EP2S130F780C5 - Stratix II FPGA, 132K LE, 780-FBGA | Intel
MPN: EP2S130F780C5 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2725 | $27,250.00 |
| 100 | $2545 | $254,500.00 |
| 250 | $2410 | $602,500.00 |
| 500 | $2295 | $1,147,500.00 |
EP2S130F780C5 Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable logic device that combines configurable logic blocks, programmable routing, embedded memory, and hardened functional blocks (such as DSP blocks, transceivers, and PLLs) into a single IC. FPGAs sit above general-purpose microcontrollers in the programmable-logic taxonomy: programmable logic device (PLD) -> CPLD -> FPGA -> high-end SoC FPGA. Stratix II was specifically architected for ASIC prototyping, high-throughput DSP, and parallel processing in communications infrastructure, where deterministic hardware parallelism is required.
Key features of the EP2S130F780C5 include 534 user I/O pins, an adaptive logic module (ALM) architecture (8-input fracturable LUTs), embedded DSP blocks delivering up to 1.4 GMACs DSP performance, and embedded TriMatrix memory supporting single-port, dual-port, and FIFO modes. The device family supports up to 12 global clock networks, 4 PLLs per quadrant, and up to 16 dedicated high-speed serial channels (transceivers) depending on package density. The 780-FBGA package pinout assigns 534 user I/Os plus the balance to power, ground, JTAG (IEEE 1149.1), and configuration pins.
Architecturally, Stratix II was the first FPGA family to adopt an 8-input fracturable ALM with full carry-chain and dedicated arithmetic logic, which improves logic utilization and effective DSP throughput versus 4-input LUT predecessors. The 90 nm process also enabled integration of hard PCIe, DDR2 memory controllers, and 1 Gbps+ LVDS I/O without external PHY chips.
Typical applications include ASIC prototyping, high-end telecommunication infrastructure (basestation baseband, SERDES aggregation), high-performance DSP (software-defined radio, radar signal processing, video codec acceleration), and large-scale industrial control. The commercial temperature grade ('C' suffix) targets 0C to +85C junction, suiting laboratory, enterprise, and rugged-but-non-automotive deployments.
When designing with EP2S130F780C5, ensure the Altera/Intel Quartus II toolchain (or its maintained successor) supports the design's resource utilization, and verify the FPGA's 780-BGA PCB footprint supports the required power-delivery network (PDN) for multi-amp core currents. Note that Stratix II is a mature device family; new designs should evaluate Cyclone/Arria/Stratix V successors.
This page synthesizes distributor pricing, BGA package details, parametric drops within the Stratix II family, and design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2S130F780C5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F780C5 (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, RoHS Status, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S130F780C4
β Drop-Inβ In Stock
$6500 / Unit
View Datasheet βEP2S130F780C4N
β Drop-Inβ In Stock
$1095 / Unit
View Datasheet βEP2S130F1508C5
β Drop-Inβ In Stock
$345 / Unit
View Datasheet βEP2S130F1508C5N
β Drop-Inβ In Stock
$1390 / Unit
View Datasheet βEP2S130F1020C5
β Drop-Inβ In Stock
$4100 / Unit
View Datasheet βEP2S130F1020C5N
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2S130F780C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6627 |
| User I/O Count | 534 |
| Embedded Memory (bits) | 6,737,280 |
| Embedded 18x18 Multipliers | 252 |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) |
| Internal Clock Frequency (max) | 609.76 MHz |
| Speed Grade | C5 |
| Operating Temperature | 0 C to +85 C (TJ) |
| Package | 780-FBGA (FC-FBGA), 29 mm x 29 mm |
| Lead-Free / RoHS | Lead Free / RoHS Compliant |
| Configuration Interface | JTAG (IEEE 1149.1) + Passive Serial / Fast Passive Parallel |
| DSP Performance | Up to ~1.4 GMACs (per family datasheet) |
EP2S130F780C5 Pin Configuration
| Pin 1 | I/O / VCCIO β User I/O or VCCIO bank supply (refer to datasheet pin table for exact assignment) |
| Pin 100 | I/O β User I/O ball |
| Pin 200 | I/O β User I/O ball |
| Pin 300 | GND β Ground reference |
| Pin 400 | I/O β User I/O ball |
| Pin 500 | VCCINT β Core supply 1.2 V nominal |
| Pin 600 | I/O β User I/O ball |
| Pin 700 | I/O / JTAG β User I/O or JTAG TCK/TMS/TDO/TDI ball |
| Pin 780 | I/O β User I/O ball |
Typical Applications
EP2S130F780C5 is suitable for 6 applications: ASIC Prototyping and Emulation, Telecommunications Infrastructure, High-Performance DSP - Software Defined Radio, Video Broadcast and Image Processing, Industrial Control and Test Equipment, Military and Aerospace Legacy Systems.
ASIC Prototyping and Emulation
The EP2S130F780C5's 132,540 logic elements, 6.4 Mbit TriMatrix memory, and 252 hard multipliers make it a proven workhorse for ASIC/SoC prototyping and hardware emulation. Engineers use Stratix II arrays in multi-FPGA partitioning flows to validate ASIC RTL before tape-out, exploiting the 90 nm deterministic routing and Quartus II support for incremental compile. The 780-FBGA pinout provides 534 user I/Os for high-fanout signal mapping between partitioned ASIC blocks. Compared with microcontrollers, the FPGA's parallel architecture emulates multi-million-gate ASICs in real time. Per the Stratix II datasheet, this density tier supports emulation of ~10-15 Mgate ASIC designs. Trade-off: obsolete lifecycle means prototyping boards are increasingly built around Stratix V or Arria 10 instead.
Recommended
Telecommunications Infrastructure
Stratix II EP2S130F780C5 served telecom OEMs as the platform for basestation baseband, line-card packet processing, and SERDES aggregation. Its 252 18x18 multipliers and 6.4 Mbit memory enable channelization, FEC, and FFT processing for WiMAX/LTE early-deployments; the 780-FBGA exposes 534 I/Os for backplane interconnect. The C5 speed grade provides headroom for the 609.76 MHz family fmax, sufficing for baseband symbol rates of typical 3G/4G carriers. Embedded PLL and clock networks let designers meet the jitter budgets required by CPRI/OBSAI fronthaul links. Compared with ASIC ASSPs, the FPGA's reprogrammability let network OEMs ship with late-binding to operator specs. Today's designs have moved to Arria 10 or Stratix V for higher transceivers, but legacy basestations still run Stratix II.
Recommended
High-Performance DSP - Software Defined Radio
The EP2S130F780C5's 252 dedicated 18x18 multipliers deliver up to ~1.4 GMACs aggregate throughput, ideal for software-defined radio (SDR), radar signal processing, and beamforming. Stratix II DSP blocks implement parallel FIR filters, FFT butterflies, and CORDIC engines at clock rates far beyond microcontrollers. The 6.4 Mbit embedded memory provides coefficient storage and on-chip sample buffering, eliminating latency of external SRAM. In radar applications, the 534 I/Os serve ADC/DAC data lanes and antenna-element fan-out. Stratix II pioneered ALM-based DSP pipelining that later Stratix/Arria families extended. Trade-off: obsolete lifecycle and 90 nm static power favor Arria 10 or Stratix 10 for new SDR designs, but legacy waveforms continue to run on Stratix II hardware.
Recommended
Video Broadcast and Image Processing
Broadcast video routers, codecs, and image-processing pipelines relied on Stratix II EP2S130F780C5 for HD-SDI routing, scaling, and transcoding. The device's ALM architecture and 6.4 Mbit memory enable multi-channel SDI crosspoints, de-interlacers, and color-space converters on a single FPGA. 534 user I/Os permit parallel connection to multiple video ADCs, DACs, and HDMI/SDI serializers. Stratix II's DDR2 controller and embedded PLLs simplify memory-buffered frame stores. Compared with DSP processors, the FPGA handles full HD pixel rates (148.5 MHz) with deterministic latency. The C5 speed grade provides timing margin for high-end broadcasting. New designs prefer Cyclone 10 or Arria 10, but existing broadcast equipment uses Stratix II extensively.
Recommended
Industrial Control and Test Equipment
The EP2S130F780C5 has been deployed in high-channel-count industrial control, ATE, and instrumentation systems where the 534 I/Os and 252 multipliers enable parallel test vector generation and protocol bridging. The 780-FBGA's generous I/O budget supports multi-axis motion controllers and high-pin-count logic analyzers. Stratix II's deterministic fabric suits IEC 61508-style safety paths in legacy industrial designs. The commercial 0C to +85C junction range covers most factory-floor enclosures. Compared with microcontroller-based PLCs, an FPGA-based design can sample thousands of points per millisecond. Trade-off: obsolete lifecycle prompts new industrial designs toward Cyclone V SoC, but retrofitting older equipment continues to use Stratix II cards.
Recommended
Military and Aerospace Legacy Systems
Stratix II EP2S130F780C5 variants served military/aerospace applications including signal intelligence, avionics bus bridging, and radar data pre-processing. The 90 nm radiation-tolerant design rules and industrial/extended-temperature variants meet specific platform requirements. The 780-FBGA package with 534 I/Os supports MIL-STD-1553, ARINC 429, and custom high-speed serial interfaces common in avionics. Despite being obsolete, the EP2S130F780C5 remains qualified in some long-lifecycle platforms. According to Stratix II datasheet errata, temperature and reliability grades are documented per device suffix. For new programs, MIL-spec designers should consider Microsemi/RTAX, Xilinx Virtex-5QV, or Microsemi SmartFusion 2.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F780C5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F780C4 | EP2S130F780C4N | EP2S130F1508C5 | EP2S130F1508C5N | EP2S130F1020C5 | EP2S130F1020C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA | 780-FBGA (same) | 780-FBGA (same) | 1508-FBGA | 1508-FBGA | 1020-FBGA | 1020-FBGA |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| User I/O Count | 534 | 534 | 534 | 742 | 742 | 626 | 626 |
| Speed Grade | C5 (fastest commercial) | C4 | C4 | C5 (same) | C5 (same) | C5 (same) | C5 (same) |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Memory (Mbit) | 6.4 | 6.4 | 6.4 | 6.4 | 6.4 | 6.4 | 6.4 |
| Embedded 18x18 Multipliers | 252 | 252 | 252 | 252 | 252 | 252 | 252 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density Stratix II in 780-FBGA package (vs EP2S130F1508C5)
- C5 speed grade for maximum internal fmax (vs EP2S130F780C4)
- Pb-free / RoHS compliant commercial-grade silicon (vs EP2S130F780C5N)
Design Notes
The EP2S130F780C5 at 1.2 V core can exceed 10 W dissipation under heavy utilization. Per the Stratix II datasheet PowerPlay section, use a multi-rail PDN with dedicated 1.2 V regulators for VCCINT and separate 2.5 V/3.3 V supplies for VCCIO banks. Place decoupling within 0.5 inches of BGA balls; high-density Stratix II designs typically need 30-50 decoupling capacitors. Enable power-saving features (Auto-on Sleep, programmable LUT output enables) when full fabric utilization is not required.
Estimated: at 1.2 V and 15 W total power, with 780-FBGA theta_JA around 12-15 C/W on a 6-layer PCB with 1 oz copper, junction-to-ambient rise is approximately 180-225 C. Without heatsink or airflow, this exceeds the 85 C commercial limit. Required: thermal vias under BGA, top-side copper pour, and 200-400 LFM forced-air cooling. Without thermal management, the FPGA will throttle or trigger thermal shutdown at high toggle rates.
The 780-FBGA uses 1 mm ball pitch on a 29 x 29 mm body. Per Altera AN-471, route escape with 0.8 mm via-in-pad (VIP) technique on inner layers; outer BGA fan-out requires HDI microvias. Maintain 50 ohm impedance on LVDS pairs, 100 ohm differential, and provide length-matching within 150 ps for DDR2 interfaces. Use 4-6 layer stackup minimum, with 0.5 oz copper on outer and 1 oz on inner power planes to handle multi-amp core currents.
Common pitfalls when designing with EP2S130F780C5: (1) Quartus II toolchain is no longer the latest - Intel recommends Quartus Prime Pro for new designs, but Stratix II is supported only via legacy Quartus II 13.0sp1 or earlier; (2) JTAG chain must include the FPGA at correct TDO->TDI order with 4.7k pull-ups on TCK/TMS; (3) configuration file must select correct Stratix II device variant before generation, else FIT will fail with IDCODE mismatch; (4) EPCS or EPCQ configuration memory may be discontinued; verify source before designing new boards.
Compliance Information
RoHS compliant per Altera/Intel product page and third-party listings (Lisleapex, Ampheo, Xecor). Not AEC-Q100 qualified (not an automotive part). Lead-free FC-FBGA package. Halogen-free status not explicitly stated in available data - set to unknown. Conflict minerals: Intel publishes a current CMRT/EMRT filing.
