Intel

EP2SGX90FF1508C5 - 90K LE Stratix II GX FPGA 1.2V FC-FBGA-1508

MPN: EP2SGX90FF1508C5 βœ— End of Life
In Stock Ships in 1-3 business days
1.15 V to 1.25 V (1.2 V nominal) Vdss 1508-ball FC-FBGA (flip-chip) Package C5 Speed 4,520,448 Memory
From $1350 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $1850 $1,850.00
10 $1750 $17,500.00
100 $1620 $162,000.00
500 $1480 $740,000.00
1,000 $1350 $1,350,000.00
ℹ️ All prices are in USD

EP2SGX90FF1508C5 Overview

The Intel EP2SGX90FF1508C5 is a high-density Stratix II GX field-programmable gate array (FPGA) with 90,960 logic elements, 4,520,448 bits of embedded memory, and integrated 3.125 Gbps transceivers, housed in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 90nm process and operating from a 1.15V–1.25V core supply (1.2V nominal), the device is rated commercial (0 Β°C to +85 Β°C junction) and offers up to 609.76 MHz internal performance.

A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor belonging to the programmable logic device family, sitting hierarchically between ASICs (Application-Specific Integrated Circuits) and general-purpose processors in the embedded IC taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). FPGAs integrate configurable logic blocks, programmable interconnect, dedicated hard IP (memory controllers, transceivers, DSP blocks), and I/O cells on a single die. The Stratix II GX family specifically targets high-speed serial connectivity by embedding multi-gigabit transceivers alongside logic fabric, replacing multi-chip FPGA + PHY designs with a single component.

Key features of the EP2SGX90FF1508C5 include 4,548 LABs (logic array blocks), 650 user I/Os, embedded transceivers supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, and on-chip memory suitable for packet buffering. The flip-chip FC-FBGA-1508 package provides a high pin count and short die-to-package interconnect for signal-integrity-critical serial links at multi-gigabit data rates.

Architecturally, the Stratix II GX uses an ALM (Adaptive Logic Module) based logic fabric combined with TriMatrix embedded memory blocks and DSP blocks, with dedicated PMA (Physical Medium Attachment) and PCS (Physical Coding Sublayer) hard IP per transceiver channel. Designers configure the device using the Quartus II design suite, which has been the de-facto toolchain for this generation of Intel/Altera FPGAs.

Typical applications include high-end communication line cards, multi-gigabit serial backplanes, base-station signal processing, test and measurement equipment with high-speed serial I/O, and protocol bridging cards. The integration of transceivers, memory, and 90K logic elements in one package makes it well suited to system-level designs that previously required a discrete PHY plus a separate FPGA.

When designing with the EP2SGX90FF1508C5, use Quartus II (legacy) or Quartus Prime for synthesis, place-and-route, and timing closure. Pay close attention to the FC-FBGA-1508 PCB land pattern, which requires microvia or laser-drilled via technology and tightly controlled trace impedance on transceiver channels. The commercial speed grade (C5) is the most widely available bin; review Altera's device handbook for transceiver channel-placement rules to avoid signal-integrity issues.

This page synthesizes distributor inventory, drop-in compatible same-package alternatives from the same Stratix II GX family, and practical Quartus-based design notes that complement the official datasheet.

Drop-in alternatives for EP2SGX90FF1508C5 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2SGX90FF1508C5 (same form factor and footprint) β€” differing in Speed Grade, Package, Operating Temperature, RoHS Status, Mounting Type.

Intel
Speed Grade: 5
Package: 1508-Ball FCBGA (FC-FBGA)
Mounting Type: Surface Mount (Flip-Chip BGA)
Compare with EP2SGX90FF1508C5 β†’
Intel
Package: 1508-ball FC-FBGA, 1.0 mm pitch
Compare with EP2SGX90FF1508C5 β†’
Altera
Speed Grade: -5 (moderate)
Package: 1508-BBGA, FCBGA (1508-ball BGA)
Operating Temperature: 0C to +85C (commercial)
Compare with EP2SGX90FF1508C5 β†’
Intel
Speed Grade: -3
Operating Temperature: 0C to +85C (commercial)
RoHS Status: Compliant
Compare with EP2SGX90FF1508C5 β†’
Intel
Speed Grade: C3
Package: 1508-ball FC-FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch
Operating Temperature: 0C to +85C (Commercial)
Compare with EP2SGX90FF1508C5 β†’
Intel
Speed Grade: C4
Operating Temperature: 0C to 85C
Compare with EP2SGX90FF1508C5 β†’
Intel
Operating Temperature: 0 C to 85 C (Commercial / Extended)
RoHS Status: Compliant (verify by date code)
Compare with EP2SGX90FF1508C5 β†’
Intel
Operating Temperature: 0C to +85C (commercial grade per 'C' suffix)
RoHS Status: Lead-free per 'N' suffix; RoHS status to be confirmed
Compare with EP2SGX90FF1508C5 β†’
Intel
Package: 1508-ball FC-FBGA (FF1508)
Operating Temperature: Commercial Extended (0C to +85C)
Compare with EP2SGX90FF1508C5 β†’
Intel
Speed Grade: C5 (commercial, -5 speed)
Package: 1508-ball FCBGA (FBGA-1508), 40 x 40 mm, 1 mm pitch
Operating Temperature: Commercial (0C to +85C junction)
Compare with EP2SGX90FF1508C5 β†’
Altera
Speed Grade: C6
Package: 1508-BBGA, FCBGA (Flip-Chip BGA)
Operating Temperature: 0 C to +85 C (commercial)
Compare with EP2SGX90FF1508C5 β†’
Altera
Speed Grade: C7 (-7 fastest)
Package: 1508-ball FineLine BGA (FF1508)
Operating Temperature: 0C to +85C (commercial)
Compare with EP2SGX90FF1508C5 β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2SGX90FF1508C4N

βœ… Drop-In
Intel
πŸ“¦ 1508-ball FC-FBGA (FF1508)
Stratix II GX Β· 90960 Β· 4548 Β· 4520448 Β· 650 Β· 0C to +85C (commercial grade per 'C' suffix) Β· 1508-BBGA, FCBGA (PBGA1508, 40 x 40 mm, 1 mm pitch)

βœ“ In Stock

$1500 / Unit

View Datasheet β†’

EP2SGX90FF1508C4ES

βœ… Drop-In
Intel
πŸ“¦ 1508-ball FC-FBGA (FF1508)
Stratix II GX Β· 90960 Β· 4828 Β· 4828 Β· 717 MHz Β· 90 nm CMOS Β· 1.2 V (1.15 V to 1.25 V) Β· 12 channels at up to 6.375 Gbps

βœ“ In Stock

$1095 / Unit

View Datasheet β†’

EP2SGX90FF1508C4

βœ… Drop-In
Intel
πŸ“¦ 1508-ball FC-FBGA (FF1508)
Stratix II GX Β· 90,960 Β· 4,548 Β· 650 Β· 717 MHz Β· 0C to 85C

βœ“ In Stock

$1390 / Unit

View Datasheet β†’

EP2SGX90EF1508C5

βœ… Drop-In
Altera
πŸ“¦ 1508-ball FC-FBGA (FF1508)
Stratix II GX Β· EP2SGX90 Β· 90,960 Β· 4,520,448 bits Β· 8 Β· Up to 6.375 Gbps Β· 384 (18x18 multipliers) Β· 734

βœ“ In Stock

$1320 / Unit

View Datasheet β†’

EP2SGX90FF1508C3N

βœ… Drop-In
Intel
πŸ“¦ 1508-ball FC-FBGA (FF1508)
Stratix II GX Β· 90,960 Β· 45,480 (approx.) Β· 4548 Β· 4,520,448 bits Β· 384 Β· 650 Β· 12

βœ“ In Stock

$1295 / Unit

View Datasheet β†’

EP2S90F1508C5N

βœ… Drop-In
Intel
πŸ“¦ 1508-ball FC-FBGA (F1508)
Stratix II Β· 90,960 Β· 4,548 Β· 902 Β· 4,520,488 Β· 609.76 MHz Β· 90 nm Β· 1.2 V

βœ“ In Stock

$3780 / Unit

View Datasheet β†’

EP2SGX90FF1508C5 Maximum Ratings & Electrical Characteristics

Family Stratix II GX
Logic Elements 90,960
Logic Array Blocks (LABs) 4,548
Embedded Memory Bits 4,520,448
Maximum User I/Os 650
Transceivers Embedded multi-gigabit transceivers (MGT)
Process Technology 90 nm
Core Supply Voltage (VCCINT) 1.15 V to 1.25 V (1.2 V nominal)
Maximum Internal Performance 609.76 MHz
Operating Temperature 0 Β°C to +85 Β°C (Commercial)
Package 1508-ball FC-FBGA (flip-chip)
Mounting Type Surface Mount
Speed Grade C5
Configuration Method Quartus II / Quartus Prime

EP2SGX90FF1508C5 1508-ball fc-fbga (flip-chip) Pin Configuration Guide

Pin configuration for EP2SGX90FF1508C5 (1508-ball fc-fbga (flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

1508-ball fc-fbga (flip-chip) package pinout diagram for EP2SGX90FF1508C5

No detailed pinout data available for EP2SGX90FF1508C5.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2SGX90FF1508C5 is suitable for 6 applications: High-Speed Serial Line Cards, Wireless Base Station Baseband Processing, Test & Measurement Equipment with Multi-Gigabit I/O, Network Protocol Bridging & Aggregation, High-Performance Computing Fabric Interfaces, Medical Imaging & Diagnostic Systems.

🌐

High-Speed Serial Line Cards

The EP2SGX90FF1508C5 is well suited to high-speed serial line cards in communication equipment because its integrated multi-gigabit transceivers (MGTs) support up to 3.125 Gbps per channel, enabling protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without an external PHY. The 90,960 logic elements and 4,520,448 bits of embedded memory allow line-card designers to implement packet processing, queuing, and traffic-management logic alongside the SERDES, collapsing multi-chip PHY+FPGA designs into a single device. In a typical line card, the FPGA is placed on the fabric interface between the network processor and the backplane, with 4 to 12 transceiver channels routed to the backplane connectors with controlled-impedance differential pairs. Compared with a discrete PHY + small FPGA partition, this single-chip approach reduces BOM, simplifies power sequencing, and frees PCB area for the rest of the system. The FC-FBGA-1508 package's flip-chip interconnect provides the short, matched-length die-to-ball paths required for multi-gigabit signal integrity, especially important when channels run above 2.5 Gbps.

πŸ“‘

Wireless Base Station Baseband Processing

The 90,960 logic elements and dedicated DSP blocks in the EP2SGX90FF1508C5 provide the DSP throughput required for baseband signal processing in wireless base stations, including channelization, modulation/demodulation, and FEC (Viterbi/Turbo) decoding. The 4,520,448 bits of embedded memory act as a fast on-chip buffer for symbol-level data, reducing pressure on external DDR memory. In a typical base-station board, the Stratix II GX is paired with RF front-end ICs and a network processor, handling PHY-layer functions while the network processor manages MAC and higher layers. The integrated transceivers interface directly to CPRI or OBSAI links between the baseband unit and remote radio heads, eliminating the need for a separate SERDES chip. Designers should use Quartus II's DSP Builder to accelerate filter and FFT implementation, and review the Stratix II GX handbook's transceiver channel-placement rules to maintain signal integrity on CPRI links at 1.228 Gbps and 2.457 Gbps.

πŸ–₯️

Test & Measurement Equipment with Multi-Gigabit I/O

Test and measurement platforms benefit from the EP2SGX90FF1508C5's combination of high logic density and integrated multi-gigabit transceivers, enabling the FPGA to act as a pattern generator, BERT (bit-error-rate tester), or protocol analyzer backend. Designers can implement custom serial protocol decoders, deep packet capture buffers, and stimulus engines all in one device. The 650 user I/Os support parallel data acquisition paths, while the MGTs handle standard serial test interfaces such as SATA, XAUI, and PCI Express for cross-domain testing. The 1.2V core at 609.76 MHz internal performance gives sufficient timing margin for the high-speed state machines used in protocol analyzers, and the FC-FBGA-1508 package accommodates the dense multi-channel BGA required for high pin-count test fixtures. The 90nm process node is well understood and supported in the established Quartus II toolchain, simplifying timing closure for T&M designs.

🌐

Network Protocol Bridging & Aggregation

Protocol bridging and aggregation appliances rely on the EP2SGX90FF1508C5 to terminate multiple serial protocols on one side and present a unified interface (often Ethernet or PCI Express) on the other. The device's transceivers support the heterogeneous mix of protocols commonly seen in service-provider aggregation equipment: XAUI, Serial RapidIO, OC-48, and Gigabit Ethernet. With 90,960 logic elements, the FPGA can implement wire-speed lookup tables, policing, and shaping functions, while the 4.5 Mbit of embedded memory serves as a high-speed packet buffer between the bridging paths. In practice, the FPGA sits between the line interface and the aggregation switch ASIC, offloading protocol translation in hardware rather than consuming CPU cycles. Designers should plan the channel placement early and use the Stratix II GX handbook's channel-bonding and clock-network guidelines to keep multi-protocol skew within budget.

πŸ–₯️

High-Performance Computing Fabric Interfaces

The EP2SGX90FF1508C5 is a strong choice for high-performance computing (HPC) fabric interfaces where it acts as a co-processor or fabric bridge, leveraging its 90,960 logic elements for low-latency messaging and its embedded transceivers for high-bandwidth serial fabric links such as Serial RapidIO or proprietary HPC fabrics. The 4.5 Mbit of embedded memory supports low-latency message queues, while the 650 user I/Os are useful for parallel accelerator interfaces. In a typical HPC node, the FPGA sits between the host CPU and the compute fabric, offloading data movement and protocol-stack processing from the host. The 1.2V core at 609.76 MHz internal clock supports the tight timing windows required for HPC message-passing, and the FC-FBGA-1508 package's flip-chip interconnect provides the high signal-integrity channels needed at multi-gigabit fabric rates. Quartus II's TimeQuest timing analyzer is recommended for closing timing on HPC fabric paths.

πŸ’Š

Medical Imaging & Diagnostic Systems

Medical imaging systems such as ultrasound scanners, CT machines, and digital X-ray detectors use the EP2SGX90FF1508C5 to process high-bandwidth image data streams in real time, thanks to its combination of 90,960 logic elements, dedicated DSP blocks, and high-speed transceivers for camera-link or proprietary imaging interfaces. The 4,520,448 bits of embedded memory hold scan-line buffers and image-processing windows, allowing real-time filtering, beamforming, and image reconstruction in hardware. In an ultrasound system, the FPGA connects to transducer arrays via high-speed ADCs and performs beamforming, demodulation, and envelope detection before passing data to the host for display. The integrated transceivers enable high-speed image transfer to the host over standard serial protocols. The 90nm process and well-characterized Quartus II toolchain give the predictable timing closure medical systems require, and the FC-FBGA-1508 package supports the dense multi-channel BGA needed for parallel ADC interfaces.

What is the EP2SGX90FF1508C5?
The EP2SGX90FF1508C5 is an Intel (formerly Altera) Stratix II GX high-density FPGA with 90,960 logic elements, 4,520,448 bits of embedded memory, 650 user I/Os, and integrated multi-gigabit transceivers, packaged in a 1508-ball flip-chip FC-FBGA. It is built on a 90 nm process and operates from a 1.15 V to 1.25 V core supply, with a maximum internal performance of 609.76 MHz. The 'C5' suffix denotes the commercial temperature grade (0 Β°C to +85 Β°C) and speed grade 5.
How much logic and memory does the EP2SGX90FF1508C5 have?
The EP2SGX90FF1508C5 contains 90,960 logic elements organized into 4,548 Logic Array Blocks (LABs) and provides 4,520,448 bits of embedded TriMatrix memory. This places it at the upper end of the Stratix II GX family in terms of logic density. The large memory and logic capacity make it suitable for packet buffering, DSP co-processing, and protocol bridging in line-card designs.
What transceivers are integrated in the EP2SGX90FF1508C5?
The EP2SGX90FF1508C5 integrates hardened multi-gigabit transceivers (MGTs) supporting data rates up to 3.125 Gbps, with PMA and PCS hard IP per channel. These transceivers are designed to support common serial protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet. Specific channel count and speed grade behavior are detailed in the Stratix II GX Device Handbook.
Where to buy the EP2SGX90FF1508C5 online?
As of 2026-09-09, authorized distributors listing the EP2SGX90FF1508C5 include DigiKey (stocked by Rochester Electronics), Mouser, and FPGAkey's sourcing network. Pricing varies substantially because the part is in NRND/EOL transition; quote-based and on-request supply is common for non-stocked tiers. Compare distributor stock and lead time on Octopart before placing high-volume orders.
What is the price of the EP2SGX90FF1508C5?
Pricing as of 2026-09-09 on Octopart is approximately USD 1,850 at qty-1, decreasing to roughly USD 1,350 per unit at the 1,000-piece break based on observed distributor quotes. The exact price depends on availability, because most inventory is now channel/aftermarket stock. Contact authorized distributors directly for current spot pricing and volume quotes.
What is the lead time for the EP2SGX90FF1508C5?
Lead time for the EP2SGX90FF1508C5 is typically 8 to 16 weeks as of 2026-09-09, because the part is in NRND status and Intel/Altera has transitioned most new designs to Stratix IV and later families. Aftermarket suppliers including Rochester Electronics and independent brokers may have shorter lead times at higher unit cost. Place orders early and confirm allocation before locking production schedules.
EP2SGX90FF1508C5 vs EP2SGX90EF1508C5 - which is the drop-in replacement?
The EP2SGX90FF1508C5 uses a flip-chip FC-FBGA-1508 package, while the EP2SGX90EF1508C5 is a wire-bond or alternative-package variant in the same 1508-ball BGA footprint. Both share 90,960 logic elements, 4,520,448 memory bits, 4,548 LABs, and the same C5 speed grade, so the EF variant is the recommended drop-in replacement when the FF version is out of stock. Confirm PCB land-pattern compatibility against the device handbook before substituting.
Can the EP2SGX130GF1508C5 replace the EP2SGX90FF1508C5?
The EP2SGX130GF1508C5 is a Stratix II GX part with 130,000+ logic elements in a 1508-ball BGA, and is a footprint-compatible upgrade for designs that need higher logic capacity while keeping the same FC-FBGA-1508 land pattern. It is not a 100% drop-in replacement because bitstream files, power-up sequencing, and core supply tolerances differ; the design must be re-synthesized and re-validated in Quartus II. Use it as a same-package upgrade path rather than a direct substitute.
Is the EP2SGX90FF1508C5 still in production?
The EP2SGX90FF1508C5 is in NRND (Not Recommended for New Designs) status as of 2026-09-09. Intel/Altera has transitioned new Stratix II GX designs to Stratix IV GX and later families. The part is still available through authorized distributors and authorized aftermarket suppliers like Rochester Electronics for existing customers, but new designs should target the recommended replacement families.
What software is used to program the EP2SGX90FF1508C5?
The EP2SGX90FF1508C5 is programmed using the Quartus II design suite (legacy releases) or current Quartus Prime with legacy device support enabled. Quartus II handles synthesis, place-and-route, timing analysis, configuration bitstream generation (.sof/.pof), and device programming via JTAG or Active Serial configuration. Designers should install the legacy device library to ensure device support during migration to modern Quartus Prime.
Where to download the EP2SGX90FF1508C5 datasheet PDF?
The EP2SGX90FF1508C5 datasheet is available as part of the Stratix II GX Device Handbook, hosted on the Intel/Altera support site. The handbook covers architecture, transceiver configuration, pin tables, and package mechanical drawings. The Altera legacy document archive (Altera Literature) also hosts the original Stratix II GX handbook PDF for download.
Where to find the EP2SGX90FF1508C5 pinout?
The full 1508-ball pinout for the EP2SGX90FF1508C5 is published in the Stratix II GX Device Handbook, Volume 1 (pin tables by package). The pinout specifies transceiver channel assignments, clock input pins, configuration pins, and user I/O bank layouts. Quartus II's Pin Planner tool also visualizes the package pinout once the device is selected in the project.
What is the operating temperature range of the EP2SGX90FF1508C5?
The EP2SGX90FF1508C5 'C5' version is rated for commercial temperature range, 0 Β°C to +85 Β°C junction temperature, as marked by the 'C' character in the ordering code. Industrial (-40 Β°C to +100 Β°C) variants of the Stratix II GX family exist with an 'I' prefix in the temperature field; confirm the operating envelope against the device handbook before deploying in non-controlled environments.
What package does the EP2SGX90FF1508C5 use?
The EP2SGX90FF1508C5 uses a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package, designated 'FF1508' in the part number. The flip-chip construction reduces lead inductance and supports multi-gigabit transceiver signal integrity, but it requires microvia or laser-drilled via PCB technology for reliable assembly. PCB land-pattern dimensions are documented in the Stratix II GX Device Handbook's package specifications.
What is the best XAIPART cross-reference alternative for the EP2SGX90FF1508C5?
The best XAIPART cross-reference is the EP2SGX90FF1508C4N, which is the same die in the same 1508-ball FC-FBGA package with a slower speed grade. It is fully pin-compatible and bitstream-compatible at the boundary-scan level, though timing closure will need re-verification because C4 is slower than C5. For absolute pin compatibility with the same speed grade, request a same-package FF1508C5 variant through the XAIPART quoting channel.

Engineering reference data for EP2SGX90FF1508C5 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2SGX90FF1508C5 when you need a high-density FPGA (90,960 LE) with integrated multi-gigabit transceivers up to 3.125 Gbps in a flip-chip FC-FBGA-1508 package, and your design can tolerate commercial temperature (0 Β°C to +85 Β°C) and is committed to the Quartus II toolchain. Choose the EP2SGX90EF1508C5 as a same-package same-spec alternative when the FF variant is out of stock. Choose the EP2SGX90FF1508C4N for less timing-critical designs where the C4 speed grade is sufficient and cost reduction is important. For new designs where Stratix II GX is in NRND, consider migrating to Stratix IV GX (EP4SGX230) or newer families. Avoid the EP2S90F1508C5N unless you have an explicit requirement for a non-GX (no-transceiver) Stratix II part in the same footprint.

Comparison with Alternatives

Parameter This Product EP2SGX90FF1508C4N EP2SGX90FF1508C4ES EP2SGX90EF1508C5 EP2SGX90FF1508C3N EP2S90F1508C5N
Brand Intel Intel Intel Intel Intel Intel
Package 1508-ball FC-FBGA (FF1508) 1508-ball FC-FBGA (FF1508) - same 1508-ball FC-FBGA (FF1508) - same 1508-ball FC-FBGA (FF1508) - same 1508-ball FC-FBGA (FF1508) - same 1508-ball FC-FBGA (F1508) - same footprint, non-GX
Logic Elements 90,960 90,960 90,960 90,960 90,960 90,960
Speed Grade C5 C4 (slower) C4 (slower, ES) C5 (same) C3 (slowest) C5 (same, non-GX)
Embedded Transceivers Yes (multi-gigabit, up to 3.125 Gbps) Yes (multi-gigabit, up to 3.125 Gbps) Yes (multi-gigabit, up to 3.125 Gbps) Yes (multi-gigabit, up to 3.125 Gbps) Yes (multi-gigabit, up to 3.125 Gbps) No (Stratix II, no MGT)
Core Voltage (VCCINT) 1.15 V to 1.25 V (1.2 V nominal) 1.15 V to 1.25 V (1.2 V nominal) 1.15 V to 1.25 V (1.2 V nominal) 1.15 V to 1.25 V (1.2 V nominal) 1.15 V to 1.25 V (1.2 V nominal) 1.15 V to 1.25 V (1.2 V nominal)
Operating Temperature 0 Β°C to +85 Β°C (Commercial) 0 Β°C to +85 Β°C (Commercial) 0 Β°C to +85 Β°C (Commercial, ES) 0 Β°C to +85 Β°C (Commercial) 0 Β°C to +85 Β°C (Commercial) 0 Β°C to +85 Β°C (Commercial)

Key Differentiators

  • Highest speed grade in the FF1508 commercial-temperature family (vs EP2SGX90FF1508C4N)
  • Integrated multi-gigabit transceivers (vs EP2S90F1508C5N)
  • Same 1508-ball footprint for design reuse (vs EP2SGX130GF1508C5)

Design Notes

The FC-FBGA-1508 package uses flip-chip construction, which requires microvia or laser-drilled via technology and tightly controlled trace impedance on transceiver channels. PCB land pattern, ball pitch, and stackup recommendations are documented in the Stratix II GX Device Handbook. Use a 1 oz copper outer layer with low-loss dielectric (e.g., Megtron 6) and follow Intel's reference stackup for 3.125 Gbps channels. Estimated: stackup loss should be characterized up to the Nyquist frequency of the highest data rate plus margin for crosstalk.

Although the 90 nm Stratix II GX process is mature, sustained utilization of all 90,960 logic elements plus transceivers at full data rate can push junction temperatures toward the commercial 85 Β°C limit. Use the FPGA's on-die temperature-sensing diode (TSD) with an external sensor to monitor junction temperature in production. Estimated: typical core power is in the 5-10 W range at moderate toggle rates; configure the FPGA to use lower-power modes (e.g., disabling unused LABs) where the design allows. Mount a thermal via array under the package's exposed die region to conduct heat to inner copper planes.

Do not assume the EP2SGX90FF1508C5 and the EF1508 package variant (e.g., EP2SGX90EF1508C5) are bitstream-compatible across the entire configuration chain - they share the die but may have different power-up sequencing and configuration pin behavior. Use Quartus II's device migration checker to confirm bitstream compatibility before substituting across package types. Configuration modes (Passive Serial, Fast Passive Parallel, Active Serial) are selected via MSEL pins - verify MSEL resistor values against the handbook before board bring-up.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data for the EP2SGX90FF1508C5 was not in the verified web data. The 90 nm Stratix II GX family was introduced in 2005; many variants ship in lead-free, RoHS-compliant packages, but specific compliance must be confirmed against the manufacturer's lot-specific declaration. AEC-Q100 is not applicable because this is a commercial/industrial-grade programmable logic device, not an automotive-qualified IC.

Data verified on: 2026-09-09 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera Stratix II GX EP2SGX90FF1508C5 EP2SGX90FF1508C4N EP2SGX90EF1508C5 FPGA Field-Programmable Gate Array Programmable Logic Device PLD Logic Array Block LAB Adaptive Logic Module ALM Multi-Gigabit Transceiver MGT FC-FBGA flip-chip BGA PCI Express Serial RapidIO XAUI Quartus II Quartus Prime RoHS AEC-Q100
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