EP2SGX90FF1508 - 90,960 Cells FPGA | Altera | High-Speed Systems
MPN: EP2SGX90FF1508 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2SGX90FF1508 Overview
A field-programmable gate array is a semiconductor device whose logic functions, interconnects, and I/O behavior can be programmed after manufacturing. Within the hierarchy, EP2SGX90FF1508 is a FPGA, then a programmable logic device, then an integrated circuit, and ultimately a configurable digital semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA supports design changes without a new mask set. Its configurable architecture is useful when interface standards, protocol processing, timing requirements, or product variants evolve.
The principal resources are 90,960 logic elements and 4,520,448 RAM bits. DigiKey describes 650 user I/O for the EP2SGX90FF1508C3N ordering variant, and Mouser describes 4,548 LABs. These resources allow parallel datapaths, memory-intensive packet processing, and multiple interface controllers to coexist. The 1508-ball FCBGA package supports a large pin count on a compact BGA footprint, but demands controlled impedance, high-quality multilayer routing, and careful power delivery.
The supplied Arrow listing states 1.2 V, 816.9 MHz, and 90,960 cells for the EP2SGX90FF1508C3N. A related Ampheo listing gives 717 MHz for EP2SGX90FF1508C4N, showing why speed grade and ordering code matter. The target base MPN does not contain a visible speed-grade suffix in the provided text, so design decisions must use the exact ordered part and its manufacturer handbook. The device belongs to a high-speed family suited to demanding logic and memory configurations rather than low-cost control-only implementations.
Typical applications include high-throughput communications equipment, network packet processing, and test or imaging systems with parallel I/O. For communications systems, the programmable fabric can implement protocol-specific datapaths while 650 listed I/O support numerous external connections. For test equipment, 90,960 logic elements can implement real-time processing, capture control, and high-speed interfaces. These examples depend on final pin assignments, transceiver capability, power integrity, and timing closure in the exact configuration.
Designers should first resolve the complete ordering code and download the applicable Stratix II GX device documentation. Validate the intended 1.2 V rail, speed-grade timing, supported I/O standards, configuration scheme, clock resources, junction temperature, and exact 1508-ball pinout. BGA assembly requires appropriate via-in-pad or via construction, escape routing, solder-paste geometry, and package warpage controls. Use the exact ordering-code table rather than assigning a frequency solely from a related speed grade.
This product page combines verified distributor facts, explicit uncertainty markers, application context, package constraints, and sourcing information. It distinguishes exact base-MPN facts from suffix-specific listings and does not infer a guaranteed frequency where the verified data conflicts. Engineers should use the page to frame procurement and architecture decisions, then confirm implementation against the official Intel or Altera documentation and the exact purchased MPN.
Drop-in alternatives for EP2SGX90FF1508 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF1508 (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, RoHS Status, Total RAM Bits.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90EF1508C3N
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$1450 / Unit
View Datasheet βEP2SGX90EF1508C4
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$1395 / Unit
View Datasheet βEP2SGX90EF1508C5
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$1320 / Unit
View Datasheet βEP2SGX90F1508C3
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$1350 / Unit
View Datasheet βEP2SGX90F1508
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View Datasheet βEP2SGX90FF1508 Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | Stratix II GX |
| Logic Cell Count | 90,960 cells |
| Logic Element Count | 90,960 elements |
| User I/O Count | 650 I/O |
| RAM Bits | 4,520,448 bits |
| LAB Count | 4,548 LABs |
| Supply Voltage | 1.2 V |
| Listed Frequency | 816.9 MHz |
| Related Speed-Grade Frequency | 717 MHz |
| Technology | CMOS |
| Package Type | FCBGA |
| Package Pin Count | 1,508 balls |
| Package Body Size | 40 mm x 40 mm |
| Ball Pitch | 1 mm |
| Package Outline Reference | MS-034AAU-1 |
| Mounting Type | Surface mount |
| Lead-Free Status | Lead-free |
EP2SGX90FF1508 ms-034aau-1 Pin Configuration Guide
Pin configuration for EP2SGX90FF1508 (ms-034aau-1 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90FF1508.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90FF1508 is suitable for 6 applications: High-Throughput Communications Equipment, Network Packet Processing, Industrial Control and Automation, Automated Test Equipment, High-Speed Imaging and Video Systems, Legacy Telecommunications Infrastructure.
High-Throughput Communications Equipment
EP2SGX90FF1508 fits communications equipment that needs substantial programmable processing and dense external connectivity. Its verified 90,960 logic elements, 4,520,448 RAM bits, and 650 listed I/O can support protocol transformation, packet inspection, buffering, traffic management, and multiple interface controllers on one FPGA. The 1,508-ball FCBGA package accommodates the required I/O and power connections but makes signal integrity and power delivery critical. Designers should implement parallel datapaths with registered boundaries and confirm exact bank, pin, voltage, and timing assignments from official documentation before routing.
Recommended
Network Packet Processing
EP2SGX90FF1508 is well matched to network packet-processing functions that combine filtering, classification, buffering, and statistics with protocol-specific control. The verified 4,520,448 RAM bits provide embedded storage for queues and lookup data, while 90,960 logic elements can implement parallel match engines, counters, and state machines. Its 650 listed I/O can connect packet interfaces, management buses, and control paths. A successful implementation should partition packet paths to limit fanout, use registered interfaces, and meet timing with the exact speed-grade documentation rather than relying only on the 816.9 MHz C3N distributor listing.
Recommended
Industrial Control and Automation
EP2SGX90FF1508 can serve centralized industrial automation systems that require deterministic logic, sensor aggregation, motion control, and several real-time communication interfaces. Its 90,960 logic elements allow parallel processing of encoder inputs, interlocks, timing logic, and supervisory control. The 4,520,448 RAM bits support FIFOs, event histories, and intermediate processing buffers, while the 650 listed I/O can reduce the number of companion interface devices. Industrial qualification and operating temperature are not provided, so the exact suffix must be checked for temperature and reliability requirements before deployment.
Recommended
Automated Test Equipment
EP2SGX90FF1508 suits automated test equipment that must coordinate acquisition modules, generate patterns, process measurements, and communicate with a host. The FPGA's 90,960 logic elements can implement timing engines, sequencing, digital-signal conditioning, and high-speed control logic. Its 4,520,448 RAM bits can store captured samples and test vectors, and the 650 listed I/O support numerous instrument connections. Use careful clock-domain partitioning and deterministic pipelines, then validate the exact I/O standard, pin bank, termination, and timing model. The supplied snippets do not establish an operating-temperature grade or complete pinout.
Recommended
High-Speed Imaging and Video Systems
EP2SGX90FF1508 is relevant to imaging systems that ingest high-rate pixel data, perform preprocessing, and bridge multiple storage or display interfaces. The verified 90,960 logic elements can handle line buffers, color conversion, filtering, frame management, and timing generation, while 4,520,448 RAM bits support buffers and lookup operations. Its 650 listed I/O provide capacity for camera links, memory interfaces, and control connections. The large 1,508-ball FCBGA package enables dense integration, but exact high-speed electrical specifications are not supplied, so signal-integrity simulations and official interface limits are mandatory.
Recommended
Legacy Telecommunications Infrastructure
EP2SGX90FF1508 can be used to maintain established telecommunications infrastructure where board redesign is undesirable and the existing firmware already targets Stratix II GX. Its 90,960 logic elements, 4,520,448 RAM bits, and 650 listed I/O provide the central programmable resources used by many protocol and line-card functions. The 1,508-ball FCBGA package and legacy architecture make verified inventory, configuration-file retention, and obsolescence planning essential. Before substituting any suffix, validate pin map, timing, power, temperature, and configuration compatibility; no true drop-in replacement is confirmed by the supplied cross-reference data.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF1508 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1508C3N | EP2SGX90EF1508C4 | EP2SGX90EF1508C5 | EP2SGX90F1508C3 | EP2SGX90F1508 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1,508-ball FCBGA | FBGA-1508; same ball count | FBGA-1508; same ball count | FBGA-1508; same ball count | FBGA-1508; same ball count | FBGA-1508; same ball count |
| Pin-Count Difference | 1,508 balls | 0 balls; 0% | 0 balls; 0% | 0 balls; 0% | 0 balls; 0% | 0 balls; 0% |
| Pin-to-Pin Verification | Not applicable | Not verified by supplied data | Not verified by supplied data | Not verified by supplied data | Not verified by supplied data | Not verified by supplied data |
Key Differentiators
- Verified combination of logic density, memory, and package I/O (vs EP2SGX130GF1508C3)
- Specific high-frequency distributor listing for the C3N variant (vs EP2SGX90EF1508C4)
- Documented 650-I/O configuration in the verified C3N listing (vs EP2SGX90EF1508C5)
Design Notes
Use the official power spreadsheet for the exact EP2SGX90FF1508 ordering code and speed grade. The supplied evidence establishes a 1.2 V listing for the C3N variant but does not provide rail currents, tolerances, transient limits, or power-consumption figures. Estimate current only after defining clock rates, toggle activity, configuration, memory use, and I/O loading. Keep each required rail source impedance low, place local decoupling at the specified package-entry locations, and verify rail sequencing, startup current, and transient response with an oscilloscope before production release.
The verified data does not include junction-temperature limits, thermal resistance, power dissipation, or airflow requirements. Therefore, no safe junction-temperature rise can be calculated without a vendor-supported power model and board definition. For an engineering estimate, enter measured per-rail current into the exact speed-grade power spreadsheet, add FPGA and memory I/O losses, and combine the resulting power with the board's theta-JA conditions. Keep thermal shutdown and ambient limits separate from calculated estimates, then validate the assembled board at maximum clock, utilization, and ambient temperature.
Treat the 1,508-ball, 40 mm by 40 mm, 1 mm-pitch FCBGA as a constrained multilayer-BGA design. The official package drawing must control ball numbering, land diameter, solder-mask definition, escape pattern, and keepout geometry; none of those details appears in the supplied data. Select stack-up for simultaneous power-plane impedance, low-impedance returns, and high-speed escape. Review via-in-pad reliability with the fabricator, use the assembly house's BGA process window, and perform assembly trial or package-level inspection before volume production.
Do not infer interface performance from the 816.9 MHz Arrow listing, which is attached to the C3N ordering variant rather than a guaranteed base-MPN rating. Confirm supported I/O standards, differential amplitudes, data rates, bank restrictions, termination values, and reference-clock limits from official documentation. Route high-speed nets over an uninterrupted reference plane, minimize via transitions, control pair spacing and length, and use receiver-plus-transmitter channel simulations for every voltage and protocol corner. Validate the programmed configuration and measured waveforms on prototype hardware.
Avoid treating related suffix codes or same-pin-count devices as automatically compatible. EP2SGX90FF1508C3N, C4N, C5, and site-listed same-family codes may differ in speed, temperature, power, configuration, or ordering attributes even when the package has 1,508 balls. The supplied cross-reference search did not verify a drop-in part. Before any substitution, compare the official ordering tables, ball maps, timing models, power rails, configuration interfaces, software support, and firmware image. Require an authorized written cross-reference and qualification evidence; otherwise treat the candidate as a redesign.
Compliance Information
Ampheo describes the related EP2SGX90FF1508C4N as lead-free. The supplied data does not establish RoHS, REACH, halogen-free, or conflict-minerals status for the exact target MPN. No AEC-Q100 claim is verified; not_qualified means no qualification evidence was supplied, not that a declaration explicitly denies qualification.
