EP2SGX90FF1508C5 - 90K LE Stratix II GX FPGA 1.2V FC-FBGA-1508
MPN: EP2SGX90FF1508C5 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1350 | $1,350,000.00 |
EP2SGX90FF1508C5 Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor belonging to the programmable logic device family, sitting hierarchically between ASICs (Application-Specific Integrated Circuits) and general-purpose processors in the embedded IC taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). FPGAs integrate configurable logic blocks, programmable interconnect, dedicated hard IP (memory controllers, transceivers, DSP blocks), and I/O cells on a single die. The Stratix II GX family specifically targets high-speed serial connectivity by embedding multi-gigabit transceivers alongside logic fabric, replacing multi-chip FPGA + PHY designs with a single component.
Key features of the EP2SGX90FF1508C5 include 4,548 LABs (logic array blocks), 650 user I/Os, embedded transceivers supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, and on-chip memory suitable for packet buffering. The flip-chip FC-FBGA-1508 package provides a high pin count and short die-to-package interconnect for signal-integrity-critical serial links at multi-gigabit data rates.
Architecturally, the Stratix II GX uses an ALM (Adaptive Logic Module) based logic fabric combined with TriMatrix embedded memory blocks and DSP blocks, with dedicated PMA (Physical Medium Attachment) and PCS (Physical Coding Sublayer) hard IP per transceiver channel. Designers configure the device using the Quartus II design suite, which has been the de-facto toolchain for this generation of Intel/Altera FPGAs.
Typical applications include high-end communication line cards, multi-gigabit serial backplanes, base-station signal processing, test and measurement equipment with high-speed serial I/O, and protocol bridging cards. The integration of transceivers, memory, and 90K logic elements in one package makes it well suited to system-level designs that previously required a discrete PHY plus a separate FPGA.
When designing with the EP2SGX90FF1508C5, use Quartus II (legacy) or Quartus Prime for synthesis, place-and-route, and timing closure. Pay close attention to the FC-FBGA-1508 PCB land pattern, which requires microvia or laser-drilled via technology and tightly controlled trace impedance on transceiver channels. The commercial speed grade (C5) is the most widely available bin; review Altera's device handbook for transceiver channel-placement rules to avoid signal-integrity issues.
This page synthesizes distributor inventory, drop-in compatible same-package alternatives from the same Stratix II GX family, and practical Quartus-based design notes that complement the official datasheet.
Drop-in alternatives for EP2SGX90FF1508C5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF1508C5 (same form factor and footprint) β differing in Speed Grade, Package, Operating Temperature, RoHS Status, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90FF1508C4N
β Drop-Inβ In Stock
$1500 / Unit
View Datasheet βEP2SGX90FF1508C4ES
β Drop-Inβ In Stock
$1095 / Unit
View Datasheet βEP2SGX90FF1508C4
β Drop-Inβ In Stock
$1390 / Unit
View Datasheet βEP2SGX90EF1508C5
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2SGX90FF1508C3N
β Drop-Inβ In Stock
$1295 / Unit
View Datasheet βEP2S90F1508C5N
β Drop-Inβ In Stock
$3780 / Unit
View Datasheet βEP2SGX90FF1508C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) | 4,548 |
| Embedded Memory Bits | 4,520,448 |
| Maximum User I/Os | 650 |
| Transceivers | Embedded multi-gigabit transceivers (MGT) |
| Process Technology | 90 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) |
| Maximum Internal Performance | 609.76 MHz |
| Operating Temperature | 0 Β°C to +85 Β°C (Commercial) |
| Package | 1508-ball FC-FBGA (flip-chip) |
| Mounting Type | Surface Mount |
| Speed Grade | C5 |
| Configuration Method | Quartus II / Quartus Prime |
EP2SGX90FF1508C5 1508-ball fc-fbga (flip-chip) Pin Configuration Guide
Pin configuration for EP2SGX90FF1508C5 (1508-ball fc-fbga (flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90FF1508C5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90FF1508C5 is suitable for 6 applications: High-Speed Serial Line Cards, Wireless Base Station Baseband Processing, Test & Measurement Equipment with Multi-Gigabit I/O, Network Protocol Bridging & Aggregation, High-Performance Computing Fabric Interfaces, Medical Imaging & Diagnostic Systems.
High-Speed Serial Line Cards
The EP2SGX90FF1508C5 is well suited to high-speed serial line cards in communication equipment because its integrated multi-gigabit transceivers (MGTs) support up to 3.125 Gbps per channel, enabling protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without an external PHY. The 90,960 logic elements and 4,520,448 bits of embedded memory allow line-card designers to implement packet processing, queuing, and traffic-management logic alongside the SERDES, collapsing multi-chip PHY+FPGA designs into a single device. In a typical line card, the FPGA is placed on the fabric interface between the network processor and the backplane, with 4 to 12 transceiver channels routed to the backplane connectors with controlled-impedance differential pairs. Compared with a discrete PHY + small FPGA partition, this single-chip approach reduces BOM, simplifies power sequencing, and frees PCB area for the rest of the system. The FC-FBGA-1508 package's flip-chip interconnect provides the short, matched-length die-to-ball paths required for multi-gigabit signal integrity, especially important when channels run above 2.5 Gbps.
Recommended
Wireless Base Station Baseband Processing
The 90,960 logic elements and dedicated DSP blocks in the EP2SGX90FF1508C5 provide the DSP throughput required for baseband signal processing in wireless base stations, including channelization, modulation/demodulation, and FEC (Viterbi/Turbo) decoding. The 4,520,448 bits of embedded memory act as a fast on-chip buffer for symbol-level data, reducing pressure on external DDR memory. In a typical base-station board, the Stratix II GX is paired with RF front-end ICs and a network processor, handling PHY-layer functions while the network processor manages MAC and higher layers. The integrated transceivers interface directly to CPRI or OBSAI links between the baseband unit and remote radio heads, eliminating the need for a separate SERDES chip. Designers should use Quartus II's DSP Builder to accelerate filter and FFT implementation, and review the Stratix II GX handbook's transceiver channel-placement rules to maintain signal integrity on CPRI links at 1.228 Gbps and 2.457 Gbps.
Recommended
Test & Measurement Equipment with Multi-Gigabit I/O
Test and measurement platforms benefit from the EP2SGX90FF1508C5's combination of high logic density and integrated multi-gigabit transceivers, enabling the FPGA to act as a pattern generator, BERT (bit-error-rate tester), or protocol analyzer backend. Designers can implement custom serial protocol decoders, deep packet capture buffers, and stimulus engines all in one device. The 650 user I/Os support parallel data acquisition paths, while the MGTs handle standard serial test interfaces such as SATA, XAUI, and PCI Express for cross-domain testing. The 1.2V core at 609.76 MHz internal performance gives sufficient timing margin for the high-speed state machines used in protocol analyzers, and the FC-FBGA-1508 package accommodates the dense multi-channel BGA required for high pin-count test fixtures. The 90nm process node is well understood and supported in the established Quartus II toolchain, simplifying timing closure for T&M designs.
Recommended
Network Protocol Bridging & Aggregation
Protocol bridging and aggregation appliances rely on the EP2SGX90FF1508C5 to terminate multiple serial protocols on one side and present a unified interface (often Ethernet or PCI Express) on the other. The device's transceivers support the heterogeneous mix of protocols commonly seen in service-provider aggregation equipment: XAUI, Serial RapidIO, OC-48, and Gigabit Ethernet. With 90,960 logic elements, the FPGA can implement wire-speed lookup tables, policing, and shaping functions, while the 4.5 Mbit of embedded memory serves as a high-speed packet buffer between the bridging paths. In practice, the FPGA sits between the line interface and the aggregation switch ASIC, offloading protocol translation in hardware rather than consuming CPU cycles. Designers should plan the channel placement early and use the Stratix II GX handbook's channel-bonding and clock-network guidelines to keep multi-protocol skew within budget.
Recommended
High-Performance Computing Fabric Interfaces
The EP2SGX90FF1508C5 is a strong choice for high-performance computing (HPC) fabric interfaces where it acts as a co-processor or fabric bridge, leveraging its 90,960 logic elements for low-latency messaging and its embedded transceivers for high-bandwidth serial fabric links such as Serial RapidIO or proprietary HPC fabrics. The 4.5 Mbit of embedded memory supports low-latency message queues, while the 650 user I/Os are useful for parallel accelerator interfaces. In a typical HPC node, the FPGA sits between the host CPU and the compute fabric, offloading data movement and protocol-stack processing from the host. The 1.2V core at 609.76 MHz internal clock supports the tight timing windows required for HPC message-passing, and the FC-FBGA-1508 package's flip-chip interconnect provides the high signal-integrity channels needed at multi-gigabit fabric rates. Quartus II's TimeQuest timing analyzer is recommended for closing timing on HPC fabric paths.
Recommended
Medical Imaging & Diagnostic Systems
Medical imaging systems such as ultrasound scanners, CT machines, and digital X-ray detectors use the EP2SGX90FF1508C5 to process high-bandwidth image data streams in real time, thanks to its combination of 90,960 logic elements, dedicated DSP blocks, and high-speed transceivers for camera-link or proprietary imaging interfaces. The 4,520,448 bits of embedded memory hold scan-line buffers and image-processing windows, allowing real-time filtering, beamforming, and image reconstruction in hardware. In an ultrasound system, the FPGA connects to transducer arrays via high-speed ADCs and performs beamforming, demodulation, and envelope detection before passing data to the host for display. The integrated transceivers enable high-speed image transfer to the host over standard serial protocols. The 90nm process and well-characterized Quartus II toolchain give the predictable timing closure medical systems require, and the FC-FBGA-1508 package supports the dense multi-channel BGA needed for parallel ADC interfaces.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF1508C5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF1508C4N | EP2SGX90FF1508C4ES | EP2SGX90EF1508C5 | EP2SGX90FF1508C3N | EP2S90F1508C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-ball FC-FBGA (FF1508) | 1508-ball FC-FBGA (FF1508) - same | 1508-ball FC-FBGA (FF1508) - same | 1508-ball FC-FBGA (FF1508) - same | 1508-ball FC-FBGA (FF1508) - same | 1508-ball FC-FBGA (F1508) - same footprint, non-GX |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Speed Grade | C5 | C4 (slower) | C4 (slower, ES) | C5 (same) | C3 (slowest) | C5 (same, non-GX) |
| Embedded Transceivers | Yes (multi-gigabit, up to 3.125 Gbps) | Yes (multi-gigabit, up to 3.125 Gbps) | Yes (multi-gigabit, up to 3.125 Gbps) | Yes (multi-gigabit, up to 3.125 Gbps) | Yes (multi-gigabit, up to 3.125 Gbps) | No (Stratix II, no MGT) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | 1.15 V to 1.25 V (1.2 V nominal) | 1.15 V to 1.25 V (1.2 V nominal) | 1.15 V to 1.25 V (1.2 V nominal) | 1.15 V to 1.25 V (1.2 V nominal) | 1.15 V to 1.25 V (1.2 V nominal) |
| Operating Temperature | 0 Β°C to +85 Β°C (Commercial) | 0 Β°C to +85 Β°C (Commercial) | 0 Β°C to +85 Β°C (Commercial, ES) | 0 Β°C to +85 Β°C (Commercial) | 0 Β°C to +85 Β°C (Commercial) | 0 Β°C to +85 Β°C (Commercial) |
Key Differentiators
- Highest speed grade in the FF1508 commercial-temperature family (vs EP2SGX90FF1508C4N)
- Integrated multi-gigabit transceivers (vs EP2S90F1508C5N)
- Same 1508-ball footprint for design reuse (vs EP2SGX130GF1508C5)
Design Notes
The FC-FBGA-1508 package uses flip-chip construction, which requires microvia or laser-drilled via technology and tightly controlled trace impedance on transceiver channels. PCB land pattern, ball pitch, and stackup recommendations are documented in the Stratix II GX Device Handbook. Use a 1 oz copper outer layer with low-loss dielectric (e.g., Megtron 6) and follow Intel's reference stackup for 3.125 Gbps channels. Estimated: stackup loss should be characterized up to the Nyquist frequency of the highest data rate plus margin for crosstalk.
Although the 90 nm Stratix II GX process is mature, sustained utilization of all 90,960 logic elements plus transceivers at full data rate can push junction temperatures toward the commercial 85 Β°C limit. Use the FPGA's on-die temperature-sensing diode (TSD) with an external sensor to monitor junction temperature in production. Estimated: typical core power is in the 5-10 W range at moderate toggle rates; configure the FPGA to use lower-power modes (e.g., disabling unused LABs) where the design allows. Mount a thermal via array under the package's exposed die region to conduct heat to inner copper planes.
Do not assume the EP2SGX90FF1508C5 and the EF1508 package variant (e.g., EP2SGX90EF1508C5) are bitstream-compatible across the entire configuration chain - they share the die but may have different power-up sequencing and configuration pin behavior. Use Quartus II's device migration checker to confirm bitstream compatibility before substituting across package types. Configuration modes (Passive Serial, Fast Passive Parallel, Active Serial) are selected via MSEL pins - verify MSEL resistor values against the handbook before board bring-up.
Compliance Information
Compliance data for the EP2SGX90FF1508C5 was not in the verified web data. The 90 nm Stratix II GX family was introduced in 2005; many variants ship in lead-free, RoHS-compliant packages, but specific compliance must be confirmed against the manufacturer's lot-specific declaration. AEC-Q100 is not applicable because this is a commercial/industrial-grade programmable logic device, not an automotive-qualified IC.