EP3C40F484C8N - Cyclone III FPGA 39.6K LEs 484-FBGA | Intel
MPN: EP3C40F484C8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.85 | $2,985.00 |
| 500 | $26.1 | $13,050.00 |
| 1,000 | $23.75 | $23,750.00 |
| 3,000 | $21.4 | $64,200.00 |
EP3C40F484C8N Overview
A Cyclone III FPGA is a programmable logic device that allows hardware designers to implement arbitrary digital circuits - from glue logic and bus bridges to soft-core processors and DSP pipelines - on a single silicon die. FPGAs sit between fixed-function ASICs (Application-Specific Integrated Circuits) and microcontrollers in the digital design hierarchy: they offer higher integration density than discrete logic ICs but lower per-unit cost than full-custom ASICs at low-to-medium volumes. Cyclone III, released in 2007, is the third-generation low-cost Cyclone family and is widely used as a stepping stone between discrete logic and high-end FPGAs.
Key features of the EP3C40F484C8N include 4 PLLs for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and dedicated LVDS pairs on every I/O pin with data rates up to 875 Mbps. The 484-FBGA (23Γ23 mm, 1.0 mm pitch) package provides ample routing density for memory-rich designs. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes with the dedicated EPCS serial configuration device family.
Architecturally, the EP3C40F484C8N uses Altera's Logic Array Block (LAB) structure with each LAB containing 16 Logic Elements (LEs). Each LE combines a 4-input LUT, a programmable register, and dedicated carry-chain logic. Embedded multiplier blocks support 18Γ18 signed or unsigned multiplication natively, enabling single-cycle DSP operations at speeds up to 260 MHz. The M9K memory blocks can be configured as RAM, ROM, shift registers, or FIFO buffers with byte enables for parity/ECC support.
Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, telecom line cards, and low-volume ASIC prototyping. Designers frequently pair the EP3C40 with external DDR/DDR2 SDRAM, EPCS configuration memory, and a 100 MHz LVCMOS clock source. The 484-BGA package is also suitable for designs migrating to Cyclone IV E (EP4CE40F484) via the Quartus II Cyclone III to Cyclone IV migration guide.
When designing with this part, ensure proper bank voltage supply for each I/O group, keep VCCINT within 1.15Vβ1.25V with at least 4 bulk ceramic decoupling capacitors placed within 5 mm of the package, and verify signal-integrity on LVDS links since the 1.0 mm BGA pitch requires controlled-impedance routing on a 6+ layer PCB. Quartus II Web Edition (free) supports the EP3C40 with full synthesis, place-and-route, and timing analysis.
This page synthesizes real-time distributor pricing, drop-in package-compatible alternatives (same 484-FBGA footprint, including variants within the Cyclone III family and pin-compatible Cyclone IV E migrations), and practical hardware design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3C40F484C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40F484C8N (same form factor and footprint) β differing in Package, Process Technology, Speed Grade, Operating Temperature, Configuration.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3C40F484C8
β Drop-Inβ In Stock
$88.1 / Unit
View Datasheet βEP3C40F484C7N
β Drop-Inβ In Stock
$264 / Unit
View Datasheet βEP3C40F484C6N
β Drop-Inβ In Stock
$312.4 / Unit
View Datasheet βEP3C25F484C8N
β Drop-Inπ Reference alternative (not in catalog)
EP3C120F484C8N
β Drop-Inπ Reference alternative (not in catalog)
EP3C16F484C8N
β Drop-Inβ In Stock
$29.95 / Unit
View Datasheet βEP3C40F484C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements | 39,600 |
| Logic Array Blocks (LABs) | 2,475 |
| Embedded Memory | 1,161,216 bits (1134 Kbit M9K RAM) |
| Embedded 18Γ18 Multipliers | 126 |
| User I/Os | 331 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| Package | 484-FBGA (23Γ23 mm, 1.0 mm pitch) |
| Speed Grade | 8 (commercial) |
| Operating Temperature | -40C to +85C (industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Lead-free / RoHS compliant |
| Configuration Modes | AS, AP, PS, JTAG |
| LVDS Data Rate | Up to 875 Mbps per pair |
EP3C40F484C8N 484-fbga (23Γ23 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP3C40F484C8N (484-fbga (23Γ23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C40F484C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C40F484C8N is suitable for 7 applications: Industrial Motor Control, Video Processing Bridge, Software-Defined Radio Front-End, Telecom Line Card Glue Logic, ASIC Prototyping Platform, Data Acquisition System Back-End, LED Display Controller.
Industrial Motor Control
The EP3C40F484C8N's 39,600 logic elements and 126 embedded 18Γ18 multipliers make it well suited for industrial motor-control loops running field-oriented control (FOC) algorithms at 10β20 kHz PWM. The 4 on-chip PLLs generate the high-resolution PWM carrier clocks from a single 50 MHz crystal, while the 126 multipliers accelerate Clarke/Park transforms and PI controller math without saturating logic. The 331 user I/Os interface to multi-axis gate drivers, encoder feedback (QEI/Hall), and isolated comms. The -40C to +85C industrial temperature range and 65 nm low-power process tolerate factory-floor thermal environments. In practice, designers pair it with external 16-bit ADCs for current sensing and EPCS16 configuration flash; total system BOM runs well below an equivalent DSP+MCU split.
Recommended
Video Processing Bridge
For HDMI-to-LVDS or MIPI-to-RGB video bridges, the EP3C40F484C8N provides enough logic for color-space conversion, frame buffering in 1.16 Mbit of M9K block RAM, and limited deinterlacing at 1080p60. The 875 Mbps LVDS transceivers on every I/O pin drive direct LVDS display panels without external serializer ICs, and the 4 PLLs generate pixel clocks at fractional ratios. Compared to an ASSP video bridge, the FPGA offers reconfigurability when supporting multiple input/output formats. Designers typically use a 60 Hz frame buffer in external DDR2 SDRAM, with the FPGA managing refresh and addressing. The 484-BGA provides ample I/O for parallel RGB, HDMI (via TFP410), and LVDS panels simultaneously.
Recommended
Software-Defined Radio Front-End
In software-defined radio (SDR) front-ends, the EP3C40F484C8N handles digital down-conversion (DDC), FIR filtering, and channelization at baseband sample rates up to 100 MSPS. The 126 embedded 18Γ18 multipliers enable 31-tap FIR filters and CORDIC-based NCO rotation in a single clock cycle, while the 1.16 Mbit block RAM stores filter coefficients and FIFO samples. The 4 PLLs generate the ADC sampling clock and baseband processing clocks with sub-ns jitter. Pair the FPGA with a 14-/16-bit ADC (e.g., AD9648) and a DAC for full transmit/receive paths; the 484-FBGA package keeps traces short for the LVDS-ADC interface. Power consumption at 100 MHz core clock is approximately 0.5W, manageable without a heatsink.
Recommended
Telecom Line Card Glue Logic
The EP3C40F484C8N functions as a multi-protocol glue-logic device on telecom line cards, bridging between network processors, framers, SERDES devices, and backplane interfaces. The 331 user I/Os support multiple LVDS lanes for SPI-4.2 or SGMII-style parallel interfaces, while the embedded M9K RAM implements small packet FIFOs for rate adaptation. The 4 PLLs generate multiple frequency domains from a single 155.52 MHz or 161.13 MHz telecom reference. Compared to discrete logic, the FPGA consolidates 5β10 bus-bridge ICs into a single device, reducing board area and BOM. The 65 nm low-power process keeps idle power under 0.3W, important for high-density line-card deployments.
Recommended
ASIC Prototyping Platform
Designers use the EP3C40F484C8N as a cost-effective ASIC prototype target for mid-complexity ASICs in the 30Kβ50K gate-equivalent range. Its 39,600 LEs map easily to most gate-level netlists after synthesis in Quartus II, and the 484-FBGA package exposes enough I/Os for full ASIC signal visibility. Multiple FPGAs can be chained on a prototyping board to emulate larger ASICs; the EP3C40's 126 multipliers and 1.16 Mbit block RAM emulate on-chip SRAM and DSP blocks at full speed. Quartus II Web Edition (free) supports synthesis, place-and-route, and timing closure, eliminating the need for a paid license during prototyping. Power and thermal emulation are reasonably accurate compared to the final ASIC at gate-equivalent complexity.
Recommended
Data Acquisition System Back-End
For multi-channel data-acquisition systems, the EP3C40F484C8N aggregates samples from 4β8 ADCs (16-bit, up to 250 MSPS each) into a single high-speed data stream for USB 3.0 or Ethernet output. The 126 multipliers implement real-time digital filtering, decimation, and FFT processing on each channel independently, while the 1.16 Mbit block RAM buffers samples between the ADC front-end and the host interface. The 331 user I/Os accept parallel LVDS or CMOS ADC data plus SPI/I2C configuration channels. Compared to a DSP-based system, the FPGA offers deterministic latency and per-channel parallel processing at lower cost per channel. Pair with FT601 USB 3.0 or W5500 Ethernet MAC for host connectivity.
Recommended
LED Display Controller
The EP3C40F484C8N drives large multi-panel LED video walls by generating parallel RGB data streams for dozens of LED receiver cards simultaneously. With 331 user I/Os available, the FPGA supports 8β16 parallel Gigabit Ethernet-style data outputs to HUB-type LED receiver cards, refreshing panels at 3840 Hz with 16-bit color depth. The 1.16 Mbit block RAM stores gamma correction tables and color-space conversion coefficients. The 4 PLLs generate pixel clocks at exact fractional ratios matching panel timing requirements. Compared to dedicated LED controller ASICs, the FPGA offers field-upgradeable firmware support for new panel types without hardware respin. The 484-BGA footprint fits comfortably on a 4-layer controller board.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40F484C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40F484C8 | EP3C40F484C7N | EP3C40F484C6N | EP3C25F484C8N | EP3C120F484C8N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-FBGA (F484, 23Γ23 mm) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 24,624 (-38%) | 119,088 (+200%) |
| Embedded Memory (M9K) | 1,161,216 bits (1.16 Mbit) | 1.16 Mbit | 1.16 Mbit | 1.16 Mbit | 594 Kbit (-49%) | 3.89 Mbit (+234%) |
| Embedded 18Γ18 Multipliers | 126 | 126 | 126 | 126 | 66 (-48%) | 288 (+129%) |
| User I/Os (max) | 331 | 331 | 331 | 331 | 331 (same) | 331 (same) |
| Speed Grade | C8 (commercial) | C8 | C7 (faster) | C6 (slowest) | C8 | C8 |
| Operating Temperature | -40C to +85C | 0C to +85C (commercial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Price (qty 100, USD) | 29.85 | 29.85 | 32.50 (+9%) | 27.10 (-9%) | 24.30 (-19%) | 62.40 (+109%) |
| Lead Time (factory) | 12β16 weeks | 12β16 weeks | 12β16 weeks | 12β16 weeks | 12β16 weeks | 12β16 weeks |
Key Differentiators
- Right-sized mid-density with highest I/O count in 484-BGA package family (vs EP3C25F484C8N)
- Lowest unit cost among same-density EP3C40 variants in C-grade (vs EP3C40F484C7N)
- Lower static power vs same-footprint EP3C120 (vs EP3C120F484C8N)
Design Notes
The EP3C40F484C8N requires four separate supply rails per the Cyclone III Device Handbook: VCCINT (1.15β1.25V core), VCCA (2.5V PLL analog), VCCD_PLL (1.2V PLL digital), and per-bank VCCIO (1.2/1.5/1.8/2.5/3.3V). Place at least four 4.7 Β΅F X5R ceramic bulk capacitors within 5 mm of the VCCINT balls and 0.1 Β΅F/1 nF decoupling pairs at each VCCIO bank. Power sequencing requirement: VCCINT must ramp before or simultaneously with VCCA. Estimated: at 100 MHz core clock and typical I/O toggle rates, VCCINT current is approximately 0.5 A (0.6W). Add a ferrite bead between switching regulator output and VCCINT for noise isolation.
The 484-FBGA package uses a 1.0 mm ball pitch, requiring a minimum 6-layer PCB with 0.5 oz copper for breakout routing. Use a 4-mil (0.1 mm) trace/space design rule with microvia-in-pad for inner rows. Escape the outer 4 rows with dog-bone fanout; inner rows require via-in-pad with 0.4 mm laser-drilled microvias. Per Intel/Altera Cyclone III hardware design guidelines, place at least 8 GND vias under the package center thermal pad for thermal dissipation, and dedicate an entire inner layer as a GND plane stitched with 200-mil spacing to the BGA GND balls. Total board thickness should be 1.6 mm standard.
Estimated: with 0.6 W VCCINT dissipation at room temperature, junction-to-ambient thermal resistance of the 484-FBGA is approximately 12 C/W, giving a 7 C rise above ambient. No heatsink is required for typical operation below 1.5 W total. For high-utilization designs above 1.5 W (e.g., DDR2 controller with sustained memory throughput, parallel FFT pipelines), add a small 10Γ10 mm copper heatsink or thermal pad to the package top, or use a 6-layer board with 2 oz copper on top/bottom layers. Keep the case temperature below 85 C for industrial-grade reliability.
Common pitfalls when designing with the EP3C40F484C8N: (1) Do not leave unused I/O pins floating - configure them as inputs with internal weak pull-up or as outputs driving a defined logic level, per Cyclone III Device Handbook Chapter 7. (2) Do not apply power to VCCIO before VCCINT - this can cause latch-up; use a power sequencer or schottky diode clamp. (3) The JTAG TCK pin requires a 1 kΞ© pull-down to keep the device out of programming mode at reset. (4) LVDS pairs must be length-matched within 100 mils (2.5 mm) for reliable operation above 500 Mbps. (5) The MSEL[3:0] boot-mode pins must be hardwired correctly per Table 8-1 of the handbook; incorrect setting prevents configuration.
Place the EPCS configuration flash within 25 mm of the FPGA DATA0/DCLK/nCS pins to keep AS configuration timing within spec. Use 50 Ξ© controlled-impedance single-ended traces for AS configuration signals. For DDR2 interfaces, route DQS/DQ groups with length matching within 25 mils, and place the VTT termination resistors within 5 mm of the FPGA DQ pins. Keep clock inputs (CLK0βCLK15) routed on the top layer with a continuous GND reference plane beneath; do not cross clock signals over power plane splits. Decoupling capacitor loops must be kept under 50 mils (1.25 mm) total path length for effective high-frequency bypassing.
Compliance Information
Per Altera/Intel product page: lead-free, RoHS compliant. Halogen-free status not explicitly stated in the verified web data. Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA; for automotive designs, consider Cyclone IV E automotive variants or Cyclone V.
