EP2SGX130GF40C3N - 132K LE Stratix II GX FPGA | Intel | BGA-1508
MPN: EP2SGX130GF40C3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 25 | $1680 | $42,000.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1485 | $742,500.00 |
EP2SGX130GF40C3N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and hardened IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs occupy the top tier of the programmable logic hierarchy: discrete logic < CPLD < FPGA, and within the FPGA family, Stratix II GX sits in the high-performance transceiver-equipped branch designed for ASIC-prototyping, signal-processing, and high-speed serial I/O. The Stratix II GX family uses a 90 nm process and a 1.2 V core supply, with auxiliary voltages for transceivers and PLLs.
Key features include up to 734 user I/O pins, embedded transceivers operating from 600 Mbps to 6.375 Gbps, dedicated PCS hardening per channel, and on-chip PLL/DLL blocks for clock generation. The device supports high-speed external memory interfaces including DDR2 SDRAM, QDRII SRAM, and RLDRAM II through dedicated DQS phase-shift circuitry. Embedded transceivers support popular protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G through configurable PCS logic.
The architecture combines a logic fabric of adaptive logic modules (ALMs) with embedded multiplier blocks, TriMatrix memory blocks of MRAM/M4K/M512 types, and four corner PLLs plus two per-side PLLs. Configuration is supported through passive serial, fast passive parallel, and JTAG modes, with optional configuration via Altera EPCS or EPC configuration memories. The result is a programmable platform that integrates DSP, memory, and serial I/O previously requiring multiple companion chips.
Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2 endpoints, Serial RapidIO switches, XAUI MACs), ASIC prototyping for networking and storage ASICs, software-defined radio baseband processing, digital video broadcast infrastructure, and high-end test-and-measurement equipment. The 40-transceiver count makes this specific die ideal for designs requiring many simultaneous serial links, such as multi-channel base-station cards or protocol-conversion switches.
When designing with this device, allocate sufficient PCB area for power decoupling near each transceiver quadrant (the GF40 layout places transceivers in physical columns requiring isolated analog supplies), and ensure the flip-chip BGA has a properly microvia-stitched escape pattern. The 1508-ball package requires a multi-layer PCB with buried vias and a minimum 1 oz copper pour for the ground-return path to control simultaneous-switching noise (SSN).
This page synthesizes distributor pricing from DigiKey, Octopart, Jotrin, and SZComponents, cross-references against the in-house Stratix II GX family table, and presents drop-in alternatives within the 1508-BGA footprint plus practical design notes not included in the manufacturer datasheet.
Drop-in alternatives for EP2SGX130GF40C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF40C3N (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Logic Array Blocks (LABs), Operating Temperature Grade.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX130GF40C4N
β Drop-Inπ Reference alternative (not in catalog)
EP2SGX130GF40C5N
β Drop-Inπ Reference alternative (not in catalog)
EP2SGX130GF1508C3
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2SGX130GF1508C4N
β Drop-Inβ In Stock
$118 / Unit
View Datasheet βEP2SGX130GF1508I4N
β Drop-Inβ In Stock
$2050 / Unit
View Datasheet βEP2SGX130GF1508I5N
β Drop-Inβ In Stock
$372 / Unit
View Datasheet βEP2SGX130GF1508C5N
β Drop-Inβ In Stock
$3890 / Unit
View Datasheet βEP2SGX130GF40C3ES
β Drop-Inβ In Stock
$1200 / Unit
View Datasheet βEP2SGX130GF40C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Embedded Memory | 6.7 Mbits |
| Embedded Multipliers (18x18) | 252 |
| User I/O Count | 734 |
| Transceiver Count | 40 channels |
| Max Transceiver Data Rate | 6.375 Gbps |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Package | 1508-ball FC-FBGA |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C3 |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG |
| RoHS Status | Compliant |
EP2SGX130GF40C3N 1508-ball fc-fbga Pin Configuration Guide
Pin configuration for EP2SGX130GF40C3N (1508-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF40C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF40C3N is suitable for 6 applications: PCI Express Endpoint Card, Serial RapidIO Switch, ASIC Prototyping Platform, Software Defined Radio Baseband, Digital Video Broadcast Infrastructure, High-Speed Test and Measurement.
PCI Express Endpoint Card
The EP2SGX130GF40C3N's 40 embedded transceivers operating up to 6.375 Gbps make it well-suited for PCIe Gen2 endpoint cards requiring 4-8 lanes plus auxiliary serial links. The 132,540 logic elements provide ample capacity for protocol stacks and user applications, while the hardened PCIe PCS hard-IP block offloads transaction-layer and data-link-layer processing, freeing fabric for application logic. Designers typically place this device between a host processor and downstream ASIC, with the FPGA implementing DMA engines, scatter-gather engines, and protocol multiplexing; the wide 734-pin I/O count supports DDR2/QDRII memories for buffering. Compared with discrete PHY plus FPGA, this integrated transceiver approach reduces BOM cost by 25-40% and simplifies PCB layout.
Recommended
Serial RapidIO Switch
Serial RapidIO switches benefit directly from the EP2SGX130GF40C3N's high transceiver density. Each of the 40 channels can be configured as a 1x or 4x Serial RapidIO port at 1.25 / 2.5 / 3.125 Gbps, allowing a single device to implement a 10-port 4x switch with no external PHYs. The 132,540 logic elements and 252 18x18 multipliers handle routing table lookup, congestion management, and CRC computation; embedded TriMatrix memory buffers packets at line rate. The commercial 0C to +85C temperature grade fits telecom equipment shelves. This architecture avoids the cost and latency of a dedicated switch ASIC while supporting field upgrades through FPGA bitstream reload.
Recommended
ASIC Prototyping Platform
The EP2SGX130GF40C3N is widely used as a building block in multi-FPGA ASIC prototyping platforms because of its high logic density (132,540 LEs), generous 734 user I/Os, and 40 transceivers. A typical four-board prototyping system splits a 500K-gate ASIC into 4 instances of this FPGA, with chips operating in cut-through mode through the transceivers and pin-multiplexed I/O through the 1508-BGA. The 6.7 Mbits of embedded memory and 252 18x18 multipliers map directly to common ASIC primitives including register files and DSP MACs. Quartus II synthesis with Synplify or Precision provides good correlation to ASIC target libraries. For lower-volume ASIC replacement this single FPGA can implement entire subsystems directly without re-spinning to silicon.
Recommended
Software Defined Radio Baseband
Software-defined radio (SDR) baseband processing leverages the EP2SGX130GF40C3N's combination of 252 18x18 multipliers, 6.7 Mbit embedded memory, and 40 transceivers running up to 6.375 Gbps. A single device can implement two complete wideband receive channels plus one transmit channel with FFT/iFFT, channelization, and baseband modulation/demodulation blocks at rates up to 100 MHz complex bandwidth. The hardened PCS supports CPRI and OBSAI fronthaul protocols natively. The commercial temperature range suits indoor base-station equipment. Designers typically pair this FPGA with high-speed ADC/DAC converters through the LVDS I/O banks.
Recommended
Digital Video Broadcast Infrastructure
The EP2SGX130GF40C3N supports digital video broadcast (DVB) and ATSC infrastructure equipment including MPEG-2 / H.264 encoders, multi-format transcoders, and head-end multiplexers. The 40 transceivers handle DVB-ASI, SMPTE-259M/292M/424M SDI serial digital video, and 10 GbE network uplinks simultaneously. The 132K logic elements provide capacity for multiple codec cores in parallel, while the embedded TriMatrix memory buffers ES, PES, and TS packet streams at line rate. PCI Express integration simplifies pairing with host servers; the wide I/O count supports DDR2 video frame buffers directly.
Recommended
High-Speed Test and Measurement
The EP2SGX130GF40C3N's combination of high logic density and 40 transceivers makes it an excellent choice for high-end test-and-measurement instruments such as protocol analyzers, logic analyzer probes, and bit-error-rate testers (BERT). A BERT implementation can use 8-16 transceivers for multi-channel PRBS generation and checking at up to 6.375 Gbps, while the logic fabric implements pattern-matching, error counting, and trigger logic. The 6.7 Mbit embedded memory stores captured waveform history; the 252 multipliers enable real-time FFT-based jitter analysis. Commercial temperature rating suits laboratory environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF40C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF40C4N | EP2SGX130GF40C5N | EP2SGX130GF1508C3 | EP2SGX130GF1508C4N | EP2SGX130GF1508I4N |
|---|---|---|---|---|---|---|
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | C3 | C4 (faster) | C5 (fastest) | C3 (identical) | C4 | I4 (industrial) |
| Logic Elements | 132,540 | 132,540 (same) | 132,540 (same) | 132,540 (same) | 132,540 (same) | 132,540 (same) |
| Transceiver Count | 40 | 40 (same) | 40 (same) | 40 (same) | 40 (same) | 40 (same) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Unit Price (qty 1) | $1,850 | ~$1,950 | ~$2,150 | ~$1,850 | ~$1,950 | ~$2,250 |
Key Differentiators
- 40 transceivers at 6.375 Gbps in a single die (vs EP2S130F1508C3N (Stratix II non-GX, no transceivers))
- 132,540 logic elements in 1508-BGA footprint (vs EP2S60F672C3N (smaller Stratix II in 672-BGA))
- Commercial C3 speed grade offers balanced Fmax and cost (vs EP2SGX130GF40C5N (C5 grade))
- Industrial I-grade variant available in same footprint (vs EP2SGX130GF1508I4N)
Design Notes
The EP2SGX130GF40C3N requires multiple supply rails: 1.2 V core, 2.5 V / 3.3 V I/O bank supplies, 2.5 V PLL analog supply (VCCA_PLL), and separate analog supplies for each of the four transceiver quadrants (VCCA_TX, VCCR_TX, VCCT_TX). Decoupling must use a 1-2-3 capacitor hierarchy: 0.1 uF X7R at each transceiver pin-pair, 1 uF X5R per quadrant, and 22-47 uF bulk per supply rail placed within 25 mm of the BGA balls. Simultaneous-switching noise (SSN) on the 1.2 V core can exceed 100 mA transients; a synchronous buck converter with at least 20 A peak rating is recommended. Estimated: total quiescent current at typical utilization is 1.8-2.4 A on 1.2 V plus 200 mA per transceiver channel in active operation.
The 1508-ball FC-FBGA package has a theta_JB of approximately 0.4 C/W and theta_JA of 14 C/W with a properly designed 12-layer 2 oz copper PCB and top/bottom heatsink. At typical 4-6 W consumption plus dynamic switching, junction-to-ambient temperature rise of 50-70 C is expected; for commercial-grade operation the maximum ambient must be limited to approximately 15-35 C, requiring forced-air cooling at 200-400 LFM or a dedicated heatsink. Thermal vias under the BGA thermal pad array are mandatory, with at least 0.3 mm drill on 1.0 mm pitch connected to internal ground planes. Industrial variants (I-grade) tighten this further. Estimated: with 1 oz copper and 4-layer stack, theta_JA doubles to ~28 C/W, which will fail thermal compliance for the commercial 0-85C range at full load.
Layout the 1508-BGA escape with 0.8 mm pitch, using 0.15 mm laser-drilled microvias for signal layers and 0.4 mm mechanical vias for inner power planes. Each transceiver quadrant should have its own isolated analog ground island stitched together at a single point at the device to control return-path impedance; never run digital signals across the analog ground split. The high-speed serial traces must use matched 100 ohm differential routing with intra-pair skew below 5 ps, and length tuning to within 150 mil of the intended protocol specification. Maintain at least 5 W spacing between adjacent 6 Gbps channels to reduce crosstalk below -35 dB.
Do not confuse the GF40 variant (40 transceivers) with the GF30 (30 transceivers) or GE variants (no transceivers) - same 1508-BGA footprint but different active ball assignments. Verify configuration mode (PS/FPP/JTAG) and configuration voltage (VCCIO of MSEL pins) match the EPCS/EPC memory you have selected. The Quartus II-generated .pof file is bitstream-specific to the device speed grade; a C3 bitstream will not operate reliably on a C5 device. Finally, power-up sequencing requires the 1.2 V core supply to rise within 100 ms of the I/O supplies; using a multi-rail power supply with PG signal enables correct ordering.
Compliance Information
RoHS compliant per Intel/Altera product documentation. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade part. Halogen-free status not explicitly stated in retrieved sources.