EP2SGX130GF40C4NGB - Stratix II GX FPGA, 132K LEs, 6.6K LABs | Intel
MPN: EP2SGX130GF40C4NGB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $780 | $7,800.00 |
| 50 | $720 | $36,000.00 |
| 100 | $685 | $68,500.00 |
| 250 | $640 | $160,000.00 |
EP2SGX130GF40C4NGB Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built around an array of programmable logic blocks, programmable interconnect, and I/O cells, belonging to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Modern FPGAs combine this programmable fabric with hardened IP such as transceivers, memory blocks, PLLs, multipliers, and embedded processors, allowing designers to implement custom datapaths, protocol controllers, and parallel processing pipelines on a single chip. The Stratix II GX series extends the general-purpose Stratix II family by adding multi-gigabit transceivers.
The EP2SGX130GF40C4NGB integrates up to 20 transceivers supporting serial interfaces up to 6.375 Gbps, embedded TriMatrix memory, and DSP blocks. With 734 user I/O pins and 8 PLLs, the device supports a wide range of high-speed parallel and serial I/O standards. The 1508-ball FBGA package provides high pin density and signal integrity for backplane, telecommunications, and high-performance computing applications, and the C4 speed grade balances timing margin and operating frequency for commercial-temperature designs.
Architecturally, the Stratix II GX device uses a row-based logic structure, ALM-based adaptive logic modules, and source-synchronous circuitry optimized for 600 MHz to 1 GHz internal operation. Hard IP for PCI Express, SerialLite II, and other serial protocols reduces soft-logic footprint, while the on-chip TriMatrix memory provides up to 6.7 Mbits of distributed and block RAM with multiple operating modes.
Typical applications include 10G/40G Ethernet line cards, SONET/SDH framers, HD-SDI video routers, high-performance DSP co-processing, software-defined radio (SDR) baseband, ASIC prototyping, and high-density protocol bridging. Designers select the EP2SGX130GF40C4NGB when 132K logic elements and 6.375 Gbps transceivers are required in a single device on a commercial-temperature board.
When designing with this device, ensure Quartus II software compatibility (the device is supported by Quartus II version 9.1 and later, but newer Quartus releases may no longer include the device in active support). Plan PCB layout with controlled-impedance transceiver channels and adequate thermal dissipation for the 1508-ball FBGA; reference the Altera Stratix II GX Device Handbook and the AN 532 application note for transceiver signal-integrity guidelines.
This page synthesizes distributor pricing, drop-in alternative MPNs from the Stratix II GX family, and engineering design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and PCB implementation decisions.
Drop-in alternatives for EP2SGX130GF40C4NGB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF40C4NGB (same form factor and footprint) — differing in Package, Speed Grade, Mounting Type, Logic Array Blocks (LABs), RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX130GF40C4NES
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX130GF40C4ES
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2SGX130GF40C3NES
✅ Drop-In✓ In Stock
$124 / Unit
View Datasheet →EP2SGX130GF40C3N
✅ Drop-In✓ In Stock
$1485 / Unit
View Datasheet →EP2SGX130GF40C3ES
✅ Drop-In✓ In Stock
$1200 / Unit
View Datasheet →EP2SGX130GF40C4NGB Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Family | Enhanced Configuration (EPC) Devices |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| User I/O Pins | 734 |
| Package | 1508-ball FBGA (GF40) |
| Terminal Pitch | 1.00 mm |
| Speed Grade | C4 |
| Temperature Grade | Commercial (0C to 85C) |
| Transceivers | Up to 20 multi-gigabit transceivers |
| Max Transceiver Data Rate | 6.375 Gbps |
| PLLs | 8 |
| On-chip Memory | TriMatrix memory (block RAM + distributed RAM) |
| DSP Blocks | Yes (embedded multipliers) |
| Configuration | Enhanced / EPC mode |
EP2SGX130GF40C4NGB 1508-ball fbga (gf40) Pin Configuration Guide
Pin configuration for EP2SGX130GF40C4NGB (1508-ball fbga (gf40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF40C4NGB.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF40C4NGB is suitable for 6 applications: 10 Gigabit Ethernet Line Card, SONET/SDH Framer and Mapper, HD-SDI Video Router and Switcher, ASIC Prototyping Platform, Software-Defined Radio Baseband, Industrial Test and Measurement Instrumentation.
10 Gigabit Ethernet Line Card
The EP2SGX130GF40C4NGB's 20 transceivers at up to 6.375 Gbps enable 4-lane XAUI implementations at 3.125 Gbps each, providing 10 Gbps aggregate Ethernet bandwidth per port. The 132,540 logic elements and embedded TriMatrix memory deliver the FIFO depth, statistics counters, and packet-processing datapath required for 10 GbE MAC and bridge functions, while the 734 user I/O pins route parallel data and control to external PHYs. Placed on a line-card PCB between SFP+ cages and a network processor, this FPGA replaces a discrete MAC plus bridging ASIC. Performance trade-off: at C4 speed grade the device meets XAUI timing at 3.125 Gbps but headroom is tighter than the Stratix IV GX; for new designs, Stratix V GX is preferred.
Recommended
SONET/SDH Framer and Mapper
With up to 20 transceivers supporting OC-48/STM-16 (2.488 Gbps) and OC-192/STM-64 (9.95 Gbps) interfaces via external muxing, the EP2SGX130GF40C4NGB suits multi-port SONET/SDH framer designs. The 132K logic elements implement pointer processors, payload mappers, and overhead insertion, while the TriMatrix memory supplies the elasticity FIFO and section/line overhead buffers. The 1508-ball FBGA package routes 734 user I/O pins to backplane connectors and clock-distribution PLLs. The C4 speed grade meets STS-192 timing budgets for industrial-temperature environments when paired with adequate cooling. Designers should plan PCB layout with controlled-impedance differential pairs and reference Altera application note AN 532 for transceiver signal-integrity guidelines.
Recommended
HD-SDI Video Router and Switcher
The EP2SGX130GF40C4NGB supports HD-SDI (1.485/1.4835 Gbps) and 3G-SDI (2.97 Gbps) video routing with up to 20 simultaneous I/O streams. Its 132K logic elements implement cross-point switching matrices, embedded audio embedding/de-embedding, and ancillary data processing for broadcast studio and outside-broadcast (OB) trucks. The 734 user I/O pins accept parallel video and audio buses from external receivers, while the dedicated transceivers drive BNC connectors directly. The C4 speed grade sustains 3G-SDI reclocking at production-grade timing margins. Design consideration: at 6.375 Gbps the device also supports dual-link 3G-SDI; for UHD/4K routing on a single board, pair with a higher-density Stratix IV or V family device.
Recommended
ASIC Prototyping Platform
With 132,540 logic elements, the EP2SGX130GF40C4NGB is widely deployed as an ASIC prototype target for designs targeting 100K-150K ASIC gates. Its 734 user I/O pins allow multi-chip ASIC prototyping across daughter cards, and the embedded TriMatrix memory provides realistic memory subsystem modeling. The Stratix II GX device supports prototyping of PCIe, SerialLite, DDR2, and QDRII memory interfaces via hardened IP, accelerating ASIC verification by 2-5x compared to simulation alone. Reference the Altera ASIC Proving Ground methodology and Quartus II incremental compilation flow. Trade-off: for prototyping larger ASICs (>200K gates), stack multiple Stratix II GX FPGAs or move to Stratix V/VII prototyping boards.
Recommended
Software-Defined Radio Baseband
The EP2SGX130GF40C4NGB's 132K logic elements combined with embedded multipliers and TriMatrix memory support multi-channel SDR baseband processing for wireless infrastructure such as LTE eNodeB and WiMAX base stations. Its transceivers interface directly to RF front-end ADCs and DACs at sample rates up to 6.375 Gbps, enabling wideband digital down-conversion (DDC) and digital up-conversion (DUC). The 8 PLLs provide independent clock domains for ADC sampling, FPGA fabric, and backhaul Ethernet. Designers use Altera's DSP Builder and reference designs to accelerate FFT, channelization, and modulation codepath development. Caveat: this device is commercial-temperature grade only; for outdoor basestation deployment, verify extended-temperature Stratix II GX variants or move to Stratix V GX industrial parts.
Recommended
Industrial Test and Measurement Instrumentation
Engineers use the EP2SGX130GF40C4NGB in high-end oscilloscope, logic analyzer, and protocol analyzer front-ends where 6.375 Gbps transceiver channels capture or generate high-speed serial data. The 132K logic elements implement real-time triggering, protocol decoding, and statistics collection across hundreds of channels, while the TriMatrix memory buffers deep acquisition records. The 734 user I/O pins route LVDS/LVTTL parallel data to backplane digitizers. The C4 commercial speed grade limits field deployment to lab environments; for portable instruments, pair with a thermally efficient heatsink. Reference the Altera Signal Integrity toolkit and IBIS models for the 1508-ball FBGA package to optimize probe-front signal fidelity.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF40C4NGB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF40C4NES | EP2SGX130GF40C4ES | EP2SGX130GF40C3NES | EP2SGX130GF40C3N | EP2SGX130GF40C3ES |
|---|---|---|---|---|---|---|
| Package | 1508-ball FBGA (GF40) | 1508-ball FBGA (GF40) - same | 1508-ball FBGA (GF40) - same | 1508-ball FBGA (GF40) - same | 1508-ball FBGA (GF40) - same | 1508-ball FBGA (GF40) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| LABs | 6,627 | 6,627 | 6,627 | 6,627 | 6,627 | 6,627 |
| User I/O Pins | 734 | 734 | 734 | 734 | 734 | 734 |
| Transceivers | Up to 20 (6.375 Gbps) | Up to 20 (6.375 Gbps) | Up to 20 (6.375 Gbps) | Up to 20 (6.375 Gbps, slower timing) | Up to 20 (6.375 Gbps, slower timing) | Up to 20 (6.375 Gbps, slower timing) |
| Speed Grade | C4 | C4 | C4 | C3 (slower) | C3 (slower) | C3 (slower) |
| Temperature Grade | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Largest-density member of the Stratix II GX family in the GF40 footprint (vs EP2SGX130GF40C3N)
- Commercial temperature grade with extended tape-and-reel availability (vs EP2SGX130GF40C4ES)
- Same silicon as other GF40 ordering codes - true drop-in replacement (vs EP2SGX130GF40C4NES)
Design Notes
The 1508-ball FBGA GF40 package dissipates up to 15-20 W under typical Stratix II GX workloads. Reference the Altera AN 358 thermal management application note and derate the theta_JA value (approximately 12 C/W with 4-layer PCB and 0 LFM airflow) by at least 30% for production thermal margin. Attach a thermal interface material (TIM) and heatsink; for chassis designs with no airflow, use a copper heat spreader bonded directly to the package lid.
Design the PCB to support 1.00 mm BGA pitch with 0.8 mm via pads and microvia stack-ups (laser-drilled 0.1 mm vias). Reference the Altera Stratix II GX board design guidelines for layer stack-up, transceiver channel routing (length-matched differential pairs with 100 ohm differential impedance), and power-plane decoupling (recommend 0.1 uF + 0.01 uF ceramic capacitors within 5 mm of each power pin pair).
Do not confuse the 1508-ball FBGA GF40 pinout with the 1508-ball FBGA F1508 variant - they share ball count but use different ball maps and are NOT drop-in compatible. Always verify the package code from the Altera ordering information (GF40 vs F1508) before PCB layout. Also note that the device is commercial-temperature grade only; for industrial deployments add external thermal management or move to an industrial-grade Stratix II GX variant.
Stratix II GX transceivers at 6.375 Gbps require pre-emphasis and equalization settings tuned to the channel loss profile. Use the Quartus II Transceiver Toolkit to characterize your channel; reference AN 532 (Stratix II GX Transceiver Signal Integrity) and Altera's IBIS-AMI models for board-level SI simulation. Plan for -8 dB channel loss at 3 GHz with appropriate pre-emphasis settings.
Use a 4-2-4 or 6-4-6 layer stack-up with continuous ground planes beneath the BGA. Route transceiver differential pairs on the top layer or buried stripline layers with maximum length matching of 5 mils (0.127 mm) per pair; keep AC-coupling capacitors within 200 mils of the FPGA balls. Reference the Altera Stratix II GX High-Speed PCB Design Guidelines document for full layout rule recommendations.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not present in verified web data; set to 'unknown' rather than guessed. AEC-Q100 not applicable as this is a logic IC, not an automotive-grade semiconductor. Compliance data should be verified with the manufacturer or distributor for production use.
