EP2SGX130GF40C3NES - Stratix II GX FPGA, 132K LE, 6.375Gbps | Altera
MPN: EP2SGX130GF40C3NES β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138.75 | $69,375.00 |
| 1,000 | $124 | $124,000.00 |
EP2SGX130GF40C3NES Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be re-programmed after manufacturing to implement arbitrary digital logic. FPGAs sit in the hierarchy between programmable logic devices (PLDs), complex programmable logic devices (CPLDs), and application-specific integrated circuits (ASICs), offering higher logic density and higher performance than CPLDs but lower per-unit cost and longer lead time than ASICs at high volumes.
Key features of the EP2SGX130GF40C3NES include up to 6.375 Gbps transceiver data rate per channel, embedded transceivers with clock/data recovery, on-chip memory, DSP blocks for high-throughput signal processing, and dedicated support for external memory interfaces such as DDR2/QDRII+. The Stratix II GX architecture was Altera's third-generation FPGA to combine high-speed serial transceivers with a scalable logic array, targeting line-card and backplane applications where multi-gigabit serial I/O eliminates external PHY chips.
The device fabric is built on 90 nm CMOS technology and supports a maximum internal clock frequency around 717-779 MHz depending on configuration, with embedded transceivers typically delivering 4 to 20 channels at 6.375 Gbps. On-chip TriMatrix memory provides distributed RAM, block RAM, and shift-register memory resources for buffering, packet processing, and DSP coefficient storage.
Typical applications include high-speed serial backplane interfaces (XAUI, PCIe, Serial RapidIO, Gigabit Ethernet), protocol bridging and aggregation line cards, multi-gigabit test and measurement equipment, broadcast video processing, and defense/radar signal processing front-ends. Designers also use Stratix II GX parts for proprietary chip-to-chip links requiring SERDES at 3 to 6 Gbps where the integrated transceiver eliminates the cost and signal-integrity overhead of a separate PHY.
When designing with this part, plan the PCB for a high-density 1508-ball FC-FBGA which requires microvia-stack-up HDI technology, controlled-impedance SERDES routing, and strict power-rail decoupling per Altera's Stratix II GX design guidelines. Designers transitioning to newer projects should evaluate Stratix IV GX/GT, Arria, or Cyclone families for active-product longevity and tool support.
This page synthesizes distributor stock and pricing data, same-package Stratix II GX drop-in alternatives drawn from the XAIPART Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2SGX130GF40C3NES β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF40C3NES (same form factor and footprint) β differing in Package, Package Type, Speed Grade, Family, Logic Array Blocks (LABs).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX130GF40C3N
β Drop-Inβ In Stock
$1485 / Unit
View Datasheet βEP2SGX130GF1508C3N
β Drop-Inβ In Stock
$1395 / Unit
View Datasheet βEP2SGX130GF1508C3
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2SGX130GF1508C4N
β Drop-Inβ In Stock
$118 / Unit
View Datasheet βEP2SGX130GF1508C4
β Drop-Inβ In Stock
$985 / Unit
View Datasheet βEP2SGX130GF1508C5N
β Drop-Inβ In Stock
$3890 / Unit
View Datasheet βEP2SGX130GF40C3NES Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 132540 |
| Logic Array Blocks (LABs) | 7047 |
| Maximum Internal Frequency | 778.82 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Transceiver Channels | 4 to 20 (per device family configuration) |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| Transceiver Feature | Embedded SERDES with Clock/Data Recovery (CRU) |
| Memory Type | TriMatrix embedded memory (distributed RAM, block RAM, shift register) |
| Package | 1508-ball FC-FBGA (40 x 40 mm, 1 mm pitch) |
| Operating Temperature Grade | Commercial Extended |
| Terminal Form | Ball (BGA) |
| Mounting Type | Surface Mount |
| RoHS Status | Lead-free compliant (per package code MS-034AAU-1) |
| Series | EP2SGX130 |
EP2SGX130GF40C3NES 1508-ball fc-fbga (40 x 40 mm, 1 mm pitch) Pin Configuration Guide
Pin configuration for EP2SGX130GF40C3NES (1508-ball fc-fbga (40 x 40 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF40C3NES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF40C3NES is suitable for 7 applications: Multi-Gigabit Serial Backplane Interfaces, Telecom Line Card Aggregation, Test and Measurement Equipment, Broadcast Video Processing, Defense and Radar Signal Processing, Industrial Protocol Bridging, Medical Imaging Data Acquisition.
Multi-Gigabit Serial Backplane Interfaces
The EP2SGX130GF40C3NES is purpose-built for multi-gigabit serial backplane applications such as XAUI (3.125 Gbps), PCIe Gen1 (2.5 Gbps), Serial RapidIO, and Gigabit Ethernet. Its integrated transceivers with embedded SERDES and clock/data recovery operate up to 6.375 Gbps per channel, eliminating external PHY chips and simplifying line-card design. With 132,540 logic elements and 7047 LABs, the device can implement MAC-layer processing, link training, and protocol bridging alongside the physical interface. The 1.2 V core on 90 nm CMOS keeps power consumption manageable for high-density line cards, while the FC-FBGA-1508 package provides the I/O density required for 4-20 transceiver channels plus parallel control planes.
Recommended
Telecom Line Card Aggregation
In telecom aggregation line cards, the EP2SGX130GF40C3NES aggregates multiple lower-rate serial links into higher-rate uplinks while performing packet classification, queuing, and traffic shaping in the FPGA fabric. The 132K LE fabric and TriMatrix memory provide ample headroom for 10G-to-multi-1G fan-out designs, while the embedded SERDES removes the need for a separate PHY plus magnetics stack. Designers typically pair this device with external QDRII+ or DDR2 memory for packet buffering. The industrial temperature grade (where applicable on C3/C4/C5N variants) supports controlled-environment central-office deployments. Compared to ASIC alternatives, the FPGA enables rapid field upgradability as protocol standards evolve.
Recommended
Test and Measurement Equipment
Test and measurement instruments leverage the EP2SGX130GF40C3NES to implement high-speed pattern generators, BERT (bit error rate tester) receivers, and protocol analyzers with multi-gigabit serial I/O. The 6.375 Gbps transceivers enable stimulus and analysis of 10G-class interfaces, while the 132K LE fabric supports custom DSP, error counting, and real-time trigger logic. The embedded CDR simplifies clock recovery for incoming streams, and the large TriMatrix memory buffers captured data for post-processing. Engineers can reconfigure the FPGA in the field to support new test standards, extending the usable lifetime of the instrument platform. The FC-FBGA-1508 package's thermal performance allows sustained multi-channel operation with appropriate PCB copper.
Recommended
Broadcast Video Processing
Broadcast video routers and processing engines use the EP2SGX130GF40C3NES to handle uncompressed HD-SDI, 3G-SDI, and dual-link SDI streams alongside Ethernet control. The integrated transceivers can transport SDI directly over chip-to-chip or backplane links, while the FPGA fabric performs format conversion, frame synchronization, and audio embedding. With 132,540 logic elements and dedicated DSP blocks, the device can implement multi-channel up/down/cross-conversion in a single chip, reducing system cost and power. The 1.2 V core voltage on the 90 nm process keeps thermal output within broadcaster enclosure limits. Designers value the FPGA's ability to upgrade codec and routing features via in-system programming as new broadcast standards emerge.
Recommended
Defense and Radar Signal Processing
Defense and radar signal processing front-ends exploit the EP2SGX130GF40C3NES for high-throughput DSP across wideband receiver channels. The on-chip DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput, sufficient for pulse compression, MTI filtering, and beamforming kernels. The 6.375 Gbps transceivers move digitized IF data between ADC boards and the processor FPGA without external PHYs. The 132K LE fabric supports multi-channel synchronization and adaptive threshold algorithms, while the TriMatrix memory buffers intermediate samples and coefficient tables. The FC-FBGA-1508 package meets the density and pin-count requirements of high-channel-count radar receivers, and Altera's military-temperature variants support extended-environment deployments.
Recommended
Industrial Protocol Bridging
Industrial gateway and bridge designs use the EP2SGX130GF40C3NES to convert between legacy industrial protocols (PROFIBUS, CAN, RS-485) and modern Ethernet-based standards. The integrated transceivers provide the gigabit Ethernet PHY functionality for uplink ports, while the FPGA fabric runs soft-IP stacks for Modbus TCP, EtherNet/IP, and PROFINET. With 132K LEs, the device can host multiple protocol stacks concurrently with custom application logic, eliminating a stack of discrete microcontroller and PHY chips. The 1.2 V core and 90 nm CMOS provide predictable thermal performance for enclosed industrial cabinets. Long-term availability of the same-die drop-in variants supports industrial product life cycles of 10+ years.
Recommended
Medical Imaging Data Acquisition
Medical imaging systems such as ultrasound scanners and MRI receivers use the EP2SGX130GF40C3NES to aggregate high-speed data from multiple transducer or coil channels. The 6.375 Gbps transceivers transport digitized RF or baseband data from analog front-end boards to the processing FPGA with minimal latency. The 132K LE fabric implements beamforming, channel summation, and image reconstruction kernels, while on-chip DSP blocks accelerate FFT and convolution operations. The TriMatrix memory provides temporary buffers for raw channel data before scan conversion. Designers choose this part for its deterministic latency, field reprogrammability across imaging modes, and the FC-FBGA-1508 package's high I/O density for multi-channel systems.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF40C3NES β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF40C3N | EP2SGX130GF1508C3N | EP2SGX130GF1508C3 | EP2SGX130GF1508C4N | EP2SGX130GF1508C5N |
|---|---|---|---|---|---|---|
| Package | 1508-ball FC-FBGA (40x40 mm, 1 mm pitch) | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 132540 | 132540 | 132540 | 132540 | 132540 | 132540 |
| Speed Grade | C3 (fastest) | C3 | C3 | C3 | C4 | C5 |
| Operating Temperature Grade | Commercial Extended | Commercial | Industrial | Commercial | Industrial | Industrial |
| Maximum Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Approx. Unit Price (1 pc) | USD 185 | USD 175-190 | USD 165-185 | USD 155-175 | USD 145-165 | USD 135-155 |
Key Differentiators
- Highest speed grade within the Stratix II GX family (vs EP2SGX130GF1508C5N)
- Same-die drop-in compatibility with the broader Stratix II GX 1508-ball family (vs EP4CGX150CF23I7N (Stratix IV GX))
- Integrated 6.375 Gbps SERDES with CDR (vs Stratix II non-GX (e.g., EP2S130F1508C3))
Design Notes
The 1508-ball FC-FBGA at 1 mm pitch requires HDI PCB technology with laser-drilled microvias for inner-row escape. Plan an 8-12 layer stack-up with dedicated ground and power planes adjacent to signal layers. Maintain 50-ohm differential impedance for SERDES pairs per the Stratix II GX hardware design guidelines. Allow at least 1.0 mm keep-out around the package edge for via-in-pad structures if used. Estimated: based on the package dimensions (40 x 40 mm) and Altera's published via-pattern guidelines, expect 2-3 microvia layers to fully break out all 1508 balls.
Provide independent decoupling for the 1.2 V core, 2.5 V PLL auxiliary, 1.5 V transceiver analog, and I/O rails. Use a mix of bulk, ceramic, and high-frequency MLCC capacitors placed as close as possible to the package balls. Follow Altera's PDN (Power Distribution Network) guideline for target impedance. Estimated: at full transceiver utilization with 20 channels active, expect total device power around 15-20 W; budget the regulator solution accordingly and provide adequate airflow or heatsink attachment to the exposed die region.
Stratix II GX FC-FBGA packages dissipate significant heat from the die through the package top and the BGA balls into the PCB. Use thermal vias under the central ball grid to sink heat into internal copper planes, and consider a heatsink or thermal interface material for sustained high-load operation. Monitor junction temperature via the on-die temperature sensing diode accessible through the JTAG or dedicated pins. Estimated: at 15-20 W total power, theta-JA for the FC-FBGA-1508 with typical PCB design is around 8-12 C/W, yielding junction temperature rise of 50-70 C above ambient at full load.
SERDES channels are highly sensitive to jitter, crosstalk, and impedance discontinuities. Route transceiver differential pairs with matched lengths (within 5 mils for the P and N legs) and keep total length under the maximum specified by Altera for the targeted data rate. Avoid routing SERDES signals across split power planes. Use AC-coupling capacitors as specified (typically 0.1 uF) at the transmitter side, and provide a clean reference clock with jitter below the requirements listed in the Stratix II GX device handbook.
Do not attempt to substitute a Stratix IV/V or Arria FPGA in the same FC-FBGA-1508 footprint - the pinout differs and the transceiver calibration sequences are not compatible. When migrating to a new family, treat it as a full redesign: PCB rework, Quartus project recompile, and revalidation of all SERDES links. Also verify the date code and lot traceability with your supplier for any EP2SGX130 alternative to ensure silicon revision parity and avoid mixing stepping levels on the same board.
Compliance Information
Lead-free per Altera package code MS-034AAU-1. RoHS compliance per Altera product page; REACH and conflict-minerals status not explicitly stated in verified web data for this obsolete part. AEC-Q100 is not applicable for FPGA logic devices.
