EP2S15F672I4N - 15.6K LEs Stratix II FPGA, 366 I/O, 672-FBGA
MPN: EP2S15F672I4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $444.93 | $444.93 |
| 10 | $426.83 | $4,268.30 |
| 25 | $405.04 | $10,126.00 |
| 100 | $364.84 | $36,484.00 |
| 250 | $338.15 | $84,537.50 |
EP2S15F672I4N Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit at the apex of programmable logic, below ASICs (which require masks) and above CPLDs (which are smaller, non-volatile, and lower-density). The Stratix II family uses an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the preceding Stratix/LUT-4 generations, while the dedicated DSP blocks, TriMatrix memory, and high-speed I/O make these devices common in signal processing, communications, and embedded compute.
Key parametric features of the EP2S15 include 15,600 LEs, 15600 logic cells, 419,328 bits of embedded memory, 156 DSP blocks, and 12 PLLs supporting multi-rate clock generation. I/O count is 366 across the 672-ball FCBGA (also referenced as 672-FBGA, 27x27 mm). The device supports a wide variety of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X through per-bank reference voltages. Configuration is typically via JTAG or an external configuration device.
Typical applications include industrial control, telecom line cards, video and image processing, software-defined radio, test and measurement, and embedded DSP. The EP2S15 is also frequently deployed in legacy designs that began life on Stratix II and must remain in production for long life-cycle programs. The industrial temperature grade makes it well suited to factory floor, outdoor telecom, and rail/military-adjacent embedded systems.
When designing with the EP2S15, plan power sequencing carefully - Stratix II requires ramped VCCINT and VCCIO supplies, and decoupling must follow the reference design with multiple low-ESR ceramic capacitors around the perimeter. PCB layout must preserve impedance-controlled pairs for LVDS and external memory interfaces.
Drop-in alternatives for EP2S15F672I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S15F672I4N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Total RAM Bits, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S15F672I4
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View Datasheet →EP2S15F672C5N
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View Datasheet →EP2S15F672C4N
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View Datasheet →EP2S15F672C3N
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View Datasheet →EP2S30F672I4N
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View Datasheet →EP2S15F672I4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 15,600 |
| Logic Cells | 15,600 |
| Total RAM Bits | 419,328 |
| DSP Blocks | 156 |
| Maximum User I/O | 366 |
| PLLs | 12 |
| Process Technology | 90 nm |
| Core Voltage (VCCINT) | 1.2 V |
| Operating Temperature (TJ) | -40C to +100C |
| Speed Grade | 4 (mid) |
| Package | 672-Ball FCBGA (27x27 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Lead Free | Yes |
EP2S15F672I4N 672-ball fcbga (27x27 mm) Pin Configuration Guide
Pin configuration for EP2S15F672I4N (672-ball fcbga (27x27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S15F672I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S15F672I4N is suitable for 7 applications: Industrial Automation & Process Control, Telecom Line Card & Baseband Processing, Video & Image Processing, Test & Measurement Instrumentation, Legacy Software-Defined Radio (SDR), Aerospace & Defense Embedded Systems, Medical Imaging & Diagnostic Equipment.
Industrial Automation & Process Control
The EP2S15F672I4N is well suited to industrial automation, where its industrial -40C to +100C junction temperature and 366 user I/O let it drive a large number of discrete I/O, encoder inputs, and EtherCAT/Ethernet MAC interfaces. The 15,600 logic elements plus 156 DSP blocks execute multi-axis motion-control loops, PID algorithms, and high-speed data acquisition in a single device. Compared with a microcontroller + CPLD split, the EP2S15 consolidates logic, timing, and signal conditioning on one chip, reducing BOM and PCB area. The 672-FBGA footprint is the highest I/O density Stratix II package, enabling direct connection to multi-port external memory without external bus switches.
Recommended
Telecom Line Card & Baseband Processing
In telecom line cards, the EP2S15F672I4N is used for packet classification, traffic shaping, and baseband signal processing. The 156 DSP blocks deliver tens of GMACs of multiply-accumulate throughput, suitable for FEC, scrambling, and narrowband baseband functions. The 419,328 bits of embedded block RAM act as line-rate buffers, and the 12 PLLs synthesize multiple clock domains from a single reference, supporting TDM and SerDes interfaces. Industrial temperature grade is well matched to outdoor base-station enclosures.
Recommended
Video & Image Processing
The 366 user I/O plus 156 DSP blocks make the EP2S15F672I4N an effective platform for video processing pipelines, including color-space conversion, scaling, de-interlacing, and real-time video analytics. The embedded TriMatrix memory (419 Kbit) is split into MRAM, M512, and M4K blocks to support different line-buffer depths required by SD, HD, and emerging 1080p streams. ALM-based fabric is more area-efficient than LUT-4 predecessors when implementing wide video datapaths, allowing 1080p60 color processing to fit in a single device. DDR SDRAM controller IP is available through the Quartus II library, easing external memory integration.
Recommended
Test & Measurement Instrumentation
Test and measurement instruments exploit the EP2S15F672I4N for high-speed waveform capture, digital signal synthesis, and protocol-aware triggering. The 156 DSP blocks implement real-time FFTs and digital down-conversion, while the 366 I/O accept parallel LVDS or LVCMOS data from high-speed ADCs. Industrial temperature grade suits laboratory and field-deployed equipment. Compared with a DSP-plus-FPGA split, the integrated Stratix II architecture reduces latency between acquisition and analysis, which is critical for trigger response and closed-loop stimulus generation.
Recommended
Legacy Software-Defined Radio (SDR)
The EP2S15F672I4N is frequently deployed in legacy SDR platforms that pair an FPGA with a high-speed ADC/DAC to implement flexible RF front-ends. The 156 DSP blocks at 90 nm deliver enough throughput for narrowband waveforms such as 2G/3G base stations, tactical radios, and amateur radio transceivers. The 12 PLLs generate the multiple clock domains required for digital up/down-conversion. Industrial temperature grade and the N suffix (lead-free) make the part suitable for modern manufacturing lines while preserving backward compatibility with older RF designs.
Recommended
Aerospace & Defense Embedded Systems
Aerospace and defense programs that began life on Stratix II continue to use the EP2S15F672I4N for radar front-end processing, avionics data buses, and electronic warfare subsystems. The industrial -40C to +100C temperature grade, combined with the high I/O count of the 672-FBGA, supports MIL-STD-1553, ARINC 429, and parallel ADC interfaces in a single device. The lead-free N-suffix assembly meets modern RoHS requirements for line-replaceable units. For new defense programs, the more recent Stratix V or Cyclone V families are recommended for long-term availability.
Recommended
Medical Imaging & Diagnostic Equipment
The EP2S15F672I4N is used in medical imaging systems including ultrasound beamformers, endoscopy video processors, and patient-monitoring DSP front-ends. The 156 DSP blocks execute real-time beamforming and FIR filtering on multi-channel ultrasound data, while the 366 user I/O connect to high-speed ADCs and LVDS displays. The industrial temperature grade supports the thermal envelope of cart-based and bedside imaging systems. For new medical designs, the Cyclone V SoC family is preferred for integrated ARM Cortex-A9 cores and lower power.
Recommended
Recommended Products Summary
Engineering reference data for EP2S15F672I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S15F672I4 | EP2S15F672C5N | EP2S15F672C4N | EP2S15F672C3N | EP2S30F672I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-Ball FCBGA (27x27 mm) | 672-Ball FCBGA - same | 672-Ball FCBGA - same | 672-Ball FCBGA - same | 672-Ball FCBGA - same | 672-Ball FCBGA - same |
| Logic Elements | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 | ~33,880 |
| Total RAM Bits | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 | ~1,369,728 |
| DSP Blocks | 156 | 156 | 156 | 156 | 156 | 192 |
| User I/O | 366 | 366 | 366 | 366 | 366 | 366 |
| Temperature Grade | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) | Commercial (0C to +85C TJ) | Commercial (0C to +85C TJ) | Commercial (0C to +85C TJ) | Industrial (-40C to +100C TJ) |
| Speed Grade | 4 (mid) | 4 (mid) | 5 (fastest) | 4 (mid) | 3 (slower) | 4 (mid) |
| Lead Free / RoHS | Yes (N suffix) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature grade (-40C to +100C TJ) in the same 672-FBGA package (vs EP2S15F672C4N)
- Higher logic and memory capacity in same 672-FBGA footprint (vs EP2S15F672I4)
- Lead-free, RoHS-compliant assembly (vs EP2S15F672I4)
Design Notes
The Stratix II EP2S15 requires a 1.2 V VCCINT supply, separate VCCIO banks for I/O standards, and an analog PLL supply (VCC_PLL). Power-on ramp sequencing should follow the Stratix II Device Handbook - VCCINT must reach threshold before VCCIO to avoid latch-up. Use a multi-rail LDO or DC-DC with Power Good tied to a logic supervisor. Decoupling requires at least 10x 0.1uF and 4x 10uF ceramic capacitors per VCCINT region, placed as close to the BGA balls as the PCB stack-up allows. Estimated: at 100% toggle rate, the EP2S15 with 366 I/O at 100 MHz draws approximately 1.5-2.0 A on VCCINT alone.
The 672-Ball FCBGA at 27x27 mm has a 1.0 mm ball pitch - a 4-6 layer PCB stack-up with microvia construction is recommended. Matched-length impedance must be controlled to 50 ohm single-ended (100 ohm differential) for LVDS pairs. Use break-out routing on the top layer and escape through microvias. BGA X-ray inspection after reflow is mandatory. The thermal pad (if present in the package variant) must be soldered to a continuous copper pour on the top and inner layers with thermal vias for heat dissipation.
Common pitfalls with the EP2S15F672I4N include: (1) confusing the I4 suffix (industrial, speed grade 4) with the I3/I5 variants - check both letters carefully; (2) using a non-N-suffix part in a lead-free reflow line; (3) forgetting the VCCPD (pre-driver) supply that must be tied to 3.3 V; (4) failing to include the MSEL pins for configuration mode selection. The part is NRD - new designs should target Stratix V, Cyclone V, or Cyclone 10 families for long-term support.
Compliance Information
RoHS compliance and lead-free status confirmed by 'N' suffix per Altera naming convention. REACH, halogen-free, and conflict-minerals status not stated in the verified web data; marked as 'unknown' rather than inferred.
