EP2S30F484C3 - Stratix II FPGA, 33.8K LE, 484-FBGA | Intel
MPN: EP2S30F484C3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $870.79 | $870.79 |
| 10 | $820 | $8,200.00 |
| 100 | $740 | $74,000.00 |
| 500 | $680 | $340,000.00 |
| 1,000 | $620 | $620,000.00 |
EP2S30F484C3 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory/DSP blocks that can be reconfigured by the end user after manufacturing. FPGAs occupy a specific position in the digital logic hierarchy: programmable logic device -> FPGA -> high-density FPGA -> SoC FPGA. Unlike fixed-function ASICs, FPGAs offer rapid prototyping, in-field updates, and parallel hardware execution, which is why they are widely used in communications infrastructure, high-performance DSP, and ASIC prototyping. The Stratix II family specifically targets high-density, high-performance applications.
The EP2S30F484C3 distinguishes itself with embedded DSP blocks, up to 12 embedded transceivers depending on the variant, and hard intellectual-property (IP) blocks such as memory controllers and PLLs. The 1.20 V core voltage reduces dynamic power compared with the 1.5 V Stratix generation while preserving high clock rates, with internal performance characterized up to 717 MHz. The 23 x 23 mm FBGA-484 package with 1.0 mm ball pitch provides a compact footprint suitable for high-density PCB designs while exposing up to 342 user I/O for external interfacing.
This FPGA architecture is well suited for telecom baseband processing, high-speed serial protocol bridging, video/image processing pipelines, and ASIC prototyping where designers need to validate complex RTL before committing to silicon. The embedded TriMatrix memory blocks provide true dual-port RAM configurations, simplifying FIFO and packet-buffer implementations.
When designing with the EP2S30F484C3, consider that the FBGA-484 package requires careful PCB layout with microvia or via-in-pad technology. Designers must follow Altera's power-decoupling and sequencing guidelines to ensure clean 1.2 V core rail delivery and avoid latch-up during hot-swap events.
Drop-in alternatives for EP2S30F484C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S30F484C3 (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Core Voltage, Maximum Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S30F484C3N
✅ Drop-In✓ In Stock
$797.9622 / Unit
View Datasheet →EP2S30F484C4
✅ Drop-In✓ In Stock
$124 / Unit
View Datasheet →EP2S30F484C4N
✅ Drop-In✓ In Stock
$480 / Unit
View Datasheet →EP2S30F484C5
✅ Drop-In✓ In Stock
$305.4 / Unit
View Datasheet →EP2S30F484C5N
✅ Drop-In✓ In Stock
$367.48 / Unit
View Datasheet →EP2S30F484C3 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 33,880 |
| LABs / CLBs | 1,694 |
| Total RAM Bits | 1,369,728 |
| Number of User I/O | 342 |
| Number of I/O Pins (Package) | 500 |
| Core Voltage | 1.20 V |
| Operating Temperature (Max) | 85 C (Commercial) |
| Speed Grade | C3 |
| Package | 484-BBGA, FCBGA, 23 x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm CMOS |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO) |
| Embedded DSP Blocks | Yes |
| PLL Count | Multiple (per family datasheet) |
EP2S30F484C3 484-bbga, fcbga, 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2S30F484C3 (484-bbga, fcbga, 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S30F484C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S30F484C3 is suitable for 7 applications: Telecom Baseband Processing, High-Speed Serial Protocol Bridge, Video and Image Processing Pipeline, ASIC Prototyping and Emulation, Industrial Control and Automation, Test and Measurement Instrumentation, Aerospace and Defense Avionics.
Telecom Baseband Processing
The EP2S30F484C3 fits telecom baseband designs thanks to its 33,880 logic elements and embedded DSP blocks capable of executing high-throughput channel-coding and modulation algorithms. At 1.20 V core and 717 MHz internal performance, the FPGA can implement multiple parallel DSP pipelines for 3G/4G baseband sample rates while staying within thermal and power budgets. The 342 user I/O allow connection to multiple ADC/DAC channels and backplane interfaces. Designers place the FPGA on a multi-layer PCB with controlled-impedance traces and use the embedded TriMatrix RAM for symbol buffers and de-interleaver storage. Unlike ASIC implementations, the FPGA allows late-stage algorithm updates for evolving wireless standards.
Recommended
High-Speed Serial Protocol Bridge
The EP2S30F484C3 serves as a protocol-bridging FPGA between serializer/deserializer interfaces operating at multi-gigabit rates. The 342 user I/O support multiple LVDS or HSTL channels, while embedded transceivers (where present in variant) handle Aurora, Serial RapidIO, or custom 8b/10b protocols. The 1,369,728-bit TriMatrix memory provides sufficient buffering for packet reassembly between mismatched clock domains. Engineers typically pair the FPGA with external PHY chips and use the PLL resources to generate low-jitter reference clocks. Compared with discrete protocol converters, the FPGA approach allows firmware-level protocol customization without respinning the PCB.
Recommended
Video and Image Processing Pipeline
The EP2S30F484C3 is well suited for video processing because of its parallel DSP blocks and 1.20 V core, enabling real-time HD video filtering, scaling, and color-space conversion. The 342 I/O provide ample bandwidth for parallel digital-video buses such as BT.1120, LVDS, or HDMI bridge logic. Designers allocate on-chip TriMatrix memory as line buffers, freeing external DDR for frame storage. The 90 nm CMOS process delivers sufficient logic density to implement 2D convolutions, motion-estimation kernels, or JPEG2000 codecs in a single device. Compared with GPU-based solutions, the FPGA offers deterministic latency and lower power at the same throughput.
Recommended
ASIC Prototyping and Emulation
The EP2S30F484C3 serves as a target platform for ASIC/ASSP prototyping, where designers partition large RTL designs across multiple FPGAs and verify functionality before tape-out. The 33,880 logic elements accommodate mid-complexity ASIC blocks, while the FBGA-484 footprint enables multi-FPGA partitioning boards with standardized pinout. Engineers use the embedded TriMatrix RAM to model ASIC SRAM macros and the DSP blocks to verify DSP-intensive ASIC paths. Compared with running the same logic on a slower software simulator, FPGA prototyping provides 100x-1000x speedup and exposes real-world timing and I/O behavior that simulation cannot capture.
Recommended
Industrial Control and Automation
The EP2S30F484C3 supports industrial control designs requiring deterministic logic and parallel sensor processing. The 342 I/O allow direct connection to multiple encoder, PWM, and GPIO channels found in motor-control and PLC systems. The 1.20 V core reduces power dissipation relative to older 1.5 V FPGAs, easing thermal management in sealed industrial enclosures. Designers implement custom communication stacks (EtherCAT, Profinet, Modbus) directly in logic to bypass external ASICs. Compared with microcontroller-based solutions, the FPGA approach delivers deterministic cycle times and supports fast parallel I/O scanning rates required by high-end motion controllers.
Recommended
Test and Measurement Instrumentation
The EP2S30F484C3 fits test and measurement platforms requiring high-speed custom DSP and parallel data acquisition. The FPGA's embedded DSP blocks implement real-time FFTs, FIR filters, and digital demodulation, while the 342 I/O support multi-channel ADC interfacing with LVDS or parallel CMOS interfaces. The 1,369,728-bit TriMatrix memory provides deep capture buffers for transient analysis. Engineers use the PLL resources to generate low-jitter ADC sampling clocks from a precision external reference. Compared with commercial DSP processors, the FPGA delivers higher sample rates at lower cost per channel in logic-analyzer and oscilloscope designs.
Recommended
Aerospace and Defense Avionics
The EP2S30F484C3, despite being commercial-grade, is widely deployed in legacy aerospace and defense systems where long-term support outweighs the need for industrial or military temperature grades. The 33,880 logic elements handle guidance, navigation, and control algorithms in UAV and avionics subsystems, while the 342 I/O connect to multiple sensor buses. Defense-grade supply channels provide traceability and lot-date-code documentation required by aerospace quality standards. Engineers use the embedded TriMatrix memory to implement radar pulse-compression buffers and DSP blocks for signal conditioning. Compared with radiation-hardened FPGAs, the EP2S30F484C3 offers 5x-10x higher logic density at a fraction of the cost for non-space applications.
Recommended
Recommended Products Summary
Engineering reference data for EP2S30F484C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S30F484C3N | EP2S30F484C4 | EP2S30F484C4N | EP2S30F484C5 | EP2S30F484C5N |
|---|---|---|---|---|---|---|
| Package | 484-BBGA (FBGA-484) | 484-BBGA (FBGA-484) - same | 484-BBGA (FBGA-484) - same | 484-BBGA (FBGA-484) - same | 484-BBGA (FBGA-484) - same | 484-BBGA (FBGA-484) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Speed Grade | C3 | C3 | C4 (slower) | C4 (slower) | C5 (slowest) | C5 (slowest) |
| Lead-Free / RoHS | Standard (non-N suffix) | Yes (N suffix) | Standard | Yes (N suffix) | Standard | Yes (N suffix) |
| Total RAM Bits | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| User I/O Count | 342 | 342 | 342 | 342 | 342 | 342 |
| Core Voltage | 1.20 V | 1.20 V | 1.20 V | 1.20 V | 1.20 V | 1.20 V |
Key Differentiators
- Higher speed grade vs same-package alternatives (vs EP2S30F484C4)
- Mid-density sweet spot in Stratix II family (vs EP2S130F1508C3N)
- Same silicon as lead-free N variant (vs EP2S30F484C3N)
Design Notes
The FBGA-484 package at 1.0 mm ball pitch requires microvia or via-in-pad PCB technology for reliable BGA breakout. Designers must allocate at least 4 PCB layers (signal, ground, power, signal) with continuous reference planes beneath the BGA to maintain signal integrity for the 342 user I/O. Use of low-Dk/Df PCB materials is recommended above 100 MHz I/O rates to control insertion loss on parallel buses.
The EP2S30F484C3 requires multiple supply rails (1.20 V core, 2.5 V/3.3 V I/O banks, PLL analog supply) with strict power-on sequencing per Altera's Stratix II handbook. Designers must use Altera-recommended controller ICs such as the LTM4627 or equivalent to enforce VCCINT-before-VCCIO ramp order. Bulk decoupling of 330 uF plus 0.1 uF ceramic per supply pin is required; missing decoupling leads to core-voltage droop and JTAG configuration failures.
Configuration failures are the most common Stratix II board bring-up issue. Verify MSEL pin strapping matches the desired configuration mode (AS, PS, JTAG, FPP). Confirm CONF_DONE, nSTATUS, and nCONFIG pull-ups are present. For legacy designs, ensure the Quartus II programmer version supports the Stratix II device ID - newer Quartus versions drop older device support, so archive the programming files with the firmware revision.
At high utilization (above 80% logic and DSP usage), the FBGA-484 package can dissipate 5-8 W depending on clock rate and toggle activity. Although commercial temperature grade (0-85 C) is rated, a 1 sq inch copper pour with thermal vias to inner ground planes is recommended to keep junction temperature below 100 C. Forced-air cooling should be considered for fanless sealed enclosures.
Compliance Information
EP2S30F484C3 (non-N suffix) is the standard lead finish variant; the EP2S30F484C3N is the lead-free RoHS variant. Both share the same FBGA-484 footprint.
