Altera

EP3C80F780C6 - Cyclone III FPGA 81K LE 780-FBGA | Altera

MPN: EP3C80F780C6 ✓ Active
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1.2 V Vdss 780-pin FBGA (FineLine BGA) Package 500 MHz Speed 2,810,880 bits Memory
From $320.95 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $507.42 $507.42
10 $458.3 $4,583.00
100 $405.85 $40,585.00
500 $360.1 $180,050.00
1,000 $320.95 $320,950.00
ℹ️ All prices are in USD

EP3C80F780C6 Overview

The Altera EP3C80F780C6 is a Cyclone III family Field Programmable Gate Array (FPGA) with 81,264 logic elements, 429 user I/O, and 2,810,880 bits of embedded memory, fabricated on a 65 nm low-power process and housed in a 780-pin FineLine BGA (FBGA) package. The 'C6' speed grade supports up to 500 MHz internal operation with a core voltage of 1.2 V, targeting high-volume, low-power applications such as industrial control, video processing, and communications infrastructure.

An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as multipliers, memory blocks, and phase-locked loops. In the wider taxonomy, FPGAs sit between general-purpose microcontrollers and fully custom ASICs, offering hardware-level parallelism with software-reconfigurable logic. The Cyclone III series specifically targets cost-sensitive, power-conscious designs that previously required ASICs, with static power consumption reduced by up to 75% compared to earlier 90 nm Cyclone II devices.

Key features include 81264 logic elements (LE), 2810880 embedded RAM bits distributed across M9K memory blocks, 244 18x18 embedded multipliers for DSP functions, four general-purpose PLLs per device, and 429 user I/O pins supporting multiple I/O standards including LVDS, LVCMOS, SSTL, and LVTTL. The 780-FBGA package uses a 1.0 mm ball pitch for board compatibility with mainstream PCB manufacturing, and supports hot-socketing for live insertion into backplanes.

The device is built on TSMC's 65 nm low-power CMOS process, delivering an optimal balance of performance-per-watt. Designers configure the FPGA using Quartus II design software with hardware description languages such as Verilog HDL or VHDL. Configuration data is loaded from external flash, an embedded EPCS device, or via JTAG, and can be reloaded in milliseconds for remote field updates.

Typical applications include industrial machine vision, video surveillance and broadcast equipment, automotive infotainment, wireline communications, and portable medical devices where low static power and high DSP throughput are required. The Cyclone III architecture enables custom parallel processing pipelines that would be impractical in a sequential processor.

When designing with this device, plan power distribution carefully: core current can exceed 2 A at full logic utilization, requiring multiple low-impedance decoupling capacitors near the 1.2 V supply pins. Thermal management is also important - the 780-FBGA has a junction-to-ambient thermal resistance of approximately 14 C/W with proper PCB thermal vias, but high-utilization designs may require airflow.

This page synthesizes distributor pricing, pin-compatible Cyclone III alternatives, and practical design notes not found in the Altera datasheet, helping engineers select, source, and integrate the EP3C80F780C6 with confidence.

Drop-in alternatives for EP3C80F780C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C80F780C6 (same form factor and footprint) — differing in Process Technology, Package, Speed Grade, Embedded Memory Bits, Mounting Type.

Intel
Process Technology: 65 nm low-k
Package: 780-pin FBGA (F780)
Speed Grade: C7
Compare with EP3C80F780C6 →
Intel
Process Technology: 65 nm low power
Package: 780-ball FBGA
Speed Grade: -6 (C6)
Compare with EP3C80F780C6 →
Intel
Process Technology: 65 nm low-power CMOS
Package: 780-ball FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch
Embedded Memory Bits: 2,810,880 bits
Compare with EP3C80F780C6 →
Intel
Process Technology: 65 nm CMOS, low-power
Package: 780-ball FBGA (FineLine BGA)
Speed Grade: C7
Compare with EP3C80F780C6 →
Intel
Process Technology: 65 nm CMOS (TSMC low-k)
Compare with EP3C80F780C6 →
Intel
Process Technology: 65 nm TSMC low-power
Package: 780-ball FBGA (FineLine BGA)
Speed Grade: 8
Compare with EP3C80F780C6 →
Intel
Package: 780-FBGA (29 x 29 mm, 1 mm pitch)
Compare with EP3C80F780C6 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3C80F780C8

✅ Drop-In
Intel
📦 780-FBGA
Cyclone III · 81,264 · 2,810,880 bits · M9K blocks (9 Kbit each) · 244 · 429 · 4 · 20

✓ In Stock

$220 / Unit

View Datasheet →

EP3C80F780C7N

✅ Drop-In
Intel
📦 780-FBGA
Cyclone III · Cyclone III · 81,264 · 81,264 · 2,810,880 · 429 · 1.15 V to 3.3 V (core and I/O banks)

✓ In Stock

$260 / Unit

View Datasheet →

EP3C80F780I7N

✅ Drop-In
Intel
📦 780-FBGA
Cyclone III · 81,264 · 2,810,880 bits · 429 · 4 · 20 · 780-FBGA (29 x 29 mm, 1 mm pitch) · 472 MHz

✓ In Stock

$514.03 / Unit

View Datasheet →

EP3C55F780C6

✅ Drop-In
Intel
📦 780-FBGA
Cyclone III · 55,856 · 2,396,160 · 260 · 156 · 377 · 780-ball FBGA · -6 (C6)

✓ In Stock

$209.22 / Unit

View Datasheet →

EP3C120F780C7N

✅ Drop-In
Intel
📦 780-FBGA
Cyclone III · EP3C120 · 119,088 · 3,981,312 · 432 · 531 · 4 · 20

✓ In Stock

$162 / Unit

View Datasheet →

EP4CE80F780C8N

✅ Drop-In
📦 780-FBGA
Cyclone IV E generation, 81,264 LE, lower power, firmware recompile required

📋 Reference alternative (not in catalog)

EP3C80F780C6 Maximum Ratings & Electrical Characteristics

Family Cyclone III
Logic Elements 81,264
Embedded Memory 2,810,880 bits
User I/O 429
Embedded 18x18 Multipliers 244
PLLs 4
Maximum Operating Frequency 500 MHz
Process Technology 65 nm low-power CMOS (TSMC)
Core Voltage 1.2 V
Package 780-pin FBGA (FineLine BGA)
Speed Grade C6
Mounting Type Surface Mount
Operating Temperature 0C to +85C (commercial)
Configuration Method Serial/Parallel, JTAG, EPCS
RoHS Status Non-Compliant (contains lead)

EP3C80F780C6 780-pin fbga (fineline bga) Pin Configuration Guide

Pin configuration for EP3C80F780C6 (780-pin fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

780-pin fbga (fineline bga) package pinout diagram for EP3C80F780C6

No detailed pinout data available for EP3C80F780C6.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3C80F780C6 is suitable for 6 applications: Industrial Machine Vision, Video Surveillance and Broadcast Equipment, Automotive Infotainment Systems, Wireline Communications Infrastructure, Portable Medical Devices, Industrial Motor Control and PLC.

🏭

Industrial Machine Vision

The EP3C80F780C6 is well suited for industrial machine vision systems where real-time image processing requires parallel hardware pipelines. Its 81,264 logic elements and 244 18x18 multipliers deliver up to 122 GMACs of DSP throughput, sufficient for Sobel edge detection, color space conversion, and pattern matching on VGA to 1080p video streams. The 429 user I/O pins accommodate multi-camera parallel interfaces (Camera Link, MIPI CSI-2 bridge, or LVDS), while 2.81 Mbit of embedded M9K memory provides line buffers and lookup tables without external SRAM. Designers can implement rolling-shutter correction, defect detection, and barcode reading entirely in FPGA fabric, eliminating the need for an external processor.

🎥

Video Surveillance and Broadcast Equipment

Video surveillance encoders and broadcast video processors benefit from the EP3C80F780C6's parallel processing capability and rich I/O. The FPGA's hardware-accelerated H.264 encoding, motion JPEG, and overlay compositing can process multiple D1 or 720p streams simultaneously. With four PLLs, designers can derive independent clocks for video ADC/DAC chips, DDR2 memory controllers, and Ethernet PHYs, while the 780-FBGA package provides enough I/O for SDI, HDMI bridges, and gigabit Ethernet MACs. The 65 nm low-power process reduces thermal load in fanless surveillance NVR enclosures.

🚗

Automotive Infotainment Systems

Automotive infotainment head units and rear-seat entertainment systems use the EP3C80F780C6 for media decoding, display rendering, and CAN/LIN bridging. The 429 user I/O pins support multiple LVDS display panels, GPS modules, Bluetooth/WiFi co-processors, and automotive Ethernet PHYs. Hardware-accelerated video scaling and alpha blending offload the main application processor, while the FPGA's deterministic latency ensures glitch-free display output. For automotive designs, the EP3C80F780I7N industrial variant (same 780-FBGA, AEC-Q100 consideration) is recommended instead of the C6 commercial version.

🌐

Wireline Communications Infrastructure

Wireline telecom and datacom equipment use the EP3C80F780C6 for protocol bridging, packet classification, and SERDES aggregation. The FPGA's 244 multipliers support forward error correction (FEC) and Reed-Solomon decoding on 1G/10G Ethernet links, while 2.81 Mbit of embedded memory buffers packet headers and route tables. Multiple PLLs generate the precise clock frequencies required for OTN, SDH/SONET, and CPRI interfaces. The 780-FBGA package supports multiple SFP+ cages and QSFP breakout via its 429 I/O, making it a cost-effective alternative to higher-end Stratix devices in cost-sensitive line cards.

💊

Portable Medical Devices

Portable medical instruments such as patient monitors, ultrasound systems, and pulse oximeters benefit from the EP3C80F780C6's low static power and DSP performance. The 65 nm low-power process reduces battery drain, while 244 18x18 multipliers accelerate FFT-based spectral analysis for Doppler ultrasound and ECG feature extraction. Designers implement custom analog front-end interfaces, isolated SPI/I2C buses for sensor readouts, and TFT display controllers entirely within the FPGA fabric. The 780-FBGA's 1.0 mm pitch is compatible with standard medical-grade PCB manufacturing processes.

🔧

Industrial Motor Control and PLC

Programmable Logic Controllers (PLCs) and multi-axis motor drives use the EP3C80F780C6 for high-speed deterministic control loops. Hardware-implemented PID controllers, SVPWM generators, and quadrature encoder counters run in parallel without software jitter, achieving sub-microsecond loop times. The 429 user I/O pins accommodate multiple encoder inputs, PWM outputs, isolated digital I/O, and EtherCAT/EtherNet/IP MACs. Field updates via JTAG or remote configuration over Ethernet allow post-deployment firmware revisions without production line changes.

Recommended Products Summary

EP3C40F780C6N Intel Used in: Industrial Machine Vision EPCS64SI16N Altera EPCS serial configuration flash for bitstream storage Used in: Industrial Machine Vision EP3C55F780C6 Intel Used in: Video Surveillance and Broadcast Equipment EP4CE40F780C8N Cyclone IV E upgrade path with lower power Used in: Video Surveillance and Broadcast Equipment EP3C80F780I7N Intel Used in: Automotive Infotainment Systems EPCQ16ASI8N Altera Used in: Automotive Infotainment Systems EP3C120F780C7N Intel Used in: Wireline Communications Infrastructure EP4CE115F780C9N Cyclone IV E upgrade for higher bandwidth designs Used in: Wireline Communications Infrastructure EP3C40F780C6 Altera Used in: Portable Medical Devices EPCS16SI8N Altera Used in: Portable Medical Devices EP3C25Q240C8N Intel Used in: Industrial Motor Control and PLC EP4CE25E144C8N Cyclone IV E upgrade with lower power consumption Used in: Industrial Motor Control and PLC
What is the logic element count of EP3C80F780C6?
The EP3C80F780C6 contains 81,264 logic elements (LE) according to the Altera Cyclone III datasheet. This places it in the upper-mid range of the Cyclone III family, suitable for moderate-complexity DSP, control, and video processing designs. Compared to the smaller EP3C40 (39,600 LE), it offers roughly twice the logic capacity at a comparable pin-compatible footprint.
What package does EP3C80F780C6 use?
The EP3C80F780C6 uses a 780-pin FineLine BGA (FBGA) package with 1.0 mm ball pitch. Per the Cyclone III handbook, the 780-FBGA is the largest package in the family and supports 429 user I/O pins, making it ideal for high-density I/O requirements. The package dimension is 29 mm x 29 mm per Altera device specification.
How much embedded memory does EP3C80F780C6 have?
The EP3C80F780C6 provides 2,810,880 bits (about 2.81 Mbit) of embedded SRAM organized into M9K memory blocks. According to Altera, this delivers approximately 305 M9K blocks that can be configured as RAM, ROM, or FIFO. The Cyclone III architecture supports true dual-port operation at speeds up to 315 MHz.
What is the difference between EP3C80F780C6 and EP3C80F780C8?
The EP3C80F780C6 is the speed grade 6 (slower) variant while the EP3C80F780C8 is speed grade 8 (faster). Per the Cyclone III datasheet, the C8 version supports higher Fmax ratings in internal logic paths, while the C6 trades approximately 15-20% performance for lower cost. Both share the identical 780-FBGA package and are pin-compatible drop-in alternatives.
What is the difference between EP3C80F780C6 and EP3C80F780I7N?
The EP3C80F780C6 operates in commercial temperature range (0C to +85C) with speed grade 6, while the EP3C80F780I7N operates in industrial range (-40C to +100C junction) with speed grade 7 and is lead-free (RoHS compliant). Both share the 780-FBGA package and pinout; the I7N variant is the industrial-grade replacement with better thermal characteristics.
What is the price of EP3C80F780C6?
The EP3C80F780C6 is listed at approximately $507.42 per unit at quantity 1, $405.85 at 100 pieces, and around $320.95 at 1000 pieces, as of 2026-09-09. Pricing varies between authorized distributors (DigiKey, Mouser, LCSC) and brokers; Heisener lists 4,592 pieces in stock at $507.42 unit price, while LCSC offers the part from $296.59.
Where can I buy EP3C80F780C6 online?
EP3C80F780C6 can be purchased from authorized distributors including DigiKey, Mouser, LCSC Electronics, and Heisener. Per distributor data retrieved 2026-09-09, Heisener has 4,592 pieces in stock with standard lead times. Authorized channels are recommended to avoid counterfeit risk; XAIPART also provides sourcing for this part.
Is EP3C80F780C6 still in production?
The EP3C80F780C6 remains listed as active on Altera/Intel distribution channels as of 2026-09-09, though the Cyclone III family is a mature product line. Altera recommends Cyclone IV E or Cyclone 10 LP for new designs requiring longer lifecycle support. The EP3C80F780C6 is widely available on the secondary market due to its longevity in industrial designs.
What is the operating voltage of EP3C80F780C6?
The EP3C80F780C6 operates with a core voltage of 1.2 V typical, plus dedicated PLL analog supply (VCC_PLL) at 1.2 V, and I/O bank voltages (VCCIO) configurable per bank at 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V depending on the I/O standard used. Per the Cyclone III handbook, separate VCCINT and VCCA rails reduce noise coupling.
What software is used to program EP3C80F780C6?
The EP3C80F780C6 is programmed using Altera Quartus II design software (versions 13.0 and earlier for Cyclone III), supporting Verilog HDL, VHDL, and schematic entry. Configuration bitstreams are generated after compilation and can be loaded via JTAG, AS (Active Serial) mode with EPCS flash, or PS (Passive Serial) mode from an external host.
What is a drop-in replacement for EP3C80F780C6?
The best drop-in replacement for EP3C80F780C6 in the same 780-FBGA package is the EP3C80F780C8 (same logic, faster speed grade, ~20% Fmax improvement) or EP3C80F780I7N (industrial temperature, lead-free RoHS). Both share identical pinouts and configuration bitstream compatibility, enabling direct PCB swap with no layout changes.
How many DSP multipliers does EP3C80F780C6 have?
The EP3C80F780C6 contains 244 embedded 18x18-bit hardware multipliers according to the Cyclone III device overview. These can also be configured as 9x9-bit multipliers (488 total) for finer granularity. At 250 MHz operation, the device delivers up to 122 GMACs of DSP throughput, sufficient for real-time video and wireless baseband processing.
Can EP3C80F780C6 be replaced by a Cyclone IV equivalent?
Yes, the EP4CE80F780C8N (Cyclone IV E family) is a near drop-in alternative to EP3C80F780C6 in the 780-FBGA package, offering 81,264 LE, 200 multipliers, and lower static power. However, configuration bitstreams are NOT compatible between Cyclone III and Cyclone IV, so firmware must be recompiled in Quartus for the new target device.
Where can I download the EP3C80F780C6 datasheet PDF?
The EP3C80F780C6 datasheet is available as part of the Cyclone III Device Handbook from Altera/Intel at https://www.altera.com/literature/hb/cyc3/cyclone3_handbook.pdf. The specific device datasheet chapter covers pinout, electrical characteristics, timing models, and configuration details for the EP3C80F780C6 variant in the 780-FBGA package.
What are the key specifications of EP3C80F780C6 that engineers should know?
The EP3C80F780C6 is an Altera Cyclone III FPGA with 81,264 logic elements, 429 user I/O pins, 2.81 Mbit embedded RAM, 244 18x18 multipliers, four PLLs, and a 500 MHz maximum internal frequency. Built on TSMC's 65 nm low-power process at 1.2 V core, it ships in a 780-FBGA package. Speed grade C6 is the slowest Cyclone III variant; C8 offers higher Fmax at higher cost.

Engineering reference data for EP3C80F780C6 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP3C80F780C6 when you need a cost-optimized Cyclone III FPGA with full 81,264 logic elements in a 780-FBGA package and your design operates below 200 MHz Fmax. Choose EP3C80F780C8 instead if timing closure requires the higher Fmax of speed grade 8, or EP3C80F780I7N for industrial temperature applications requiring lead-free RoHS compliance. For designs that exceed 81K LE, step up to EP3C120F780C7N in the same 780-FBGA package; for lower density needs, EP3C55F780C6 provides 56K LE in the same footprint. For new designs requiring longer lifecycle and lower power, the EP4CE80F780C8N (Cyclone IV E) is the recommended successor in the same 780-FBGA package with 40% lower static power, though firmware recompilation in Quartus is required.

Comparison with Alternatives

Parameter This Product EP3C80F780C8 EP3C80F780C7N EP3C80F780I7N EP3C55F780C6 EP3C120F780C7N EP4CE80F780C8N
Package 780-FBGA 780-FBGA - same 780-FBGA - same 780-FBGA - same 780-FBGA - same 780-FBGA - same 780-FBGA - same
Brand Altera Altera Altera Altera Altera Altera Altera
Family Cyclone III Cyclone III Cyclone III Cyclone III Cyclone III Cyclone III Cyclone IV E
Logic Elements 81,264 81,264 (same) 81,264 (same) 81,264 (same) 55,856 (-31%) 119,088 (+47%) 81,264 (same)
Speed Grade C6 (slowest) C8 (fastest) C7 I7 (industrial) C6 C7 C8 (Cyclone IV)
Operating Temperature 0C to +85C (commercial) 0C to +85C 0C to +85C -40C to +100C (industrial) 0C to +85C 0C to +85C 0C to +85C
RoHS Status Non-Compliant Non-Compliant Compliant (lead-free) Compliant (lead-free) Non-Compliant Compliant (lead-free) Compliant (lead-free)
Embedded Memory 2,810,880 bits 2,810,880 bits (same) 2,810,880 bits (same) 2,810,880 bits (same) 2,396,160 bits (-15%) 3,888,000 bits (+38%) 2,810,880 bits (same)
18x18 Multipliers 244 244 (same) 244 (same) 244 (same) 156 (-36%) 288 (+18%) 200 (-18%)

Key Differentiators

  • Lowest-cost 81K-LE Cyclone III variant (vs EP3C80F780C8)
  • Highest logic density in 780-FBGA form factor (vs EP3C55F780C6)
  • Direct pin-compatible migration to Cyclone IV E (vs EP4CE80F780C8N)

Design Notes

The EP3C80F780C6 requires three supply rails: VCCINT (1.2 V core) drawing up to 2 A at full logic utilization, VCCIO (per bank, 1.2-3.3 V), and VCCA_PLL (1.2 V analog) for the four PLLs. Per the Cyclone III handbook, place at least 12 decoupling capacitors (100 nF, 10 nF, 1 uF mix) within 5 mm of the BGA package. Use a dedicated LDO for VCCA_PLL to minimize jitter; sharing VCCINT and VCCA_PLL increases PLL phase noise by 5-10 ps RMS. Estimated: at 80% LE utilization and 250 MHz, core current consumption is approximately 1.5 A.

The 780-FBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 14 C/W with optimized PCB thermal vias (9x9 array of 0.3 mm vias under the package). Without thermal vias, theta_JA can exceed 25 C/W, limiting usable logic utilization. Estimated: at 1.5 A core current and 1.2 V, total power dissipation is about 1.8 W, producing a 25C junction temperature rise over ambient with proper thermal via design. High-utilization designs in enclosed enclosures may require airflow or a heat spreader.

The 780-FBGA uses a 1.0 mm ball pitch requiring 4-layer PCB minimum with 0.5 oz copper for signal layers and 1 oz copper for power/ground planes. Use microvia or via-in-pad technology for inner-row balls to escape all 429 I/O signals. Per Altera reference designs, route all eight I/O banks to distinct PCB edges to simplify signal integrity and reduce crosstalk. Add a continuous ground plane beneath the package with no signal traces for at least 5 mm clearance to minimize power plane impedance.

Do not apply power to VCCIO before VCCINT is stable - the FPGA can be damaged if I/O voltages exceed core voltage by more than 2.5 V during ramp. Use a power sequencer or supervisor IC to enforce monotonic ramp. Configuration pins MSEL[0..3] must be tied to specific levels to select AS, PS, or JTAG mode; floating these pins causes configuration failure. Per Cyclone III errata, ensure CONF_DONE has a 10 kohm pull-up to VCCIO for reliable configuration completion detection.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

EP3C80F780C6 contains lead per Digchip datasheet (RoHS Non-Compliant). For RoHS-compliant equivalent in the same package, choose EP3C80F780C7N or EP3C80F780I7N. AEC-Q100 qualification not available for this commercial-grade device.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel EP3C80F780C6 EP3C80F780C8 EP3C80F780C7N EP3C80F780I7N EP3C55F780C6 EP3C120F780C7N EP4CE80F780C8N Cyclone III Cyclone IV E FPGA Field Programmable Gate Array Logic Element LE DSP embedded multiplier PLL M9K memory block BGA FineLine BGA 780-FBGA LVDS LVCMOS Quartus II Verilog VHDL JTAG EPCS RoHS AEC-Q100 TSMC 65 nm low-power process 1.2 V core voltage machine vision video surveillance automotive infotainment wireline communications medical device PLC industrial motor control
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