EP3CLS70U484I7 - Cyclone III LS FPGA 70K LEs 484-FBGA | Altera
MPN: EP3CLS70U484I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.4 | $78.40 |
| 10 | $71.2 | $712.00 |
| 100 | $64.8 | $6,480.00 |
| 500 | $58.5 | $29,250.00 |
| 1,000 | $52.3 | $52,300.00 |
EP3CLS70U484I7 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that can be reconfigured by the designer after manufacturing. FPGAs sit between fixed-function ASICs and software-driven processors in the compute hierarchy - offering hardware parallelism and custom logic without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low static power (approximately 0.25 W typical for this density) and high logic density per dollar for high-volume applications such as industrial control, video processing, and communications infrastructure.
Key features of this part include 70,208 logic elements, 4 M9K memory blocks totaling approximately 3 Mb of RAM, 4 PLLs, 247 embedded multipliers (18x18), and 20 global clock networks. The device operates from a 1.2 V core supply with separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V I/O standards including LVDS, LVTTL, SSTL, and PCI Express. Configuration is supported via JTAG, passive serial, active serial (EPCS), and fast passive parallel modes using external configuration devices.
Architecturally, the Cyclone III LS uses a 60 nm process technology and incorporates hard memory blocks (M9K) and hard multiplier blocks distributed across the fabric, providing deterministic performance for DSP and data-path operations. The 484-UBGA package has a 1.0 mm ball pitch in a 19x19 mm body, with 278 user I/O pins allocated across 8 I/O banks. Memory interfaces up to DDR2/DDR SDRAM are supported via soft PHY in the Quartus II design software.
Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment prototypes, low-cost ASIC prototyping, PCI Express endpoint bridges, and consumer display controllers. The industrial temperature grade also makes it suitable for outdoor telecom equipment and factory automation where commercial-grade parts would fail. The 70K LE density is well-matched to medium-complexity designs that exceed typical CPLD capacity but do not justify higher-density FPGAs.
When designing with this part, careful attention must be paid to the four configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) and the dual-purpose nature of shared pins - some user I/O pins double as configuration or JTAG pins and must be correctly assigned in the Quartus pin planner. The 1.0 mm ball pitch of the UBGA-484 package requires ENIG or OSP surface finish and 4-6 layer PCB stackup with microvia or via-in-pad for breakout routing.
Drop-in alternatives for EP3CLS70U484I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70U484I7 (same form factor and footprint) — differing in Process Technology, Package, Embedded 18x18 Multipliers, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS100U484I7
✅ Drop-In✓ In Stock
$188 / Unit
View Datasheet →EP3CLS70U484C8N
✅ Drop-In✓ In Stock
$244.2 / Unit
View Datasheet →EP3CLS70U484C7N
✅ Drop-In✓ In Stock
$128.1 / Unit
View Datasheet →EP3CLS70U484C8
✅ Drop-In✓ In Stock
$245.9 / Unit
View Datasheet →EP3CLS70U484C7
✅ Drop-In✓ In Stock
$55.75 / Unit
View Datasheet →EP4CE70F484I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3CLS70U484I7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 70,208 |
| Number of Logic Blocks | 4,612 |
| Total Memory Bits | 3,068,928 (3 Mb) |
| Number of M9K Memory Blocks | 247 |
| Number of Embedded 18x18 Multipliers | 247 |
| Number of PLLs | 4 |
| User I/O Pins | 278 |
| Package Type | 484-FBGA / 484-UBGA (UBGA-484) |
| Package Size | 19 mm x 19 mm |
| Ball Pitch | 1.0 mm |
| Core Supply Voltage | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Modes | JTAG, Passive Serial, Active Serial, Fast Passive Parallel |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
| Mounting Type | Surface Mount (BGA) |
EP3CLS70U484I7 19 mm x 19 mm Pin Configuration Guide
Pin configuration for EP3CLS70U484I7 (19 mm x 19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS70U484I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS70U484I7 is suitable for 6 applications: Industrial Motor Control, Video Surveillance & Image Processing, Automotive Infotainment Prototyping, ASIC Prototyping & Emulation, PCI Express Endpoint Bridge, Consumer Display Controllers.
Industrial Motor Control
The EP3CLS70U484I7 fits industrial motor control because its 70K logic elements and 247 embedded 18x18 multipliers implement multi-axis Field-Oriented Control (FOC) algorithms with hardware parallelism that no microcontroller can match. The 247 M9K memory blocks buffer three-phase PWM duty cycles and quadrature encoder feedback in real time, while the four PLLs generate the high-frequency carrier clocks required for 20 kHz+ PWM switching. Designers typically place the FPGA between a 32-bit MCU (for command interface) and three-phase IGBT/MOSFET gate drivers, achieving sub-microsecond control loop latency.
Recommended
Video Surveillance & Image Processing
The EP3CLS70U484I7 is well matched to video surveillance because its 247 multipliers implement real-time Sobel edge detection, motion estimation, and H.264 baseline encode at D1 (720x576) resolution. The 3 Mb of M9K RAM line-buffers incoming video streams with no external memory bottleneck at 27 MHz pixel clock. The 8 I/O banks interface simultaneously to CMOS image sensors (LVDS), DDR2 frame buffer memory, and an Ethernet PHY for streaming output, with the industrial temperature rating enabling outdoor IP camera deployments.
Recommended
Automotive Infotainment Prototyping
The EP3CLS70U484I7's industrial temperature rating and 70K logic elements support automotive infotainment prototypes where engineers validate LVDS display panels, CAN bus bridges, and MOST network interfaces before committing to an ASIC. Its 247 multipliers handle audio DSP for hands-free telephony and active noise cancellation, while 4 PLLs generate the precise pixel clocks required by WVGA and qHD automotive displays. Although not AEC-Q100 qualified, the industrial temp grade is widely accepted for in-cabin prototyping where -40C to +100C operation is mandatory.
Recommended
ASIC Prototyping & Emulation
The EP3CLS70U484I7 is widely used as a cost-effective ASIC prototyping platform because 70K logic elements and 3 Mb of distributed RAM can map mid-complexity ASIC RTL at 1:1 gate equivalence. Designers partition large ASICs across multiple FPGAs using the 278 user I/O pins for inter-FPGA communication, then validate system behavior at near-ASIC speed before tapout. The Cyclone III LS variant reduces static power versus the base Cyclone III, allowing longer validation runs without thermal throttling.
Recommended
PCI Express Endpoint Bridge
The EP3CLS70U484I7 supports PCI Express Gen1 endpoint operation through Altera's hard PCIe IP block, providing a low-cost bridge for legacy parallel bus systems to PCIe x1 lanes. The 70K logic elements implement custom DMA engines and protocol conversion while the 247 multipliers accelerate data-path operations. With 278 I/O pins the FPGA connects to legacy 32-bit parallel buses, DDR2 buffers, and the PCIe PHY simultaneously, achieving 250 MB/s sustained throughput.
Recommended
Consumer Display Controllers
The EP3CLS70U484I7 drives consumer LCD and OLED display controllers because its 247 multipliers perform real-time color management, gamma correction, and image scaling from FHD (1920x1080) sources to panel-native resolutions. The 4 PLLs generate independent pixel clocks for dual-display outputs, while the 8 I/O banks support LVDS, mini-LVDS, and RSDS panel interfaces simultaneously. The industrial temperature rating enables use in kiosks and digital signage where ambient temperatures exceed commercial-grade specs.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70U484I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS100U484I7 | EP3CLS70U484C8N | EP3CLS70U484C7N | EP4CE70F484I7N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-UBGA | 484-UBGA | 484-UBGA | 484-UBGA | 484-FBGA |
| Logic Elements | 70,208 | 100,448 | 70,208 | 70,208 | 70,208 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Industrial |
| Speed Grade | 7 | 7 | 8 | 7 | 7 |
| Embedded Memory | 3,068,928 bits | 3,888,896 bits | 3,068,928 bits | 3,068,928 bits | 2,810,880 bits |
| Embedded 18x18 Multipliers | 247 | 266 | 247 | 247 | 266 |
| User I/O Pins | 278 | 278 | 278 | 278 | 290 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.0 V |
| Approx. Unit Price (USD, qty-1) | $78.40 | $115.00 | $68.00 | $65.00 | $72.00 |
Key Differentiators
- Same-package logic density upgrade path to 100K LEs (vs EP3CLS100U484I7)
- Industrial temperature range for harsh environments (vs EP3CLS70U484C7N)
- Low static power Cyclone III LS sub-family (vs EP3C70U484I7 (base Cyclone III))
Design Notes
The 484-UBGA package uses 1.0 mm ball pitch on a 19x19 mm body. PCB fabrication requires ENIG surface finish and 4-6 layer stackup with 0.4 mm microvia or via-in-pad for inner-row signal breakout. Per IPC-7351B and the Altera AN 315 guidelines, ball pads should be 0.5 mm NSMD (non-solder-mask defined) with 0.25 mm solder-mask opening to maximize self-alignment during reflow. Thermal pad connection should use a 5x5 via array (0.3 mm drill, 0.5 mm pitch) to inner ground plane for heat dissipation.
Core power (VCCINT) requires a low-noise 1.2 V regulator capable of supplying approximately 1.5-2.5 A peak during configuration and full utilization. Per Altera's Cyclone III PowerPlay analysis, the LS variant at 70K LEs typically draws 0.5-1.0 A steady-state depending on toggle rate. Decoupling requires 0402-size 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of every VCCINT/VCCIO ball pair, with bulk 220 uF polymer capacitors on the supply rails. PLL analog supplies (VCCA_PLL) need pi-filter isolation from digital VCCINT to meet jitter spec.
The MSEL[3:0] pins must be tied to select configuration mode - AS (active serial EPCS) requires MSEL=00000, PS (passive serial) requires MSEL=00010, JTAG-only requires MSEL=10010. nCONFIG must be tied to VCCIO through a 10 kohm pull-up; if left floating, partial power-up transients can trigger unintended reconfiguration. CONF_DONE and nSTATUS require 10 kohm pull-ups to VCCIO. The JTAG chain (TCK, TMS, TDI, TDO) must follow the 4-wire IEEE 1149.1 topology with 10 kohm pull-ups on TCK and TMS to prevent floating-state scan errors.
LVDS inputs require 100-ohm differential termination across each LVDS pair; the Cyclone III supports on-chip differential termination (OCT) via Quartus pin assignment, eliminating external resistor networks. For DDR2 interfaces operating at 200 MHz, route signals to inner stripline layers with controlled impedance 50 ohm single-ended / 100 ohm differential and length-match within +/-25 ps. Per the Altera External Memory Interface Handbook, use fly-by topology for multi-rank DIMMs to reduce simultaneous-switching noise on the address/command bus.
Estimated: At maximum utilization (70K LEs at 100 MHz toggle rate), the EP3CLS70U484I7 dissipates approximately 1.5-2.0 W steady-state. With theta_JA of approximately 18 C/W for the 484-UBGA on a standard 4-layer JEDEC test board, junction temperature rise above ambient is approximately 27-36 C - well within the 100 C industrial limit. In enclosed housings with no airflow, derate by 25% and verify with on-board thermal sensor via the built-in Cyclone III temperature-sensing diode.
Compliance Information
RoHS and REACH compliant per Altera/Intel material declaration. Not AEC-Q100 qualified; industrial temperature grade only. Halogen-free per JEDEC JS709B. Conflict minerals compliant under Section 1502 of the Dodd-Frank Act.
