EP2S60F1020 - Stratix II FPGA, 60K LEs, 1020-BBGA | Altera
MPN: EP2S60F1020 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1755 | $17,550.00 |
| 100 | $1645 | $164,500.00 |
| 250 | $1580 | $395,000.00 |
| 500 | $1495 | $747,500.00 |
EP2S60F1020 Overview
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O behavior are defined post-fabrication via a configuration bitstream. FPGAs sit at the top of the programmable-logic taxonomy (above CPLDs) and below custom ASICs in NRE cost, making them the dominant platform for prototyping, low-volume production, and acceleration workloads that demand parallel processing. The Stratix II family in particular targets high-end digital signal processing, telecom backhaul, and high-speed serial I/O applications.
Key features of the EP2S60F1020 include 12 transceiver channels (up to 3.125 Gbps each, in select package variants), dedicated hardware multipliers feeding 36 DSP blocks (144 18x18 multipliers), up to 12 PLLs (4 enhanced + 8 fast), and embedded TriMatrix memory comprising M512 (32x18 bit), M4K (128x36 bit), and M-RAM (4Kx144 bit) blocks. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes, with optional configuration encryption using the 128-bit AES bitstream encryption engine.
The architecture emphasizes design flexibility through ALMs, where each ALM contains two adaptive LUTs plus dedicated adders and register chains, enabling efficient implementation of arithmetic pipelines, wide multiplexers, and state machines. Designers targeting DDR/DDR2 SDRAM interfaces benefit from dedicated DPA circuitry that aligns data strobes at 10 ps resolution. The 1020-ball BGA package uses flip-chip land-grid construction for low inductance power delivery to the core.
Typical applications include high-speed DSP (radar, software-defined radio), telecommunications line cards (OC-48/STM-16 framer interfaces), high-end protocol bridging, and ASIC prototyping of mid-complexity SoCs. The wide memory aggregate suits image-processing datapaths where line buffers must be held on-chip.
When designing with this part, pay particular attention to power estimation - the Stratix II family introduced the PowerPlay early power estimator tool which must be used before PCB commitment, because core current can exceed 3 A at full utilization. Thermal management of the BGA requires a minimum of eight ground balls in the center array and a 1.2 V core supply derived from a multi-phase buck controller with output accuracy better than +/-30 mV.
This page synthesizes distributor inventory, Stratix II parametric positioning, and pin-compatible BGA alternatives that are not present in any single distributor listing - providing engineers with the consolidated replacement view needed for legacy board repair and redesign.
Drop-in alternatives for EP2S60F1020 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F1020 (same form factor and footprint) — differing in Package, RoHS Status, Family, PLLs, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S60F1020C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1095 / Unit
View Datasheet →EP2S60F1020C4N
✅ Drop-In✓ In Stock
$67 / Unit
View Datasheet →EP2S60F1020C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$995 / Unit
View Datasheet →EP2S60F1020C5N
✅ Drop-In✓ In Stock
$143.75 / Unit
View Datasheet →EP2S60F1020I4
✅ Drop-In✓ In Stock
$1454.92 / Unit
View Datasheet →EP2S60F1020I4N
✅ Drop-In✓ In Stock
$270 / Unit
View Datasheet →EP2S60F1020 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements (LE) | 60,440 |
| Adaptive Logic Modules (ALM) | 30,220 |
| Total Embedded Memory Bits | 2,544,192 bits |
| Embedded Memory Type | TriMatrix (M512 / M4K / M-RAM) |
| DSP Blocks | 36 (18x18 multipliers) |
| Maximum User I/O | 718 |
| Package | 1020-BBGA (flip-chip BGA) |
| Process Technology | 90 nm |
| Supply Voltage (Core) | 1.2 V |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| PLLs | 12 (4 enhanced + 8 fast) |
| Bitstream Encryption | 128-bit AES |
| Operating Temperature Grades | Commercial (C), Industrial (I) |
| RoHS Status | Compliant (lead-free variants available) |
EP2S60F1020 Pin Configuration
| Pin A1 | IO — General-purpose user I/O ball (varies by pinout file) |
| Pin A2 | IO — General-purpose user I/O ball |
| Pin A3 | VCCIO — I/O supply voltage bank |
| Pin A4 | IO — General-purpose user I/O ball |
| Pin B1 | IO — General-purpose user I/O ball |
| Pin B2 | GND — Ground |
| Pin B3 | VCC — Core supply (1.2 V) |
| Pin B4 | IO — General-purpose user I/O ball |
| Pin C1 | IO — General-purpose user I/O ball |
| Pin C2 | IO — General-purpose user I/O ball |
| Pin C3 | GND — Ground |
| Pin C4 | VCCIO — I/O supply voltage bank |
Typical Applications
EP2S60F1020 is suitable for 6 applications: High-Speed DSP (Radar and Software-Defined Radio), Telecom Line Cards (OC-48 / STM-16 Framing), ASIC Prototyping and SoC Emulation, High-Performance Image Processing, Industrial Control and Motion Control, Test and Measurement Instrumentation.
High-Speed DSP (Radar and Software-Defined Radio)
The EP2S60F1020 is well suited for high-speed digital signal processing in radar front-ends and software-defined radio (SDR) platforms. Its 36 dedicated DSP blocks deliver 144 18x18 multipliers operating at up to 370 MHz, enabling real-time FFT, FIR filtering, and digital down-conversion pipelines. The 2.5 Mbit embedded TriMatrix memory (with M-RAM blocks) holds radar pulse-compression coefficients and FFT window tables on-chip, eliminating external memory round-trips. Compared with a software-DSP implementation, this FPGA achieves 10-50x throughput per watt for fixed-point signal processing. Engineers typically pair it with high-speed ADCs (e.g., 14-bit 250 MSPS) and route differential LVDS pairs through the 718 available user I/Os.
Recommended
Telecom Line Cards (OC-48 / STM-16 Framing)
Telecommunications infrastructure from the Stratix II era relied on the EP2S60F1020 for OC-48 (2.488 Gbps) and STM-16 framer implementations, where the FPGA handles framing, scrambling, pointer processing, and overhead extraction in hardware. The device's enhanced PLLs (up to 12 total) provide the multi-frequency synthesis needed for line-side and system-side clock generation, while the 718 user I/Os accommodate 16-bit UTOPIA / POS-PHY interfaces to network processors. Power consumption at full utilization (~6-8 W) requires a forced-air-cooled chassis but remains within typical ATCA line-card thermal envelopes.
Recommended
ASIC Prototyping and SoC Emulation
FPGA-based ASIC prototyping platforms use multiple EP2S60F1020 devices interconnected via board-level high-speed channels to emulate mid-complexity SoC designs before tapeout. The 60K LE capacity is sufficient for ARM7/ARM9-class cores plus peripheral logic; the abundant M-RAM blocks (144 Kbit each) emulate SRAM and cache subsystems. Design partitioning tools from Synopsys (Certify) and Mentor (Precision) target this family specifically. Compared with software simulation, FPGA prototyping runs at 10-100 MHz real-time clock, enabling firmware development and regression testing weeks before silicon availability.
Recommended
High-Performance Image Processing
Image processing pipelines for medical imaging, machine vision, and broadcast video benefit from the EP2S60F1020's parallel logic fabric and 2.5 Mbit embedded memory. The M-RAM blocks (4 Kbit x 144 configuration) hold full image line buffers on-chip, supporting 1080p video at 60 fps without external DDR access for some filter kernels. The 18x18 hardware multipliers accelerate 2D convolution, Sobel edge detection, and motion-estimation algorithms. A typical implementation uses three EP2S60F1020 devices in a pipeline (capture -> process -> display) for real-time HD video processing at sub-frame latencies.
Recommended
Industrial Control and Motion Control
Multi-axis motion control systems use the EP2S60F1020 to execute high-rate PID loops, trajectory generation, and encoder feedback processing in parallel. The FPGA's deterministic latency (single-clock-cycle propagation through ALMs) ensures precise servo-loop timing, while the 718 user I/Os accommodate encoder inputs (typically 4-6 per axis), PWM outputs, and fieldbus interfaces (EtherCAT, Profinet). Industrial temperature-grade variants (EP2S60F1020I4) operate from -40C to +100C junction, suitable for factory-floor enclosures. Compared with DSP-based controllers, FPGA implementations reduce loop latency from microseconds to tens of nanoseconds.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment such as logic analyzers, protocol analyzers, and bit-error-rate testers (BERT) leverage the EP2S60F1020 for high-speed state machine and pattern generation. The ALM architecture's 8-input LUTs efficiently implement deep counters, sequence generators, and protocol decoders; the 12 PLLs provide independent timing domains for multi-standard testing (PCIe Gen1, SATA, USB 3.0). The device's deterministic timing and deep memory also enable capture-and-store operation for protocol trace buffers. Legacy instruments from the 2005-2012 era often used multiple EP2S60F1020s to achieve multi-channel parallel test capability.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F1020 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F1020C3N | EP2S60F1020C4N | EP2S60F1020C5 | EP2S60F1020C5N | EP2S60F1020I4 | EP2S60F1020I4N |
|---|---|---|---|---|---|---|---|
| Package | 1020-BBGA | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 60,440 LEs | 60,440 LEs | 60,440 LEs | 60,440 LEs | 60,440 LEs | 60,440 LEs | 60,440 LEs |
| Operating Temperature | Commercial (0C to +85C) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| DSP Blocks | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
| Maximum User I/O | 718 | 718 | 718 | 718 | 718 | 718 | 718 |
Key Differentiators
- Same-package speed grade flexibility within one device family (vs EP2S60F1020C3N)
- Commercial-to-industrial temperature grade migration in identical footprint (vs EP2S60F1020I4)
- M-RAM 144-Kbit memory blocks for line-buffer applications (vs Stratix I (EP1S series))
Design Notes
Estimated: at full utilization with 80% toggle rate and 100 MHz clock, the EP2S60F1020 core current can reach 3-4 A at 1.2 V (3.6-4.8 W core power), with additional I/O power from 718 user I/Os switching at LVCMOS25 levels. Use the PowerPlay Early Power Estimator (EPE) spreadsheet before PCB commitment - it accepts RTL utilization inputs and outputs per-rail current estimates. A multi-phase buck controller with output accuracy better than +/-30 mV is required for the 1.2 V core rail to meet VCC tolerance requirements.
The 1020-ball flip-chip BGA package requires thermal management at high utilization. Estimated: at 5 W total power and theta_JA of 8 C/W (with 8-layer PCB and thermal vias in the BGA center array), junction temperature rise is approximately 40C above ambient. Above 70C ambient or with concurrent DSP and transceiver activity, force-air cooling or a heatsink attached to the BGA top side is required. Design the PCB land pattern with 0.5 mm pitch and an array of thermal vias under the central GND balls.
Route configuration and JTAG signals (TCK, TMS, TDI, TDO) away from high-speed LVDS pairs and clock traces to avoid crosstalk during in-system programming. Place the EPCS configuration memory within 50 mm of the FPGA's dedicated configuration pins to minimize signal integrity issues. Decouple every VCC and VCCIO ball with a 0.1 uF X7R ceramic capacitor plus a 10 uF bulk capacitor per bank; place bulk capacitors as close as possible to the BGA balls to suppress switching transients.
Do not substitute the EP2S60F1020 with EP2S90F1508 or EP2S30F484 variants without board redesign - the package ballouts differ significantly (1508-BBGA vs 1020-BBGA vs 484-BBGA). When migrating designs to Stratix IV (EP4S series), the configuration bitstream is NOT compatible - the JTAG programming file must be regenerated. For boards originally designed for the EP2S60F1020, use the same package speed grade for compatibility; for example, do not place EP2S60F1020C5 silicon in a board designed for I4 timing constraints without revalidating timing closure.
Compliance Information
RoHS-compliant variants identified by 'N' suffix (e.g., EP2S60F1020C5N). Non-RoHS variants (EP2S60F1020C5 without N) use lead-bearing solder balls. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part. Verify RoHS status at order entry based on the exact part number suffix.
