Altera

EP3C40U484C6 - Cyclone III FPGA 39.6K LE 484-UBGA | Altera

MPN: EP3C40U484C6 ✗ End of Life
In Stock Ships in 1-3 business days
1.15 V to 1.25 V Vdss 484-UBGA (U484) 19x19 mm, 0.8 mm pitch Package 20 Speed
From $105 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $196 $196.00
10 $178 $1,780.00
100 $152 $15,200.00
500 $128 $64,000.00
1,000 $105 $105,000.00
ℹ️ All prices are in USD

EP3C40U484C6 Overview

The Altera (Intel) EP3C40U484C6 is a member of the Cyclone III family of low-power, high-volume Field-Programmable Gate Arrays (FPGAs), delivering 39,600 logic elements and 1,161,216 bits of embedded memory in a 484-ball UFBGA (UBGA) package with 0.8 mm ball pitch and 19 mm × 19 mm body. The device integrates 396 logic array blocks, 4 PLLs, 20 global clock networks, and 331 maximum user I/O pins, making it suitable for cost-sensitive, high-volume digital logic applications.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP such as block RAM, DSP blocks, and phase-locked loops (PLLs). FPGAs occupy a unique position in the digital design hierarchy: more flexible than application-specific integrated circuits (ASICs) yet offering higher performance per watt than general-purpose microcontrollers for parallel DSP, video bridging, and custom interface work. The Cyclone III family specifically targets the low-power end of the FPGA market, leveraging a 65 nm TSMC process and 1.2 V core to optimize dollar-per-logic-element.

Key features of the EP3C40U484C6 include 126 embedded 18×18 multipliers suitable for DSP-intensive functions, 4 PLLs for clock management and frequency synthesis, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device operates across a commercial temperature grade (the C6 suffix indicates a 6-speed grade), with a core supply of 1.15 V to 1.25 V and I/O banks that can be independently powered for mixed-voltage designs. The non-volatile configuration is loaded from external serial or parallel flash, supported by Altera's Quartus II design software.

The Cyclone III architecture uses an SRAM-based lookup table (LUT) fabric paired with M9K block RAM tiles. The 1,161,216 bits of embedded RAM can be configured as true dual-port, simple dual-port, or single-port memory at widths from ×1 to ×36 bits. Multiplier blocks can be combined with adjacent logic to build DSP filters and FFT engines without consuming general fabric resources.

Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, and embedded prototyping platforms. In motor control, the EP3C40's DSP blocks accelerate Park/Clarke transforms and space-vector PWM generation. In display bridging, the device converts between camera, HDMI, and LVDS data streams at line-rate. The 484-UBGA package supports up to 331 user I/Os, enabling dense parallel interfaces such as DDR2 memory buses and high-speed LVDS links.

When designing with this part, plan the power-decoupling network carefully: each PLL requires its own filtered analog supply, and the core supply must be sequenced with the I/O supplies per Altera's Cyclone III Handbook. The UFBGA-484 PCB footprint demands 0.8 mm-pitch via-in-pad or dog-bone fan-out, with controlled-impedance routing for LVDS and DDR2 interfaces. JTAG and Active Serial configuration should be brought out to a header for in-system programming and debug.

This page synthesizes distributor pricing, drop-in alternatives, and engineering design guidance not found in the standalone manufacturer datasheet, including same-package same-family variants that share the 484-UBGA footprint.

Drop-in alternatives for EP3C40U484C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C40U484C6 (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Family, Operating Temperature.

Intel
Package: 484-ball UFBGA
Compare with EP3C40U484C6 →
Altera
Package: 484-UFBGA (U484), 19 mm × 19 mm, 1.0 mm ball pitch
Speed Grade: -6 (mid-tier)
RoHS Status: Compliant (Pb-Free)
Compare with EP3C40U484C6 →
Intel
Family: Cyclone III (Low-Power FPGA)
Compare with EP3C40U484C6 →
Intel
Package: 484-ball FBGA (UBGA)
Speed Grade: C8 (8 ns core)
RoHS Status: Contains lead / RoHS non-compliant (per micro-semiconductor listing)
Compare with EP3C40U484C6 →
Intel
Package: 484-FBGA (UBGA, 19x19 mm, 0.8 mm pitch)
Speed Grade: 8 (C8, slowest / lowest-cost)
RoHS Status: Compliant (lead-free)
Compare with EP3C40U484C6 →
Intel
Package: 484-pin UBGA (Ultra FineLine BGA), 1.0 mm ball pitch
Speed Grade: 7 (mid)
Operating Temperature: -40C to +100C (Industrial)
Compare with EP3C40U484C6 →
Intel
Package: 484-ball UBGA (FineLine BGA)
Speed Grade: C6
Operating Temperature: 0°C to +70°C (Commercial)
Compare with EP3C40U484C6 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3C40U484C7N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 484-UBGA (U484)
Cyclone® III · Cyclone III (Low-Power FPGA) · 39,600 · 1,161,216 · 331 (maximum user I/O) · 2,481 · 39,600 · 1161216 bit

✓ In Stock

$119.4 / Unit

View Datasheet →

EP3C40U484C8N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 484-UBGA (U484)
Cyclone III · Cyclone III (65 nm low-power FPGA) · 39,600 · 1,161,216 bits · 126 · 331 · 4 · 20

✓ In Stock

$71.04 / Unit

View Datasheet →

EP3C40U484A7N

✅ Drop-In
Intel
📦 484-UBGA (U484)
Cyclone III · 39,600 · 1,161,216 bits · 126 · 4 · 331 · 65 nm · 1.2 V

✓ In Stock

$21.45 / Unit

View Datasheet →

EP3C40U484C6N

✅ Drop-In
Altera
📦 484-UBGA (U484)
Cyclone III · FPGA (Field Programmable Gate Array) · 39,600 · 1,161,216 bits (approx. 1134 Kbit) · 126 · 331 · 4 · 65 nm CMOS

✓ In Stock

$50.2 / Unit

View Datasheet →

EP3C40U484I7N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 484-UBGA (U484)
Cyclone III · Intel (formerly Altera) · 39,600 · 1,161,216 bits · 126 · 126 · 4 · 331

✓ In Stock

$118.8 / Unit

View Datasheet →

EP3C40U484C6 Maximum Ratings & Electrical Characteristics

Family Cyclone III
Logic Elements 39,600
Logic Array Blocks 396
Total RAM Bits 1,161,216 bits
Embedded 18x18 Multipliers 126
PLLs 4
Maximum User I/O 331
Global Clock Networks 20
Package 484-UBGA (U484) 19x19 mm, 0.8 mm pitch
Process Technology 65 nm TSMC low-power
Core Voltage 1.15 V to 1.25 V
Speed Grade 6 (C6, commercial)
Operating Temperature 0C to +85C (commercial)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

EP3C40U484C6 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 IO/ball — User I/O (bank 1, reference Cyclone III pin-out chapter for exact function)
Pin B2 IO/ball — User I/O (bank 1)
Pin GND1 GND — Ground reference (multiple GND balls distributed across the array)
Pin VCCINT VCCINT — Core supply, 1.15 V to 1.25 V (multiple balls)
Pin VCCIO1 VCCIO — I/O bank 1 supply (multiple balls, each bank has its own VCCIO)
Pin VCCA_PLL1 VCCA_PLL — Analog PLL supply for PLL 1 (filtered 1.2 V required)
Pin VCCD_PLL1 VCCD_PLL — Digital PLL supply for PLL 1 (filtered 1.2 V required)
Pin TCK TCK — JTAG test clock input
Pin TMS TMS — JTAG test mode select input
Pin TDI TDI — JTAG test data input
Pin TDO TDO — JTAG test data output
Pin MSEL0 MSEL0 — Configuration mode select bit 0
Pin MSEL1 MSEL1 — Configuration mode select bit 1
Pin MSEL2 MSEL2 — Configuration mode select bit 2
Pin nCE nCE — Chip enable (active low, pulled high for single-device configuration)
Pin nCONFIG nCONFIG — Configuration control (active low, falling edge initiates configuration)
Pin nSTATUS nSTATUS — Configuration status (open-drain, pulled up externally)
Pin CONF_DONE CONF_DONE — Configuration done indicator (open-drain, pulled up)
Pin DCLK DCLK — Configuration clock (from external controller or EPCS device)
Pin DATA0 DATA0 — Configuration data input bit 0 (AS mode receives serial data on this pin)

Typical Applications

EP3C40U484C6 is suitable for 6 applications: Industrial Motor Control, Video Processing Bridge, Software-Defined Radio Front-End, Embedded Prototyping Platform, Medical Imaging Signal Processor, Industrial Networking Switch.

🏭

Industrial Motor Control

The EP3C40U484C6 fits industrial motor control applications because its 126 embedded 18×18 multipliers accelerate Park/Clarke transforms and space-vector PWM computation, while its 4 PLLs synthesize the multiple clock domains required for encoder sampling, PWM switching, and communication. With 39,600 logic elements, the device has headroom for custom control loops (FOC, DTC) and safety logic. The 484-UBGA package supports the multi-axis PWM output count (typically 24 to 48 channels), encoder interfaces, and isolated communication ports (RS-485, CAN, EtherCAT). Commercial temperature grade suits factory-floor enclosures with controlled climate, and Quartus II Qsys tool flow simplifies IP integration. Compared to a microcontroller DSP, the FPGA delivers deterministic latency at high PWM frequencies (>50 kHz) for high-speed spindle drives.

📺

Video Processing Bridge

The EP3C40U484C6 is well suited as a video format converter or camera-to-display bridge because its 1,161,216 bits of embedded RAM buffer full-HD video lines (1920×1080×16 bits ≈ 33 Mbits, easily fitting as line buffers), and its 331 user I/Os support parallel camera/HDMI/LVDS interfaces. The DSP blocks handle color-space conversion (RGB↔YCrCb) and scaling in real time at 150 MHz pixel clock. The 484-UBGA package provides the pin count required for 24-bit parallel video plus sideband control signals, while the 4 PLLs generate the independent pixel clocks for input and output domains. Compared to an ASSP bridge chip, the FPGA offers field-upgradeable protocol support, which is critical when the source device (camera, SoC) changes its interface mid-product cycle.

📡

Software-Defined Radio Front-End

The EP3C40U484C6 serves as a digital down-conversion (DDC) and channelization engine in software-defined radio front-ends, leveraging its 126 multipliers to implement polyphase filter banks and FFT cores, and its 39,600 logic elements to host multiple parallel receiver chains. The 4 PLLs derive the sampling clocks required for ADC capture, decimation filtering, and Ethernet transport. The 484-UBGA package routes 16+ ADC data lines plus DDR2 memory for buffering at 200 MSPS rates. Commercial temperature grade is acceptable for indoor base-station or test-instrument environments. The Quartus II DSP Builder tool accelerates FIR compiler and FFT IP development, shortening time-to-prototype compared to a custom ASIC approach.

🖥️

Embedded Prototyping Platform

The EP3C40U484C6 is widely deployed on FPGA prototyping boards and daughter-cards because its mid-range logic capacity (39,600 LE) accommodates full SoC verification workloads, while its 331 user I/Os expose enough signals for prototype bring-up of multi-bus designs. The 484-UBGA package is offered on many commercial evaluation boards from Altera partners, simplifying PCB carrier design. The 4 PLLs generate the multiple clock domains typical of ASIC prototyping (CPU core, DDR memory, peripheral buses). Quartus II supports fast compile flows and incremental compilation, which keeps iteration cycles short during ASIC design validation.

💊

Medical Imaging Signal Processor

The EP3C40U484C6 is appropriate for medical imaging front-end signal processing (ultrasound beamforming, patient monitor DSP) because its 126 multipliers implement FIR filters and Hilbert transforms in real time at ultrasound sample rates (up to 40 MHz per channel), while its embedded RAM buffers scan-line data. The 4 PLLs synthesize the phased-array transducer clocks for beam steering. The 484-UBGA package supports the parallel ADC inputs (16 to 64 channels) typical of portable ultrasound carts. Commercial temperature grade and IEC 60601-1 compliance paths are well-documented in Altera's medical reference designs, simplifying regulatory submission for connected patient-monitoring systems.

🌐

Industrial Networking Switch

The EP3C40U484C6 functions as a managed industrial Ethernet switch controller or PROFINET/EtherCAT slave controller because its 39,600 logic elements implement the cut-through store-and-forward pipeline and management CPU interface. The 1,161,216 bits of RAM provide packet buffer space for QoS queueing, while 4 PLLs generate the 25 MHz, 50 MHz, and 125 MHz clocks required for PHY interfaces (MII, GMII, RGMII). The 484-UBGA package exposes enough I/Os to support multi-port Gigabit Ethernet with SERDES external PHYs. Industrial temperature grade is preferred for factory-floor switches, and the Quartus II Nios II soft-core enables embedded CPU integration without an external MCU.

What is the logic element count of the EP3C40U484C6?
The EP3C40U484C6 contains 39,600 logic elements organized into 396 logic array blocks, per the Cyclone III Device Handbook. The '40' in the part number designates this density tier, while the 'U' indicates a wire-bond UFBGA package. This density places the device in the mid-range of the Cyclone III family, above the EP3C16 and EP3C25 but below the EP3C55, EP3C80, and EP3C120 variants.
Is the EP3C40U484C6 still in production or discontinued?
The EP3C40U484C6 is classified as Not Recommended for New Designs (NRND) by Intel/Altera. While existing inventory remains available through distributors like DigiKey, the Cyclone III family has been superseded by Cyclone IV, Cyclone V, and Cyclone 10 families for new designs. Engineers starting fresh projects should evaluate Cyclone IV E or Cyclone 10 LP equivalents for new board designs.
Where can I buy EP3C40U484C6 and what is the current price?
The EP3C40U484C6 is available through distributors including DigiKey, Mouser, Heisener, and IC-Components, with a single-unit price of approximately $196 USD as of 2026-09-09. Heisener lists 6,592 pieces in stock with lead time to be confirmed. Bulk pricing falls to around $105 at 1000-piece quantity per distributor tiers.
What is the difference between EP3C40U484C6 and EP3C40U484C6N?
The EP3C40U484C6 and EP3C40U484C6N share the same die and U484-484-UBGA package, but the 'N' suffix denotes lead-free / Pb-free terminal finish compliant with RoHS requirements. The non-N variant may use SnPb or non-compliant plating. Both parts are functionally identical and pin-to-pin compatible; the N variant is preferred for new RoHS-compliant products.
What is the difference between EP3C40F484C7N and EP3C40U484C6?
The EP3C40F484C7N uses the F484 (FineLine BGA, 1.0 mm pitch) package and the C7 (faster) speed grade, while the EP3C40U484C6 uses the U484 (Ultra FineLine BGA, 0.8 mm pitch) package and the C6 speed grade. Both share the same Cyclone III EP3C40 die, but the packages are not drop-in compatible due to differing ball patterns and PCB footprints.
How much embedded memory does the EP3C40U484C6 have?
The EP3C40U484C6 contains 1,161,216 bits of embedded SRAM distributed across M9K (9 Kbit) block RAM tiles, per the Cyclone III family datasheet. This memory can be configured as true dual-port, simple dual-port, or single-port RAM at widths from ×1 to ×36 bits, supporting FIFO buffers, lookup tables, and small data caches without consuming general logic fabric.
What is the maximum operating frequency of the EP3C40U484C6?
The EP3C40U484C6 has a maximum internal operating frequency dependent on the speed grade (C6 in this case) and design routing. Distributor listings cite 472.5 MHz as a typical marketing figure for the family, while real-world Fmax depends on the logic path, temperature, and voltage. PLLs support output frequencies up to several hundred MHz for clock synthesis.
Does EP3C40U484C6 support DDR2 SDRAM external memory interfaces?
Yes, the EP3C40U484C6 supports DDR, DDR2, and QDRII SDRAM external memory interfaces through dedicated DQS (data strobe) pins and on-chip PLL-based phase shifting. The 331 user I/Os and 4 PLLs in this density provide sufficient bandwidth for DDR2-400 memory controllers in typical embedded designs.
What is the best drop-in replacement for EP3C40U484C6?
The best drop-in replacement for EP3C40U484C6 in the same 484-UBGA package is the EP3C40U484C7 (faster speed grade, same U484 footprint) or the EP3C40U484C8. For designers willing to redesign the PCB to a different package, the EP3C40F484C6N (F484 1.0 mm pitch BGA, same die) is functionally equivalent but requires a new PCB footprint.
Where can I download the EP3C40U484C6 datasheet PDF?
The official EP3C40U484C6 datasheet is available as part of the Cyclone III Device Handbook, hosted by Intel at the Altera literature archive. Per the manufacturer datasheet documentation set, the handbook contains the EP3C40 device-specific chapters covering electrical characteristics, pin-out, and configuration. Octopart also mirrors the datasheet PDF for download.
What is the pinout and ball map of the EP3C40U484C6 484-UBGA?
The EP3C40U484C6 pinout is published in the Cyclone III Device Handbook Pin-Out chapter, with 484 balls arranged on a 22×22 array (with depopulated corners) on a 0.8 mm pitch. Balls include dedicated PLL supply pins, JTAG (TCK/TMS/TDI/TDO), configuration (MSEL, nCE, nCONFIG, DATA, DCLK), and 8 I/O banks labeled 1 through 8. Pin 1 is typically marked with a corner dot.
Hey Google, what can replace the EP3C40U484C6 if it is end of life?
If the EP3C40U484C6 is end of life, the closest same-package drop-in alternatives are EP3C40U484C7 (faster speed grade, same U484 footprint) and EP3C40U484C8 (even faster). For a modern alternative, Intel's Cyclone IV EP4CE40F23I7N uses a different BGA but offers similar 39,600 LE density. Designers should consider the entire Cyclone III NRND transition path.
Is EP3C40U484C6 the same as EP3C40U484I7?
The EP3C40U484C6 and EP3C40U484I7 are not exactly the same. They share the same U484 package and EP3C40 die, but differ in two parameters: the C6 suffix indicates a commercial temperature grade (0C to +85C) with speed grade 6, while the I7 suffix indicates an industrial temperature grade (-40C to +100C) with speed grade 7. The I7 variant is pin-compatible but specified for wider temperature operation.
What is the best cross-brand equivalent for EP3C40U484C6?
There is no true cross-brand pin-compatible equivalent for the EP3C40U484C6 because the Cyclone III U484 package and Altera/Intel-specific configuration scheme are unique. Competitors like Xilinx Spartan-6 LX45 (in CSG484 package) offer similar logic density but require a completely new PCB layout and Quartus-to-ISE/Vivado tool migration, so they cannot be considered drop-in replacements.
What are the key specifications of EP3C40U484C6 that engineers should know?
The key specifications of the EP3C40U484C6 are: 39,600 logic elements, 1,161,216 bits of RAM, 126 18x18 multipliers, 4 PLLs, 331 maximum user I/Os, 484-UBGA package at 0.8 mm pitch, 65 nm process, 1.2 V core, commercial temperature grade, and C6 speed grade. The device is NRND as of 2026-09-09, so new designs should consider Cyclone IV E or Cyclone 10 LP alternatives.

Engineering reference data for EP3C40U484C6 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C40U484C6 when designing a Cyclone III-based system targeting the commercial temperature range (0C to +85C) with standard timing closure headroom, and where cost is a primary driver. The C6 speed grade is the lowest-priced option in the U484 family, suitable for designs with comfortable Fmax margins (typically <150 MHz internal logic). For designs that require industrial temperature operation, switch to EP3C40U484I7N (or the lead-free EP3C40U484I7N variant). For designs that need the fastest timing closure, choose EP3C40U484C8N. All four alternatives share the same 484-UBGA footprint, so PCB layout remains identical across selections. If the U484 package is too small or the C6 speed grade insufficient, consider the EP3C55 or EP3C120 density step within the Cyclone III family.

Comparison with Alternatives

Parameter This Product EP3C40U484C7N EP3C40U484C8N EP3C40U484A7N EP3C40U484C6N EP3C40U484I7N
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 484-UBGA (U484) 484-UBGA (U484) - same 484-UBGA (U484) - same 484-UBGA (U484) - same 484-UBGA (U484) - same 484-UBGA (U484) - same
Logic Elements 39,600 39,600 - same 39,600 - same 39,600 - same 39,600 - same 39,600 - same
Speed Grade C6 (commercial, grade 6) C7 (faster) C8 (fastest) A7 (industrial, grade 7) C6 (same) I7 (industrial, grade 7)
Temperature Grade Commercial (0C to +85C) Commercial Commercial Industrial (auto) Commercial Industrial (-40C to +100C)
Lead-Free (N suffix) No Yes Yes Yes Yes Yes
Total RAM Bits 1,161,216 1,161,216 - same 1,161,216 - same 1,161,216 - same 1,161,216 - same 1,161,216 - same
Embedded 18x18 Multipliers 126 126 - same 126 - same 126 - same 126 - same 126 - same
Maximum User I/O 331 331 - same 331 - same 331 - same 331 - same 331 - same
PLLs 4 4 - same 4 - same 4 - same 4 - same 4 - same

Key Differentiators

  • Standard commercial speed grade at the lowest price point in the EP3C40 U484 family (vs EP3C40U484C7N)
  • Industry-standard 39,600 LE density that matches most common ASIC prototyping workloads (vs EP3C16U256C8N)
  • Wire-bond UFBGA package enables finer 0.8 mm pitch for compact designs (vs EP3C40F484C6N)

Design Notes

The EP3C40U484C6 requires at least three separate power rails: VCCINT (1.15 V to 1.25 V core), VCCIO (1.2 V to 3.3 V per bank), and VCCA/VCCD_PLL (1.2 V filtered analog/digital for each of the 4 PLLs). Estimated worst-case static power for a fully utilized EP3C40 is approximately 0.5 W to 1.0 W plus dynamic power proportional to toggle rate. Use a power sequencer or simple RC network to ensure VCCINT comes up before VCCIO. Place a ferrite bead and 10 uF + 0.1 uF decoupling on each PLL analog supply pin to minimize jitter.

The 484-UBGA package uses a 0.8 mm ball pitch, which demands via-in-pad or dog-bone fan-out. Use 0.4 mm laser-drilled vias with 0.2 mm capture pads for via-in-pad, or 0.5 mm mechanical vias with dog-bone routing. Estimated: trace width of 0.1 mm with 0.1 mm spacing on a 4-layer 1 oz copper stack-up provides approximately 50 ohm controlled impedance for LVDS pairs. Maintain continuous reference planes under all high-speed signal traces; never route a signal over a plane split.

Do not confuse the U484 (Ultra FineLine BGA, 0.8 mm pitch, 19x19 mm) with the F484 (FineLine BGA, 1.0 mm pitch, 17x17 mm) Cyclone III package: they have different ball maps and require different PCB footprints. Verify the exact package code in the part number (U484 vs F484 vs Q240) before PCB layout. A common pitfall is also leaving MSEL pins floating: MSEL[2:0] must be tied to VCCIO or GND to select the desired configuration mode (AS, PS, JTAG).

For DDR/DDR2 SDRAM interfaces, route DQS (data strobe) traces matched within 50 mil to the associated DQ byte lanes, and use fly-by termination on the address/command bus per the Cyclone III External Memory Interface Handbook. Estimated: at 200 MHz DDR2 clock, intra-byte skew should be kept below 25 ps. Enable on-chip OCT (on-chip termination) for impedance matching rather than external resistors to simplify routing and reduce stub effects.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

The EP3C40U484C6 base part is not explicitly RoHS compliant in the suffix (N suffix is required for lead-free). RoHS/REACH status varies by distributor lot and date code. Industrial temperature variants (I7) and automotive temperature variants (A7) are NOT AEC-Q100 qualified by Intel/Altera for the Cyclone III family.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel EP3C40U484C6 EP3C40U484C7N EP3C40U484C8N EP3C40U484A7N EP3C40U484C6N EP3C40U484I7N Cyclone III FPGA CPLD logic element logic array block block RAM M9K DSP block 18x18 multiplier PLL phase-locked loop Quartus II JTAG 484-UBGA UFBGA RoHS AEC-Q100 DDR2 SDRAM QDRII SRAM 65 nm process TSMC commercial temperature grade industrial temperature grade active serial configuration EPCS Nios II Qsys video bridge motor control software-defined radio
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