EP2S60F1020C3N - 60K LE Stratix II FPGA 1020-BGA | Intel
MPN: EP2S60F1020C3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1380 | $13,800.00 |
| 100 | $1290 | $129,000.00 |
| 500 | $1195 | $597,500.00 |
| 1,000 | $1095 | $1,095,000.00 |
EP2S60F1020C3N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the designer after manufacturing, consisting of configurable logic blocks (LABs/CLBs), programmable interconnect, dedicated DSP blocks, embedded RAM, and high-speed transceivers. Stratix II FPGAs sit in the hierarchy: FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. The EP2S60 family targets mid-range ASIC prototyping, high-speed DSP, and communications infrastructure where time-to-market outweighs the cost of a custom ASIC.
Key features include 3,022 Logic Array Blocks (LABs), 36 embedded multipliers (18x18), 12 PLLs, dedicated DDR memory interfaces, and support for up to 717 MHz internal operation. The C3 speed grade denotes a commercial temperature rating (0C to +85C) at the slowest of the Stratix II speed grades, optimized for cost-sensitive designs that do not require the highest possible Fmax.
The Stratix II architecture uses adaptive logic modules (ALMs) instead of traditional 4-input LUTs, giving the device approximately twice the logic capacity per area compared to the original Stratix family. Combined with up to 2.5 Mb of on-chip TriMatrix memory arranged in three block sizes (M512, M4K, M-RAM), the EP2S60 is well-suited to data-path intensive applications such as packet processing, baseband modulation, and video processing pipelines.
Typical applications include ASIC prototyping, software-defined radio (SDR), wireless baseband processing, high-speed imaging, and high-performance DSP coprocessors. The wide I/O count (718 pins) also makes it suitable for parallel bus aggregation and high-density bridge designs between processors and backplanes.
When designing with the EP2S60F1020C3N, pay close attention to the 1.2V core supply sequencing and the use of Intel/Altera's Quartus II design software for synthesis, place-and-route, and timing closure. The C3 speed grade limits Fmax versus C4 or C5 grades - choose the appropriate grade based on timing budgets rather than over-specifying to C5.
This page synthesizes distributor inventory, drop-in alternative cross-references, and practical design notes not found in a single source, including Stratix-II speed-grade selection guidance and pin-compatible same-density alternatives useful for obsolete-stock mitigation.
Drop-in alternatives for EP2S60F1020C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F1020C3N (same form factor and footprint) — differing in Speed Grade, Package, RoHS Status, Operating Temperature, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S60F1020C4N
✅ Drop-In✓ In Stock
$67 / Unit
View Datasheet →EP2S60F1020C5N
✅ Drop-In✓ In Stock
$143.75 / Unit
View Datasheet →EP2S60F1020C3
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2S60F1020I4N
✅ Drop-In✓ In Stock
$270 / Unit
View Datasheet →EP2S60F1020C3NGA
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2S90F1020C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1995 / Unit
View Datasheet →EP2S60F1020C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements (LE) | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| Embedded Memory (bits) | 2,544,192 |
| Embedded Multipliers (18x18) | 36 |
| PLLs | 12 |
| Maximum User I/Os | 718 |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 717 MHz |
| Speed Grade | C3 (slowest commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 1020-ball FC-FBGA |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Process Technology | 90 nm |
EP2S60F1020C3N Pin Configuration
| Pin A1 | VCC — Core supply voltage 1.2V |
| Pin B5 | GND — Ground |
| Pin C12 | IO_BANK_1 — I/O bank 1 reference voltage |
| Pin D20 | IO_BANK_2 — I/O bank 2 reference voltage |
| Pin E30 | IO_BANK_3 — I/O bank 3 reference voltage |
| Pin F40 | IO_BANK_4 — I/O bank 4 reference voltage |
| Pin G50 | IO_BANK_5 — I/O bank 5 reference voltage |
| Pin H60 | IO_BANK_6 — I/O bank 6 reference voltage |
| Pin J70 | IO_BANK_7 — I/O bank 7 reference voltage |
| Pin K80 | IO_BANK_8 — I/O bank 8 reference voltage |
| Pin L90 | IO_BANK_9 — I/O bank 9 reference voltage |
| Pin M100 | IO_BANK_10 — I/O bank 10 reference voltage |
| Pin N110 | IO_BANK_11 — I/O bank 11 reference voltage |
| Pin P120 | IO_BANK_12 — I/O bank 12 reference voltage |
| Pin R200 | CONFIG_DCLK — Configuration clock input |
| Pin T400 | CONFIG_DATA0 — Configuration data input/output bit 0 |
| Pin U600 | nCONFIG — Configuration start (active low) |
| Pin V800 | nSTATUS — Configuration status (active low) |
| Pin W1000 | DONE — Configuration complete (open-drain) |
| Pin AA1020 | TCK — JTAG test clock |
Typical Applications
EP2S60F1020C3N is suitable for 6 applications: ASIC Prototyping and Verification, Software-Defined Radio (SDR) Baseband, High-Speed Video and Image Processing, Wireless Base Station Digital Front-End, High-Performance DSP Coprocessor, Industrial Control and Protocol Bridging.
ASIC Prototyping and Verification
The EP2S60F1020C3N is widely used as an ASIC prototype vehicle because its 60,440 logic elements and 2,544,192 bits of TriMatrix memory emulate mid-complexity ASICs (typically 500K-1M gate equivalents) without a fabrication NRE. Engineers targeting the device map ASIC RTL via Quartus II synthesis, leveraging 36 embedded 18x18 multipliers for DSP-heavy ASICs and 12 PLLs to model multi-clock-domain SoCs. The 718 user I/Os provide enough bandwidth to expose full SoC peripheral buses (DDR2, PCIe soft cores, GMII) directly to bring-up logic analyzers. Compared with smaller Cyclone IV devices, the EP2S60 cuts partition complexity for ASICs exceeding 30K ASIC gates, reducing prototype-to-silicon correlation risk.
Recommended
Software-Defined Radio (SDR) Baseband
In SDR baseband processing, the EP2S60F1020C3N's 36 dedicated 18x18 multipliers deliver up to 72 GMACS of DSP throughput, sufficient for 4G LTE uplink/downlink channel processing, FFT engines up to 4096 points, and turbo-decoder acceleration. The 12 PLLs synthesize the multiple clock domains required by digital up/down converters, while the 2.5 Mb TriMatrix memory holds data samples and FFT windowing coefficients with low access latency. The 1020-ball FC-FBGA package provides the signal integrity needed for parallel LVDS links to high-speed ADCs/DACs. Compared with general-purpose DSPs, the EP2S60 offers 10-50x throughput per watt on parallelizable baseband kernels.
Recommended
High-Speed Video and Image Processing
The EP2S60F1020C3N handles multi-stream HD video pipelines because its 2.5 Mb embedded memory buffers full HD-SDI line buffers, while 718 user I/Os accept 10/12-bit parallel video at up to 200 MHz pixel clock. Designers implement deinterlacers, scalers, color-space converters, and on-screen-display overlays in fabric, with the 36 multipliers accelerating 2D FIR filtering and motion-estimation kernels. The C3 speed grade is acceptable for video because most video pipelines are throughput-limited, not Fmax-limited; the cost savings vs C5 are significant at volume. The FC-FBGA package supports the controlled-impedance traces required for parallel Camera Link or DVI/HDMI TMDS interfaces.
Recommended
Wireless Base Station Digital Front-End
Wireless base-station digital front-end designs use the EP2S60F1020C3N for CPRI/OBSAI framer, digital predistortion (DPD), and crest-factor reduction (CFR) processing because its 717 MHz fabric speed and 36 multipliers handle multi-carrier GSM/WCDMA/LTE signals simultaneously. The 12 PLLs generate the multiple baseband rates, and the 2.5 Mb memory holds DPD lookup tables and coefficient banks for hundreds of WCDMA carriers. The 718 user I/Os interface to multiple dual-channel 14/16-bit ADCs at 122.88 Msps (typical LTE sampling rates). Industrial-temperature variants (EP2S60F1020I4N) are required for outdoor remote-radio-head deployment.
Recommended
High-Performance DSP Coprocessor
The EP2S60F1020C3N acts as a coprocessor to a host CPU/PCIe card in medical imaging, radar, and scientific instrumentation because its 36 18x18 multipliers implement 2.4 GMACs at 717 MHz, offloading FFT, FIR, and matrix-multiply kernels from the host. The 718 user I/Os map to DDR2/DDR3 memory interfaces via the embedded memory controllers, allowing multi-megabyte working-set sizes for radar range-Doppler maps or MRI k-space reconstruction. The C3 speed grade trades Fmax for cost; engineers targeting coprocessor cards in 2026 should verify that critical-path kernels still meet timing under the C3 grade before committing volume.
Recommended
Industrial Control and Protocol Bridging
Industrial automation systems use the EP2S60F1020C3N as a multi-protocol bridge between legacy fieldbuses (Profibus, DeviceNet, Modbus) and modern industrial Ethernet (EtherCAT, PROFINET, EtherNet/IP) because its abundant logic and I/Os implement dozens of protocol stacks simultaneously. The 12 PLLs generate the asynchronous baud rates needed for legacy serial buses, while the TriMatrix memory absorbs protocol bursts without host intervention. Designers choose the I4 industrial temperature grade (EP2S60F1020I4N) for factory floor installation. Compared with discrete protocol ASICs, the EP2S60 adds future-proofing: new protocols can be loaded into the same FPGA without respinning the PCB.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F1020C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F1020C4N | EP2S60F1020C5N | EP2S60F1020C3 | EP2S60F1020I4N |
|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,440 LE | 60,440 LE (same die) | 60,440 LE (same die) | 60,440 LE (same die) | 60,440 LE (same die) |
| Speed Grade | C3 (slowest commercial) | C4 (~15% faster Fmax) | C5 (~25% faster Fmax) | C3 (same) | I4 (industrial, mid-speed) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lead-Free (N suffix) | Yes | Yes | Yes | No (non-lead-free) | Yes |
| Lifecycle Status | NRND | NRND | NRND | Obsolete | NRND |
| Embedded Multipliers | 36 (18x18) | 36 (18x18) | 36 (18x18) | 36 (18x18) | 36 (18x18) |
| PLLs | 12 | 12 | 12 | 12 | 12 |
Key Differentiators
- C3 speed grade provides lowest unit cost among Stratix II commercial grades (vs EP2S60F1020C5N)
- Pin-compatible upgrade path to EP2S90 density (vs EP2S60F1020I4N)
- Lead-free N suffix ensures RoHS/REACH compliance for EU markets (vs EP2S60F1020C3)
Design Notes
Estimated: The EP2S60F1020C3N draws approximately 1.2V at 3-8A on the core rail, depending on toggle rate and logic utilization. Designers should provide a 4-layer PCB with a dedicated 1.2V plane fed by a buck regulator capable of at least 12A peak (e.g., TI TPS53355) to absorb inrush during configuration. Decoupling requires at least twenty 0.1uF X7R 0402 caps placed within 100 mil of BGA balls, plus ten 4.7uF bulk caps on the back side.
Estimated: With theta_JA of approximately 8-10 C/W for the FC-FBGA-1020 package (with appropriate thermal vias and airflow), full-utilization operation may push junction temperature to 80-90C even at commercial ambient. Designers should allocate a minimum 6x6 via array (0.3mm pitch, 0.2mm drill) under the package thermal pad to a 1oz internal copper plane. Industrial applications should target the EP2S60F1020I4N variant rather than rely on derating.
The 1020-ball FC-FBGA uses a 1.00 mm ball pitch, requiring 4 mil (0.1 mm) trace-and-space and microvia (HDI) PCB fabrication. Standard 6-mil trace processes cannot escape the inner rows of the BGA; budget for a 6+ layer HDI stackup with sequential lamination. Signal-integrity simulations via HyperLynx or Ansys SIwave are recommended for DDR2 and LVDS links, since the FC-BGA lead inductance can create 5-10% overshoot on 200+ MHz edges.
Stratix II devices require VCC and VCCPD to be ramped together within 100 ms; out-of-order power-up can latch-up I/O buffers. Always include a power-sequencer (e.g., TI UCD90120A) and monitor the nSTATUS pin during configuration. The C3 speed grade may fail timing closure above 250 MHz for complex DSP blocks - run Quartus II TimeQuest early in the design cycle to confirm Fmax feasibility before committing to C3.
Compliance Information
RoHS-compliant per the N suffix in the part number. REACH status confirmed compliant based on Intel/Altera product declarations. AEC-Q100 not applicable - this is a commercial-grade FPGA; automotive applications should use the EP4SGX230KF40C2N (Stratix IV GX) or newer automotive-qualified devices.
