EP3C40U484C8 - Cyclone III FPGA 40K LE 484-FBGA | Intel
MPN: EP3C40U484C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $57.12 | $57.12 |
| 10 | $53.2 | $532.00 |
| 100 | $47.85 | $4,785.00 |
| 500 | $42.1 | $21,050.00 |
| 1,000 | $36.75 | $36,750.00 |
EP3C40U484C8 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic elements (LEs), embedded memory blocks, and programmable interconnect, all of which can be reconfigured by the end user after manufacturing. Within the broader semiconductor hierarchy, FPGAs sit between fixed-function ASICs (Application-Specific Integrated Circuits) and general-purpose processors, offering hardware-level parallelism and post-production flexibility. Cyclone III specifically targets volume applications requiring moderate logic density, embedded multipliers, and low power.
Standout features of the EP3C40U484C8 include 4 PLLs for clock management, 126 embedded 18x18 multipliers for DSP operations, and a commercial temperature grade (C8 speed grade denoting 8 ns core performance). The device supports common I/O standards such as LVDS, SSTL, and LVCMOS, and interfaces to external memories including DDR, DDR2, and QDRII SRAM. Configuration can be performed via JTAG, AS, or PS modes using Altera/Intel Quartus software.
Typical applications include industrial motor control, video processing, automotive infotainment subsystems, telecommunications line cards, and consumer electronics requiring custom logic integration. Its combination of low power and high logic density makes it attractive for portable and battery-powered designs where ASIC NRE cost is prohibitive.
When designing with the EP3C40U484C8, engineers should pay close attention to BGA fanout and PCB stack-up routing constraints, and verify thermal dissipation in space-limited enclosures. Quartus II / Quartus Prime provides synthesis, place-and-route, and timing analysis toolchains that fully support this device family.
This page synthesizes distributor pricing, verified drop-in alternatives, and engineering design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3C40U484C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40U484C8 (same form factor and footprint) — differing in Package, Configuration Method, Speed Grade, Family, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C40U484C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$71.04 / Unit
View Datasheet →EP3C40U484C7N
✅ Drop-In✓ In Stock
$119.4 / Unit
View Datasheet →EP3C40U484C7
✅ Drop-In✓ In Stock
$56.2 / Unit
View Datasheet →EP3C40U484C6N
✅ Drop-In✓ In Stock
$50.2 / Unit
View Datasheet →EP3C40U484C6
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EP3C40U484A7N
✅ Drop-In✓ In Stock
$21.45 / Unit
View Datasheet →EP3C40U484C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements (LE) | 39,600 |
| Total Memory Bits | 1,161,216 bits |
| Embedded Memory (M9K blocks) | 126 blocks (396 Kbits total) |
| Embedded 18x18 Multipliers | 126 |
| PLLs | 4 |
| Maximum User I/O | 331 |
| Process Node | 65 nm low-power |
| Speed Grade | C8 (8 ns core) |
| Temperature Grade | Commercial (0C to +85C) |
| Package | 484-ball FBGA (UBGA) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Contains lead / RoHS non-compliant (per micro-semiconductor listing) |
| Configuration Method | JTAG, Active Serial (AS), Passive Serial (PS) |
| Supported I/O Standards | LVDS, SSTL, LVCMOS, PCI, PCI-X |
EP3C40U484C8 484-ball fbga (ubga) Pin Configuration Guide
Pin configuration for EP3C40U484C8 (484-ball fbga (ubga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C40U484C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C40U484C8 is suitable for 7 applications: Industrial Motor Control, Video Processing and Image Pipeline, Telecommunications Line Cards, Automotive Infotainment Subsystems, Test and Measurement Instrumentation, Industrial IoT Gateways, LED Video Wall Controllers.
Industrial Motor Control
The EP3C40U484C8 is well-suited for industrial motor control, where its 39,600 logic elements and 126 embedded 18x18 multipliers can implement field-oriented control (FOC) loops, PWM generators, and encoder interfaces in parallel hardware. Its 4 PLLs provide the multiple clock domains needed to drive PWM switching frequencies up to hundreds of kHz while sampling analog feedback at a different rate. The 331 user I/Os comfortably handle multi-axis drives connecting to Hall sensors, quadrature encoders, and gate drivers. Per the Intel datasheet, the 65 nm low-power process keeps junction temperatures manageable even in enclosed IP54 cabinets. Estimated power: at 100 MHz toggle rate the core draws roughly 0.5-1 W, leaving thermal headroom for industrial environments up to +85C.
Recommended
Video Processing and Image Pipeline
The EP3C40U484C8 enables real-time video processing pipelines by leveraging its 1,161,216 bits of embedded M9K memory for line buffers and frame storage, plus 126 hardware multipliers for convolution kernels and color-space conversion. Designers commonly implement scaling, deinterlacing, and edge-detection algorithms at SDTV/HDTV resolutions. The 331 user I/Os can directly drive digital video ports such as BT.656, BT.1120, or LVDS-based DisplayPort interfaces, and the 4 PLLs synthesize pixel clocks at precise rates. Per the Intel Cyclone III Device Handbook, the C8 speed grade supports 8 ns core timing, which is ample for 1080p60 processing pipelines.
Recommended
Telecommunications Line Cards
In telecommunications line cards, the EP3C40U484C8 implements serial protocol bridging, packet classification, and traffic shaping functions. Its 39,600 LEs support multiple soft-core processors such as Nios II/e for control-plane tasks, while 126 hardware 18x18 multipliers accelerate Reed-Solomon and CRC error-correction paths. The 331 user I/Os connect directly to LVDS-based backplanes, TDM buses, and SERDES interfaces through external transceivers. Per the Cyclone III datasheet, the device supports SSTL and HSTL I/O standards required for interfacing to DDR and QDRII SRAM buffers commonly used in telecom queues.
Recommended
Automotive Infotainment Subsystems
The EP3C40U484C8 is frequently deployed in automotive infotainment head units, where it bridges multiple display panels, touch controllers, and audio codecs. Its 39,600 LEs drive LVDS display serialization, I2S audio routing, and CAN/LIN gateway logic simultaneously. The 126 hardware multipliers handle audio DSP such as EQ and noise reduction. Per the Cyclone III datasheet, the 4 PLLs generate independent clocks for display refresh, audio sample rates, and CAN bus timing. For under-hood or cabin environments with wider temperature swings, the EP3C40U484A7N automotive-grade variant (AEC-Q100 style qualification) is preferred over the commercial-temperature EP3C40U484C8.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments benefit from the EP3C40U484C8's combination of 4 PLLs, 331 user I/Os, and 126 hardware multipliers for parallel signal processing. Designers build arbitrary waveform generators, logic analyzers, and protocol exercisers using the FPGA as a real-time data engine, with 1.16 Mbit embedded memory providing deep capture buffers. Per Intel's datasheet, the C8 speed grade allows 125 MHz state-machine operation, sufficient for most parallel digital acquisition up to 100 MSPS. The 484-ball FBGA package also supports BGA socketing for prototype iteration in lab environments.
Recommended
Industrial IoT Gateways
Industrial IoT gateways use the EP3C40U484C8 to aggregate sensor data from Modbus, Profibus, EtherCAT, and CAN fieldbuses before forwarding to Ethernet or cellular uplinks. The 39,600 LEs implement multiple soft real-time controllers (Nios II) handling each protocol stack, and the 1.16 Mbit embedded memory serves as packet buffers. Per the Intel datasheet, the LVCMOS and SSTL I/O standards support direct interfacing to RS-485 transceivers and external DDR2 memory. The 4 PLLs synthesize independent clocks for each fieldbus segment, while 331 user I/Os scale to dozens of simultaneously connected sensors.
Recommended
LED Video Wall Controllers
LED video wall controllers drive hundreds to thousands of RGB LEDs with high refresh and color depth. The EP3C40U484C8's 126 embedded 18x18 multipliers perform gamma correction and color-space conversion in real time, while its 331 user I/Os fan out to LED driver chains using LVDS or differential signaling. The 1.16 Mbit embedded memory stores lookup tables for brightness uniformity compensation across the wall. Per Intel's Cyclone III datasheet, the C8 speed grade supports pixel clock rates well beyond 150 MHz, enabling 1080p LED wall refresh with 16-bit color depth. The 484-ball FBGA package provides the routing density required for high-channel-count designs.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40U484C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40U484C8N | EP3C40U484C7N | EP3C40U484C6N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (UBGA) | 484-FBGA (UBGA) - same | 484-FBGA (UBGA) - same | 484-FBGA (UBGA) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits |
| Maximum User I/O | 331 | 331 | 331 | 331 |
| Speed Grade | C8 (fastest) | C8 | C7 (~10% slower) | C6 (~25% slower) |
| Temperature Grade | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C |
| Embedded 18x18 Multipliers | 126 | 126 | 126 | 126 |
| PLLs | 4 | 4 | 4 | 4 |
Key Differentiators
- Highest speed grade in the EP3C40 family (vs EP3C40U484C7N)
- Commercial temperature grade is sufficient for indoor industrial designs (vs EP3C40U484A7N)
- Maximum user I/O count in 484-ball FBGA class (vs EP3C40Q240C8N)
Design Notes
The EP3C40U484C8 uses a 484-ball FineLine BGA package that demands careful PCB stack-up design. Use a 4-to-6 layer board with a dedicated ground plane directly beneath the BGA, and route escape traces on the top two layers. Per JEDEC MSL-3 handling, bake the parts at 125C for 24 hours before assembly to prevent popcorn cracking. BGA pad diameter of 0.4 mm with 0.65 mm pitch is typical; verify against the Intel footprint recommendation in the Cyclone III Handbook Chapter 7.
Estimated: at typical toggle activity around 50-100 MHz the EP3C40U484C8 dissipates roughly 0.5 to 1.5 W. The 484-FBGA package has a theta_JA around 15-20 C/W with adequate PCB copper, yielding a junction-to-ambient rise under 30 C in still air. For sealed enclosures or industrial environments near +85C ambient, provide forced-air cooling or attach a small heatsink to the top of the package. Always monitor junction temperature via the built-in on-chip sensor during prototype bring-up.
For DDR/DDR2/QDRII memory interfaces, follow Intel's Cyclone III external memory interface guidelines: length-match DQ/DQS signals within +/-25 mils, use 50-ohm microstrip or stripline with 100-ohm differential for DQS pairs, and place 50-ohm termination at the FPGA end of clock lines. Per Intel application note AN465, source-synchronous interfaces benefit from PLL-based clock centering. Avoid routing memory signals across plane splits, which cause return-path discontinuities and degrade eye margins.
Do not confuse the U484 (484-ball FBGA) package with the F484 or Q240 variants - they have different pinouts despite sharing the family name. Always double-check the package designator in the part number before laying out the PCB. Also note the C8 speed grade is the fastest available; using C6 or C7 to save cost may require timing closure work. The device is RoHS non-compliant per micro-semiconductor listing - confirm RoHS requirements before shipping to EU customers.
Decoupling: place 0.1 uF ceramic capacitors as close as possible to every VCCINT, VCCA, and VCCIO pin pair. Add a few 4.7 uF to 22 uF bulk capacitors around the periphery of the BGA. Provide a low-impedance ground return by stitching vias around the BGA perimeter every 200 mils. Per Intel's Cyclone III pin connection guidelines, do not leave any VCC pin floating - unused VCC pins can still be left unconnected per the handbook but unused GND pins must all be tied to the ground plane.
Compliance Information
Per micro-semiconductor listing, EP3C40U484C8 contains lead and is RoHS non-compliant. Use EP3C40U484C8N (if available) for industrial temp range; AEC-Q100 automotive variants are designated by the 'A' suffix (e.g., EP3C40U484A7N).
