EP2S30F484C3N - Stratix II FPGA 33880 LE, 342 IO | Intel
MPN: EP2S30F484C3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $797.9622 | $797.96 |
| 10 | $797.9622 | $7,979.62 |
| 100 | $797.9622 | $79,796.22 |
| 500 | $797.9622 | $398,981.10 |
| 1,000 | $797.9622 | $797,962.20 |
EP2S30F484C3N Overview
A field-programmable gate array is an integrated circuit whose logic fabric can be reconfigured after manufacturing, allowing digital logic functions to be implemented without a custom ASIC. FPGAs sit in the programmable-logic hierarchy as FPGA -> programmable logic device -> embedded processing/accelerator; they are used when designers need parallel computing, flexible I/O, and in-field updates. Stratix II is Altera's second-generation high-density FPGA family built for high-bandwidth communications, DSP, and system-level integration. Understanding this hierarchy helps engineers position the EP2S30F484C3N inside a board-level design and select appropriate configuration, memory, and power-management companion devices.
Key features of the EP2S30F484C3N include 33,880 logic elements arranged in 1,694 LABs, 1,369,728 bits of embedded RAM, 342 user I/Os, and a quoted maximum internal frequency of 816.99 MHz. The device is manufactured on a 90 nm CMOS process and operates from a 1.2 V core supply. The 484-ball FC-FBGA package provides a dense interconnect for a wide interface count while keeping the PCB footprint manageable. These parameters make the device well suited for applications that require substantial on-chip logic, distributed memory, and many parallel I/O channels.
Architecturally, Stratix II organizes logic in LABs containing adaptive logic modules, giving the device more efficient mapping of wide logic functions than conventional four-input LUT architectures. Embedded memory blocks support multiple data-width and synchronous modes, while the general-purpose I/O supports numerous single-ended and differential standards. In the EP2S30F484C3N, the 1,369,728 RAM bits are available for packet buffering, image line storage, or soft-processor local memory. The 90 nm process technology balances density with power, but legacy FPGAs of this family still require careful power-supply and thermal design in modern systems.
Typical applications for the EP2S30F484C3N include high-bandwidth telecom packet processing, software-defined radio, video and image processing, medical imaging, and aerospace pre-processing circuits. The abundant I/Os allow direct connection to LVDS buses, commercial memory interfaces, and backplane logic. On-chip RAM reduces off-chip memory bandwidth pressure for line-rate buffering and datapath staging. Designers should also consider this FPGA for high-performance glue logic and protocol bridging where an ASIC is not justified.
When using the EP2S30F484C3N, keep the 1.2 V core supply well decoupled with low-ESR ceramic capacitors and verify that the serial configuration device supports the intended power-on reset scheme. Because this is a mature 90 nm device, plan for package date code availability, thermal management, and board-level signal integrity. The configuration bitstream should be stored in an external configuration device such as an EPC or EPCS part.
This page synthesizes distributor pricing, within-family drop-in alternatives, and practical design guidance not found in a single distributor listing, helping engineers evaluate the EP2S30F484C3N for new designs and legacy replacement projects.
Drop-in alternatives for EP2S30F484C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S30F484C3N (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Core Voltage, Maximum Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S30F484C3
✅ Drop-In✓ In Stock
$620 / Unit
View Datasheet →EP2S30F484C4N
✅ Drop-In✓ In Stock
$480 / Unit
View Datasheet →EP2S30F484C5
✅ Drop-In✓ In Stock
$305.4 / Unit
View Datasheet →EP2S30F484C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$124 / Unit
View Datasheet →EP2S30F484I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$305 / Unit
View Datasheet →EP2S30F484C3N Maximum Ratings & Electrical Characteristics
| FPGA Family | Stratix II |
| Number of Logic Elements/Cells | 33880 cells |
| Number of LABs | 1694 LABs |
| Total RAM Bits | 1369728 bits |
| Number of User I/Os | 342 |
| Core Supply Voltage | 1.2 V |
| Maximum Internal Frequency | 816.99 MHz |
| Technology Process | 90 nm CMOS |
| Package / Case | 484-BBGA, FC-FBGA |
| Number of Ball Terminals | 484 |
| Mounting Type | Surface Mount |
| Terminal Form | Ball |
| Package Shape | Square |
EP2S30F484C3N square Pin Configuration Guide
Pin configuration for EP2S30F484C3N (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S30F484C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S30F484C3N is suitable for 6 applications: High-Bandwidth Telecom Packet Processing, Software-Defined Radio and Digital Signal Processing, Video and Medical Image Processing, Industrial Automation and Motion Control, Aerospace, Defense and Radar Pre-Processing, ASIC Prototyping and High-Performance Glue Logic.
High-Bandwidth Telecom Packet Processing
The EP2S30F484C3N is well suited to telecom line-card and aggregation designs where parallel processing of many packet streams is required. Its 342 user I/Os can connect directly to multiple MAC/PHY interfaces and backplane parallel busses, while the 1,369,728 RAM bits provide on-chip FIFO and packet-buffer memory. The 33,880 logic elements give enough capacity for soft MAC engines, traffic schedulers, and framing logic without an external host FPGA. Because the core runs at 1.2 V on 90 nm CMOS, designers must provide clean low-voltage rails and decoupling close to the FC-FBGA package. A configuration EPCS or EPC device should be used to load the SRAM-based bitstream at power-up. For replacement projects, verify that the selected speed grade supports the required backplane clock frequency.
Recommended
Software-Defined Radio and Digital Signal Processing
Software-defined radio subsystems benefit from the EP2S30F484C3N's abundant logic elements and memory resources for digital down-conversion, channel filtering, and protocol processing. The device can implement multiple parallel FIR filtering stages or numerically controlled oscillator datapaths in programmable logic, allowing the radio waveform to be updated in the field by changing the FPGA configuration. The 342 I/O pins are enough to interface to wide high-speed ADCs and DACs using LVDS or parallel CMOS standards. The 1,369,728 RAM bits allow coefficient storage or sample buffers to be kept on-chip. When using this Stratix II device in radio designs, pay attention to clock jitter on the clocks that feed the FPGA and consider the lower C4/C5 speed-grade alternatives only if datapath timing margins permit. This is not a real-time processor but a parallel hardware accelerator, so DSP algorithms must be mapped into RTL rather than C code.
Recommended
Video and Medical Image Processing
The EP2S30F484C3N provides enough programmable logic and on-chip RAM to perform video scaling, image filtering, frame synchronization, and display timing control. A 33,880-logic-element FPGA can host several line buffers and a simple soft processor for coordinate tracking or system control, while the 1,369,728 RAM bits are useful for storing image lines and small frame tiles. The wide I/O count allows connection to high-speed image sensors, DDR memory devices, and display interface ICs. Medical imaging products benefit from the deterministic latency of FPGA processing and the ability to update image-processing algorithms without changing PCB hardware. For a medical or safety-critical deployment, confirm the device temperature grade, power supply quality, and configuration memory reliability. The C3 speed grade is preferred when processing high-pixel-rate video at 60 fps or above, while lower speed grades may be acceptable for lower-resolution systems.
Recommended
Industrial Automation and Motion Control
In industrial automation, EP2S30F484C3N can implement multi-axis motor-control loops, encoder decoding, fieldbus interfacing, and safety logic in one device. The FPGA's parallel architecture can generate multiple PWM waveforms with tightly controlled phase relationships and can decode quadrature encoder signals without CPU load. The 342 I/Os provide ample connectivity for optocouplers, isolated gate drivers, encoder interfaces, and industrial backplane buses. Because industrial environments can have noisy supplies and wide temperature variation, use an industrial-grade variant such as EP2S30F484I4N if the ambient temperature exceeds the commercial range. The Stratix II I/O banks support many standards, allowing direct connection to 3.3 V and 2.5 V logic families. For high-reliability motion controllers, add external clock supervision and brown-out monitoring on the 1.2 V core rail.
Recommended
Aerospace, Defense and Radar Pre-Processing
Defense and aerospace systems often use FPGAs for radar pulse compression, beamforming coefficient generation, and secure protocol handling. The EP2S30F484C3N offers 33,880 logic elements that can host multiple parallel receive chains and digital down-converters, while the embedded memory supports wide data buffers between analog front-ends and back-end processors. Its 484-ball FC-FBGA package is compatible with standard high-reliability PCB assembly flows, but any aerospace deployment must verify against the original Altera qualification data because this is a commercial-temperature part. The C3 speed grade is frequently selected when maximum pulse repetition interval processing speed is needed. Use external configuration memory with error detection, and add supply filtering on the 1.2 V core to minimize power-supply-induced noise. For extended-temperature operation, select the I4N industrial variant or evaluate an alternative Stratix II package if required.
Recommended
ASIC Prototyping and High-Performance Glue Logic
EP2S30F484C3N is frequently used during ASIC prototyping because it has enough logic elements and I/Os to map RTL blocks intended for custom silicon. Design teams can select a socketed board containing this FPGA to validate functions before committing to an ASIC mask. The 342 user I/Os allow connections to multiple emulation probes, memory models, and test headers, while the 1,369,728 RAM bits help model semiconductor memories. The C3 speed grade is valuable for prototyping because it gives the best timing margin for emulation clocks. In high-performance glue logic applications, the FPGA can also replace multiple discrete bus transceivers and state machines, reducing board complexity. A soft processor can be instantiated for system management while the rest of the fabric implements custom peripherals. This type of usage requires a well-designed configuration controller and power sequencing for reliable operation.
Recommended
Recommended Products Summary
Engineering reference data for EP2S30F484C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S30F484C3 | EP2S30F484C4N | EP2S30F484C5 | EP2S30F484C4 | EP2S30F484I4N |
|---|---|---|---|---|---|---|
| Package | 484-BBGA (FC-FBGA) | 484-BBGA (FC-FBGA) | 484-BBGA (FC-FBGA) | 484-BBGA (FC-FBGA) | 484-BBGA (FC-FBGA) | 484-BBGA (FC-FBGA) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Number of Logic Elements | 33880 | 33880 | 33880 | 33880 | 33880 | 33880 |
| Number of LABs | 1694 | 1694 | 1694 | 1694 | 1694 | 1694 |
| Total RAM Bits | 1369728 | 1369728 | 1369728 | 1369728 | 1369728 | 1369728 |
| Number of User I/Os | 342 | 342 | 342 | 342 | 342 | 342 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade / Temperature Grade | C3 (commercial speed grade 3) | C3, no N suffix | C4N (commercial, one speed bin lower) | C5 (commercial, low speed bin) | C4, no N suffix | I4N (industrial temperature, speed grade 4) |
Key Differentiators
- C3 speed grade is the fastest commercial bin in the 484-ball EP2S30 family (vs EP2S30F484C4N)
- Lead-free N suffix for RoHS-sensitive assembly (vs EP2S30F484C3)
- 484-ball density with 342 user I/Os and 1.37 Mbit RAM (vs EP2S15F484C3N)
Design Notes
The EP2S30F484C3N core operates from a 1.2 V supply. Estimated core power will depend on logic utilization, toggle rate, clock frequency, and I/O loading; use the Stratix II power estimator spreadsheet from Intel/Altera rather than a simple static calculation. Place multiple 100 nF ceramic capacitors and a few 10 uF bulk capacitors close to the core supply balls, and keep the 1.2 V plane low impedance across the frequency range. Verify that the regulator can source the transient current without droop below the Stratix II minimum VCC specification. For legacy boards reusing this FPGA, check that the voltage regulator is not oversized for the actual current demand, causing poor light-load efficiency.
The 484-ball FC-FBGA package requires careful PCB breakout, especially because the EP2S30F484C3N has 342 user I/Os. Follow the recommended ball map from the Stratix II device handbook and use blind/buried vias only if they are supported by the board stack-up. Route high-speed differential pairs with controlled impedance and place series termination near the FPGA I/O. Because this is a 90 nm device with fast I/O edge rates, avoid unnecessarily long traces to memory or bus interfaces. Use ground vias around each signal via to reduce emissions and improve signal integrity. If reusing a legacy layout, confirm the ball pad size and via capture pad match the specific FC-FBGA package drawing.
A common pitfall with Stratix II designs is forgetting that this is an SRAM-based FPGA requiring external configuration at every power-up. Do not leave the configuration pins unconnected, and choose an EPC or EPCS device compatible with the selected configuration scheme. Another pitfall is assuming C4N or C5 speed grades offer identical timing to C3; they share the same silicon and package, but performance is binned lower. Re-run timing analysis after changing the speed-grade suffix, and verify any low-level I/O standards in the target voltage bank. Because this part is mature, also confirm that the date code is valid and that the extended supply chain can support your production forecast.
Compliance Information
The N suffix in Altera Stratix II ordering normally denotes a lead-free/RoHS-compliant package finish, but the retrieved web data does not explicitly state RoHS or REACH status. AEC-Q100 is not applicable because this is a commercial FPGA, not an automotive IC. Confirm final compliance against the original Intel/Altera qualification documents.
