EP2SGX130GF40C4ES - 132,540 Logic Cells FPGA | Intel
MPN: EP2SGX130GF40C4ES β End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2SGX130GF40C4ES Overview
A field-programmable gate array, or FPGA, is a semiconductor device whose logic function is defined by configuration rather than fixed internal circuitry. In the system hierarchy, the FPGA combines programmable logic blocks, routing resources, input and output blocks, and optional embedded functions on one integrated circuit. Designers use implementation software to convert a digital design into configuration data, after which the device performs parallel logic, interface, signal-processing, or control functions. The EP2SGX130GF40C4ES belongs to the Stratix II GX family and targets applications requiring substantial logic capacity and high pin count.
The principal verified specifications are 132,540 logic cells, 7,047 CLBs, 734 user I/O, and 1,508 package pins. The GX family positioning makes the part relevant to designs that combine high-density programmable logic with serial transceiver-oriented integration. The 717 MHz internal-frequency listing provides a useful reference for the device's speed class, while the 40 mm by 40 mm package supports a large number of parallel interfaces and power connections. The exact transceiver count, operating temperature, configuration memory capacity, and speed-grade interpretation were not exposed in the supplied web snippets.
The EP2SGX130GF40C4ES uses SRAM-based programmable-logic technology, as indicated by its Stratix II GX family identity and CMOS process classification. Designers synthesize the intended circuit and load it into the FPGA through its configuration interface. With 734 user I/O and 1,508 total pins, board implementation requires careful assignment of power, ground, configuration, clock, and user-signal balls. The large BGA package can support wide parallel buses, memory interfaces, protocol bridges, and high-channel-count digital processing structures.
Typical applications include communications equipment, high-speed test and measurement systems, industrial imaging and video processing, data-acquisition platforms, and protocol-conversion hardware. The 132,540 logic-cell resource count suits designs that need many parallel datapaths, while 734 user I/O can support numerous external buses. Serial transceivers may also make the GX family appropriate where the target design requires high-speed serial connectivity, although the supplied data does not provide a verified transceiver count.
Before layout or production release, engineers should obtain the complete manufacturer datasheet and verify ball assignments, configuration requirements, supported I/O standards, transceiver limits, power sequencing, thermal design, and operating-temperature details. The 40 mm by 40 mm FBGA requires a multilayer PCB, controlled escape routing, and sound power-distribution design. Missing parameters are marked rather than inferred, and design-in decisions should be based on the complete datasheet and Quartus support documentation.
This product data combines the verified distributor and manufacturer-source snippets with engineering context unavailable on a typical price listing. The result helps buyers compare capacity, package, and commercial information while giving FPGA engineers a clear distinction between confirmed specifications and parameters that still require datasheet-level verification.
Drop-in alternatives for EP2SGX130GF40C4ES β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF40C4ES (same form factor and footprint) β differing in Package, Speed Grade, Mounting Type, Family, Logic Array Blocks (LABs).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX130GF40C3NES
β Drop-Inβ In Stock
$124 / Unit
View Datasheet βEP2SGX130GF40C3N
β Drop-Inβ In Stock
$1485 / Unit
View Datasheet βEP2SGX130GF40C3ES
β Drop-Inβ In Stock
$1200 / Unit
View Datasheet βEP2SGX130GF1508I4N
β Drop-Inβ In Stock
$2050 / Unit
View Datasheet βEP2SGX130GF1508C4N
β Drop-Inβ In Stock
$118 / Unit
View Datasheet βEP2SGX130GF40C4ES Maximum Ratings & Electrical Characteristics
| Product Type | Field-programmable gate array (FPGA) |
| Product Family | Stratix II GX |
| Logic Cells | 132,540 |
| Configurable Logic Blocks | 7,047 CLBs |
| Logic Technology | CMOS |
| User I/O | 734 I/O |
| Internal Frequency | 717 MHz |
| Supply Voltage Range | 1.15 V to 1.25 V |
| Package Pin Count | 1,508 pins |
| Package Type | FBGA-1508 |
| Package Body Size | 40 mm by 40 mm |
| Ball Pitch | 1 mm |
| Package Designation | MS-034AAU-1 |
| Lead-Free | Yes |
| Mounting Type | Surface mount |
EP2SGX130GF40C4ES ms-034aau-1 Pin Configuration Guide
Pin configuration for EP2SGX130GF40C4ES (ms-034aau-1 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF40C4ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF40C4ES is suitable for 6 applications: High-Speed Communications Equipment, Industrial Automation Controllers, Test and Measurement Systems, Video and Image Processing, Data Acquisition and Protocol Bridge, Aerospace and Defense Digital Processing.
High-Speed Communications Equipment
EP2SGX130GF40C4ES is a candidate for communications platforms that need substantial parallel logic and a large number of external connections. Its verified 132,540 logic cells and 7,047 CLBs provide capacity for protocol handling, packet processing, clock distribution, and control functions, while 734 user I/O support wide buses and multiple peripheral interfaces. The Stratix II GX family name also makes the device relevant to serial-data designs, although the supplied data does not confirm the transceiver count, supported protocols, or line rates. Design implementation should therefore use the complete datasheet and the relevant Intel or Altera device-support files before committing the device to a communications backplane.
Recommended
Industrial Automation Controllers
EP2SGX130GF40C4ES can support industrial controllers that require many deterministic I/O, parallel datapaths, and flexible logic. The verified 734 user I/O count is useful for connecting sensors, actuators, motor-control peripherals, and industrial Ethernet interfaces through external devices. The 132,540 logic cells allow multiple control loops, communication bridges, and safety-related monitoring functions to be integrated in one programmable platform. The 717 MHz internal-frequency figure provides a device-level reference, but actual controller performance depends on synthesis, routing, and timing closure. The supplied data does not confirm the industrial temperature grade or all I/O standards, so those requirements must be checked before field deployment.
Recommended
Test and Measurement Systems
EP2SGX130GF40C4ES fits test and measurement architectures requiring parallel acquisition, high logic density, and numerous controlled interfaces. Its 7,047 CLBs and 132,540 logic cells can host instrument sequencing, trigger logic, data formatting, error detection, and communication processing. The 734 user I/O allow a design to connect multiple converters, memory devices, clocks, and control ports, while the 717 MHz internal-frequency listing offers a reference for high-speed digital processing. The part does not replace the required analog front end or measurement converter. Confirm I/O timing, electrical standards, package-ball assignments, and the supported design-software version from the full manufacturer documentation.
Recommended
Video and Image Processing
EP2SGX130GF40C4ES is suitable for image-processing platforms that need parallel pixel processing, frame buffering control, and multiple high-bandwidth interfaces. The verified 132,540 logic cells can implement filters, format conversion, color processing, and multi-channel control logic, while 7,047 CLBs provide configurable hardware parallelism. A design can use 734 user I/O to connect cameras, displays, memory, and bridge devices. The 40 mm by 40 mm FBGA package gives the board designer a large, fine-pitch device that supports extensive power and signal distribution. The supplied data does not specify embedded memory, DSP blocks, transceiver count, or maximum I/O rate, so those resources must be verified before selecting the FPGA for a particular video pipeline.
Recommended
Data Acquisition and Protocol Bridge
EP2SGX130GF40C4ES can serve as a programmable protocol bridge between parallel data sources, memory systems, and high-speed serial or downstream logic. The 734 user I/O count supports many channels, while 132,540 logic cells provide resources for buffering, packetization, clock-domain management, and error handling. Its Stratix II GX family identity is useful when the system architecture anticipates integrated serial connectivity, but the exact transceiver resources are not stated in the supplied data. A successful implementation must verify the complete ball map, voltage rails, configuration interface, I/O standards, and supported IP. The 1,508-ball package also requires careful multilayer routing and a verified BGA footprint.
Recommended
Aerospace and Defense Digital Processing
EP2SGX130GF40C4ES may be evaluated for aerospace or defense systems requiring high logic density, deterministic parallel processing, and extensive external connectivity. The verified 7,047 CLBs and 132,540 logic cells can support command processing, telemetry formatting, sensor aggregation, and interface control. The 734 user I/O count is useful for connecting multiple data converters, memory banks, and control networks. The partβs lead-free 40 mm by 40 mm FBGA package is mechanically significant for multilayer boards, but the supplied data does not establish an aerospace qualification, operating-temperature range, radiation performance, or lifecycle status. Those requirements require manufacturer documentation and system-specific qualification before use.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF40C4ES β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF40C3NES | EP2SGX130GF40C3N | EP2SGX130GF40C3ES | EP2SGX130GF1508I4N | EP2SGX130GF1508C4N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-1508, 40 mm by 40 mm, 1 mm pitch | FBGA-1508 | FBGA-1508 | FBGA-1508 | FBGA-1508 | FBGA-1508 |
| Product Family | Stratix II GX | Stratix II GX family, exact details not supplied | Stratix II GX family, exact details not supplied | Stratix II GX family, exact details not supplied | Stratix II GX family, exact details not supplied | Stratix II GX family, exact details not supplied |
| Pinout / Ball Compatibility | 1,508-ball FBGA | Not verified by supplied data | Not verified by supplied data | Not verified by supplied data | Not verified by supplied data | Not verified by supplied data |
Key Differentiators
- High verified logic density (vs EP2SGX130GF40C3N)
- Large parallel-interface capacity (vs EP2SGX130GF1508I4N)
- Large 1,508-ball FBGA integration (vs EP2SGX130GF40C3ES)
Design Notes
EP2SGX130GF40C4ES is listed with a 1.15 V to 1.25 V supply range, but that single value is not a complete power architecture. Before design, obtain the manufacturer datasheet and identify every required core, I/O, auxiliary, and ground connection, including permitted tolerances, sequencing, and current limits. Use a regulator with adequate transient response, keep high-current paths short, and place decoupling capacitors at the appropriate package balls. Do not assume that a nominal rail voltage guarantees operation at 717 MHz or under the full 734-I/O load.
The 40 mm by 40 mm FBGA with 1 mm ball pitch requires the exact land pattern and assembly recommendations from the manufacturer. Use multilayer escape routing, continuous reference planes, and symmetric via transitions where the footprint requires them. Keep differential pairs and clock routes short and impedance-controlled, and avoid routing unrelated high-speed traces through BGA escapes. Reserve enough vias, plane layers, and stitching around the device. The supplied data confirms the package geometry but not the complete ball map, so pin-by-pin placement cannot be completed from this record alone.
The 734 user I/O and 717 MHz internal-frequency figures make signal-integrity validation important, but they do not specify the supported I/O standards or maximum external clock rate. Confirm differential-pair rules, termination values, output-current settings, voltage-referenced interfaces, and transceiver constraints in the full datasheet. For memory buses or parallel converters, use controlled impedance, matched clock distribution, and receiver placement that minimizes skew. Run post-layout extraction and timing analysis on the actual design; a generic family-level frequency is not a substitute for a closed timing budget.
A 1,508-ball, 40 mm by 40 mm FPGA can concentrate heat even though the supplied data does not provide a junction-to-air thermal-resistance value. Estimate thermal performance only after the complete power table, package model, airflow, copper area, and board stack-up are known. Place thermal vias and copper spreading beneath the package where the land pattern permits, and model the board and enclosure rather than relying on package size alone. Keep temperature-sensing and shutdown behavior consistent with the chosen configuration. No junction-temperature rise is calculated here because the verified data does not provide total device power or thermal impedance.
Do not confuse 1,508 total package pins with 734 user I/O; the difference includes power, ground, configuration, clock, and dedicated functions. Also do not treat a similar EP2SGX130 family ordering code as a drop-in substitute without checking the exact suffix, speed grade, temperature grade, ball map, voltage limits, and supported software. The verified web results identify several related MPNs but do not prove their electrical equivalence. Maintain the original configuration image and timing constraints during any device migration, and perform a new board review even when the package is the same.
Compliance Information
The verified data identifies the package as lead-free but does not provide RoHS, REACH, halogen-free, automotive qualification, or conflict-minerals declarations. Lifecycle status is unknown because no current manufacturer lifecycle statement is supplied.
