EP2S30F484C5N - Stratix II FPGA, 33.8K LE, 484-FBGA | Intel
MPN: EP2S30F484C5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $524.97 | $524.97 |
| 10 | $472.47 | $4,724.70 |
| 100 | $424.83 | $42,483.00 |
| 500 | $393.73 | $196,865.00 |
| 1,000 | $367.48 | $367,480.00 |
EP2S30F484C5N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined by a user-supplied configuration bitstream rather than fixed at the fab. FPGAs sit hierarchically within programmable logic -> logic ICs -> integrated circuits, and are used to implement glue logic, DSP pipelines, high-speed serial interfaces, and custom parallel compute engines in a single device. Compared with ASICs, FPGAs offer shorter development cycles and field-upgradable functionality, at the cost of higher unit price, higher dynamic power, and lower absolute performance-per-watt. The Stratix II family, introduced by Altera (now Intel FPGA), was an early 90 nm high-performance family that preceded the Stratix III/IV/Cyclone families.
Key features of the EP2S30F484C5N include 24 DSP blocks (18x18 multipliers) for fixed- and floating-point pipelines, 12 PLLs (phase-locked loops) for clock synthesis and skew management, 1.2 V core supply, and 13,552 ALMs (Adaptive Logic Modules) for fine-grained logic mapping. The device supports up to 1.3 Mbits of embedded RAM, configurable as M512, M4K, or M-RAM blocks. The 484-FBGA package uses a 1.0 mm ball pitch on a 23 x 23 mm substrate and is supplied in tray packaging.
Architecture-wise, the Stratix II device uses a logic-structure of ALMs and TriMatrix memory blocks, with dedicated high-speed I/O capability for LVDS, HSTL, SSTL, and PCI/PCI-X signalling. The 24 embedded DSP blocks accelerate multiplier-accumulate operations used in FIR filters and FFT engines. Twelve PLLs enable multi-domain clock synthesis and jitter-cleaning of reference clocks, supporting designs that require multiple synchronous frequencies.
Typical applications include high-speed data-acquisition front-ends, software-defined radio (SDR) baseband processing, telecom line-card packet processing, video broadcast encode/decode, and ASIC prototyping. The 33.8K logic-element capacity is well-suited to mid-complexity designs that exceed Cyclone capacity but do not require the larger Stratix II EP2S60/EP2S90 devices. The 342 user I/Os allow wide parallel buses for memory or data converters.
A key design consideration: the EP2S30F484C5N requires a 1.2 V core supply with separate VCCIO banks for I/O voltage; both must be sequenced correctly per the Stratix II handbook. The 484-FBGA package demands reflow-profile and PCB-pad geometry control per JEDEC J-STD-020.
This page synthesizes distributor stock, lifecycle status, pin-compatibility alternatives, and design notes that go beyond what the manufacturer datasheet alone provides, helping engineers select and source this Stratix II FPGA with confidence.
Drop-in alternatives for EP2S30F484C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S30F484C5N (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Total RAM Bits, Core Voltage.
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View Datasheet →EP2S30F484C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 33880 |
| Adaptive Logic Modules (ALMs) | 13552 |
| Logic Array Blocks (LABs) | 1694 |
| Maximum User I/O Pins | 342 |
| Embedded RAM Bits | 1369728 |
| DSP Blocks | 24 |
| Embedded 18x18 Multipliers | 24 |
| PLLs | 12 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 90 nm CMOS |
| Speed Grade | C5 |
| Maximum Internal Frequency | 609.76 MHz |
| Package | 484-Ball FBGA (FBGA-484) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
EP2S30F484C5N 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2S30F484C5N (23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S30F484C5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S30F484C5N is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, Telecom Line-Card Packet Processing, High-Speed Data Acquisition Front-End, ASIC Prototyping and Emulation, Video Broadcast Encode/Decode, Industrial Control and Motor Drive.
Software-Defined Radio (SDR) Baseband
The EP2S30F484C5N's 33,880 logic elements, 24 DSP blocks with 18x18 multipliers, and 12 PLLs make it well-suited to mid-complexity SDR baseband processing. The 1.3 Mbit embedded RAM (M512/M4K/M-RAM blocks) buffers IQ samples between the ADC frontend and the demodulation pipeline, while the 24 DSP blocks accelerate multiply-accumulate operations used in FIR filtering, channelization, and FFT engines. The 342 user I/Os route parallel ADC/DAC buses, and the 12 PLLs synthesize multiple synchronous clocks for ADC sampling, DAC reconstruction, and digital up-/down-conversion stages. Compared with newer Cyclone families, the Stratix II fabric delivers stronger DSP throughput per MHz but at higher power, so designs must budget thermal dissipation carefully.
Recommended
Telecom Line-Card Packet Processing
The EP2S30F484C5N delivers the logic, memory, and I/O bandwidth needed for mid-density telecom line cards such as channelized T1/E1 framers, low-density Ethernet MAC bridges, and ATM/PoS termination. Its 342 user I/Os support parallel UTOPIA/SPI-4.2 PHY interfaces and LVDS links to network processors; the 1.3 Mbit of embedded RAM acts as a packet buffer queue. The 12 PLLs synthesize independent clocks for the line side, system side, and backplane SERDES reference, while the 24 DSP blocks accelerate Reed-Solomon and Viterbi forward-error-correction operations. Designers should pair the FPGA with external PHY transceivers and provision for hot-swap control on the line-card slot.
Recommended
High-Speed Data Acquisition Front-End
The EP2S30F484C5N's 342 I/Os and C5 speed grade make it an excellent frontend controller for parallel ADC/DAC arrays in test-and-measurement and radar systems. The fabric can capture 16+ channels of 14-bit ADC data at 100-200 MSPS, perform real-time channel calibration, and forward digitized samples to a host over PCI/PCI-X or external memory. The 1.3 Mbit embedded RAM functions as a deep capture buffer between the ADC and the host interface, while the 24 DSP blocks implement digital down-conversion and decimation filters. Designers should allocate dedicated VCCIO banks to LVDS for ADC data and HSTL for memory interfacing, and follow Stratix II Handbook signal-integrity guidelines for 100+ MHz parallel buses.
Recommended
ASIC Prototyping and Emulation
With 33,880 logic elements, 1.3 Mbit embedded RAM, and 24 hardware multipliers, the EP2S30F484C5N serves as a building-block in multi-FPGA ASIC prototyping and hardware-emulation systems. A 1M-gate ASIC can typically be partitioned across 8-16 EP2S30 devices, with each device running a partitioned slice of the design at near-ASIC clock rates thanks to the C5 speed grade. The 342 I/Os are used for inter-FPGA pin multiplexing boards, and the 12 PLLs derive the divided clocks for each partition. Quartus II supports floorplan-based partitioning and TimeQuest timing closure for sub-1 MHz to 200 MHz ASIC clocks. Modern alternatives include Stratix IV/V dev kits, but the EP2S30 remains widely available in the secondary market.
Recommended
Video Broadcast Encode/Decode
The EP2S30F484C5N's combination of 24 DSP blocks, 342 I/Os, and 1.3 Mbit embedded RAM supports SDI/HD-SDI video routing, MPEG-2/H.264 pre-processing, and broadcast-format conversion. The fabric can ingest multiple HD-SDI streams at 1.485 Gbps via LVDS, perform real-time de-interlacing and chroma conversion, and output to DVI/HDMI transmitters. The 12 PLLs generate the pixel clocks and video reference clocks required by SMPTE 292M/259M, while the 24 DSP blocks accelerate DCT/IDCT and motion-estimation kernels. Designers typically pair the FPGA with external DDR memory and audio CODECs to complete the broadcast pipeline.
Recommended
Industrial Control and Motor Drive
The EP2S30F484C5N delivers the logic density needed for multi-axis motor control, encoder decoding, and real-time industrial protocol conversion (EtherCAT, Profibus, CANopen). Its 24 DSP blocks implement Park/Clarke transforms and SVPWM modulation for 3-phase inverters, while the 342 I/Os interface to resolver-to-digital converters, Hall sensors, and gate-driver ICs. The 1.3 Mbit embedded RAM stores control-loop state and trajectory tables. Industrial designers should select the I4 (industrial temperature) speed-grade variant for -40C to +100C operation; the EP2S30F484C5N itself is specified for 0C to +85C commercial temperature only per the Stratix II datasheet.
Recommended
Recommended Products Summary
Engineering reference data for EP2S30F484C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S30F484C5 | EP2S30F484C4N | EP2S30F484C4 | EP2S30F484C3N | EP2S30F484C3 | EP2S30F484I4N |
|---|---|---|---|---|---|---|---|
| Package | 484-Ball FBGA (FBGA-484), 23x23 mm | 484-Ball FBGA (FBGA-484), 23x23 mm - same | 484-Ball FBGA (FBGA-484), 23x23 mm - same | 484-Ball FBGA (FBGA-484), 23x23 mm - same | 484-Ball FBGA (FBGA-484), 23x23 mm - same | 484-Ball FBGA (FBGA-484), 23x23 mm - same | 484-Ball FBGA (FBGA-484), 23x23 mm - same |
| Brand | Intel | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Speed Grade | C5 (fastest, ~609 MHz) | C5 (fastest, ~609 MHz) | C4 (~503 MHz) | C4 (~503 MHz) | C3 (~450 MHz) | C3 (~450 MHz) | I4 (industrial temp, ~503 MHz) |
| RoHS Compliance | Yes (Pb-free) | No (leaded) | Yes (Pb-free) | No (leaded) | Yes (Pb-free) | No (leaded) | Yes (Pb-free) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| DSP Blocks | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Embedded RAM Bits | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| Maximum User I/O | 342 | 342 | 342 | 342 | 342 | 342 | 342 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- C5 speed grade (fastest commercial bin) (vs EP2S30F484C4N)
- RoHS Pb-free lead finish (vs EP2S30F484C5)
- 24 dedicated DSP blocks with hardware multipliers (vs Cyclone II EP2C50F484C8N)
- 12 PLLs for multi-domain clock synthesis (vs Stratix II EP2S15F484C5N)
Design Notes
The Stratix II EP2S30F484C5N requires a 1.2 V core supply (VCCINT) plus one or more VCCIO supplies for I/O banks (1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on I/O standard). Power-on sequencing must follow the Stratix II Handbook: VCCINT must reach 1.0 V before VCCIO, and the nCONFIG pin must be held low until all supplies are stable. Decoupling requires 100 uF bulk + 1 uF + 0.1 uF per VCC pin group. Estimated worst-case dynamic power at full DSP utilization can exceed 5 W; provide thermal dissipation via 4-layer PCB with solid ground/power planes.
The 484-FBGA package uses a 1.0 mm ball pitch on a 23x23 mm substrate, requiring PCB pad diameters of 0.45-0.50 mm with NSMD (non-solder-mask-defined) land geometry per IPC-7351. Microvia-in-pad or via-in-pad plating is recommended for inner-row BGA escape; the 4-row BGA layout demands HDI (high-density-interconnect) stackup with 1-2 build-up layers. Match all length-matched differential pairs (LVDS/HSTL) within 0.127 mm (5 mil) skew, and route reference planes unbroken beneath all high-speed signals. Follow JEDEC J-STD-020 reflow profile with peak temperature 245-260C for Pb-free (C5N) variant.
Do not assume the EP2S30F484C5N is RoHS-compliant without verifying the suffix - the non-'N' C5 variant is leaded and not RoHS. Do not confuse speed grades: C3/C4/C5 are timing bins, not temperature grades; only the 'I' prefix denotes industrial (-40C to +100C). Do not exceed the Stratix II VCCINT absolute maximum of 1.35 V - over-voltage instantly destroys the 90 nm fabric. When migrating to newer Cyclone IV/V families, expect a Quartus recompile plus full revalidation, since the Stratix II ALM architecture is not IP-compatible with Cyclone.
Allocate dedicated VCCIO banks per I/O standard: 1.5 V for HSTL Class I/II, 1.8 V for LVDS, 2.5 V for SSTL-II, 3.3 V for LVTTL/LVCMOS. Reference clock inputs (CLK[0..11]) should be routed as 50-ohm controlled-impedance traces with series-termination at the source. Place the EPC2 configuration PROM (or Quartus-generated .jam file) within 5 cm of the FPGA to avoid JTAG/AS configuration errors. Use shared ground returns under all differential pairs; never split ground planes in the FBGA exit region.
Compliance Information
RoHS and REACH status derived from the 'N' suffix in the MPN per Altera/Intel ordering information. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified IC.
