EP4CE40F29I8L - Cyclone IV E 39.6K LE FPGA 532 I/O 780-FBGA | Intel
MPN: EP4CE40F29I8L ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $133.14 | $133.14 |
| 10 | $119.83 | $1,198.30 |
| 100 | $106.51 | $10,651.00 |
| 250 | $98.62 | $24,655.00 |
| 500 | $91.74 | $45,870.00 |
EP4CE40F29I8L Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hard IP such as memory and multiplier blocks. FPGAs sit within the programmable logic hierarchy, alongside CPLDs, as a more flexible alternative to ASICs for medium-volume designs and rapid prototyping. The Cyclone IV E family specifically targets cost-sensitive, power-conscious applications where the absolute highest performance is not required but rich logic density and DSP capability are essential.
Key features of the EP4CE40F29I8L include 532 maximum user I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, up to 8 input clocks per device through global clock networks, and configuration via Active Serial (AS), Passive Serial (PS), JTAG, or Fast Passive Parallel (FPP) modes. The 60nm process technology combined with the Cyclone IV E architecture typically delivers 25% lower static power than the previous Cyclone III generation at equivalent utilization.
Architecturally, the EP4CE40F29I8L arranges its 39,600 LEs into Logic Array Blocks (LABs) with 16 LEs per LAB, distributed alongside embedded memory blocks (M9K) and DSP blocks across a fabric of programmable row and column interconnects. The 116 18x18 multipliers can be combined for higher-precision arithmetic, and the four PLLs provide flexible clock synthesis with on-chip clock conditioning.
Typical applications include industrial motor control and machine vision, video processing and display controllers, automotive infotainment subsystems, telecommunications protocol bridges, and general-purpose logic consolidation in place of discrete glue logic. The wide I/O count makes it particularly suited for parallel data acquisition and parallel-to-serial protocol conversion boards.
When designing with this device, use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and timing closure. Pay close attention to the FBGA-780 PCB land pattern and ensure adequate decoupling across the supply rails (VCCINT, VCCA, VCCIO banks) per the Cyclone IV E Hardware Reference.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations that complement (not duplicate) the manufacturer's datasheet, helping engineers evaluate the EP4CE40F29I8L for new designs or as a drop-in for end-of-life prior-generation parts.
Drop-in alternatives for EP4CE40F29I8L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F29I8L (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Configuration Modes, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE40F29I8LN
✅ Drop-In✓ In Stock
$150 / Unit
View Datasheet →EP4CE40F29I7N
✅ Drop-In✓ In Stock
$124 / Unit
View Datasheet →EP4CE40F29C8LN
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP4CE40F29C8N
✅ Drop-In✓ In Stock
$104.6 / Unit
View Datasheet →EP4CE40F29C8L
✅ Drop-In✓ In Stock
$78.36 / Unit
View Datasheet →EP4CE40F29C7N
✅ Drop-In✓ In Stock
$55.85 / Unit
View Datasheet →EP4CE40F29I8L Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Logic Elements (LEs) | 39,600 |
| Embedded Memory | 1,161,216 bits (116 M9K blocks) |
| Embedded 18x18 Multipliers | 116 |
| Phase-Locked Loops (PLLs) | 4 |
| Maximum User I/O | 532 |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.2 V (nominal) |
| Operating Temperature | -40C to +100C (industrial) |
| Package | 780-pin FBGA (FineLine BGA) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Modes | AS, PS, JTAG, FPP |
| Logic Array Blocks (LABs) | 2475 |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL |
| RoHS Status | Compliant |
EP4CE40F29I8L 780-pin fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP4CE40F29I8L (780-pin fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE40F29I8L.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE40F29I8L is suitable for 7 applications: Industrial Machine Vision, Video Processing & Display Controllers, Motor Control & Industrial Drive, Telecommunications Protocol Bridges, Medical Imaging Data Acquisition, Logic Consolidation / Glue Logic Replacement, Industrial Test & Measurement Equipment.
Industrial Machine Vision
The EP4CE40F29I8L is well suited to industrial machine-vision preprocessing boards where its 39,600 LEs and 116 18x18 multipliers accelerate Bayer-to-RGB demosaicing, edge-detection convolutions, and pixel-level thresholding pipelines running on parallel image data from MIPI or LVDS image sensors. With 532 user I/Os the FPGA can simultaneously capture from multiple camera lanes (such as four Camera-Link channels) and drive a GigE Vision or USB3 Vision output, while the four PLLs synthesize independent pixel-clock domains for sensor and back-end interfaces. Industrial temperature rating ensures reliable operation in factory-floor enclosures where ambient temperatures routinely exceed 70C.
Recommended
Video Processing & Display Controllers
Multi-format video bridging boards benefit from the EP4CE40F29I8L's abundant logic, 116 multipliers for chroma upscaling and color-space conversion (YUV to RGB, BT.601 to BT.709), and 532 I/Os that simultaneously drive HDMI/DVI input, LVDS LCD output, and parallel RGB interfaces. The 1,161,216 bits of embedded M9K memory provide frame-buffer line stores without requiring external SRAM, reducing BOM cost in mid-resolution display pipelines up to 1080p60.
Recommended
Motor Control & Industrial Drive
In multi-axis servo and stepper motor controllers, the EP4CE40F29I8L's 116 18x18 multipliers implement Field-Oriented Control (FOC) math, PID loops, and SVPWM modulation for 3 to 6 simultaneous axes. The 532 I/Os handle quadrature encoder inputs, Hall-sensor inputs, PWM outputs to gate drivers, and SPI/I2C communication to power-stage MCUs, while the four PLLs generate precisely phased carrier frequencies. Industrial temperature rating and the 780-FBGA's robust thermal performance suit inverter enclosures near power-switching heat sources.
Recommended
Telecommunications Protocol Bridges
The EP4CE40F29I8L serves as a flexible protocol bridge between legacy telecom interfaces (E1/T1, RS-422, V.35) and modern packet-based backplanes, leveraging its 532 I/Os for parallel bus fan-in/fan-out and its 116 multipliers for HDLC framing, scrambling, and CRC acceleration. The four PLLs derive independent clock domains for each line interface, while 1,161 Kbits of embedded memory buffer packets between mismatched clock domains without external SRAM.
Recommended
Medical Imaging Data Acquisition
Portable ultrasound, patient-monitoring, and point-of-care diagnostic systems use the EP4CE40F29I8L to digitize analog front-end signals, run digital beamforming or FIR decimation filters using the 116 multipliers, and pre-process data streams before forwarding to an application processor. The 532 I/Os support multi-channel ADC/DAC connections (16-channel at 16-bit), while embedded M9K memory provides sample-rate buffering. Industrial temperature grade accommodates clinical and field-deployed medical enclosures.
Recommended
Logic Consolidation / Glue Logic Replacement
Designers often use the EP4CE40F29I8L to replace dozens of discrete 74-series logic, bus transceivers, and small CPLDs on legacy boards, consolidating them into a single programmable device with 532 I/Os. The FPGA's abundant LE count allows fine-grained mapping of address decoders, wait-state generators, interrupt controllers, and custom bus-arbitration logic. Migration from a discrete-logic board typically reduces PCB area by 60-70% and improves noise immunity by shortening signal traces.
Recommended
Industrial Test & Measurement Equipment
ATE platforms and bench-top instruments leverage the EP4CE40F29I8L for pattern generation, protocol-aware stimulus generation, and real-time signal analysis. The 116 hardware multipliers accelerate FFT, correlation, and digital-filter computations, while 532 I/Os provide direct connections to high-pin-count test fixtures. Industrial temperature operation and the rugged 780-FBGA package suit laboratory and production-floor environments with thermal cycling.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F29I8L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F29I8LN | EP4CE40F29I7N | EP4CE40F29C8LN | EP4CE40F29C8N | EP4CE40F29C8L | EP4CE40F29C7N |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA (F29) | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 39,600 | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same |
| Embedded Memory | 1,161,216 bits | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same |
| 18x18 Multipliers | 116 | 116 - same | 116 - same | 116 - same | 116 - same | 116 - same | 116 - same |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same | Industrial - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 8 | 8 - same | 7 (~10% lower fMAX) | 8 - same | 8 - same | 8 - same | 7 (~10% lower fMAX) |
| Lead-Free Terminal Finish | No (leaded) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | No (leaded) | Yes (Pb-free) |
Key Differentiators
- Highest speed grade (-8) within the industrial-temperature EP4CE40 F29 family (vs EP4CE40F29I7N)
- Industrial temperature grade with maximum user I/O count (vs EP4CE40F29C8LN)
- Leaded terminal finish for backward compatibility with SnPb assembly processes (vs EP4CE40F29I8LN)
Design Notes
The 780-FBGA package has a typical theta-JA of approximately 8-12 C/W with the recommended PCB land pattern and a 2x2 array of thermal vias beneath the center balls. For designs expected to dissipate more than 2 W of continuous FPGA power (typical for designs using 50%+ of LEs at 100 MHz), increase the top-side copper area connected to GND balls and ensure at least six thermal vias per power/ground ball cluster. Without adequate thermal relief, junction temperatures may exceed 100C in sealed enclosures.
Decoupling for the EP4CE40F29I8L follows the Cyclone IV E reference schematic: place one 0.1 uF X7R 0402 or 0201 ceramic capacitor within 100 mils of every VCCINT and VCCIO ball cluster, plus bulk 100 uF tantalum or polymer capacitors at each power-rail entry point. Use a four-layer PCB with dedicated VCCINT and GND planes; route VCCIO bank supplies in a star topology from a ferrite-bead-isolated LDO per bank to keep switching noise between banks isolated.
Use the Intel-provided IBIS models for SI simulation of LVDS and SSTL interfaces. Match trace lengths within 50 mils for source-synchronous DDR interfaces, and within 10 mils for LVDS pairs. Keep clock and global signal routing on inner layers with reference to a continuous ground plane. Avoid routing signal traces beneath the FBGA footprint; reserve all inner-layer copper directly under the BGA for thermal vias and power-plane stitching.
Do not confuse the EP4CE40F29 (780-FBGA) variant with the EP4CE40F23 (484-FBGA) variant - they have entirely different pin maps and are not PCB-compatible. Also ensure the configuration mode selection pins (MSEL[3:0]) are strapped to the correct logic levels for the chosen programming mode (AS, PS, JTAG, or FPP) before power-up; incorrect MSEL strapping leaves the device in an undefined state after configuration.
Compliance Information
RoHS and REACH compliant per Intel product declaration. The L (no suffix after speed grade) terminal finish is matte-tin with SnPb lead-bearing solder balls - choose the LN-suffix variant for Pb-free-only assembly lines. Not AEC-Q100 qualified; choose automotive-grade Cyclone V or Cyclone 10 LP variants for AEC-Q100 applications.
