EP2C70F896I8N - Cyclone II FPGA 68K LE 1.15Mbit 622 IO | Intel
MPN: EP2C70F896I8N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $264 | $2,640.00 |
| 100 | $232.5 | $23,250.00 |
| 250 | $215 | $53,750.00 |
| 500 | $198 | $99,000.00 |
EP2C70F896I8N Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), embedded memory, multipliers, and programmable interconnect, all of which can be reconfigured by the designer after manufacture. Cyclone II sits in the low-cost FPGA segment and is used for glue logic, parallel processing, video bridging, motor control, and prototype ASIC replacement. Within Intel's FPGA portfolio, Cyclone II sits below Cyclone III/IV/V in logic density but remains in service for cost-sensitive, industrial-grade designs.
Key features of the EP2C70F896I8N include 68,416 logic elements, 4,608 Kbits of M9K embedded RAM (1,152,000 bits total), 150 embedded 18x18 multipliers, 4 phase-locked loops (PLLs), and 622 user I/O pins distributed across 8 I/O banks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and other common I/O standards, and offers dedicated DDR/DDR2 SDRAM external memory interfaces through soft IP cores.
Architecturally, Cyclone II uses a 4-input LUT-based logic element with an associated register, optimized for high logic density per square millimeter. The 90 nm process gives a favorable logic-per-watt ratio compared to the prior Cyclone generation, and the embedded multipliers enable DSP functions such as FIR filters and FFT butterflies without external co-processors. The EP2C70F896I8N uses 1.2 V core and 1.2 V/2.5 V/3.0 V/3.3 V I/O supplies, configurable through bank voltage pins.
Typical applications include industrial machine vision, motor control drive boards, video processing and format conversion, low-cost DSP acceleration, telecom line cards, and educational/hobbyist development. The Cyclone II toolchain is supported by Intel Quartus II (legacy) software, and the device is well documented with mature reference designs.
Designers should note that Cyclone II is an older generation part; long-term supply is on the NRND/last-time-buy trajectory, so a migration plan to Cyclone IV E or Cyclone V is recommended for new production programs. Existing designs can rely on the documented pin-out and IBIS models from the Intel Cyclone II Device Handbook.
Drop-in alternatives for EP2C70F896I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C70F896I8N (same form factor and footprint) — differing in Package, Process Technology, RoHS Status, Configuration Modes, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C70F896I8
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →EP2C70F896I7N
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View Datasheet →EP2C70F896C8N
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$189.55 / Unit
View Datasheet →EP2C70F896C7N
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$175 / Unit
View Datasheet →EP2C70F896C6N
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View Datasheet →EP2C70F896I8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 68,416 |
| Embedded Memory Bits | 1,152,000 bits (4,608 Kbits via M9K blocks) |
| Embedded Multipliers (18x18) | 150 |
| PLLs | 4 |
| Maximum User I/O | 622 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Maximum Core Frequency | 402.58 MHz (family typical) |
| Operating Temperature Range | -40C to +100C (industrial, I8 grade) |
| Package | 896-ball FBGA |
| Mounting Type | Surface Mount (BGA) |
| I/O Banks | 8 |
| RoHS Status | Compliant (lead-free) |
EP2C70F896I8N 896-ball fbga Pin Configuration Guide
Pin configuration for EP2C70F896I8N (896-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C70F896I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C70F896I8N is suitable for 7 applications: Industrial Machine Vision, Motor Control and Drive, Video Format Conversion, Telecom Line Card Glue Logic, DSP Acceleration Coprocessor, Educational and Prototyping FPGA Board, Legacy Embedded Industrial Control.
Industrial Machine Vision
The EP2C70F896I8N's 68,416 logic elements, 150 embedded 18x18 multipliers, and 1,152 Kbits of M9K memory make it well suited for industrial machine vision pipelines where Bayer-to-RGB conversion, edge detection, and object classification must run in real time. The 622 user I/Os across 8 banks support parallel image-sensor interfaces (LVDS/CMOS) plus external DDR2 SDRAM for frame buffering, while the 4 PLLs generate the high-frequency pixel clocks needed by modern CMOS sensors. The I8 industrial -40C to +100C junction rating allows deployment in factory-floor enclosures where ambient temperatures exceed 60C.
Recommended
Motor Control and Drive
The EP2C70F896I8N implements field-oriented control (FOC), space-vector PWM, and encoder interfaces for AC induction and PMSM motor drives. Its 150 hardware multipliers execute Park/Clarke transforms and PID loops at microsecond loop rates, and the 4 PLLs derive the switching frequencies typically used in servo and variable-frequency drive applications. The 622 I/Os connect to multi-axis PWM outputs, Hall/quadrature encoders, and resolver excitation channels. Industrial temperature rating suits cabinet-mounted drives without active cooling.
Recommended
Video Format Conversion
The EP2C70F896I8N bridges SDI/HDMI/DisplayPort to LVDS or MIPI by reformatting pixel data through on-chip line buffers backed by 1,152 Kbits of M9K memory. The 622 user I/Os in 8 banks accommodate multiple high-speed video interfaces simultaneously, and the 150 multipliers handle chroma upsampling and color-space conversion in real time. Designers typically implement scalers, deinterlacers, and frame-rate converters as soft IP cores mapped onto the 68,416 LEs.
Recommended
Telecom Line Card Glue Logic
Telecom line cards use the EP2C70F896I8N as a high-density glue-logic aggregator, routing TDM/Ethernet streams through custom packet processors and providing low-latency backplane interfaces. The 622 I/Os support dozens of serial LVDS lanes plus parallel bus interfaces to network processors, while the 1,152 Kbits of block RAM implements per-port FIFOs and traffic shapers. Industrial temperature rating suits outdoor cabinet deployment in 3G/4G base-station equipment.
Recommended
DSP Acceleration Coprocessor
The EP2C70F896I8N accelerates DSP kernels such as FFT, FIR filtering, and convolutional encoders offloaded from a host processor. Each 18x18 hardware multiplier combined with M9K memory blocks forms a parallel MAC pipeline, and 150 multipliers deliver high multiply-accumulate throughput per the Cyclone II DSP block spec. The 4 PLLs generate the clock domains needed for multi-rate DSP blocks, and the 622 I/Os provide high-bandwidth host links via parallel LVDS or external memory bus.
Recommended
Educational and Prototyping FPGA Board
The EP2C70F896I8N is widely adopted in university labs and FPGA training boards because of its 68,416 LEs, 622 I/Os, and mature Quartus II toolchain. Students build CPU cores, graphics controllers, and SoC prototypes; the 1,152 Kbits of M9K memory supports register files and cache memories, while 150 multipliers enable hardware-accelerated learning of DSP. The I8 industrial temperature grade suits laboratory environments without special cooling.
Recommended
Legacy Embedded Industrial Control
The EP2C70F896I8N is favored in long-lifecycle industrial controllers where firmware updates are infrequent and 90 nm reliability is well understood. The device implements Modbus/Profibus/EtherCAT slave interfaces, multi-axis PWM generators, and deterministic state machines for SCADA and PLC applications. Industrial -40C to +100C operation and proven long-term availability through distribution channels make it appropriate for substation, railway, and process-control equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP2C70F896I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C70F896I8 | EP2C70F896I7N | EP2C70F896C8N | EP2C70F896C7N | EP2C70F896C6N |
|---|---|---|---|---|---|---|
| Package | 896-ball FBGA | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 |
| Embedded Memory | 1,152 Kbits (M9K) | 1,152 Kbits | 1,152 Kbits | 1,152 Kbits | 1,152 Kbits | 1,152 Kbits |
| Embedded Multipliers 18x18 | 150 | 150 | 150 | 150 | 150 | 150 |
| User I/O | 622 | 622 | 622 | 622 | 622 | 622 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I8 | I8 | I7 (faster) | C8 | C7 | C6 (fastest) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Highest-density Cyclone II in the 896-ball FBGA footprint (vs EP2C70F672I8N)
- I8 industrial temperature grade for harsh environments (vs EP2C70F896C8N)
- I8 speed grade balances fmax and power for industrial designs (vs EP2C70F896I7N)
- Drop-in compatible with other FBGA-896 Cyclone II variants (vs EP2C50F484I8N (smaller Cyclone II))
Design Notes
The 896-ball FBGA package uses 1.0 mm ball pitch and requires PCB microvia or via-in-pad technology for fan-out; standard 0.4 mm via pads will not escape the inner rows. Use a 4-6 layer stack-up with dedicated ground and 1.2 V core planes adjacent to the BGA, and follow Intel's recommended BGA breakout pattern in the Cyclone II handbook to maintain signal integrity for DDR2 interfaces running at 200 MHz+.
The EP2C70F896I8N requires separate analog 1.2 V (VCCINT), digital 1.2 V (VCCINT), and per-bank I/O supplies (VCCIO 1.2 V/2.5 V/3.0 V/3.3 V). Decoupling must include 0.1 uF X7R capacitors placed within 100 mil of every supply pin plus bulk 47-100 uF tantalum or polymer capacitors; PLL analog supplies (VCCA_PLL) need pi-filter isolation. Estimated core current at 100 MHz ranges 0.5-1.0 A depending on logic utilization.
Even at 90 nm, the EP2C70F896I8N can dissipate 2-4 W in high-utilization designs; the FBGA-896 package has theta_JA approximately 12-15 C/W on a JEDEC 4-layer test board. For industrial 70C ambient operation, provide thermal vias under the central BGA balls and consider a small heatsink or forced airflow to keep junction below 100C; thermal simulation is recommended.
Use the EPCS64SI16N or EPCS128SI16N serial configuration device to store the FPGA bitstream via Active Serial (AS) mode; for JTAG-based development, route TMS/TCK/TDO/TDI to a 10-pin header. The nCONFIG, nSTATUS, and CONF_DONE pins must be pulled high through 10 kohm resistors per the Cyclone II configuration handbook to prevent spurious reconfiguration during power-up.
Do not assume EP2C70F896I8N is pin-compatible with the EP2C70F672I8N - the 896-ball FBGA has more I/O balls even though the silicon is the same die. Also verify bank voltage compatibility: a 3.3 V LVCMOS output driving a 2.5 V LVCMOS input violates Vih spec and causes long-term reliability degradation. Use Quartus II Pin Planner to validate all I/O assignments before PCB fabrication.
Compliance Information
RoHS and lead-free compliant per Intel/Altera product page; 'N' suffix in MPN denotes lead-free. Not AEC-Q100 qualified - for automotive AEC-Q100 applications consult Intel automotive-grade product list. MSL rating not stated in available data - consult JEDEC J-STD-020 on package label.
