EP2S60F1020I4N - Stratix II FPGA, 60K LE, 1020-BGA | Intel
MPN: EP2S60F1020I4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $360.5 | $3,605.00 |
| 100 | $325 | $32,500.00 |
| 500 | $295 | $147,500.00 |
| 1,000 | $270 | $270,000.00 |
EP2S60F1020I4N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by a configuration bitstream loaded from external flash at power-up. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> system-on-chip (SoC) FPGAs, and are widely used as hardware accelerators in the hierarchy of microprocessors -> DSPs -> FPGAs -> custom ASICs. Stratix II specifically targets high-performance ASIC prototyping, telecom baseband processing, and high-speed serial I/O subsystems where deterministic latency and parallel arithmetic throughput are required.
Key features include up to 36 embedded 18x18 multipliers organized into DSP blocks, twelve PLLs for clock management, support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM, and 12 high-speed transceiver channels supporting up to 6.375 Gbps for protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Each Stratix II LAB contains 10 Adaptive Logic Modules (ALMs), each ALM containing two Adaptive Look-Up Tables (ALUTs), enabling efficient mapping of arithmetic, register, and combinational logic.
The architecture is fabricated on a 90 nm strained-silicon CMOS process with copper interconnect and low-k dielectric. It supports a maximum user I/O count of 718 across 32 I/O banks, with per-bank voltage-referenced standards ranging from 1.2 V to 3.3 V including LVDS, LVPECL, HSTL, and SSTL. Configuration is via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), fast passive parallel (FPP), or JTAG, with bitstream encryption and decompression supported through the AES-128 engine.
Typical applications include ASIC prototyping and emulation, telecom line-card payload processing, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, CEI-6G), video and image processing pipelines, and military/aerospace signal-processing platforms. The Stratix II family is widely used in defense, medical imaging, and broadcast video systems where deterministic throughput is critical.
When designing with this device, careful attention must be paid to power-rail sequencing (VCCINT, VCCIO, VCCA, VCCD_PLL), thermal management via the exposed die and 1.0 mm BGA pitch, and signal-integrity routing for the transceiver channels. Reference designs and IBIS models from Altera's design resource center are recommended for first-time bring-up. This page synthesizes distributor pricing, drop-in alternative SKUs within the Stratix II family, and practical design considerations not found on a stockist product page.
Drop-in alternatives for EP2S60F1020I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F1020I4N (same form factor and footprint) — differing in Package, RoHS Status, Operating Temperature, Logic Elements, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S60F1020I4
✅ Drop-In✓ In Stock
$1454.92 / Unit
View Datasheet →EP2S60F1020C5N
✅ Drop-In✓ In Stock
$143.75 / Unit
View Datasheet →EP2S60F1020C4N
✅ Drop-In✓ In Stock
$67 / Unit
View Datasheet →EP2S60F1020C3N
✅ Drop-In✓ In Stock
$1095 / Unit
View Datasheet →EP2S130F1020I4N
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2S60F1020I4N Maximum Ratings & Electrical Characteristics
| Series | Stratix II |
| Family | Stratix II FPGA |
| Logic Elements (LE) | 60,440 |
| Embedded Memory Bits | 2,544,192 |
| Maximum User I/O | 718 |
| Number of I/O Banks | 32 |
| DSP Blocks (18x18 multipliers) | 36 |
| PLLs | 12 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Package | 1020-ball FCBGA (33 x 33 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | -4 |
| Configuration Scheme | PS, PPS, PPA, FPP, JTAG |
| Embedded Transceiver Channels | 12 channels up to 6.375 Gbps |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | unknown |
EP2S60F1020I4N 1020-ball fcbga (33 x 33 mm) Pin Configuration Guide
Pin configuration for EP2S60F1020I4N (1020-ball fcbga (33 x 33 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S60F1020I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S60F1020I4N is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line-Card Payload Processing, High-Speed Serial Protocol Bridging, Video and Image Processing Pipelines, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP2S60F1020I4N's 60,440 logic elements at 717 MHz fabric performance and 2,544,192 bits of embedded memory make it well-suited for ASIC prototyping and emulation of mid-complexity ASIC designs. Each LAB contains 10 ALMs supporting combinational, registered, and arithmetic operations with 18x18 multipliers grouped into 36 DSP blocks. The 718 user I/Os across 32 banks enable direct mapping of wide datapath ASIPs without external muxing. Designers typically instantiate multiple EP2S60F1020I4N devices in a logic-analyzer-style partitioned array to emulate million-gate ASICs.
Recommended
Telecom Line-Card Payload Processing
Telecom line-card payload processing benefits from the EP2S60F1020I4N's 12 embedded transceivers operating up to 6.375 Gbps and its hard PCI Express Gen1/Gen2 IP block. The device can simultaneously bridge Serial RapidIO to Ethernet, perform packet classification, and execute deep-packet inspection in hardware via its 36 DSP blocks. The 1020-BGA package's 718 I/Os accommodate multiple SFI-5 / XAUI lanes plus a 64-bit DDR2 controller with ECC, supporting typical OTU2/OTU3 framer companion chips. This density fits mid-range line cards used in metro-aggregation and 3G/4G base-station backhaul.
Recommended
High-Speed Serial Protocol Bridging
The EP2S60F1020I4N's twelve embedded transceivers supporting PCI Express, Serial RapidIO, Gigabit Ethernet, and CEI-6G make it ideal for protocol-bridging applications such as PCIe-to-SRIO bridges in radar and DSP subsystems, or XAUI-to-multiple SGMII fan-out in telecom switches. The fabric's 717 MHz performance allows sub-microsecond cut-through forwarding latency. The 1020-BGA package's high I/O count (718 pins) supports both the transceiver reference clocks and the parallel side-band GPIO for I2C, MDIO, and JTAG control.
Recommended
Video and Image Processing Pipelines
The EP2S60F1020I4N's 36 dedicated DSP blocks each capable of 600 MHz 18x18 multiply-accumulate, combined with 2.5 Mbits of embedded block RAM for line buffering, deliver the throughput required for HD-SDI video processing, H.264 encode/decode acceleration, and medical-imaging pipelines. The 718 user I/Os accept multiple 10-bit/12-bit parallel video buses plus DVI/HDMI/DisplayPort interfaces through soft IP. Real-time 1080p60 processing at 148.5 MHz pixel rate is achievable with comfortable margin. Broadcast video and ultrasound systems have historically standardized on Stratix II for this workload.
Recommended
Military and Aerospace Signal Processing
The EP2S60F1020I4N's industrial temperature grade (-40C to +100C) and high-density logic fabric suit military/aerospace signal-processing platforms including software-defined radio (SDR), electronic-warfare (EW) subsystems, and radar front-end preprocessing. The device's radiation-tolerant characteristics derive from its 90 nm CMOS process and SRAM-based configuration, allowing bitstream reloading for fault recovery. The 1020-BGA package's 718 I/Os accommodate multiple ADC/DAC parallel interfaces, while the 36 DSP blocks perform FFT, FIR, and pulse-Doppler processing at radar sample rates.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol analyzers, BERT testers, and arbitrary waveform generators benefit from the EP2S60F1020I4N's 718 I/Os, twelve transceivers, and 36 DSP blocks. The fabric can implement multi-channel state machines, deep capture buffers using the 2.5 Mbit embedded RAM, and real-time protocol decoding at line rate. Industrial temperature grade supports bench, ATE, and field-deployed instrumentation. The 717 MHz fabric performance enables triggering and capture at sub-nanosecond resolution.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F1020I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F1020I4 | EP2S60F1020C5N | EP2S60F1020C4N | EP2S60F1020C3N | EP2S130F1020I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BGA (FCBGA) 33x33 mm | 1020-BGA (FCBGA) - same | 1020-BGA (FCBGA) - same | 1020-BGA (FCBGA) - same | 1020-BGA (FCBGA) - same | 1020-BGA (FCBGA) - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 132,540 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial |
| Speed Grade | -4 | -4 | -5 (faster) | -4 | -3 (slower) | -4 |
| Lead-Free (RoHS) | Yes (N suffix) | No (non-N) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| User I/O | 718 | 718 | 718 | 718 | 718 | 718 |
| Embedded Transceivers | 12 channels up to 6.375 Gbps | 12 channels up to 6.375 Gbps | 12 channels up to 6.375 Gbps | 12 channels up to 6.375 Gbps | 12 channels up to 6.375 Gbps | 12 channels up to 6.375 Gbps |
Key Differentiators
- 60,440 LEs in 1020-BGA with 718 user I/O (vs EP2S60F484I4N)
- Industrial temperature grade with -4 speed grade (vs EP2S60F1020C4N)
- Lead-free RoHS-compliant termination (vs EP2S60F1020I4)
Design Notes
Stratix II devices require carefully sequenced power rails: VCCINT (1.2 V core) must ramp first, followed by VCCIO (per-bank I/O voltage), VCCA (PLL analog 2.5 V), and VCCD_PLL (PLL digital 1.2 V). Power-on-reset (POR) circuitry monitors VCCINT and holds the device in reset until the core rail is stable. Designers must use Altera-recommended power sequencer ICs (e.g., LTC3026, MAX8800) or discrete FET sequencing. Failure to sequence rails correctly results in long-term reliability degradation and configuration bitstream corruption.
Estimated: at 100% fabric utilization and 717 MHz operation, the EP2S60F1020I4N's 1020-FCBGA package can dissipate 8-12 W. The exposed die on the FCBGA requires thermal interface material (TIM) attached to a heatsink or cold plate. Without active cooling, junction temperature can exceed 100C at industrial upper ambient (85C). Forced-air cooling at 200 LFM or heatsink attachment is strongly recommended. Junction temperature must be verified via the on-die temperature-sensing diode (analog accuracy +/-5C).
The 1020-ball FCBGA at 1.0 mm pitch requires an 8-layer PCB minimum with microvia (laser-drilled) stack-ups. Signal layers should be routed on adjacent cores, with continuous GND planes for return-current integrity. Decoupling: 0.1 uF X7R capacitors as close as possible to every VCCINT and VCCIO pin, plus bulk 220 uF tantalum or polymer caps on each supply rail. Differential transceiver lanes require 100-ohm differential impedance with intra-pair skew below 1 ps.
Three common pitfalls when designing with EP2S60F1020I4N: (1) Missing JTAG pull-up resistors on TCK/TMS/TDI - causes unreliable configuration; (2) Incorrect configuration mode selection (PS vs FPP) - bitstream must match MSEL pin strapping; (3) Attempting to use commercial-grade EP2S60F1020C3N in industrial-temperature end products - will fail at extended temperatures. Always verify Altera/Altera part number decoder for grade correctness before PCB fab release.
Compliance Information
RoHS status not explicitly stated in the verified web data; the 'N' suffix in the part number indicates lead-free termination per Altera/Intel convention. AEC-Q100 not applicable for FPGA products. REACH, halogen-free, and conflict-mineral status not available in the provided data.
