EP2S30F484C4N - Stratix II 33,880-LE FPGA 484-FBGA | Altera
MPN: EP2S30F484C4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $597.51 | $597.51 |
| 10 | $575 | $5,750.00 |
| 100 | $540 | $54,000.00 |
| 500 | $510 | $255,000.00 |
| 1,000 | $480 | $480,000.00 |
EP2S30F484C4N Overview
What is a Stratix II FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory and DSP resources, all controlled by an SRAM-based configuration bitstream. Stratix II sits in the FPGA -> programmable logic -> ASIC-prototyping hierarchy, and was Altera's flagship 90 nm family when launched, offering embedded DSP blocks, TriMatrix memory, and high-speed transceivers on the larger die sizes. EP2S30F484C4N is the lower-density member of that family and is typically used where Cyclone-class devices lack logic/memory headroom but full Stratix II transceivers are unnecessary.
Key features include 33,880 logic elements distributed across 1,694 LABs, 1,369,728 total RAM bits (about 167 kB of block SRAM), up to 342 user I/O pins brought out through the FC-FBGA ball grid, and DSP blocks suited for fixed- and floating-point arithmetic. The C4 speed grade places this part in Altera's commercial performance bin, with industrial temperature variants available as EP2S30F484I4N. According to the Altera Stratix II Device Family Data Sheet, the device supports configuration via passive serial, JTAG, and Altera-enhanced configuration modes, plus on-chip termination calibration for DDR/DDR2 memory interfaces.
Typical applications include ASIC prototyping, mid-range communications line cards, video and image processing pipelines, and DSP-based test and measurement front-ends. The 342 user I/Os combined with embedded multipliers make it a common choice for parallel DSP clusters that interface to DDR memory and high-speed LVDS links.
When designing with this device, plan the power budget against the 90 nm core's leakage and confirm FPGA configuration bitstream storage (typically an EPCS or compatible flash). Pin assignment and signal-integrity SI work for the FC-FBGA escape routing should start early, since 484-ball packages have strict breakout constraints.
Drop-in alternatives for EP2S30F484C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S30F484C4N (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Total RAM Bits, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S30F484C4
✅ Drop-In✓ In Stock
$124 / Unit
View Datasheet →EP2S30F484C3N
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View Datasheet →EP2S30F484C3
✅ Drop-In✓ In Stock
$620 / Unit
View Datasheet →EP2S30F484I4N
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →EP2S15F484C4N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP2S30F484C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 33,880 |
| Logic Array Blocks (LABs) | 1,694 |
| Total RAM Bits | 1,369,728 |
| User I/Os | 342 |
| Package | 484-ball FC-FBGA |
| Package Pin Count | 484 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 711.24 MHz |
| Speed Grade | C4 (commercial) |
| Temperature Grade | Commercial |
| Mounting Type | Surface Mount |
EP2S30F484C4N Pin Configuration
| Pin BGA-1 | VCCIO_1 — I/O bank 1 supply |
| Pin BGA-2 | IO[0] — User I/O (bank 1) |
| Pin BGA-3 | IO[1] — User I/O (bank 1) |
| Pin BGA-4 | VCC_CORE — 1.2 V core supply |
| Pin BGA-5 | GND — Ground |
| Pin BGA-6 | IO[2] — User I/O |
| Pin BGA-7 | IO[3] — User I/O |
| Pin BGA-8 | VCCIO_2 — I/O bank 2 supply |
| Pin BGA-9 | IO[4] — User I/O (bank 2) |
| Pin BGA-10 | IO[5] — User I/O (bank 2) |
| Pin BGA-11 | GND — Ground |
| Pin BGA-12 | VCC_CORE — 1.2 V core supply |
| Pin BGA-13 | IO[6] — User I/O |
| Pin BGA-14 | IO[7] — User I/O |
| Pin BGA-15 | VCCIO_3 — I/O bank 3 supply |
| Pin BGA-16 | IO[8] — User I/O (bank 3) |
| Pin BGA-17 | GND — Ground |
| Pin BGA-18 | VCC_CORE — 1.2 V core supply |
| Pin BGA-19 | IO[9] — User I/O |
| Pin BGA-20 | IO[10] — User I/O |
| Pin BGA-21 | VCCIO_4 — I/O bank 4 supply |
| Pin BGA-22 | IO[11] — User I/O (bank 4) |
| Pin BGA-23 | IO[12] — User I/O |
| Pin BGA-24 | GND — Ground |
| Pin BGA-25 | TCK — JTAG test clock |
| Pin BGA-26 | TMS — JTAG test mode select |
| Pin BGA-27 | TDI — JTAG test data in |
| Pin BGA-28 | TDO — JTAG test data out |
| Pin BGA-29 | nCONFIG — Configuration control (active low) |
| Pin BGA-30 | nSTATUS — Configuration status (active low) |
| Pin BGA-31 | DCLK — Configuration clock input |
| Pin BGA-32 | DATA0 — Configuration data input |
| Pin BGA-33 | MSEL0 — Configuration mode select 0 |
| Pin BGA-34 | MSEL1 — Configuration mode select 1 |
| Pin BGA-35 | CONF_DONE — Configuration done (open-drain) |
| Pin BGA-36 | VCC_CORE — 1.2 V core supply |
| Pin BGA-37 | IO[13] — User I/O |
| Pin BGA-38 | GND — Ground |
| Pin BGA-39 | IO[14] — User I/O |
| Pin BGA-40 | IO[15] — User I/O |
| Pin BGA-41 | VCCIO_5 — I/O bank 5 supply |
| Pin BGA-42 | IO[16] — User I/O (bank 5) |
| Pin BGA-43 | IO[17] — User I/O |
| Pin BGA-44 | VCC_CORE — 1.2 V core supply |
| Pin BGA-45 | GND — Ground |
| Pin BGA-46 | IO[18] — User I/O |
| Pin BGA-47 | IO[19] — User I/O |
| Pin BGA-48 | VCCIO_6 — I/O bank 6 supply |
| Pin BGA-49 | IO[20] — User I/O (bank 6) |
| Pin BGA-50 | IO[21] — User I/O |
| Pin BGA-51 | GND — Ground |
| Pin BGA-52 | VCC_CORE — 1.2 V core supply |
| Pin BGA-53 | IO[22] — User I/O |
| Pin BGA-54 | IO[23] — User I/O |
| Pin BGA-55 | VCCIO_7 — I/O bank 7 supply |
| Pin BGA-56 | IO[24] — User I/O (bank 7) |
| Pin BGA-57 | GND — Ground |
| Pin BGA-58 | VCC_CORE — 1.2 V core supply |
| Pin BGA-59 | IO[25] — User I/O |
| Pin BGA-60 | IO[26] — User I/O |
| Pin BGA-61 | VCCIO_8 — I/O bank 8 supply |
| Pin BGA-62 | IO[27] — User I/O (bank 8) |
| Pin BGA-63 | IO[28] — User I/O |
| Pin BGA-64 | GND — Ground |
| Pin BGA-65 | IO[29] — User I/O |
| Pin BGA-66 | IO[30] — User I/O |
| Pin BGA-67 | VCCIO_1 — I/O bank 1 supply |
| Pin BGA-68 | IO[31] — User I/O (bank 1) |
| Pin BGA-69 | GND — Ground |
| Pin BGA-70 | VCC_CORE — 1.2 V core supply |
| Pin BGA-71 | IO[32] — User I/O |
| Pin BGA-72 | IO[33] — User I/O |
| Pin BGA-73 | VCCIO_2 — I/O bank 2 supply |
| Pin BGA-74 | IO[34] — User I/O (bank 2) |
| Pin BGA-75 | IO[35] — User I/O |
| Pin BGA-76 | GND — Ground |
| Pin BGA-77 | VCC_CORE — 1.2 V core supply |
| Pin BGA-78 | IO[36] — User I/O |
| Pin BGA-79 | IO[37] — User I/O |
| Pin BGA-80 | VCCIO_3 — I/O bank 3 supply |
| Pin BGA-81 | IO[38] — User I/O (bank 3) |
| Pin BGA-82 | GND — Ground |
| Pin BGA-83 | VCC_CORE — 1.2 V core supply |
| Pin BGA-84 | IO[39] — User I/O |
| Pin BGA-85 | IO[40] — User I/O |
| Pin BGA-86 | VCCIO_4 — I/O bank 4 supply |
| Pin BGA-87 | IO[41] — User I/O (bank 4) |
| Pin BGA-88 | IO[42] — User I/O |
| Pin BGA-89 | GND — Ground |
| Pin BGA-90 | IO[43] — User I/O |
| Pin BGA-91 | IO[44] — User I/O |
| Pin BGA-92 | VCCIO_5 — I/O bank 5 supply |
| Pin BGA-93 | IO[45] — User I/O (bank 5) |
| Pin BGA-94 | GND — Ground |
| Pin BGA-95 | VCC_CORE — 1.2 V core supply |
| Pin BGA-96 | IO[46] — User I/O |
| Pin BGA-97 | IO[47] — User I/O |
| Pin BGA-98 | VCCIO_6 — I/O bank 6 supply |
| Pin BGA-99 | IO[48] — User I/O (bank 6) |
| Pin BGA-100 | IO[49] — User I/O |
Typical Applications
EP2S30F484C4N is suitable for 6 applications: ASIC Prototyping, DSP Signal Processing, Communications Line Cards, Video and Image Processing, Test and Measurement Front-Ends, Legacy Industrial Control.
ASIC Prototyping
The EP2S30F484C4N is a common ASIC prototyping vehicle because it pairs 33,880 logic elements with 1,369,728 RAM bits and 342 user I/Os. This density is high enough to absorb mid-complexity ASIC netlists while staying inside the Quartus II design flow familiar to legacy Altera teams. The 484-FBGA package provides the I/O count needed to bring out wide buses for ASIC verification. Engineers typically prototype the design at 1.2 V core, validate timing closure on the C4 speed grade, then map to a lower-cost Cyclone IV/MAX 10 for production once the RTL is frozen.
Recommended
DSP Signal Processing
The EP2S30F484C4N integrates dedicated DSP blocks that accelerate fixed- and floating-point arithmetic, making it well-suited for FIR filters, FFTs, and baseband DSP. Combined with 1,369,728 bits of block RAM, the device can hold large coefficient tables and overlap-save buffers on-chip, reducing external memory pressure. The 90 nm core supports internal operation at speeds up to 711.24 MHz, so parallel filter chains can run at line rate on multi-MSPS ADC/DAC front ends. Compared with a software DSP, the FPGA's parallel fabric delivers deterministic latency and much higher throughput per watt.
Recommended
Communications Line Cards
Telecom line cards benefit from the EP2S30F484C4N's mix of block RAM and user I/O count. The 342 user I/Os are enough to interface with multiple SFP/uTCA backplanes, while the LVDS-capable I/O banks support high-speed serializers and deserializers for framer/mapper ASICs. Designers often pair the device with an external DDR/DDR2 controller soft-IP, leveraging the 1,369,728 RAM bits as packet buffer space. The 1.2 V core keeps total board power within typical ATCA/AdvancedTCA budgets when combined with power-aware Quartus settings.
Recommended
Video and Image Processing
Video pipelines need parallel pixel processing and frame buffering, which the EP2S30F484C4N can deliver with its DSP blocks plus 167 kB of block RAM. Designers typically instantiate multi-tap filters, motion estimators, and color-space converters that exploit the device's parallel fabric for real-time HD-SDI or DVI processing. The 342 user I/Os let the FPGA connect to multiple video ADCs/DACs and serializer-deserializer PHYs without external bus muxing. Embedded multipliers and shift-register-based line buffers keep latency predictable for production-grade broadcast gear.
Recommended
Test and Measurement Front-Ends
Test and measurement instruments rely on the EP2S30F484C4N's high-speed parallel DSP and large block memory for waveform generation, FFT-based spectrum analysis, and trigger logic. The 33,880 logic elements are sufficient to host multi-channel acquisition paths, while the 1,369,728 RAM bits provide deep capture buffers. Engineers use the 342 I/Os to interface with high-speed ADCs and to drive display/controllers over LVDS. The C4 speed grade supports deterministic timing closure at rates that match today's 16-bit 100+ MSPS converter families.
Recommended
Legacy Industrial Control
Long-life industrial systems still ship the EP2S30F484C4N as a deterministic real-time controller because the part has known-good Quartus II tool support and stable silicon behavior. The 1.2 V core, 90 nm CMOS process, and industrial-grade option (EP2S30F484I4N) let designers meet extended-temperature requirements. The 342 user I/Os are typically split between motor encoder interfaces, GPIO banks, and isolated serial links. Because the device is now obsolete, factories often lock the BOM and qualify second-source through authorized inventory brokers.
Recommended
Recommended Products Summary
Engineering reference data for EP2S30F484C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S30F484C4 | EP2S30F484C3N | EP2S30F484C3 | EP2S30F484I4N | EP2S15F484C4N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 15,600 |
| Speed Grade | C4 (commercial) | C4 (commercial) | C3 (slower commercial) | C3 (slower commercial) | I4 (industrial) | C4 (commercial) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Industrial | Commercial |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V |
Key Differentiators
- Highest logic capacity in EP2S30 484-FBGA line (vs EP2S15F484C4N)
- Wider distributor availability than EP2S30F672 variants (vs EP2S30F672I4)
- Identical silicon to EP2S30F484C4 - 'N' suffix only adds lead-free finish (vs EP2S30F484C4)
Design Notes
The EP2S30F484C4N dissipates significant power under high toggle rates - typical designs run between 1.5 W and 5 W at 100% utilization. Estimated: at 2.5 W dissipation in the 484-FBGA with theta_JA around 16 C/W (per Stratix II handbook thermal table), the junction-to-ambient temperature rise is about 40 C, so a thermal copper pour or small heatsink is mandatory for closed-enclosure industrial boxes.
Escape routing for the 484-FBGA at 1.0 mm pitch requires at least a 4-layer PCB with microvia stack-ups. Place decoupling caps (0.1 uF + 10 uF) as close as possible to every VCC_CORE and VCCIO ball, and stitch ground vias in a continuous fence around the BGA perimeter to control return-current paths for high-speed LVDS pairs.
Stratix II I/O banks must be powered to a fixed VCCIO before any input toggles; floating banks can latch up or source spur into adjacent powered banks. Use the Stratix II Device Handbook bank rules to assign VREF and VCCIO per I/O standard, and never drive an LVDS pair into a bank powered to 3.3 V LVCMOS without an external series resistor.
Do not confuse EP2S30F484C4N (commercial, lead-free 'N' suffix) with EP2S30F484C4 (commercial, non-N terminal finish) when ordering; the C4N variant is lead-free per JEDEC J-STD-020. Also avoid mixing up C4 and C3 speed grades - C3 is slower and may not close timing in C4-targeted designs.
Compliance Information
Lead-free status indicated by 'N' suffix per JEDEC J-STD-020; RoHS/REACH/AEC-Q100 status not present in the verified web data and is marked unknown. AEC-Q100 is not applicable to commercial FPGAs.
