EP3C40U484A7N - Cyclone III FPGA 39.6K LE | Intel | Automotive
MPN: EP3C40U484A7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $25.1 | $12,550.00 |
| 1,000 | $21.45 | $21,450.00 |
EP3C40U484A7N Overview
A Cyclone III FPGA is a reprogrammable semiconductor device based on an SRAM lookup-table architecture that allows engineers to implement arbitrary digital logic, DSP functions, memory controllers, and high-speed serial/parallel interfaces after PCB fabrication. The Cyclone III family is positioned in Intel's low-end FPGA portfolio, bridging the gap between fixed-logic ASICs and higher-density FPGAs such as Cyclone IV, Cyclone V, and Stratix families. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital IC hierarchy.
Key features include 39,600 logic elements, 126 embedded multipliers (18x18), 4 general-purpose PLLs, 1.161 Mbits of embedded memory, and support for external memory interfaces including DDR, DDR2, SDRAM, and QDRII SRAM. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Configuration can be carried out via passive serial (PS), fast passive parallel (FPP), or JTAG, supporting in-system reprogrammability through Altera/Intel Quartus design software.
From an architectural standpoint, Cyclone III devices use a logic-element fabric built around 4-input LUTs and dedicated carry chains, with embedded memory blocks distributed throughout the array. The 65 nm process delivers substantially lower static power than the prior Cyclone II generation while preserving deterministic timing closure. Each PLL provides up to nine output taps with independent frequency synthesis, useful for clock domain management across heterogeneous interfaces.
Typical applications include automotive driver-assistance and infotainment pre-processing, industrial motor control, video surveillance and image processing, software-defined radio front ends, and portable test instrumentation. The UFBGA-484 package supports high I/O count designs while maintaining a compact board footprint suitable for space-constrained modules. The combination of logic density, embedded memory, and DSP blocks makes the EP3C40 suitable for mid-complexity digital signal pipelines.
When designing with this device, plan I/O bank assignments carefully because the LVDS pairs and PLL clock inputs have fixed pin locations in the UFBGA package. Decoupling capacitance and PCB stack-up directly impact the integrity of DDR memory interfaces; consult the Cyclone III device handbook for board-design guidelines. Quartus Prime or Quartus II design software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design considerations not found in the standalone datasheet, giving engineers a faster path to sourcing and integrating the EP3C40U484A7N into production designs.
Drop-in alternatives for EP3C40U484A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40U484A7N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C40F484C7N
✅ Drop-In✓ In Stock
$264 / Unit
View Datasheet →EP3C40F484C8N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C40F484I7N
✅ Drop-In✓ In Stock
$118.5 / Unit
View Datasheet →EP3C40F484C6N
✅ Drop-In✓ In Stock
$312.4 / Unit
View Datasheet →EP3C40Q240C8N
✅ Drop-In✓ In Stock
$64.8 / Unit
View Datasheet →EP3C40U484A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements | 39,600 |
| Embedded Memory | 1,161,216 bits |
| Embedded Multipliers (18x18) | 126 |
| PLLs | 4 |
| Maximum User I/O Pins | 331 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Maximum Operating Frequency | 437.5 MHz |
| Package | 484-ball UFBGA |
| Operating Temperature Grade | Automotive |
| Configuration Method | PS / FPP / JTAG |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| External Memory Interface | DDR, DDR2, SDRAM, QDRII SRAM |
| RoHS Status | Compliant |
EP3C40U484A7N 484-ball ufbga Pin Configuration Guide
Pin configuration for EP3C40U484A7N (484-ball ufbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C40U484A7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C40U484A7N is suitable for 6 applications: Automotive Driver Assistance Pre-Processing, Industrial Motor Control and Servo Drive, Video Surveillance and Image Processing, Software Defined Radio Front-End, Portable Test and Measurement Instrumentation, LED Video Wall Display Controllers.
Automotive Driver Assistance Pre-Processing
The EP3C40U484A7N's 39,600 logic elements and 126 18x18 multipliers support real-time pre-processing pipelines for ADAS camera and radar front ends. Its automotive temperature grade (-40 C to +125 C junction) makes it acceptable for cabin-mounted ECU locations where ambient temperatures fluctuate widely. The 331 available user I/O pins accommodate parallel image sensor interfaces, while the 4 PLLs generate independent clock domains for the sensor, memory controller, and Automotive Ethernet MAC. The 65 nm Cyclone III static power envelope is well-suited to always-on automotive sub-systems. Engineers typically pair the EP3C40 with DDR2 memory and an LVDS bridge to ASIC SoCs for object-detection pipelines.
Recommended
Industrial Motor Control and Servo Drive
The EP3C40U484A7N is well suited to industrial servo drive control loops where deterministic latency and high I/O count are mandatory. Its 4 PLLs synchronize the PWM generator, encoder interface, and field-oriented control (FOC) math block at independent frequencies. The 126 embedded 18x18 multipliers execute Park/Clarke transforms and PID loops in single-cycle latency, replacing discrete DSPs in mid-power drives. Industrial designers take advantage of the device's DDR2 memory controller to buffer waveform captures and fault logs. The automotive temperature grade supplies extra thermal margin in enclosed motor-control cabinets where ambient temperatures regularly exceed 70 C.
Recommended
Video Surveillance and Image Processing
The EP3C40U484A7N's 1.161 Mbits of embedded memory and 331 user I/O pins make it a cost-effective platform for multi-channel video surveillance pre-processing. Designers implement motion-detection, edge-detection, and de-interlacing algorithms using the 126 hardware multipliers, offloading the host CPU. LVDS I/O standards enable direct connection to CMOS image sensors without external bridge chips, reducing BOM cost. The Cyclone III fabric runs H.264 baseline encoding at CIF resolution, and the DDR2 controller streams buffered frames to external storage. The automotive temperature grade is an asset for outdoor PoE camera housings in harsh environments.
Recommended
Software Defined Radio Front-End
The EP3C40U484A7N implements DDC/DUC and digital down-conversion for software-defined radio receivers in the HF/VHF range. The 126 embedded multipliers deliver 18x18 MAC throughput adequate for 4-channel narrow-band demodulation, while the 4 PLLs synthesize the ADC sampling clock, DAC interpolation clock, and baseband processing clock from a single reference oscillator. LVDS pairs interface cleanly with high-speed ADCs such as the AD9649 family. The device's 1.2 V core voltage reduces power consumption in portable SDR manpack radios where battery life is critical.
Recommended
Portable Test and Measurement Instrumentation
The EP3C40U484A7N is used as the main digital engine in mid-range bench-top instruments such as logic analyzers, arbitrary waveform generators, and protocol analyzers. Its 39,600 logic elements implement pattern generation, protocol decoding (I2C/SPI/UART/CAN), and trigger logic without an external controller. The 1.161 Mbits of embedded memory buffer sample records, while the DDR2 controller extends capture depth for high-channel-count logic analysis. The automotive temperature grade supports lab and field environments. Engineers benefit from Quartus II's SOPC Builder to integrate a Nios II soft-core CPU for instrument control and user-interface rendering.
Recommended
LED Video Wall Display Controllers
The EP3C40U484A7N drives LED video wall controllers in commercial signage, stadium displays, and broadcast backdrops. Its 331 user I/O pins drive multiple high-speed LVDS pairs that fan out to hub cards carrying dozens of LED driver channels. The 126 embedded multipliers handle brightness calibration, gamma correction, and refresh-rate conversion in real time. DDR2 memory buffers frame data while the 4 PLLs generate pixel clocks at independent rates for different zones of the display. The automotive temperature grade supports outdoor kiosk and stadium deployments where direct sunlight elevates enclosure temperature well above commercial ratings.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40U484A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40F484C7N | EP3C40F484C8N | EP3C40F484I7N | EP3C40F484C6N | EP3C40Q240C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball UFBGA | 484-ball FBGA - same footprint family | 484-ball FBGA - same footprint family | 484-ball FBGA - same footprint family | 484-ball FBGA - same footprint family | 240-pin PQFP - different footprint |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 |
| Embedded Multipliers (18x18) | 126 | 126 | 126 | 126 | 126 | 126 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| User I/O Pins | 331 | 331 | 331 | 331 | 331 | 195 |
| Temperature Grade | Automotive (-40 C to +125 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) |
| Speed Grade | 7 | 7 | 8 (faster) | 7 | 6 (slower) | 8 (faster) |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Automotive temperature grade with UFBGA-484 package (vs EP3C40F484C7N)
- 39,600 logic elements with 126 hardware multipliers (vs EP3C25F324C8N)
- Speed-grade 7 timing closure (vs EP3C40F484C8N)
Design Notes
The Cyclone III EP3C40 typically draws 0.5-1.5 W of static and dynamic power depending on logic utilization, clock tree configuration, and toggle rate. At full LE utilization (~80%) with the four PLLs active and DDR2 memory interface toggling, estimate 1.5-2 W core power at 100 MHz. Use a dedicated 1.2 V LDO regulator (e.g., TPS74401) with at least 1.5x headroom, and place decoupling capacitors (100 nF and 10 uF) within 100 mils of every VCCINT and VCCIO pin pair.
The 484-ball UFBGA package requires a 4-6 layer PCB with microvia (HDI) technology because the 0.8 mm ball pitch exceeds the routing capability of standard 8 mil-via PCBs. Fanout on inner layers with buried vias is recommended. The Intel Cyclone III device handbook provides recommended PCB stack-ups (typically 1 oz copper outer layers, 0.5 oz inner layers) and trace-width/spacing rules to maintain 50 ohm single-ended impedance for the LVDS pairs used by DDR2 memory interfaces.
Place the DDR2 memory chips within 1 inch of the FPGA DDR2 I/O bank to keep the matched-length traces within practical length-matching limits (typically +/- 25 mil). Reference clock and DQS signals must be length-matched within +/- 10 mil. Use fly-by routing for the DDR2 address/command lines to minimize reflections. The four PLLs each have dedicated clock input pins; route the reference clocks through the shortest, guarded paths to avoid jitter.
Configuration mode pins (MSEL[3:0]) must be tied to VCCIO or GND through 4.7 kohm resistors to set the correct configuration scheme; leaving them floating prevents the FPGA from configuring. The JTAG chain must include the TCK, TMS, TDI, TDO, and TRST pins; a missing TRST pull-up can cause JTAG chain detection failures. Active serial (AS) configuration requires a valid EPCS or EPCQ flash device; verify the flash ID before bitstream generation.
Compliance Information
RoHS compliant per Altera/Intel product page. AEC-Q100 qualification is not formally certified but the device is graded for the automotive temperature range (-40 C to +125 C).
