EP2S130F1020C4 - Stratix II 132K LE FPGA 1.2V 1020-FBGA | Intel
MPN: EP2S130F1020C4 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3778.5 | $3,778.50 |
| 10 | $3500 | $35,000.00 |
| 50 | $3250 | $162,500.00 |
| 100 | $3000 | $300,000.00 |
| 500 | $2800 | $1,400,000.00 |
EP2S130F1020C4 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect, all user-defined through a hardware description language and a vendor toolchain. Stratix II FPGAs sit within the Intel/Altera programmable-logic hierarchy as a high-performance mid-2000s generation, positioned below later Stratix III/IV/V families and above Cyclone II in cost/logic density.
Key specifications include 132,540 logic elements, embedded memory, embedded multipliers for DSP, dedicated clocking PLL resources, and high-speed transceiver interfaces typical of the Stratix II family. The 'C4' speed grade places the device in a moderate-performance operating corner, and the 'F1020' package code indicates the 1020-ball FC-FBGA footprint used across the Stratix II 130K LE family.
Typical applications include high-throughput digital signal processing, telecom baseband processing, networking line cards, ASIC prototyping, and high-speed serial protocol bridging. The 1020-ball BGA gives the board designer 742 usable I/O, supporting parallel LVDS, DDR memory interfaces, and multiple standard I/O voltages from the same die.
When designing with this device, pay close attention to power-rail sequencing because Stratix II requires 1.2 V core and 3.3 V/2.5 V/1.8 V auxiliary rails. The high I/O count mandates a 4-8 layer PCB stack-up with controlled-impedance routing. Decoupling must follow the Intel Stratix II reference design guide.
This page synthesizes distributor pricing, same-package Stratix II family alternatives, and design guidance beyond the manufacturer datasheet to support cross-referencing and lifecycle planning for the EP2S130F1020C4.
Drop-in alternatives for EP2S130F1020C4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F1020C4 (same form factor and footprint) β differing in Operating Temperature, Speed Grade, Package, RoHS Status, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S130F1020C5N
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2S130F1020C3
β Drop-Inβ In Stock
$1295 / Unit
View Datasheet βEP2S130F1020C3N
β Drop-Inβ In Stock
$1095 / Unit
View Datasheet βEP2S130F1020C4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$2850 / Unit
View Datasheet βEP2S130F1020I4
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1395 / Unit
View Datasheet βEP2S130F1020C5
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$4100 / Unit
View Datasheet βEP2S130F1020C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 132,540 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Package | 1020-ball FC-FBGA |
| User I/O Count | 742 |
| Maximum Internal Frequency | 711.24 MHz |
| Mounting Type | Surface Mount |
| Operating Temperature | Commercial (0C to +85C) - grade 'C' |
| Speed Grade | C4 |
| Memory Type | Embedded SRAM blocks (Stratix II) |
| DSP Blocks | Embedded multipliers (Stratix II TriMatrix) |
| PLLs | Yes (Stratix II enhanced PLL + fast PLL) |
EP2S130F1020C4 1020-ball fc-fbga Pin Configuration Guide
Pin configuration for EP2S130F1020C4 (1020-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130F1020C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130F1020C4 is suitable for 6 applications: High-Throughput DSP and Signal Processing, Telecom Baseband and Line-Card Processing, ASIC Prototyping and Verification, Networking and Packet Processing, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation.
High-Throughput DSP and Signal Processing
The EP2S130F1020C4 with 132,540 logic elements and embedded multiplier blocks is well suited to high-throughput DSP workloads such as multi-channel baseband processing, radar signal chains, and software-defined radio front-ends. The 1.2 V core and 90 nm architecture deliver hundreds of MHz of internal fabric performance, while the embedded TriMatrix memory provides distributed and block RAM for FFT scratchpads and sample buffers. Placed on a high-layer-count PCB with controlled-impedance differential routing, this FPGA can replace multiple DSP chips in a single device, reducing BOM cost and board area while meeting tight latency budgets for real-time signal processing applications.
Recommended
Telecom Baseband and Line-Card Processing
In telecom line cards, the EP2S130F1020C4 implements channel cards, framer/mapper functions, and protocol bridging between OTN, Ethernet, and SONET interfaces. Its 742 user I/O pins support multiple parallel LVDS lanes and external memory interfaces (DDR/DDR2), which are critical for high-bandwidth packet buffers and lookup tables. The 1.2 V core keeps dynamic power within budget for dense line-card deployments, while embedded transceivers in the F1020 package handle multi-gigabit serial links. Quoted price as of 2026-09-09 is around USD 3,778.50 per unit, reflecting legacy inventory status for telecom OEMs with long lifecycle support requirements.
Recommended
ASIC Prototyping and Verification
The 132K logic-element capacity and rich memory/DSP resources make the EP2S130F1020C4 a strong target for ASIC prototyping of multi-million-gate designs in the 90 nm era. Engineers map ASIC RTL into Quartus II, partition the design across multiple FPGAs if needed, and use the 742 user I/O as prototyping interconnect for chip-to-chip emulation. The 1020-ball FC-FBGA package supports high-speed LVDS prototyping connections between multiple FPGA boards in stackable prototyping cages. This application benefits from the mature Quartus II toolchain (free Web Edition supports this device fully) and from extensive Stratix II reference designs in the Intel/Altera legacy IP catalog.
Recommended
Networking and Packet Processing
The EP2S130F1020C4 is used in core and edge routers for traffic management, deep-packet inspection, and queue scheduling. With 132K LEs, embedded memory, and 742 I/O, the FPGA can implement multi-million-entry TCAMs alongside forwarding logic and cryptographic accelerators. The 1020-ball BGA enables multiple external memory channels (DDR2/QDR) for packet buffering at line rate. Power consumption at 1.2 V core scales with toggle rate, so designers use clock gating and aggressive design partitioning; legacy Stratix II designs in production networks benefit from long-term supply via authorized distributors stocking obsolete inventory.
Recommended
Industrial Imaging and Machine Vision
In high-speed machine vision systems, the EP2S130F1020C4 receives pixel data from multiple image sensors over LVDS, performs Bayer-to-RGB conversion, edge detection, and compression, and outputs results over Gigabit Ethernet or Camera Link. The 132K LE budget supports multi-pipeline processing at full sensor frame rates (hundreds of fps), and embedded multipliers accelerate filter kernels. Industrial users benefit from the commercial 0-85C operating range and from stable long-term supply via the secondary market for end-of-life parts. Combined with external DDR2 memory, the FPGA enables complete image-processing pipelines on a single chip.
Recommended
Test and Measurement Instrumentation
Test equipment manufacturers use the EP2S130F1020C4 to implement arbitrary waveform generators, real-time spectrum analyzers, and protocol analyzers where 742 user I/O and embedded DSP blocks provide the channel density and processing bandwidth required. The 1.2 V core enables dense DSP while the F1020 FC-FBGA package supports fine-pitch PCB assembly used in compact benchtop form factors. Designers often pair the device with high-speed ADCs/DACs via LVDS interfaces and use the TriMatrix memory as deep sample storage; the Quartus II toolchain offers mature IP cores for FFT, FIR, and DDS functions required in this application space.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F1020C4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1020C5N | EP2S130F1020C3 | EP2S130F1020C3N | EP2S130F1020I4 | EP2S130F1020C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | C4 | C5N | C3 | C3N | I4 (industrial) | C5 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial |
| User I/O | 742 | 742 | 742 | 742 | 742 | 742 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Largest Stratix II family logic density (vs EP2S130F1020C3N)
- C4 commercial temperature speed grade (vs EP2S130F1020I4)
- Mature Quartus II toolchain support (vs EP2C70F896C8N)
Design Notes
Estimated: At 100% toggle rate and 200 MHz core, the EP2S130F1020C4 can dissipate 10-15 W from the 1.2 V core rail. Designers must provision a buck regulator with at least 12 A capability on VCCINT and follow the Stratix II PowerPlay Early Power Estimator (EPE) spreadsheet before PCB layout. Power-rail sequencing requires VCCINT to ramp before VCCIO to avoid latch-up; reference the Stratix II handbook chapter 7 for the power tree reference design.
The 1020-ball FC-FBGA package with 1.0 mm ball pitch requires a 6-8 layer PCB stack-up with microvia (laser-drilled) technology to fan out from the BGA to inner signal layers. Use the Stratix II F1020 BGA breakout reference in the Altera pin connection guidelines to plan layer assignment. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS pairs; add stitching vias around the BGA perimeter to provide a robust ground-return path for high-speed signals.
Estimated: Confusing the Stratix II 90 nm FPGAs with the earlier Stratix 130 nm family is a common pitfall - they use different configuration schemes (Fast Passive Parallel for Stratix II), different JTAG IDCODEs, and different Quartus II version support windows. Also, the EP2S130F1020C4 is obsolete; do not use it for new designs unless you have validated long-term supply via franchised distributors. For new designs, target Cyclone V or Stratix V with the Quartus Prime toolchain.
Compliance Information
Stratix II family is older 90 nm technology. RoHS and lead-free status were not present in the Verified Web Data snippets - flagged as [DATA_NEEDED]. Part is obsolete; new compliance certifications are unlikely to be issued.