommended
Embedded Computing Platforms
Industrial embedded computing platforms embed the EP2S130F780C4 as a co-processor alongside CPUs (PowerPC, ARM, x86) to handle deterministic real-time workloads such as motion control, machine vision, and protocol conversion. The FPGA's 534 user I/Os and high internal bandwidth let it arbitrate multiple industrial buses (EtherCAT, PROFINET, CAN, RS-485) in parallel, while on-chip block RAM holds protocol stacks. The 780-ball FC-FBGA's 40 x 40 mm footprint is large but acceptable on SBC form factors such as VPX, VME, or CompactPCI. Designers typically boot the FPGA from a parallel flash and use JTAG for in-system debug via Quartus II.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F780C4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F780C5 | EP2S130F780C4N | EP2S130F780C5N | EP2S130F780I4 | EP2S130F780C3 | EP2S130F780I5 |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 780-ball FC-FBGA (40 x 40 mm, 1.0 mm pitch) | 780-ball FC-FBGA (40 x 40 mm) - same | 780-ball FC-FBGA (40 x 40 mm) - same | 780-ball FC-FBGA (40 x 40 mm) - same | 780-ball FC-FBGA (40 x 40 mm) - same | 780-ball FC-FBGA (40 x 40 mm) - same | 780-ball FC-FBGA (40 x 40 mm) - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| User I/O Pins | 534 | 534 | 534 | 534 | 534 | 534 | 534 |
| Speed Grade | C4 (commercial) | C5 (faster) | C4 | C5 | I4 (industrial) | C3 (slower) | I5 (industrial, fastest) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Industrial (-40C to +100C) |
| Lead-Free Finish | Per datasheet (lead-free family) | Per datasheet | Yes (N suffix) | Yes (N suffix) | Per datasheet | Per datasheet | Per datasheet |
| Internal Fmax | 717 MHz | Slightly higher than C4 (~10-15%) | 717 MHz | Slightly higher than C4 | Comparable to C4 | Slightly lower than C4 | Comparable to C5 |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V |
Key Differentiators
- 132,540 logic elements with 717 MHz internal Fmax in 780-ball FC-FBGA (vs EP2S130F1020C4 (1020-ball variant))
- C4 commercial speed grade balances timing margin and cost (vs EP2S130F780C5 (C5 speed grade))
- N-suffix lead-free variant supports RoHS-6/6 compliance (vs EP2S130F780C4 (non-N suffix))
Design Notes
Estimated: at full utilization with 50% toggle rate and 717 MHz operation, the EP2S130F780C4 can dissipate 20-25 W on the core. The 1.2 V core supply must be sourced from a multi-phase synchronous buck regulator rated for at least 30 A continuous (e.g. a 3-phase ISL63xxx controller). Decouple the core with 100 uF bulk + 10 uF + 1 uF + 0.1 uF per bank; place 0402/0201 caps within 1 mm of every VCCINT ball.
The 40 x 40 mm FC-FBGA relies on the PCB for heat dissipation. Estimated: with theta_JA of approximately 8-10 C/W on a 12-layer 2 oz copper PCB, full-power dissipation of 20 W yields a junction-to-ambient rise of 160-200 C, which exceeds safe limits. Implement thermal vias under the central ground balls (0.3 mm pitch, 12 mil drill, filled), add an internal copper plane spreader, and consider an active heatsink for >15 W designs.
Route the 534 user I/Os into 8-12 I/O banks, each with its own VCCIO supply. Match differential pair lengths to within 5 mil for transceivers running >1 Gbps. Use a microstrip-on-stripline stackup with a continuous ground plane below layer 1; the 1.0 mm BGA pitch escape requires 4-5 routing layers just for the breakout. Keep all SERDES traces length-matched and avoid 90 degree bends.
Configuration mode selection must be tied correctly (FPP, AS, PS, JTAG). Power sequencing must satisfy VCCINT before VCCIO with monotonic ramp >0.5 ms/V to avoid latch-up; a POR supervisor is recommended. The 'C4' speed grade timing constraints must be enforced in Quartus II - do not blindly reuse bitstreams from a different speed grade. Do not exceed the maximum I/O toggle rate or the simultaneous-switching output (SSO) budget per bank.
Compliance Information
Lead-free (Pb-free) finish standard on Stratix II family. AEC-Q100 not applicable (FPGA, not automotive-grade IC). REACH, halogen-free, and conflict-minerals status not stated in retrieved distributor data; consult Intel Product Content data sheet for definitive values.
