EP2SGX130GF40C3ES - 130K LEs Stratix II GX FPGA 6.375Gbps | Altera
MPN: EP2SGX130GF40C3ES β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2200 | $2,200.00 |
| 10 | $1980 | $19,800.00 |
| 100 | $1750 | $175,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1200 | $1,200,000.00 |
EP2SGX130GF40C3ES Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic, interconnect, and I/O resources can be customized after manufacture via an SRAM-based configuration bitstream. FPGAs occupy a unique position in the broader hierarchy of programmable logic devices (PLDs), sitting above CPLDs in density and below hard-wired ASICs in NRE cost while offering comparable performance for many parallel and high-bandwidth tasks. The Stratix II GX family specifically combines general-purpose FPGA fabric with multi-gigabit transceivers, enabling single-chip implementations of serial-protocol interfaces (PCI Express, Serial RapidIO, XAUI, Fibre Channel, Gigabit Ethernet) without external PHY silicon.
The EP2SGX130G variant delivers up to 17 DSP blocks for fixed- and floating-point arithmetic, 16 global clock networks with up to 32 regional clock networks per device region, on-chip termination for high-speed transceivers, and dedicated circuitry for source-synchronous interfaces such as DDR/DDR2 SDRAM memory controllers operating up to 550 MHz. Internal core voltage is 1.2 V; the device is fabricated on a 90 nm CMOS process with a 12-layer metal stack.
Typical applications include high-speed serial-protocol bridging (PCI Express x4/x8 endpoints, Serial RapidIO switches), high-end test and measurement instrumentation, digital video broadcast equipment, defense radar and signal-processing systems, and high-performance DSP co-processors. The transceiver count and package combination make this variant suitable for mid-density serial I/O expansion designs.
When designing with this device, careful attention must be paid to PCB stack-up for the FBGA-1508 footprint: a minimum of 6 PCB layers with matched impedance for the high-speed serial channels, a continuous ground reference plane beneath the BGA field, and a via-in-pad or dog-bone fanout is recommended. Power-rail decoupling must follow Altera's Stratix II GX PowerPlay guidelines with multiple bulk and decoupling capacitor values placed as close as physically possible to each supply pin group. The 40 x 40 mm package footprint demands a high-density interconnect (HDI) PCB process with laser-drilled microvias.
This page synthesizes drop-in alternate ordering codes within the EP2SGX130 GF1508 package family, current distributor pricing as of 2026-09-09, and practical PCB-layout design guidance not consolidated in any single manufacturer document.
Drop-in alternatives for EP2SGX130GF40C3ES β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF40C3ES (same form factor and footprint) β differing in Package, Speed Grade, Package Type, Family, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX130GF1508C3
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2SGX130GF1508C3N
β Drop-Inβ In Stock
$1395 / Unit
View Datasheet βEP2SGX130GF1508C4
β Drop-Inβ In Stock
$985 / Unit
View Datasheet βEP2SGX130GF1508C5
β Drop-Inβ In Stock
$645 / Unit
View Datasheet βEP2SGX130GF1508C4N
β Drop-Inβ In Stock
$118 / Unit
View Datasheet βEP2SGX130GF1508C5N
β Drop-Inβ In Stock
$3890 / Unit
View Datasheet βEP2SGX130GF40C3ES Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Series | EP2SGX130 |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 7,047 |
| Embedded Memory (TriMatrix) | 6,747 Kbits |
| DSP Blocks | Up to 17 |
| High-Speed Transceiver Channels | 4 to 20 (per device variant) |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Global Clock Networks | Up to 16 |
| Regional Clock Networks | Up to 32 per device region |
| Internal Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Memory Controller Performance | Up to 550 MHz (DDR/DDR2) |
| DSP Multiplier Performance | Up to 450 MHz |
| Package | FBGA-1508, 40 x 40 mm, 1.0 mm pitch (MS-034AAU-1) |
| Operating Temperature Grade | Commercial Extended (C3) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Lead-Free (per package marking MS-034AAU-1) |
EP2SGX130GF40C3ES fbga-1508, 40 x 40 mm, 1.0 mm pitch (ms-034aau-1) Pin Configuration Guide
Pin configuration for EP2SGX130GF40C3ES (fbga-1508, 40 x 40 mm, 1.0 mm pitch (ms-034aau-1) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF40C3ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF40C3ES is suitable for 7 applications: PCI Express Endpoint Card, Serial RapidIO Switch Fabric, Telecom Line Card / Baseband Processing, Test and Measurement Instrumentation, Defense / Radar Signal Processing, High-End Video Broadcast Equipment, High-Performance DSP Co-Processor.
PCI Express Endpoint Card
The EP2SGX130GF40C3ES fits PCI Express Gen 1 endpoint applications because it embeds 4 to 20 multi-gigabit transceivers operating up to 6.375 Gbps and includes a hard PCI Express IP block that simplifies PHY/MAC implementation. With 132,540 logic elements and 6,747 Kbits of TriMatrix memory, the device can host a complete x4 or x8 Gen 1 endpoint plus user application logic on a single chip. In a typical design, the FPGA connects between the PCIe edge connector and a host ASIC/assembler, replacing external PHY silicon. Performance consideration: at 2.5 Gbps Gen 1 line rate, the Stratix II GX CDR locks within the PCIe specification's 100 ms budget; designs targeting Gen 2 (5 Gbps) must move to Stratix IV or newer.
Recommended
Serial RapidIO Switch Fabric
The EP2SGX130GF40C3ES supports Serial RapidIO (SRIO) switch implementations because each embedded transceiver independently handles 1.25 / 2.5 / 3.125 Gbps SRIO physical layers with clock/data recovery. With 17 DSP blocks running at up to 450 MHz, the device can sustain packet-routing logic plus traffic-shaping logic on-chip. In SRIO switch reference designs, this FPGA sits between multiple SRIO endpoint ASICs and performs packet decode, congestion management, and route-table lookup. Performance consideration: the 132,540 logic elements enable a 4-port SRIO switch with full queue management; designs requiring 8+ ports should move to EP2S180 or Stratix IV to keep utilization below 80%.
Recommended
Telecom Line Card / Baseband Processing
The EP2SGX130GF40C3ES fits telecom line cards because it combines high logic density with embedded transceivers that connect to SFP/SFP+ optical modules at gigabit rates. The 17 DSP blocks deliver up to 450 MHz fixed- and floating-point arithmetic suitable for baseband channel processing, while the 6,747 Kbits of TriMatrix memory buffers incoming samples between PHY and DSP pipeline stages. In a typical design, multiple FPGA instances sit on a single AdvancedTCA or ATCA line card, each handling a subset of channels. Performance consideration: the device's 1.2 V core minimizes power-per-channel for thermal-constrained PoT (point-of-temperature) line-card designs; engineers should budget 6-9 W per FPGA depending on transceiver utilization.
Recommended
Test and Measurement Instrumentation
The EP2SGX130GF40C3ES is well-suited to high-end test and measurement gear because the 6.375 Gbps transceivers enable multi-channel serial-data acquisition at rates unattainable with parallel CMOS logic, and the 132,540 logic elements host custom DSP pipelines for protocol-aware triggering and decoding. The TriMatrix memory provides 6,747 Kbits of acquisition buffer, configurable as true dual-port blocks. In a typical oscilloscope or logic-analyzer design, the FPGA sits between analog front-end ADCs and the host CPU, performing real-time decimation, eye-diagram extraction, and serial-protocol decode. Performance consideration: the on-chip 550 MHz memory controllers allow direct DDR2 SDRAM buffer attachment without external memory controller silicon, reducing BOM cost.
Recommended
Defense / Radar Signal Processing
The EP2SGX130GF40C3ES fits defense radar and signal-intelligence systems because of its radiation tolerance margin, embedded 6.375 Gbps transceivers for digitized RF data ingest, and 17 DSP blocks for real-time FFT and pulse-compression algorithms. The 6,747 Kbits of TriMatrix memory supports ping-pong buffering of antenna samples, while 16 global clock networks synchronize multi-channel data acquisition. In typical radar-channelizer designs, multiple FPGAs are cascaded through the embedded transceivers to scale channel count. Performance consideration: defense programs typically specify an extended-temperature or military-grade FPGA; the C3 commercial-extended grade here covers 0C to +85C ambient, sufficient for many ground-based and shipboard applications but not full MIL-STD-810 environments.
Recommended
High-End Video Broadcast Equipment
The EP2SGX130GF40C3ES supports high-end broadcast video applications because its 132,540 logic elements and 6.375 Gbps transceivers can ingest SDI (Serial Digital Interface) streams at 3 Gbps and convert them to HDMI, DisplayPort, or 10G Ethernet for studio routing. The DSP blocks at 450 MHz implement real-time video scaling, color-space conversion, and frame-rate conversion. In broadcast-routing and conversion-frame designs, the FPGA sits between SDI ingest ports and the studio's IP-network output, performing codec-agnostic processing. Performance consideration: designs converting multiple 3G-SDI streams simultaneously should budget for ~70-80% logic utilization to allow headroom for format-flexibility firmware updates.
Recommended
High-Performance DSP Co-Processor
The EP2SGX130GF40C3ES serves as a co-processor for high-performance DSP workloads because it pairs 17 DSP blocks at 450 MHz with up to 6.375 Gbps serial host links, enabling it to attach as an accelerator to a host CPU or DSP. Applications include financial Monte Carlo simulation, scientific matrix operations, and genomics pipelines. The 6,747 Kbits of TriMatrix memory allows large coefficient tables to be cached on-chip, dramatically reducing host-to-FPGA bandwidth pressure. Performance consideration: co-processor link latency via PCIe Gen 1 is well-matched to typical accelerator workload granularity (~10 us kernel time), but for sub-microsecond latency workloads an HFI/Shared-Memory interface is preferred.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF40C3ES β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF1508C3 | EP2SGX130GF1508C3N | EP2SGX130GF1508C4 | EP2SGX130GF1508C5 | EP2SGX130GF1508C4N | EP2SGX130GF1508C5N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | FBGA-1508 (40 x 40 mm, 1.0 mm pitch) | FBGA-1508 (40 x 40 mm, 1.0 mm pitch) - same | FBGA-1508 (40 x 40 mm, 1.0 mm pitch) - same | FBGA-1508 (40 x 40 mm, 1.0 mm pitch) - same | FBGA-1508 (40 x 40 mm, 1.0 mm pitch) - same | FBGA-1508 (40 x 40 mm, 1.0 mm pitch) - same | FBGA-1508 (40 x 40 mm, 1.0 mm pitch) - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | C3 (commercial) | C3 (commercial) | C3 (commercial) | C4 (faster) | C5 (fastest commercial) | C4 (faster) | C5 (fastest commercial) |
| Lead-Free (N suffix) | No | No | Yes | No | No | Yes | Yes |
| Embedded Transceiver Data Rate | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps |
| Embedded Memory (TriMatrix) | 6,747 Kbits | 6,747 Kbits | 6,747 Kbits | 6,747 Kbits | 6,747 Kbits | 6,747 Kbits | 6,747 Kbits |
| DSP Blocks | Up to 17 | Up to 17 | Up to 17 | Up to 17 | Up to 17 | Up to 17 | Up to 17 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Multi-gigabit transceivers integrated on-chip (vs EP2S130F1508C3 (Stratix II non-GX))
- Largest 130K-LE package variant (vs EP2SGX130GF40 (alternate package code))
- On-chip PCI Express hard IP (vs Soft-core PCIe implementation on competitor FPGA)
Design Notes
The EP2SGX130GF40C3ES 1508-ball FBGA at 1.0 mm pitch mandates a high-density interconnect (HDI) PCB process with laser-drilled microvias. Use a 6-layer minimum stack-up with continuous ground reference directly beneath the BGA field. Via-in-pad or dog-bone fanout is acceptable; matched 50 ohm differential impedance is required for all high-speed transceiver lanes to operate at the full 6.375 Gbps data rate.
Follow Altera's Stratix II GX PowerPlay design guidelines for power distribution. Place multiple bulk capacitors (220 uF, 100 uF, 47 uF) close to each supply pin group (VCCINT, VCCA, VCCP, VCCPD) and add 0.1 uF and 0.01 uF decoupling at every quad of BGA balls. Estimate: power dissipation ranges from ~6 W idle (transceivers off) to ~12-15 W fully utilized (all transceivers active, 80% logic utilization); thermal management should target a junction-to-ambient resistance of <= 1.5 C/W via a heat spreader.
Do not confuse the EP2SGX130 (Stratix II GX, with transceivers) with the EP2S130 (Stratix II, without transceivers); they have the same logic density but different I/O and pin assignments in the GF1508 package. Also note the temperature-grade code in the ordering suffix: C3 = commercial-extended (0C to +85C), I3/I4/I5 = industrial (-40C to +100C); choosing the wrong grade can cause thermal shutdown in uncontrolled environments. Always verify the full datasheet pin map before PCB layout.
Compliance Information
Lead-free status inferred from package code MS-034AAU-1 in Altera datasheet. RoHS/REACH compliance not explicitly stated in verified web data; confirm with original Altera/Intel documentation for production use.
