EP2SGX90FF1508C4N - 90k LE Stratix II GX FPGA 1508-FCBGA | Intel
MPN: EP2SGX90FF1508C4N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 25 | $1680 | $42,000.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1500 | $750,000.00 |
EP2SGX90FF1508C4N Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells. FPGAs occupy the position of ASIC-class parallel processing engines in the broader digital IC hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are defined by a hardware description language (HDL) bitstream that configures on-chip SRAM at every power-up, making them ideal for design iteration, low-volume production, and time-to-market-critical applications.
Key features include 4,548 LABs/CLBs, 4,520,448 bits of embedded RAM, dedicated DSP blocks for fixed- and floating-point math, embedded high-speed serial transceivers, and 650 general-purpose I/O pins. The device operates across industrial temperature grades and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL for mixed-voltage board integration.
Architecture-wise, the Stratix II GX fabric uses adaptive logic modules (ALMs) that pack combinational and registered logic into 8-input fracturable look-up tables, achieving higher logic density than the preceding Stratix family. Transceivers support multi-gigabit serial protocols such as PCI Express, Serial RapidIO, XAUI, and custom serial links up to 6.375 Gbps, making the part well-suited to wired communications infrastructure.
Typical applications include wired communications line cards (multi-gigabit transceivers for backplanes and SFP+ interfaces), high-end test and measurement instrumentation, radar and signal-processing front ends, ASIC prototyping, and DSP accelerator cards. The 1508-FCBGA package supplies the pin density required for the 650 I/Os plus dedicated transceiver and supply balls.
When designing with this device, follow the Stratix II GX pin connection guidelines for unused transceiver channels (tie to defined reference voltages) and provide sufficient decoupling on every VCC rail. Bitstream security should be enabled via the AES-128 programming file option for production systems to prevent unauthorized configuration readback.
Drop-in alternatives for EP2SGX90FF1508C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF1508C4N (same form factor and footprint) β differing in Operating Temperature, Package, Speed Grade, Total RAM Bits, Package Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90FF1508C4ES
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View Datasheet βEP2SGX90FF1508C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements (LE) | 90960 |
| LABs/CLBs | 4548 |
| Total RAM Bits | 4520448 |
| Number of I/O | 650 |
| Operating Temperature | 0C to +85C (commercial grade per 'C' suffix) |
| Package / Case | 1508-BBGA, FCBGA (PBGA1508, 40 x 40 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Process Node | 90 nm |
| Transceivers | Embedded multi-gigabit transceivers (Stratix II GX feature) |
| DSP Blocks | Yes (dedicated variable-precision DSP blocks) |
| RoHS Status | Lead-free per 'N' suffix; RoHS status to be confirmed |
| Lead Free | Yes (lead-free finish per datasheet summary) |
EP2SGX90FF1508C4N Pin Configuration
| Pin 1 | I/O Bank 1 (sample) β User I/O ball in Bank 1 - consult Stratix II GX pin table for exact ball assignments per device variant |
| Pin 10 | GND β Ground ball |
| Pin 100 | VCCIO1 β Bank 1 I/O supply voltage |
| Pin 1000 | VCCRT β Transceiver supply |
| Pin 1001 | GXB_RX0 β Embedded transceiver channel 0 receive (typical) |
| Pin 1010 | REFCLK β Transceiver reference clock input |
| Pin 1100 | I/O Bank (sample) β User I/O ball - exact assignment varies by package |
| Pin 1200 | VCCINT β Core supply voltage |
| Pin 1300 | GND β Ground ball |
| Pin 1400 | DQS β DDR/DDR2 data strobe ball (sample) |
| Pin 1500 | I/O (sample) β User I/O ball |
| Pin 1508 | NC β No-connect or reserved per Stratix II GX pin table |
| Pin 20 | VCCIO3 β Bank 3 I/O supply voltage |
| Pin 200 | GND β Ground ball |
| Pin 300 | VCCAUX β Auxiliary supply voltage for I/O and configuration |
| Pin 400 | GXB_TX0 β Embedded transceiver channel 0 transmit (typical) |
| Pin 500 | I/O (sample) β User I/O ball - see Stratix II GX pinout file |
| Pin 600 | VCCINT β Core supply voltage |
| Pin 700 | CONFIG β Configuration mode pin (sample) |
| Pin 800 | GND β Ground ball |
Typical Applications
EP2SGX90FF1508C4N is suitable for 6 applications: Wired Communications Line Cards, ASIC Prototyping, DSP Accelerator Cards, Test and Measurement Instrumentation, Radar and Signal-Processing Front Ends, Video Broadcast and Image Processing.
Wired Communications Line Cards
The EP2SGX90FF1508C4N's embedded multi-gigabit transceivers (up to 6.375 Gbps) and 650 user I/Os make it well-suited for wired backplane and SFP+/XAUI line-card designs. The 90960 LEs and 4.5 Mbit embedded RAM are sufficient to handle PCS, MAC, and framer functions for multiple ports on a single device, while dedicated DSP blocks accelerate forward-error-correction and Reed-Solomon decoding. The 1508-FCBGA package supplies the pin density required for the wide parallel bus to a network processor plus dedicated transceiver ball assignments, reducing PCB layer count in dense switch-fabric designs.
Recommended
ASIC Prototyping
With 90960 logic elements, 4.5 Mbit of embedded RAM, and 650 user I/Os in a single BGA, the EP2SGX90FF1508C4N is a classic ASIC-prototyping vehicle. Designers map ASIC RTL blocks across multiple FPGAs using TDM or pin-multiplexed partitioning, leveraging Quartus II synthesis to verify timing closure pre-tapeout. The 1508-FCBGA footprint exposes enough I/O to break out common ASIC busses (AXI, AHB, DDR) and to instantiate transactor endpoints for PCIe or RapidIO verification. Industrial temperature variants exist for ASIC prototyping of automotive-grade designs.
Recommended
DSP Accelerator Cards
The dedicated variable-precision DSP blocks of the EP2SGX90FF1508C4N implement FIR, FFT, and matrix-multiply pipelines with hundreds of GMACs of throughput. With 90960 LEs and embedded multiplier resources, the device can host a complete radar or beamforming front end plus host-side PCIe interface logic. The 650 user I/Os break out to high-speed ADCs and DACs while embedded transceivers handle the backhaul to a host system. 1508-FCBGA thermal performance (40 x 40 mm) supports sustained DSP workloads with adequate airflow or heatsink attachment.
Recommended
Test and Measurement Instrumentation
The EP2SGX90FF1508C4N integrates waveform generation, pattern detection, and protocol-aware decoding logic for high-end test gear. Its 90960 LEs and 4.5 Mbit embedded RAM can capture deep signal traces for protocol analyzers, while embedded transceivers drive serial-bus stimulus up to 6.375 Gbps. The 650 user I/Os map to multiple parallel DUT interfaces with mixed I/O standards (LVDS, LVCMOS, HSTL, SSTL) per pin. Programmable logic in instrument designs enables field upgrades and protocol additions without ASIC respin.
Recommended
Radar and Signal-Processing Front Ends
In radar and electronic-warfare front ends, the EP2SGX90FF1508C4N's DSP blocks perform pulse compression, MTI filtering, and CFAR detection in real time, with embedded transceivers accepting digitized IF data from high-speed ADCs. The 90960 LEs and 4.5 Mbit embedded RAM support multi-channel data aggregation, while 650 I/Os permit direct interface to memory and host processing arrays. The 1508-FCBGA package maintains signal integrity for high-speed serial links between front-end modules and back-end signal processors.
Recommended
Video Broadcast and Image Processing
The EP2SGX90FF1508C4N's embedded RAM and DSP blocks enable real-time video scaling, de-interlacing, and color-space conversion for broadcast infrastructure. The 650 I/Os route multiple video streams (3G-SDI, HDMI, DisplayPort) through on-chip serializers and frame buffers, while embedded transceivers connect to upstream camera links or downstream modulators. Industrial temperature variants suit outdoor broadcast cabinets, and the 1508-FCBGA supports the dense multi-channel I/O needed for matrix-switched video routers.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF1508C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF1508C4ES | EP2SGX90FF1508C4 | EP2SGX90FF1508C3N | EP2SGX90FF1508 | EP2SGX130GF1508C4N |
|---|---|---|---|---|---|---|
| Package | 1508-BBGA, FCBGA (40 x 40 mm) | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 90960 | 90960 | 90960 | 90960 | 90960 | 132480 |
| Embedded RAM (bits) | 4520448 | 4520448 | 4520448 | 4520448 | 4520448 | 6747840 |
| User I/Os | 650 | 650 | 650 | 650 | 650 | 650 |
| Speed Grade | -4 (C4) | -4 (C4) | -4 (C4) | -3 (C3) | unspecified | -4 (C4) |
| Lead-Free (N suffix) | Yes | ES suffix (extended screening) | Base (finish varies) | Yes | Base (finish varies) | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- True drop-in within the same family at the same speed grade (vs EP2SGX90FF1508C4ES)
- Same package, higher density path (vs EP2SGX130GF1508C4N)
- Same family speed-grade flexibility (vs EP2SGX90FF1508C3N)
Design Notes
The Stratix II GX EP2SGX90FF1508C4N requires multiple independent supply rails: VCCINT (core), VCCIO (per I/O bank), VCCAUX, VCCPD, VCCR/VCTT/VCCA for transceivers, and VCC_PLL for PLLs. Decoupling must follow the Stratix II GX PDN guidelines - bulk caps per rail plus 0.1 uF and 0.01 uF ceramics near each supply ball cluster. Estimate (based on typical Stratix II GX power calculator): a fully utilized EP2SGX90 at 50 percent toggle rate can draw 3 to 5 A on VCCINT alone; size your regulator with at least 30 percent headroom.
The 1508-FCBGA (40 x 40 mm, 1 mm pitch) requires a multi-layer PCB with a thermal via array beneath the central ball grid to meet the Stratix II GX junction-to-ambient thermal envelope. Without forced airflow or a heat-spreader attachment, ambient power dissipation should not exceed approximately 5 to 8 W for industrial reliability. Estimated: with the package's published theta_JB and a 2 oz copper PCB with thermal vias, the junction-to-ambient thermal resistance drops by 30 to 40 percent versus JEDEC EIA/JESD51 still-air.
Route transceiver channels (GXB_RX, GXB_TX) with 100 ohm differential impedance, length matching to within the budget defined by the Stratix II GX transceiver user guide (typically 5 to 10 ps of intra-pair skew). Keep AC-coupling capacitors close to the FPGA receive pins, place ferrite beads on the VCCR/VCTT analog supplies, and isolate the transceiver ground return from digital switching currents. Configuration pins MSEL[2:0] select the configuration mode (FPP, AS, PS, JTAG) and must be pulled to defined logic levels before configuration begins.
Do not leave unused transceiver channels floating - per the Stratix II GX pin connection guidelines, unused TX pins must be left open and unused RX pins must be biased through the recommended resistor divider. A common mistake is forgetting VCC_PLL decoupling for every PLL block; missing or inadequate filtering causes PLL jitter or unlock. Finally, ensure the configuration bitstream uses the correct Stratix II GX device ID or Quartus will refuse to load and the CONF_DONE pin will stay low.
Compliance Information
Lead-free finish indicated by 'N' suffix; RoHS and REACH compliance per Intel product compliance documentation. AEC-Q100 not applicable (commercial/industrial FPGA).
