EP2S15F672C5N - Stratix II FPGA, 15.6K LEs, 672-BGA | Intel
MPN: EP2S15F672C5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $178.5 | $178.50 |
| 10 | $165.2 | $1,652.00 |
| 100 | $148.75 | $14,875.00 |
| 500 | $132.4 | $66,200.00 |
| 1,000 | $121.9 | $121,900.00 |
EP2S15F672C5N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells, allowing hardware engineers to implement custom digital logic that is re-programmable in the field. FPGAs occupy the tier between general-purpose CPUs/ASICs and small CPLDs: they deliver ASIC-class parallelism and throughput with software-grade design flexibility, making them foundational in communication, computing, and signal-processing systems.
Key features include 6240 Configurable Logic Blocks (CLBs), up to 640 MHz internal operation, dedicated DSP blocks, embedded memory blocks (M512/M4K/M-RAM tiers), up to 12 transceivers depending on variant, and a MultiTrack interconnect architecture. The -C5 speed grade designates a commercial temperature range (0C to +85C) and the mid-speed timing bin, balancing Fmax against power consumption. The 'N' suffix indicates lead-free / Pb-free termination.
Typical applications include high-speed serial I/O expansion, digital signal processing pipelines, protocol bridging, radar and baseband processing, telecom line cards, video and image processing engines, and ASIC prototyping. The Stratix II architecture is widely used in designs requiring embedded transceivers and DSP throughput unavailable in lower-density FPGAs.
When designing with the EP2S15F672C5N, verify that the FBGA-672 land pattern, JTAG chain, and configuration scheme (passive serial, fast passive parallel, or JTAG) match your PCB. Decoupling follows Altera's Stratix II Power Distribution Network (PDN) guidelines with multiple bulk and decoupling capacitor values. Note that the Stratix II family is mature and Intel has since migrated designs to Stratix III/IV/V/10 series — verify long-term availability before starting new production designs.
This page synthesizes drop-in alternatives (same FBGA-672 footprint, identical 15,600-LE / 366-IO resource profile) and engineering design notes not found in the original manufacturer datasheet, helping engineers evaluate replacement risk and supply continuity.
Drop-in alternatives for EP2S15F672C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S15F672C5N (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Configuration Method, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S15F672C5
✅ Drop-In✓ In Stock
$199 / Unit
View Datasheet →EP2S15F672C4N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2S15F672C4
✅ Drop-In✓ In Stock
$235 / Unit
View Datasheet →EP2S15F672C3N
✅ Drop-In✓ In Stock
$142.75 / Unit
View Datasheet →EP2S15F672C3
✅ Drop-In✓ In Stock
$142.3 / Unit
View Datasheet →EP2S30F672C5N
✅ Drop-In✓ In Stock
$450 / Unit
View Datasheet →EP2S15F672C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Series | Altera Stratix II |
| Logic Elements | 15,600 |
| Logic Array Blocks (LABs) | 780 |
| Configurable Logic Blocks (CLBs) | 6,240 |
| Embedded Memory (bits) | 419,328 |
| User I/O Pins | 366 |
| Package | 672-BBGA / FBGA-672 |
| Package Dimensions | 35 x 35 mm |
| Ball Pitch | 1.0 mm |
| Maximum Internal Frequency | 640 MHz |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | -C5 |
| Lead-Free (Pb-Free) | Yes |
| RoHS Status | RoHS Compliant |
EP2S15F672C5N 35 x 35 mm Pin Configuration Guide
Pin configuration for EP2S15F672C5N (35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S15F672C5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S15F672C5N is suitable for 7 applications: Telecom Line Card Processing, Digital Signal Processing (DSP) Pipeline, ASIC Prototyping and Emulation, High-Speed Serial I/O Bridge, Video and Image Processing Engine, Industrial Control and Factory Automation, Military and Aerospace Avionics (Legacy).
Telecom Line Card Processing
The EP2S15F672C5N fits telecom line card processing because its 15,600 logic elements and 419 Kbits of embedded block RAM provide ample capacity for packet classification, traffic shaping, and forwarding table lookups. The 366 user I/Os support multi-interface bridging (UTOPIA, SPI-4.2, SERDES framer connections) typical of legacy SONET/SDH and Ethernet-over-SDH designs. With -C5 speed grade and Quartus Place-and-Route achieving Fmax in the 200-400 MHz range depending on logic depth, designers can implement multi-channel framer logic without external glue ASICs. The FBGA-672 footprint accommodates the high I/O count required for parallel bus interfaces alongside serial links, a configuration typical in Altera reference designs for line cards.
Recommended
Digital Signal Processing (DSP) Pipeline
The EP2S15F672C5N's dedicated DSP blocks and 419 Kbits of embedded RAM enable efficient implementation of FIR filters, FFT engines, and modulators in DSP pipelines. The -C5 speed grade provides Fmax headroom for 16- and 32-tap FIR filters running in the 200-300 MHz range, sufficient for baseband and intermediate-frequency processing. Designers typically instantiate Stratix II DSP blocks via Quartus megafunctions (ALTSQRT, FFT, FIR Compiler) and use the 366 I/Os to stream data between ADC/DAC interfaces and DSP stages. This makes the part well-suited for radar signal processing, software-defined radio baseband, and audio processing racks where high-throughput deterministic latency is required.
Recommended
ASIC Prototyping and Emulation
The EP2S15F672C5N's combination of 15,600 logic elements, abundant block RAM, and 366 I/Os makes it a common vehicle for ASIC prototyping and in-circuit emulation. Quartus Prime and the Synopsys Design Compiler FPGA prototyping flow map synthesized ASIC netlists onto Stratix II logic with high timing accuracy. Engineers partition large ASIC designs across multiple EP2S15 devices using TDM pin multiplexing or stack multiple Stratix II FPGAs on a logic-analyzer daughter board. The -C5 commercial speed grade provides predictable timing closure for ASIC validation where the goal is to verify functional correctness before committing to silicon.
Recommended
High-Speed Serial I/O Bridge
The EP2S15F672C5N supports Stratix II embedded transceivers (where fitted on specific speed-grade/packaging variants) operating at multi-gigabit rates for serial I/O bridging between protocol domains. Common applications include SPI-4.2 to SPI-3 bridging, XAUI to SGMII conversion, and custom serializer/deserializer links between FPGAs. The 366 user I/Os provide ample parallel bus bandwidth for connecting legacy parallel peripherals (memory buses, microcontrollers) to high-speed serial links. Engineers use the Altera ALT2GX megafunction in Quartus to instantiate transceivers and SERDES framing, validating link integrity via the Stratix II hardware reference designs.
Recommended
Video and Image Processing Engine
The EP2S15F672C5N supports video and image processing pipelines for industrial inspection, broadcast, and surveillance applications. The 419 Kbits of embedded RAM serve as line buffers for real-time video at SD/HD resolutions, while the 15,600 logic elements implement color space conversion, scaling, deinterlacing, and edge detection algorithms. The 366 I/Os accept parallel digital video buses (BT.656, BT.1120) and Camera Link interfaces common in machine vision. Designers use Quartus megafunctions like ALTSYNCRAM for line buffering and parameterize FIR filters for 2D convolution, achieving real-time throughput at pixel clock rates of 74.25 MHz (HD) and beyond.
Recommended
Industrial Control and Factory Automation
The EP2S15F672C5N integrates deterministic logic for industrial control, motion control, and factory automation protocols such as EtherCAT, Profibus, and CANopen. The 366 I/Os handle multiple encoder interfaces (incremental, SSI, BiSS), digital I/O expansion, and communication PHY connections. With -C5 speed grade, designers can implement high-rate motion control loops with deterministic sub-microsecond latency, critical for multi-axis CNC and robotics. The FBGA-672 industrial-grade mechanical design and 0C to +85C commercial temperature range suit enclosure-based control cabinets. Quartus SOPC Builder integrates Nios II soft processors for control logic alongside custom hardware accelerators.
Recommended
Military and Aerospace Avionics (Legacy)
The EP2S15F672C5N has historically been qualified into military and aerospace avionics systems where its FBGA-672 footprint, 366 I/Os, and 15,600 logic elements support MIL-STD-1553, ARINC 429, and custom avionics bus implementations. While the commercial -C5 speed grade (0C to +85C) is the part documented here, the broader Stratix II family includes extended-temperature variants used in flight-worthy systems. Engineers sustain legacy avionics designs with this part while migrating new platforms to radiation-tolerant FPGAs. Existing qualified designs continue using EP2S15F672C5N for repairs, retrofits, and spare-part provisioning per FAA sustainment guidelines.
Recommended
Recommended Products Summary
Engineering reference data for EP2S15F672C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S15F672C5 | EP2S15F672C4N | EP2S15F672C4 | EP2S15F672C3N | EP2S15F672C3 | EP2S30F672C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-672 | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same |
| Logic Elements | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 | 33,880 |
| Embedded Memory (bits) | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 | ~1,624,192 |
| User I/O | 366 | 366 | 366 | 366 | 366 | 366 | 366 |
| Speed Grade | -C5 | -C5 | -C4 | -C4 | -C3 | -C3 | -C5 |
| Lead-Free (Pb-Free) | Yes | No (SnPb) | Yes | No (SnPb) | Yes | No (SnPb) | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest Fmax bin within the EP2S15 family in FBGA-672 (vs EP2S15F672C4N)
- Lead-free RoHS-compliant termination (vs EP2S15F672C5 (no 'N'))
- Identical 15,600-LE / 366-IO resource profile across all EP2S15 alternatives (vs EP2S30F672C5N)
Design Notes
Stratix II FPGAs require a multi-rail power distribution network (PDN) supplying VCCINT (core), VCCIO (I/O banks), VCCAUX (auxiliary), and VCCP_PLL (PLL analog) per the Stratix II PowerPlay Power Analysis guidance. Decoupling follows Altera's recommended capacitor mix: 100 uF bulk per voltage rail plus 4.7 uF, 0.1 uF, and 0.01 uF ceramics distributed around the FBGA perimeter. Power sequencing (VCCINT before VCCIO, or simultaneous with monotonic ramp) must follow datasheet requirements to avoid latch-up.
The FBGA-672 package's thermal performance depends heavily on PCB layout — Altera's Stratix II Thermal Management guide specifies a minimum of four thermal vias in the BGA land pad pattern and 1-oz copper pours on inner/outer layers connected to the FPGA thermal pad balls. Without a heatsink, the -C5 commercial variant is rated for 0C to +85C ambient; designers must compute junction temperature via PowerPlay Early Power Estimator and verify margin against the 85C ambient ceiling.
FBGA-672 PCB layout requires 1.0 mm pitch BGA escape routing; fanout should use microvia (laser-drilled) stack-up with at least 4-6 signal layers to break out all 366 user I/Os. Reference the Stratix II device handbook's BGA escape and high-speed signal routing guidelines. Matched-length differential pairs are required for LVDS and transceiver signals; length tolerance per Altera guidelines is typically ±50 mil.
Signal integrity on 366 user I/Os at 100+ MHz requires controlled impedance traces (50 ohm single-ended, 100 ohm differential) per Altera's board design guidelines. Series termination near the FPGA output, AC termination on receiver ends, and via stub minimization (use microvias rather than through-vias) are critical. Run signal integrity simulation with Quartus SI Analyzer or HyperLynx before fabrication.
Common pitfalls: (1) Mixing N and non-N variants on the same assembly run — the lead-free 'N' suffix parts require peak reflow temperatures up to 245C versus ~220C for SnPb finishes, so reflow profile must match the lowest-temperature part on the board. (2) Configuring a -C5 design with timing constraints that exceed -C4 capabilities — verify Quartus timing reports across speed grade options before choosing. (3) Ignoring NRND status when planning new production — Intel has migrated Stratix II to NRND; for new designs evaluate Stratix IV/V/10 instead.
Compliance Information
RoHS compliance confirmed via DigiKey and Mouser product listings and Altera datasheet; the 'N' suffix denotes lead-free ball finish. REACH and conflict minerals status not stated in the verified data — set to unknown per data authenticity rules. AEC-Q100 is not applicable for FPGAs.
