EP3C120F780C8N - Cyclone III FPGA, 119K Logic | Intel
MPN: EP3C120F780C8N β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3C120F780C8N Overview
An FPGA is a semiconductor device containing programmable logic blocks, programmable interconnects, memory resources, and I/O cells. Engineers configure these resources after PCB assembly to implement combinational logic, sequential state machines, communications interfaces, processors, and application-specific accelerators. In the hierarchy of programmable devices, an FPGA sits below application-specific integrated circuits in flexibility but above fixed-function controllers in implementation speed and density. Cyclone III extends this model with a power-conscious architecture for cost-sensitive applications.
The headline density of 119,088 logic elements supports larger state machines, parallel datapaths, and multiple interface functions in one programmable device. A total of 3,981,312 embedded-memory bits provides distributed or block-oriented storage for FIFOs, buffers, lookup tables, and packet processing. The device also exposes 531 user I/O pins, enabling broad connectivity in systems that aggregate memory buses, communications links, sensors, or control peripherals. Its 780-ball FBGA package uses a 1 mm pitch and occupies approximately 23 mm by 23 mm with a 2.60 mm height.
The Cyclone III architecture combines programmable logic fabric with embedded memory and configurable I/O structures. Configuration data defines both logic behavior and routing, allowing the same physical component to serve different functions through a new bitstream. The 1.2 V operating point is central to power estimation, regulator selection, signal integrity, and thermal design. A design should not use either published frequency value as an unconditional system-clock guarantee; timing closure depends on the implemented logic, constraints, I/O standards, placement, routing, and selected speed grade.
Typical systems include industrial control and automation equipment, communications infrastructure, video and image processing, test and measurement hardware, and embedded controllers. The logic density is useful when a design must integrate many parallel functions without an ASIC development cycle. Broad I/O availability also suits boards that bridge processor buses, external memory, converters, and high-speed peripheral interfaces.
Before layout, verify the exact ball map, supported I/O standards, configuration scheme, power requirements, and timing limits in the manufacturer documentation. Decoupling, continuous core-power planes, clock distribution, signal-return paths, and configuration-interface integrity directly affect operation. The published frequency figures describe device capability but do not replace static timing analysis.
This data consolidates verified distributor specifications, package information, inventory and ordering evidence, practical architecture context, and a drop-in comparison. Because the supplied cross-reference search returned no verified pin-compatible substitutes, no alternative is asserted as a drop-in replacement without package, pinout, density, voltage, and timing evidence.
Drop-in alternatives for EP3C120F780C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C120F780C8N (same form factor and footprint) β differing in Package, Process Technology, Speed Grade, Operating Temperature, Configuration Modes.
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| Device Type | Field Programmable Gate Array (FPGA) |
| Family | Cyclone III |
| Logic Elements | 119088 |
| User I/O Count | 531 |
| Embedded Memory | 3981312 bit |
| Operating Supply Voltage | 1.2 V |
| Maximum Internal Frequency | 402 MHz |
| Alternate Listed Internal Frequency | 472 MHz |
| Package Type | FBGA-780 |
| Package Dimensions | 23 mm x 23 mm |
| Package Height | 2.60 mm |
| Ball Pitch | 1 mm |
| Mounting Type | Surface Mount |
| Ordering Status | Buy now, ships today |
EP3C120F780C8N 2.60 mm Pin Configuration Guide
Pin configuration for EP3C120F780C8N (2.60 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C120F780C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C120F780C8N is suitable for 6 applications: Industrial Control and Automation, Communications and Interface Aggregation, Test and Measurement Equipment, Video and Image Processing, Embedded Controller and Peripheral Bridge, High-Density Digital Signal Processing.
Industrial Control and Automation
EP3C120F780C8N fits industrial control and automation systems that need configurable state machines, parallel logic, and many external connections. Its 119,088 logic elements can coordinate sensor processing, actuator control, safety sequencing, and real-time protocol handling without forcing the system into a fixed-function controller. The 531 user I/O pins are valuable when a board aggregates encoders, digital inputs, analog-to-digital or digital-to-analog converters, motor-control signals, and industrial network interfaces. The FPGA operates from a verified 1.2 V supply, so the power tree must provide accurate low-voltage regulation and local decoupling. Configuration, clock distribution, and I/O integrity are especially important in factory environments where long traces, ground noise, and process variation can affect timing. A Cyclone III design also lets engineers update control algorithms and interface mappings through configuration changes, supporting equipment revisions and field upgrades without a new PCB. The design should be validated with industrial temperature and reliability requirements from the complete manufacturer documentation.
Recommended
Communications and Interface Aggregation
EP3C120F780C8N is well suited to communications equipment that combines packet handling, protocol conversion, clock-domain crossing, and physical-layer control. Its 119,088 logic elements provide capacity for parallel datapaths, FIFOs, framing, error detection, and control logic, while 3,981,312 embedded-memory bits support buffering and traffic management. The 531 user I/O pins allow a single device to interface with processors, memory, serializer or deserializer components, Ethernet control paths, and management peripherals. A 1.2 V core supply supports a low-voltage power architecture, but the exact supported I/O standards and voltage levels must be confirmed from the device documentation. Board design should control clock jitter, differential-pair geometry, return paths, and power-supply noise. Timing analysis should be performed on every implemented interface because the source-listed 402 MHz and 472 MHz figures are device capability indicators, not automatic guarantees for user logic. The programmable architecture also supports protocol updates and product variants without an ASIC respin.
Recommended
Test and Measurement Equipment
EP3C120F780C8N can serve as the programmable processing and control fabric in test and measurement equipment. The 119,088 logic elements are useful for instrument sequencing, data capture, trigger generation, filtering, and real-time analysis, while the 3,981,312 embedded-memory bits can buffer samples and implement FIFOs. Its 531 user I/O pins help connect converters, sensors, calibration interfaces, display controllers, and host processors. The deviceβs programmable nature allows measurement algorithms and instrument modes to change through configuration, which is valuable for configurable test platforms and product families. The 1.2 V operating supply should be implemented with a quiet regulator, low-impedance planes, and correctly placed local decoupling to protect sensitive acquisition paths. Clock and trigger signals require careful impedance control, short return paths, and isolation from noisy digital sections. The published 402 MHz and 472 MHz maximum internal frequency values support high logic capacity, but converter throughput, interface timing, and measurement accuracy must be established through system-level timing and noise analysis rather than inferred from the FPGA frequency alone.
Recommended
Video and Image Processing
EP3C120F780C8N provides useful logic density for video and image-processing platforms that need parallel pixel manipulation, frame buffering, timing generation, and interface adaptation. The 119,088 logic elements can implement synchronization, color conversion, filtering, region-of-interest processing, and control state machines. Embedded memory of 3,981,312 bits can support line buffers, lookup tables, and small FIFOs, although memory capacity and architecture must be assessed against the selected image format and frame rate. The 531 user I/O pins are helpful for connecting image sensors, display interfaces, processors, memory controllers, and high-speed transceivers or bridge devices. The 1.2 V supply supports a compact core-power design, but image-system performance depends on external memory bandwidth, I/O standards, clock jitter, and careful floor planning. High-speed pixel and control traces should use controlled impedance and continuous reference planes, with simulation used where edge rates or routing constraints demand it. Timing closure should be demonstrated for the actual video clock domains, resolutions, and processing pipeline.
Recommended
Embedded Controller and Peripheral Bridge
EP3C120F780C8N can act as a configurable bridge between a host processor, memory, and multiple peripheral subsystems. Its 119,088 logic elements support bus adaptation, address decoding, protocol conversion, DMA control, and custom peripheral functions, while 531 user I/O pins provide broad connectivity for sensors, storage, displays, and communications devices. The 3,981,312 embedded-memory bits can implement FIFOs and transaction buffers that smooth data movement between unequal clock domains. Because the verified device supply is 1.2 V, level translation and bank planning must be checked against the supported I/O standards and external interfaces; the FPGA core voltage should not be confused with every I/O voltage. The 780-ball FBGA package demands a high-density PCB and controlled assembly process. Reset, configuration, clock, and interrupt signals need defined startup sequencing and debounce behavior. A static timing analysis should cover the selected processor bus, memory timing, and peripheral protocol constraints. Programmable logic is particularly useful when the bridge must support evolving product configurations or several interface variants.
Recommended
High-Density Digital Signal Processing
EP3C120F780C8N supports digital signal-processing applications that benefit from parallel arithmetic, configurable datapaths, and hardware-timed execution. The 119,088 logic elements can host FIR or IIR filters, FFT stages, modulation or demodulation blocks, beamforming control, and adaptive algorithms. The 3,981,312 embedded-memory bits are useful for delay lines, sample buffers, coefficient storage, and small processing windows, but the design must evaluate memory bandwidth and partition large datasets into external memory when needed. With 531 user I/O pins, the FPGA can interface to converters, high-speed data sources, processors, and external memory or communications subsystems. The 1.2 V supply helps define the core power tree, while signal integrity depends on short clock routes, continuous return paths, controlled impedance, and appropriate decoupling. The 402 MHz and 472 MHz source-listed frequencies are not equivalent to a guaranteed DSP sample rate; throughput depends on arithmetic structure, data width, memory access, placement, and timing closure. A fixed or floating-point implementation should therefore be pipelined and verified with the intended sample rates before hardware release.
Recommended
Recommended Products Summary
Engineering reference data for EP3C120F780C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Intel |
| Package | FBGA-780 |
| Logic Elements | 119088 |
| User I/O Count | 531 |
| Embedded Memory | 3981312 bit |
| Operating Supply Voltage | 1.2 V |
| Listed Internal Frequency | 402 MHz to 472 MHz |
| Configuration | Cyclone III FPGA |
| Drop-in Candidate | No verified drop-in alternative identified |
Key Differentiators
- High logic density with broad I/O connectivity (vs No verified alternative candidate)
- Large verified embedded-memory resource (vs EP3C10F256C8N)
- Low-voltage Cyclone III architecture (vs No verified cross-brand equivalent)
Design Notes
The verified listing specifies a 1.2 V operating supply. Use the complete Cyclone III power documentation to determine regulator current, tolerance, sequencing, and transient requirements because FPGA consumption changes with logic utilization, clocking, memory use, configuration state, and I/O activity. Place local decoupling at the power-ball entry points, use a low-impedance ground and power distribution network, and keep noisy switching-converter loops away from the FPGA. Verify startup and brownout behavior at minimum input voltage and maximum expected load before release.
EP3C120F780C8N uses a 780-ball FBGA package with a verified 1 mm ball pitch, approximately 23 mm by 23 mm body size, and 2.60 mm height. Use the manufacturer land pattern and exact ball map rather than estimating pads from package dimensions. Plan escape routing, via-in-pad or dog-bone strategies, reference planes, fanout layers, and BGA inspection with the PCB fabricator before schematic freeze. Confirm whether selected configuration balls affect the available user I/O count and preserve access to required programming and clock connections.
The 531 user I/O pins and source-listed internal frequencies of 402 MHz and 472 MHz do not eliminate board-level signal-integrity work. Use controlled impedance for long clock, differential, and high-speed data traces, maintain continuous reference paths, minimize via transitions, and provide local return-current continuity. Keep configuration and clock signals away from noisy power and I/O regions where practical. Treat the published frequency values as source-dependent device capability figures and perform timing analysis using the actual speed grade, constraints, I/O standards, placement, and routing.
Do not compare FPGA alternatives using logic-element count alone. A drop-in claim requires the same package, ball mapping, configuration interface, supply requirements, I/O resources, embedded memory, and timing compatibility. The supplied cross-reference data did not identify a verified replacement, so any candidate that changes the FBGA-780 footprint or configuration method is a redesign-level change. Also avoid treating a distributor search result as a compliance, qualification, or guaranteed-lead-time statement. Confirm the exact ordering code, package markings, pinout, lifecycle status, and current commercial terms before production approval.
Compliance Information
The supplied verified web data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. No compliance claim is inferred from the Intel brand, FPGA category, package, or distributor listing.
