EP3C40U484C7N - Cyclone III FPGA, 39.6K LEs, 484-FBGA | Intel
MPN: EP3C40U484C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $157.16 | $157.16 |
| 10 | $148.5 | $1,485.00 |
| 100 | $138.2 | $13,820.00 |
| 500 | $128.75 | $64,375.00 |
| 1,000 | $119.4 | $119,400.00 |
EP3C40U484C7N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks (lookup tables, flip-flops), programmable interconnect, and I/O pads that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy: digital logic -> programmable logic -> FPGA -> programmable logic IC -> semiconductor. The Cyclone III family specifically targets low static and dynamic power consumption while offering high logic density for volume applications.
Key features of the EP3C40U484C7N include 39,600 logic elements, 1,161,216 total RAM bits distributed across M9K memory blocks, 4 user PLLs for clock management, 20 global clock networks, 331 user I/O pins, and 126 dedicated 18x18 hardware multipliers. It supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, and operates from a 1.2 V core supply with separate bank I/O voltages for mixed-voltage interfaces.
The Cyclone III architecture uses an SRAM-based lookup-table logic element with a 4-input LUT architecture, optimized for high logic utilization at low power. Embedded M9K memory blocks can be configured as RAM, ROM, or FIFO with true dual-port operation, and the 18x18 hardware multipliers enable DSP functions without consuming general-purpose logic. Power management features include hot-socketing, power-on reset, and programmable power modes.
Typical applications include industrial motor control and machine vision, video processing and display controllers, telecommunications line cards, automotive driver assistance (body electronics, infotainment), military/aerospace signal processing, and consumer electronics requiring custom glue logic or DSP acceleration. The 484-UBGA package supports dense PCB layouts for space-constrained systems.
When designing with this device, ensure proper decoupling of the 1.2 V core supply and each I/O bank supply. JTAG configuration via the dedicated AS or JTAG pins is required for programming; design must accommodate configuration mode selection and a valid configuration source (EPCS or JTAG). Thermal management must consider ambient temperature and total power consumption, with the U484 package having a measured theta-JA around 20 C/W.
This page synthesizes distributor pricing, drop-in alternatives across the Cyclone III family, and practical design notes not found in the manufacturer datasheet alone, providing engineers a single reference for evaluation and sourcing.
Drop-in alternatives for EP3C40U484C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40U484C7N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, RoHS Status, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C40U484C7
✅ Drop-In✓ In Stock
$56.2 / Unit
View Datasheet →EP3C40U484C6N
✅ Drop-In✓ In Stock
$50.2 / Unit
View Datasheet →EP3C40U484A7N
✅ Drop-In✓ In Stock
$21.45 / Unit
View Datasheet →EP3C40F484C8N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C40F484C7N
✅ Drop-In✓ In Stock
$264 / Unit
View Datasheet →EP3C40F484I7N
✅ Drop-In✓ In Stock
$118.5 / Unit
View Datasheet →EP3C40U484C7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone® III |
| Family | Cyclone III (Low-Power FPGA) |
| Logic Elements | 39,600 |
| Total RAM Bits | 1,161,216 |
| Number of I/O | 331 (maximum user I/O) |
| Number of LABs/CLBs | 2,481 |
| Number of Logic Elements/Cells | 39,600 |
| Total Memory | 1161216 bit |
| Number of PLLs | 4 |
| Embedded Multipliers (18x18) | 126 |
| Supply Voltage - Core | 1.2 V |
| Operating Temperature | 0C to +85C (commercial) |
| Package / Case | 484-FBGA (UBGA, 19x19 mm) |
| Mounting Type | Surface Mount |
| Process Technology | 65 nm TSMC low-k |
| Configuration Method | SRAM (JTAG / Active Serial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3C40U484C7N 484-fbga (ubga, 19x19 mm) Pin Configuration Guide
Pin configuration for EP3C40U484C7N (484-fbga (ubga, 19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C40U484C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C40U484C7N is suitable for 7 applications: Industrial Motor Control and Drive, Machine Vision and Image Processing, Video Processing and Display Controllers, Telecommunications Line Cards, Automotive Infotainment and Body Electronics, Military/Aerospace Signal Processing, Custom Glue Logic and DSP Acceleration.
Industrial Motor Control and Drive
The EP3C40U484C7N fits industrial motor control applications because its 39,600 logic elements and 126 embedded 18x18 hardware multipliers provide deterministic DSP throughput for field-oriented control (FOC) algorithms. The device can implement PID loops, space-vector PWM modulators, and encoder interfaces (QEP/Resolver) in a single fabric. With 331 user I/Os, designers can connect multiple feedback channels (current shunts, Hall sensors, SSI encoders) and gate-driver PWM outputs simultaneously. The 1.2V core and 65nm low-power process keep dissipation below 1.5W typical, important for sealed industrial enclosures with limited airflow. Industrial-grade operation (0 to 85C commercial, or A7 automotive variant) is suitable for cabinet-mounted drives, while the 484-UBGA package supports dense multi-axis servo designs. Recommended companions: EP3C16Q240C8N for sub-axis controllers and AD7400 isolated sigma-delta modulators for current sensing.
Recommended
Machine Vision and Image Processing
The EP3C40U484C7N is well-matched to machine vision pipelines because its M9K memory blocks (totaling 1.16 Mbit) buffer full image lines while its 18x18 multipliers accelerate Sobel, Gaussian, and convolution kernels. A typical 640x480 8-bit grayscale pipeline requires ~3 Mbit of line buffering per stage; the device can hold multiple lines internally for high-speed processing without external SRAM. The 331 user I/Os accommodate parallel CMOS image sensor interfaces (up to 24-bit RGB) plus Gigabit Ethernet or USB 3.0 PHY connections. PCIe hard IP is not present, but soft logic can implement external PHY bridging. Designers use the 4 PLLs to derive independent pixel clocks and network clocks. Recommended companions: EP3C16F484I7N for co-processor or camera link receivers and Micron MT48LC16M16A2 SDRAM for extended buffering.
Recommended
Video Processing and Display Controllers
The EP3C40U484C7N serves video display controllers and scalers because its fabric can implement deinterlacers, color-space converters, and on-screen display (OSD) compositors while sustaining full 1080p60 throughput. Embedded M9K blocks hold scaler coefficient tables and frame buffers; 18x18 multipliers accelerate polyphase scaling operations. The 331 user I/Os include LVDS pairs for direct connection to flat-panel displays, plus parallel RGB/HDMI bridge interfaces via external transmitters. Designers rely on 20 global clock networks and 4 PLLs to manage pixel clocks, memory clocks, and SDRAM/DDR2 interfaces. Recommended companions: EP3C25F256C8N for entry-level scaler designs and TI TFP410 HDMI transmitter for DVI/HDMI output.
Recommended
Telecommunications Line Cards
The EP3C40U484C7N suits telecommunications line cards because its logic capacity handles packet classification, traffic shaping, and SERDES bridge interfaces for legacy T1/E1 or CPRI fronthaul. The 331 user I/Os provide ample bus widths for external PHY devices (e.g., quad Ethernet PHYs, TDM framer chips). Hardware multipliers support V.90, Reed-Solomon, or other FEC operations. Although Cyclone III lacks integrated transceivers, designers use external SGMII PHYs and clock-data recovery chips. The device supports hot socketing for live-insertion line cards and JTAG boundary scan for board test. Recommended companions: EP3C16F484C6N for lower-port-count cards and VSC8489 SGMII PHY.
Recommended
Automotive Infotainment and Body Electronics
The EP3C40U484C7N (or A7 automotive variant) fits automotive infotainment head units and body controllers because its logic capacity implements CAN/LIN gateways, audio routing, and rear-seat entertainment muxing. The 4 PLLs generate pixel clocks for LVDS display panels and I2S clocks for audio DACs. 18x18 multipliers accelerate audio codecs and equalizer DSP. With 331 user I/Os, designers can directly drive multiple display outputs (cluster + center stack + RSE) plus camera inputs for surround-view systems. The 484-UBGA package is thermally adequate for sealed dashboard enclosures. Recommended companions: EP3C40U484A7N (automotive temperature grade variant) and TJA1043 CAN transceiver.
Recommended
Military/Aerospace Signal Processing
The EP3C40U484C7N supports military/aerospace signal processing applications such as radar preprocessing, electronic warfare sub-banding, and avionics data acquisition. Its 39,600 LEs and 126 hardware multipliers handle FFT cores and digital down-conversion while the M9K blocks buffer incoming sample streams. The 331 user I/Os connect to multi-channel ADCs (e.g., 14-bit, 125 MSPS) and DACs. Industrial-temperature variants support the -40 to 100C range needed for military and avionics equipment. Designs targeting DO-254 compliance should consider the industrial-grade EP3C40F484I7N variant. Recommended companions: AD9254 ADC for RF sampling and EP3C25F484I7N for redundancy/channel swap.
Recommended
Custom Glue Logic and DSP Acceleration
The EP3C40U484C7N excels as a custom glue-logic replacement for CPLD-plus-DSP chip combinations in consumer and industrial products. Its 39,600 LEs integrate peripheral controllers (I2C, SPI, UART, PWM), custom bus bridges, and DSP kernels (FIR, FFT) that would otherwise require two or three discrete parts. The 126 embedded 18x18 multipliers support 5 to 10 simultaneous DSP operations at 100 MHz, sufficient for motor-control, audio-effect, and predictive-maintenance algorithms. The 4 PLLs derive independent clocks for processors, peripherals, and high-speed interfaces. Cost-sensitive designs leverage the 65 nm low-power process to keep BOM and power consumption below ASIC or MPU+FPGA alternatives. Recommended companions: STM32F4 MCU for system control and EP3C16F484C7N for sub-systems.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40U484C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40U484C7 | EP3C40U484C6N | EP3C40U484A7N | EP3C40F484C8N | EP3C40F484C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (UBGA) | 484-FBGA (UBGA) - same | 484-FBGA (UBGA) - same | 484-FBGA (UBGA) - same | 484-FBGA (FineLine BGA) - different ball layout | 484-FBGA (FineLine BGA) - different ball layout |
| Logic Elements | 39,600 | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same |
| Embedded RAM (M9K bits) | 1,161,216 | 1,161,216 - same | 1,161,216 - same | 1,161,216 - same | 1,161,216 - same | 1,161,216 - same |
| Speed Grade | C7 (commercial 7) | C7 - same | C6 - slower (-15%) | A7 (automotive temp) | C8 - slowest | C7 - same |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +125C (automotive) | 0C to +85C | 0C to +85C |
| User I/O Pins (max) | 331 | 331 - same | 331 - same | 331 - same | 331 - same | 331 - same |
| Embedded 18x18 Multipliers | 126 | 126 - same | 126 - same | 126 - same | 126 - same | 126 - same |
Key Differentiators
- Identical die and pin map with bitstream compatibility to the C6 speed grade (vs EP3C40U484C6N)
- Automotive-grade temperature option in the same U484 package (vs EP3C40U484A7N)
- UBGA vs FineLine BGA package options for thermal/pin-out flexibility (vs EP3C40F484C7N)
Design Notes
The EP3C40U484C7N core operates from a 1.2V supply; design separate analog PLL supplies (VCCA_PLL) at 2.5V per Cyclone III hardware guidelines. Use a 4-layer PCB with dedicated power and ground planes. Estimated: at 50% utilization and 100 MHz core clock, total power reaches approximately 1.2 to 1.5W; the 484-UBGA package has a measured theta-JA near 20 C/W, yielding roughly 24 to 30C temperature rise over ambient without forced airflow. Add bulk ceramic decoupling (10uF X5R per supply pin group) plus 0.1uF and 0.01uF HF caps within 5 mm of each supply ball.
The 484-ball UBGA uses 1.0 mm pitch and a 19x19 mm body, requiring microvia or via-in-pad PCB technology for inner-row balls. Maintain continuous ground and power planes under the device to provide a low-impedance return path and to keep impedance-controlled traces (LVDS, DDR2) referenced properly. Use 50 ohm SE / 100 ohm differential trace geometry and length-match pairs within 150 mil for LVDS receivers. Recommended: assign ball fanout via the Cyclone III Device Family Pin Connection Guidelines (CII51016) before schematic capture.
Cyclone III I/O banks support LVDS, LVCMOS, SSTL, and HSTL standards; configure bank voltage and reference voltage per Cyclone III handbook. Series on-die termination (Rs OCT) supports 25 ohm and 50 ohm settings, eliminating external resistors for most SDRAM and memory interfaces. For DDR2 SDRAM up to 200 MHz, use Cyclone III external memory interface IP and tune read/write timing in the Quartus TimeQuest analyzer. Maintain 0.5 mm minimum trace-to-trace spacing on 50 ohm SE lines; route differential pairs with 100 ohm differential impedance and constant intra-pair skew less than 20 ps.
Configuration mode (AS / PS / JTAG) selection pins MSEL0/1/2 must be set to valid logic levels (00, 01, 10, or 11) before power-up; leaving them floating can cause configuration failure. Cyclone III is configured from SRAM, so bitstream must be reloaded on each power cycle from a non-volatile configuration source (EPCS device) or JTAG. Do not exceed the 4.6V absolute maximum on any I/O pin. Hot socketing is supported but only when the device is unconfigured; configure nCONFIG low during insertion if the system might see voltage transitions during hot-plug events.
Compliance Information
RoHS and REACH compliance per Cyclone III product page. The C7 speed grade is commercial temperature; AEC-Q100 grade requires the A7 speed grade variant EP3C40U484A7N.
