EP2S30F484I4 - Stratix II FPGA, 33880 Cells, 484-FBGA | Altera
MPN: EP2S30F484I4 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $198 | $19,800.00 |
| 500 | $178.2 | $89,100.00 |
| 1,000 | $159 | $159,000.00 |
EP2S30F484I4 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded memory and DSP resources, all of which the designer configures after manufacture via a hardware description language (HDL) and a vendor toolchain. FPGAs sit alongside ASICs and microcontrollers in the broader category of programmable logic devices and are chosen when high parallelism, custom I/O timing, or hardware-accelerated DSP is required - as in telecommunications, video processing, and military/aerospace systems.
Key features of the EP2S30F484I4 include up to 142 embedded 18 x 18 multipliers for DSP workloads, up to 12 phase-locked loops (PLLs) for multi-clock-domain synthesis, and Stratix II's signature ALM (Adaptive Logic Module) architecture that delivers higher logic efficiency than the older Stratix/LE-based approach. The 'I' speed grade and industrial temperature rating (-40 C to +100 C ambient for this part) make it suitable for harsh-environment deployments.
The 90 nm CMOS technology with 1.2 V core voltage offers a balanced trade-off between static power, dynamic performance, and logic density. The 484-pin FBGA package provides 342 usable user I/Os plus dedicated configuration, JTAG, clock, and supply balls, with the high pin count enabling wide parallel buses, multiple high-speed LVDS channels, and ample external memory interfacing.
Typical applications include high-speed telecommunications line cards, DSP-intensive baseband processing, video broadcast and imaging pipelines, radar and signal-intelligence systems, and industrial control platforms requiring custom hardware acceleration. The device is also a common choice for legacy ASIC-replacement projects.
When designing with this part, engineers must plan the power distribution network carefully because Stratix II core current can exceed several amps during high toggle rates; multiple 0.1 uF / 10 uF / 100 uF decoupling capacitors are required on each VCCINT and VCCPD rail, and a minimum 4-layer PCB stackup with a dedicated ground plane is recommended to control simultaneous switching output (SSO) noise.
This page synthesizes distributor pricing for the EP2S30F484I4, drop-in alternatives in the same 484-FBGA footprint, and practical design notes that are not present in the standalone manufacturer datasheet - giving procurement and design engineers a single reference for evaluation.
Drop-in alternatives for EP2S30F484I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S30F484I4 (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Core Voltage, Maximum Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S30F484I4N
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →EP2S30F484C5N
✅ Drop-In✓ In Stock
$367.48 / Unit
View Datasheet →EP2S30F484C5
✅ Drop-In✓ In Stock
$305.4 / Unit
View Datasheet →EP2S30F484C4N
✅ Drop-In✓ In Stock
$480 / Unit
View Datasheet →EP2S30F484C4
✅ Drop-In✓ In Stock
$124 / Unit
View Datasheet →EP2S30F484C3N
✅ Drop-In✓ In Stock
$797.9622 / Unit
View Datasheet →EP2S30F484C3
✅ Drop-In✓ In Stock
$620 / Unit
View Datasheet →EP2S30F484I4 Maximum Ratings & Electrical Characteristics
| Series | Stratix II |
| Logic Elements / Cells | 33,880 |
| Number of LABs/CLBs | 1,694 |
| Total RAM Bits | 1,369,728 |
| Number of I/O | 342 |
| Voltage - Supply | 1.2 V |
| Process Technology | 90 nm CMOS |
| Operating Temperature | -40 C to +100 C (Industrial) |
| Package / Case | 484-BBGA, FC-FBGA |
| Mounting Type | Surface Mount |
| Speed Grade | I (Industrial) |
| Embedded Multipliers | up to 142 (18 x 18) |
| PLLs | up to 12 |
EP2S30F484I4 484-bbga, fc-fbga Pin Configuration Guide
Pin configuration for EP2S30F484I4 (484-bbga, fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S30F484I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S30F484I4 is suitable for 6 applications: Telecommunications Line Cards, DSP-Intensive Baseband Processing, Video Broadcast and Imaging Pipelines, Radar and Signal-Intelligence Systems, Industrial Control and Machine Vision, ASIC Replacement and Legacy Bridge Logic.
Telecommunications Line Cards
The EP2S30F484I4's 33,880 logic elements and 1,369,728 RAM bits, combined with up to 142 embedded 18x18 multipliers, make it a strong fit for telecom line-card datapaths that run packet processing, framing, and forward-error-correction in parallel. In a typical OC-192/STM-64 line card the device implements custom ATM/IMA shimming, UTOPIA-level interface glue, and per-channel CRC engines while the LVDS-capable I/Os connect directly to SERDES framer ICs. The 1.2 V core keeps dynamic power lower than previous-generation Stratix parts, and the 484-FBGA package exposes 342 user I/Os for parallel multi-port routing without an external bus-switch fabric.
Recommended
DSP-Intensive Baseband Processing
With up to 142 hardware multipliers and 1.37 Mbit of embedded block RAM, the EP2S30F484I4 accelerates baseband DSP for wireless transceivers - including FIR filtering, FFT/iFFT kernels, channel estimation, and turbo-decoding. The Stratix II ALM architecture provides higher effective utilization than fixed-4-LUT fabrics, so a 256-point FFT fits within 25-35% of the device. The 1.2 V core plus 90 nm CMOS node deliver a balance of low power and high Fmax, while the 484-FBGA exposes enough LVDS pairs to feed multiple ADC/DAC channels in parallel.
Recommended
Video Broadcast and Imaging Pipelines
The EP2S30F484I4 supports real-time HD-SDI and DVB-ASI video processing by combining 33,880 LEs, multi-rate SDR/DDR memory interfaces, and up to 12 PLLs for video clock generation. In broadcast studio equipment it implements de-interlacing, scaling, chroma-keying, and overlay blending while the embedded RAM buffers full video frames. The industrial temperature rating (-40 C to +100 C) and 484-FBGA's high I/O count let the same part serve in studio-grade ingest units and outdoor broadcast vehicles.
Recommended
Radar and Signal-Intelligence Systems
Radar, SIGINT, and electronic-warfare platforms use the EP2S30F484I4 for pulse compression, beamforming weight calculation, and adaptive filtering at sample rates up to several hundred MHz. The 142 hardware multipliers enable real-time FFT-based spectrum analysis, while the 1.37 Mbit of block RAM holds rotating buffers for sliding-window CFAR detection. The 90 nm process offers the radiation-tolerance margin often required in defense applications, and the 484-FBGA exposes enough LVDS pairs to interface directly to high-speed ADC rails.
Recommended
Industrial Control and Machine Vision
Industrial machine-vision systems rely on the EP2S30F484I4 to glue Camera Link or CoaXPress imagers, perform high-throughput image pre-processing (gamma, white balance, edge detection), and stream results over Gigabit Ethernet. The 33,880 LEs and 342 user I/Os handle multiple simultaneous image channels, while the 1.2 V core and proven 90 nm node balance thermal envelope and performance. The industrial temperature rating (-40 C to +100 C) supports factory-floor and outdoor deployments without derating.
Recommended
ASIC Replacement and Legacy Bridge Logic
When end-of-life of a legacy ASIC forces a redesign, the EP2S30F484I4 offers 33,880 LEs in a 484-FBGA footprint that emulates the original device's logic, registers, and memory map without a respin. The Quartus II toolchain preserves legacy VHDL/Verilog, so the same HDL source compiles to the Stratix II fabric. The industrial temperature rating extends the deployment envelope of systems originally qualified for harsher environments, and the 342 user I/Os replace complex TTL/CMOS glue-logic stacks with a single programmable part.
Recommended
Recommended Products Summary
Engineering reference data for EP2S30F484I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S30F484I4N | EP2S30F484C5N | EP2S30F484C5 | EP2S30F484C4N | EP2S30F484C3N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I (Industrial) | I | 5 (slower) | 5 (slower) | 4 (faster) | 3 (fastest) |
| User I/O | 342 | 342 | 342 | 342 | 342 | 342 |
| Embedded Memory | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Industrial temperature rating with speed-grade 'I' (vs EP2S30F484C5 / EP2S30F484C5N)
- RoHS lead-free variant 'N' suffix available (vs EP2S30F484I4 (non-N))
- Mid-density 33,880-LE Stratix II positioned between EP2S15 and EP2S60 (vs EP2S15F484I4 / EP2S60F484I4)
Design Notes
Stratix II EP2S30 core current on VCCINT (1.2 V) can exceed 3-5 A under high toggle rates. Decoupling: place at least six 0.1 uF / 0.01 uF MLCCs directly under the package plus four 10 uF bulk capacitors adjacent to each VCCINT ball cluster. VCCPD banks (1.5 V to 3.3 V) each require their own 0.1 uF + 10 uF pair. Estimated core power at 100% toggle rate with 33,880 LEs: 4-6 W. A 4-layer PCB with a continuous VCC/GND plane sandwich is strongly recommended.
The 484-FBGA uses a 1.0 mm ball pitch, requiring laser-drilled microvias on the top signal layer and a high-Tg (Tg > 170 C) FR-4 stackup. Match trace lengths within each LVDS pair to within 150 mil to preserve differential signal integrity, and length-match byte lanes for DDR/DDR2 SDRAM interfaces per the Stratix II Device Handbook. Solid ground islands beneath the BGA are mandatory - stitched with GND vias on a 1 mm grid - to provide both return-current paths and thermal dissipation.
Estimated: at 4 W core dissipation and a typical FC-FBGA theta-JA of 18 C/W on a 4-layer JEDEC board, the junction temperature rises 72 C above ambient. Industrial-grade ambient ceiling (100 C) leaves only 28 C margin, so derate by either clock frequency or utilization, or add a small heatsink / copper heat-spreader. Reference the Stratix II characterization report for verified thermal resistance curves before finalizing the cooling solution.
Do not configure JTAG chains with mixed-voltage devices without a level-shifter; the EP2S30F484I4 JTAG pins are 2.5 V tolerant on most speed grades. Always pull MSEL[2:0] to the correct state for the chosen configuration mode (AS, PS, JTAG, or FPP) before power-up - a floating MSEL can leave the device in an undefined configuration state. After configuration, drive nCONFIG high and wait for CONF_DONE before starting user logic. Quartus II programmer sessions over USB-Blaster should use the latest device support file for revision 'I4'.
Series-terminate LVTTL/LVCMOS outputs with 33 ohm to 50 ohm resistors placed within 300 mil of the FPGA pin to control edge rates and SSO noise. For DDR2 SDRAM interfaces, use dynamic OCT (on-chip termination) and follow the Stratix II external memory interface guidelines for fly-by vs T-branch topology - the 484-FBGA package has limited dedicated DQS pins, so planar DDR2 interfaces require careful pin mapping. Differential LVDS pairs must be routed on the same layer with no more than 90-degree bends.
Compliance Information
RoHS / lead-free status not provided in the verified web data; EP2S30F484I4 (non-N suffix) is the lead-bearing original, while the 'N' suffix variants (EP2S30F484I4N, EP2S30F484C5N, EP2S30F484C4N, EP2S30F484C3N) are lead-free RoHS-compliant per Altera/Intel catalog conventions. AEC-Q100 is not applicable to FPGAs.
