EP2SGX60CF484I4 - 60K LEs Stratix II GX FPGA 484-FBGA | Intel
MPN: EP2SGX60CF484I4 β End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2SGX60CF484I4 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all wired together through a programmable interconnect fabric. FPGAs belong to the broader category of programmable logic devices (PLDs) within the Integrated Circuits > FPGA & CPLD family, and they sit alongside ASICs and microcontrollers as the three principal silicon platforms for digital hardware design. The Stratix II GX family specifically adds embedded transceivers, extending the general-purpose FPGA concept into serial-link-centric applications where ASIC-equivalent bandwidth would otherwise require months of custom design.
Key features of the EP2SGX60CF484I4 include 3,022 Logic Array Blocks (LABs), 4 DSP blocks for hardware-accelerated multiplication, internal clock frequencies up to 732.1 MHz, and 12 full-dupelt mode dedicated transceivers supporting standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. The 23 x 23 mm 1.0 mm-pitch FBGA-484 package provides sufficient perimeter I/O for parallel external memory buses while keeping the ball array compatible with mainstream PCB manufacturing.
The architecture combines ALM-based adaptive logic modules with TriMatrix embedded memory, allowing designers to trade logic density against block-RAM depth on a per-need basis. Hard IP blocks for transceivers, PLLs, and the DDR memory controller offload timing-critical tasks from the programmable fabric, freeing logic resources for user-defined processing and protocol stacks.
Typical applications include wireless baseband processing, video broadcast encoding and routing, serial-backplane switching, high-speed data acquisition, and defense signal intelligence platforms. The combination of 12 transceivers and abundant parallel I/O makes the EP2SGX60CF484I4 especially attractive for line-card designs that must bridge multiple SERDES links to a parallel fabric.
When designing with this device, plan the FPGA-to-transceiver channel allocation and reference-clock distribution up front, because the GX transceivers require precise 100-ohm differential layout and dedicated PLL blocks. Industrial temperature grade (I4 suffix) operation is qualified to -40 C to +100 C ambient, so verify your thermal design against worst-case power from all active transceivers.
This page synthesizes distributor stock and pricing, package-compatible drop-in alternatives, and practical design guidance not found in the Altera datasheet alone, helping engineers validate sourcing and reuse options before committing to a new design.
Drop-in alternatives for EP2SGX60CF484I4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX60CF484I4N
β Drop-Inπ Reference alternative (not in catalog)
EP2SGX60CF484C3
β Drop-Inπ Reference alternative (not in catalog)
EP2SGX60CF484C4
β Drop-Inπ Reference alternative (not in catalog)
EP2SGX60CF484C5
β Drop-Inπ Reference alternative (not in catalog)
EP2SGX60EF484I4
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2SGX60CF484I4 Maximum Ratings & Electrical Characteristics
| Device Type | FPGA - Field Programmable Gate Array |
| Series | Stratix II GX |
| Logic Elements / Cells | 60440 |
| Logic Array Blocks (LABs) | 3022 |
| Total RAM Bits | 2544192 |
| User I/O Count | 291 |
| DSP Blocks | 4 (estimated per family; verify in datasheet) |
| Number of Transceivers | 12 channels |
| Core Voltage | 1.2 V |
| Internal Frequency (max) | 732.1 MHz |
| Process Technology | 90 nm |
| Package Type | 484-BBGA (FC-FBGA) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +100 C (Industrial) |
| RoHS Status | unknown |
| Lead Free | unknown |
EP2SGX60CF484I4 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX60CF484I4 (23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60CF484I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60CF484I4 is suitable for 6 applications: Wireless Baseband Processing, Video Broadcast Encoding and Routing, Serial Backplane Switching, High-Speed Data Acquisition Systems, Defense Signal Intelligence Platforms, Industrial Imaging and Machine Vision.
Wireless Baseband Processing
The EP2SGX60CF484I4 fits wireless baseband processing because 60,440 logic elements plus 2.5 Mbits of TriMatrix memory can absorb full baseband datapaths while 12 multi-gigabit transceivers handle CPRI or OBSAI backhaul to the radio unit. Industrial temperature grade supports outdoor base-station enclosures. The 1.2 V 90 nm core delivers deterministic timing at baseband sample rates, and the 484-BBGA package exposes enough user I/O for parallel ADC/DAC interfaces.
Recommended
Video Broadcast Encoding and Routing
Broadcast video encoders and routing switchers benefit from the EP2SGX60CF484I4 because its 12 transceivers carry uncompressed SDI or HDMI-over-SDI streams at 3 Gbps while the 60K logic elements run JPEG-2000 or H.264 codecs in parallel. Industrial temperature ensures reliability in 24/7 broadcast racks. The 2.5 Mbit embedded buffer holds multiple line buffers, reducing external memory cost.
Recommended
Serial Backplane Switching
Serial backplane line cards use the EP2SGX60CF484I4 because each of its 12 transceivers can operate at up to 6.375 Gbps, supporting Serial RapidIO or custom backplane fabrics. The 291 user I/Os feed parallel switch fabric or external TCAM lookup engines, while 2.5 Mbits of block RAM provides on-chip packet queuing. Industrial temperature grade suits central-office equipment bays.
Recommended
High-Speed Data Acquisition Systems
High-speed data acquisition systems use the EP2SGX60CF484I4 to interface multi-channel ADCs over LVDS while simultaneously streaming the data off-board via transceivers. 60,440 logic elements implement FIR filters and FFT engines, and 2.5 Mbits of block RAM buffer sample bursts. Industrial temperature supports outdoor or industrial-factory DAQ chassis.
Recommended
Defense Signal Intelligence Platforms
Defense signal-intelligence (SIGINT) platforms rely on the EP2SGX60CF484I4 for its combination of 12 transceivers capturing wideband RF and 60K logic elements running channelization and demodulation in a single device. The industrial temperature range and 90 nm process are qualified for harsh-environment deployments. The 484-FBGA package fits standard 6U VPX-replacement form factors in legacy programs.
Recommended
Industrial Imaging and Machine Vision
Industrial machine-vision controllers use the EP2SGX60CF484I4 to aggregate multiple CoaXPress or Camera Link streams delivered through transceivers, then perform real-time image processing in the 60K logic elements. The 2.5 Mbit embedded memory holds line-scan frame buffers, and the 291 user I/Os drive trigger lights, encoders, and reject gates. Industrial temperature ensures 24/7 factory-floor operation.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60CF484I4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60CF484I4N | EP2SGX60CF484C3 | EP2SGX60CF484C4 | EP2SGX60CF484C5 | EP2SGX60EF484I4 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-BBGA (FC-FBGA) 23x23 mm | 484-BBGA (FC-FBGA) 23x23 mm - same | 484-BBGA (FC-FBGA) 23x23 mm - same | 484-BBGA (FC-FBGA) 23x23 mm - same | 484-BBGA (FC-FBGA) 23x23 mm - same | 484-BBGA (FC-FBGA) 23x23 mm - same |
| Logic Elements | 60440 | 60440 | 60440 | 60440 | 60440 | 60440 |
| Embedded Memory (bits) | 2544192 | 2544192 | 2544192 | 2544192 | 2544192 | 2544192 |
| User I/O Count | 291 | 291 | 291 | 291 | 291 | 291 |
| Transceiver Channels | 12 | 12 | 12 | 12 | 12 | 12 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) |
| Speed Grade | -4 (I4) | -4 (I4N) | -3 | -4 | -5 | -4 (I4) |
Key Differentiators
- Only Stratix II GX with 484-ball package and industrial temp at the 60K-LE density (vs EP2S60F484I4)
- Higher logic density with identical pinout vs 30K-LE Stratix II GX (vs EP2SGX30CF780C4)
- Industrial temperature grade extends operating range to -40 C to +100 C (vs EP2SGX60CF484C4)
Design Notes
The EP2SGX60CF484I4 requires sequenced power rails (1.2 V core, 2.5 V/3.3 V aux, 1.2 V/1.5 V transceiver PLLs and TX) per the Altera Stratix II GX PowerPlay designer guidance. Use a multi-rail controller with monotonic ramp and inrush limiting below 3 A to avoid core oxide stress; decoupling must include 0402/0603 ceramics within 100 mil of every power pin, with bulk tantalum or polymer capacitors on each rail. Estimated: 12 transceivers at 6.375 Gbps with 50% utilization draw approximately 6 to 8 W transceiver power plus 3 to 5 W fabric power, so budget a 15 W total thermal envelope for the 484-FBGA.
Route the 12 transceiver channels with 100-ohm differential impedance, length matching within 5 mil for the P and N traces, and continuous reference ground on layer 2. The 1.0 mm BGA pitch requires microvia or laser-drilled stack-up; use a 1-6-1 or 1-5-1 PCB stack with 0.5 oz copper for via-in-pad fan-out. Per the Stratix II GX hardware reference, keep the reference clock lines away from the parallel I/O banks and provide a guard trace to the transceiver PLL supply pins.
Do not confuse the EP2SGX60CF484I4 (Stratix II GX) with the EP2S60F484I4 (Stratix II without transceivers). Although both share the 484-FBGA footprint, the transceiver ball assignments differ and a direct board swap will short the SERDES power pins. Always cross-check the silicon top-mark against the orderable part number before soldering. Likewise, EP2SGX30CF780C3 differs in density (30K LEs) and package (780-ball) and is NOT a drop-in alternative.
Estimated: at 100 C ambient with all 12 transceivers active, junction temperature rise is approximately 18 C/W on a JEDEC 2s2p test board, so 12 W of dissipation translates to a 216 C junction - well above the 125 C limit. Add a heatsink or 4-layer thermal via array under the 484-BBGA exposed pad, and verify with a thermal probe after prototype bring-up. The industrial -I4 grade does not relax the 125 C junction ceiling; only ambient range is extended.
Compliance Information
Compliance status not explicitly listed in the verified web data; consult the official Altera/Intel material declaration or manufacturer datasheet for definitive RoHS/REACH information. The 'N' suffix on EP2SGX60CF484I4N indicates a lead-free reflow-compatible variant.
