EP2SGX90FF1508C6 - Stratix II GX 90K LE FPGA | Altera / Intel
MPN: EP2SGX90FF1508C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $834.57 | $834.57 |
| 10 | $815 | $8,150.00 |
| 100 | $801.19 | $80,119.00 |
| 500 | $769.14 | $384,570.00 |
| 1,000 | $738.38 | $738,380.00 |
EP2SGX90FF1508C6 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O cells can be configured by the customer after manufacture, in contrast to an ASIC whose function is fixed at tape-out. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit at the top of the hierarchy: PLD -> CPLD -> FPGA. The Stratix II GX family specifically targets high-throughput serial connectivity and DSP-heavy designs, blending logic fabric with embedded transceivers that support protocols such as PCI Express, Serial RapidIO, XAUI, and Gbit Ethernet without external PHY ICs.
Key features of the EP2SGX90FF1508C6 include the adaptive logic module (ALM) architecture that packs more logic per area than the prior Stratix generation, on-chip tri-matrix memory (MLAB + M4K + M-RAM blocks) totaling 4.52 Mbits, and DSP blocks supporting 9x9, 18x18, and 36x36 signed multiplication. The 1508-ball FCBGA package exposes up to 650 user I/O pins, providing wide parallel buses for memory and external interfaces alongside the serial transceivers.
The EP2SGX90FF1508C6 is typically used in wired-telecom line cards, broadcast video processing, software-defined radio (SDR), radar signal processing, and high-end test & measurement backplanes where both DSP throughput and multi-gigabit serial links are required in the same silicon. Its 65 nm process node balances performance and power, while the FCBGA package offers controlled-impedance signal-integrity paths for the transceivers.
When designing with this device, plan the PCB stack-up around the 1508-ball FCBGA land pattern and provide sufficient decoupling for the multi-rail core and transceiver supplies. Designers should also confirm Quartus II software support for the 'C6' speed grade when targeting timing closure.
This page synthesizes authorized-distributor pricing, drop-in same-package alternatives from the Stratix II GX and Stratix II families, and practical design notes not aggregated on any single manufacturer page.
Drop-in alternatives for EP2SGX90FF1508C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF1508C6 (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Package, Total RAM Bits, Process Node.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX90FF1508C5N
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX90FF1508C5
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$1350 / Unit
View Datasheet →EP2SGX90FF1508C4N
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$1500 / Unit
View Datasheet →EP2SGX90FF1508C4
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$1390 / Unit
View Datasheet →EP2SGX90FF1508C3N
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$1295 / Unit
View Datasheet →EP2SGX90FF1508
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View Datasheet →EP2SGX90FF1508C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Series | EP2SGX90F |
| Logic Elements | 90,960 |
| Adaptive Logic Modules (ALMs) | 4,548 |
| Total RAM Bits | 4,520,448 (4.52 Mbit) |
| Maximum User I/O | 650 |
| Package | 1508-BBGA, FCBGA (Flip-Chip BGA) |
| Speed Grade | C6 |
| Operating Temperature | 0 C to +85 C (commercial) |
| Process Node | 65 nm |
| Transceivers | Up to 20 multi-gigabit transceivers (per family) |
| DSP Blocks | Yes (9x9 / 18x18 / 36x36 multipliers) |
| Memory Types | MLAB + M4K + M-RAM |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per typical Altera product page) |
EP2SGX90FF1508C6 1508-bbga, fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP2SGX90FF1508C6 (1508-bbga, fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90FF1508C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90FF1508C6 is suitable for 7 applications: Software-Defined Radio (SDR) Baseband Processing, High-Speed Serial Backplane Aggregation, Broadcast Video Processing & Format Conversion, Radar & Electronic Warfare Signal Processing, High-End Test & Measurement Instrumentation, Medical Imaging (Ultrasound Beamformer Front-End), Industrial Motor Control & High-Power Drives.
Software-Defined Radio (SDR) Baseband Processing
The EP2SGX90FF1508C6 fits SDR baseband designs because its 90,960 logic elements and 4.52 Mbit on-chip tri-matrix memory (MLAB + M4K + M-RAM) provide the slice-and-flip buffer space and FIR / FFT pipeline stages typical of wideband digital down-conversion (DDC) and digital up-conversion (DUC). Its hardware DSP blocks support 18x18 and 36x36 signed multiplications, accelerating channelization, sample-rate conversion, and crest-factor reduction. Multi-gigabit transceivers connect directly to ADC and DAC sample ports, eliminating external PHYs and reducing board complexity. Use the C6 grade when power and cost dominate over absolute Fmax.
Recommended
High-Speed Serial Backplane Aggregation
Wired-telecom line cards use the EP2SGX90FF1508C6 to aggregate multi-gigabit serial lanes (PCI Express, Serial RapidIO, XAUI, Gbit Ethernet) on the backplane. The device exposes up to 20 embedded transceivers, allowing multiple SFP+ or QSFP modules to be served from a single FPGA without external PHYs. The 650 user I/Os provide wide parallel buses for memory (DDR2 / QDR II) and switch fabric glue logic. Place the device on an HDI PCB stack-up with controlled-impedance routing for the transceiver channels; expect careful attention to reference-clock jitter and isolation between analog and digital supply rails.
Recommended
Broadcast Video Processing & Format Conversion
Broadcast studios and video routers use the EP2SGX90FF1508C6 for real-time 3G-SDI / HD-SDI processing, multi-format conversion (up / down / cross-conversion), and frame-rate adaptation. The 4.52 Mbit on-chip RAM is large enough to hold several line buffers for scaling and de-interlacing, while the DSP blocks accelerate chroma / luma resampling and noise reduction. SDI transceivers (e.g. external Gennum GS2961) feed the FPGA through LVDS pairs, and the embedded multi-gigabit transceivers can carry HDMI or DisplayPort streams directly. The C6 commercial speed grade is sufficient for 3G-SDI line-locked processing at 60 fps.
Recommended
Radar & Electronic Warfare Signal Processing
Radar and EW front-ends rely on the EP2SGX90FF1508C6 for pulse compression, moving-target indication (MTI), and adaptive beamforming. Its 4,548 adaptive logic modules and 384 (typical) 18x18 hardware multipliers provide the parallel arithmetic needed to process dozens of antenna channels in real time. Multi-gigabit transceivers aggregate the digital IF or direct RF sample streams from ADC daughter boards. The 1508-ball FCBGA package and C6 commercial grade suit ground-based or shipboard installations; for airborne or extended-temperature applications select the I-grade EP2SGX90FF1508I4 equivalent (industrial -40 C to +100 C).
Recommended
High-End Test & Measurement Instrumentation
Test instruments such as arbitrary waveform generators, logic analyzers, and protocol analyzers use the EP2SGX90FF1508C6 as the central processing engine. The FPGA generates stimulus waveforms, drives the AWG DAC, and post-processes ADC samples for triggering and protocol decode. Its 650 user I/Os provide enough fan-out for 32+ parallel test channels, and the 4.52 Mbit on-chip memory holds deep acquisition records before DMA to host memory. Multi-gigabit transceivers stream raw sample data to a host PC over PCIe or Thunderbolt external enclosures.
Recommended
Medical Imaging (Ultrasound Beamformer Front-End)
Medical ultrasound carts and handheld imagers use the EP2SGX90FF1508C6 to beamform 64 to 256 parallel channels in real time. Each channel requires dedicated delay-line memory and arithmetic for phase-aligned summation; the device's 4.52 Mbit on-chip RAM plus hardware DSP blocks provide that pipeline without requiring external memory for the inner loop. Multi-gigabit transceivers carry the raw RF sample data from the analog front-end (AFE58xx) to the FPGA. The C6 commercial speed grade and 0 C to +85 C operating range suit bench-top and cart-based deployments. For portable / hand-held use, prefer the I-grade variant to handle thermal rise inside the enclosure.
Recommended
Industrial Motor Control & High-Power Drives
High-end industrial servo drives and multi-axis motor controllers use the EP2SGX90FF1508C6 for closed-loop control, sensorless field-oriented control (FOC), and sinusoidal PWM generation. The 90,960 logic elements and 4.52 Mbit RAM hold multi-axis PI / PID state machines and reference frames, while the 650 user I/Os drive parallel gate-driver buses for IGBT modules. Multi-gigabit transceivers carry EtherCAT, Profinet, or SERCOS feedback from the network. The C6 commercial grade and 1508-ball FCBGA suit cabinet-mounted industrial cabinets; thermal analysis must account for the FCBGA's ball-limited heat-spreading path.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF1508C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF1508C5N | EP2SGX90FF1508C4N | EP2SGX90FF1508C3N | EP2SGX90FF1508C4 |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 1508-BBGA, FCBGA | 1508-BBGA, FCBGA (same) | 1508-BBGA, FCBGA (same) | 1508-BBGA, FCBGA (same) | 1508-BBGA, FCBGA (same) |
| Speed Grade | C6 (slowest commercial) | C5 (faster) | C4 | C3 (fastest commercial) | C4 |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Total RAM Bits | 4,520,448 (4.52 Mbit) | 4,520,448 (4.52 Mbit) | 4,520,448 (4.52 Mbit) | 4,520,448 (4.52 Mbit) | 4,520,448 (4.52 Mbit) |
| Maximum User I/O | 650 | 650 | 650 | 650 | 650 |
| Lead-Free / Industrial 'N' Suffix | No (C6, commercial, no 'N') | Yes (C5N, industrial lead-free) | Yes (C4N) | Yes (C3N) | No |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Slowest / lowest-cost speed grade in the Stratix II GX 90K LE family (vs EP2SGX90FF1508C3N)
- Same FCBGA-1508 package as the entire Stratix II GX 90K LE lineup (vs EP2SGX90FF1508C5N)
- Stratix II GX family integrates up to 20 multi-gigabit transceivers (vs EP2C70F896C6 (Stratix II, non-GX))
Design Notes
The 1508-ball FCBGA package requires an HDI PCB stack-up with microvias. Per Altera application note AN-571-1.0, an 8-layer stack-up with 1-2-1-2-1-2-1-1 routing and continuous ground planes is the reference design. Ball pitch and escape routing must be confirmed against the package datasheet before launching the PCB; ball pad finish and solder paste stencil aperture should follow the IPC-7527 guidelines for BGA.
The EP2SGX90FF1508C6 requires multiple power rails: VCCINT (core), VCCIO (I/O banks), VCCA_PLL / VCCD_PLL (PLL analog), VCCCHIP / VCCL (transceiver analog), and VCCR / VCCT (transceiver digital). Each rail requires bulk decoupling plus distributed 0.1 uF and 1 nF ceramics. Sequence the rails according to the Stratix II GX Power-Up Sequence chapter to avoid latch-up. Estimate: at typical toggle activity, total device consumption can reach several amps on the core rail alone.
Transceiver channels must be routed as 100 ohm differential pairs with continuous reference planes. Per the Stratix II GX Transceiver User Guide, route length matching within 0.1 mm for signals within a transceiver bank, and use AC-coupling capacitors near the transmit pins. Minimize crosstalk by routing high-speed lanes on dedicated inner layers separated by ground planes. Use the Quartus II IBIS-AMI models for channel simulation before committing to PCB fab.
Common pitfalls with the EP2SGX90FF1508C6 include: (1) selecting a speed grade that does not close timing - if your Fmax target is tight, upgrade from C6 to C5 or C4; (2) forgetting the MSL (Moisture Sensitivity Level) handling requirements for FCBGA parts - bake per JEDEC J-STD-033 before reflow if the dry-pack indicator is pink; (3) using the wrong configuration scheme - select Active Serial (EPCS) for cost-sensitive boards but Passive Parallel (EPC) for fastest configuration time. Quartus II project settings must match the speed grade to avoid compilation errors.
Compliance Information
RoHS compliant per typical Altera product-page statements. Reach / halogen-free / conflict-minerals declarations not surfaced in the verified web data for the EP2SGX90FF1508C6 specifically - check the original manufacturer CofC or PCN for full compliance documentation.
