EP3C80F484I7N - Cyclone III FPGA 81K LE 484-FBGA | Intel
MPN: EP3C80F484I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $453.85 | $453.85 |
| 10 | $408.46 | $4,084.60 |
| 100 | $363.08 | $36,308.00 |
| 500 | $322.53 | $161,265.00 |
| 1,000 | $286.91 | $286,910.00 |
EP3C80F484I7N Overview
A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as memory blocks, multipliers, PLLs, and transceivers, all of which can be re-programmed in the field to implement arbitrary digital logic. FPGAs sit hierarchically between standard microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). Within the broader taxonomy, the EP3C80F484I7N belongs to the Cyclone III family, which is itself a low-power, high-volume sub-family of Intel's FPGA portfolio aimed at industrial, automotive driver-assist, video, and communications designs.
Key features of the EP3C80F484I7N include 81,264 logic elements, 2,810,880 RAM bits distributed across M9K memory blocks, 244 dedicated 18x18 multipliers (sufficient for DSP-class workloads such as video processing or software-defined radio baseband), four general-purpose PLLs, and 295 user I/O. The device is built on a 60 nm low-power process and operates from a 1.2 V core supply (VCCINT 1.15 V to 1.25 V), with separate VCCIO banks that support 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V interfacing.
Architecturally, the device pairs an SRAM-based LUT fabric with embedded hard IP - including M9K memory blocks, 18x18 multipliers, and PLLs - to deliver a balanced logic/memory/DSP ratio at lower static and dynamic power than prior Cyclone generations. The 60 nm process and optimized clock network allow typical commercial applications to operate without active thermal management even at full utilization.
Typical applications include industrial motor control and machine vision, video surveillance and image processing pipelines, software-defined radio (SDR) baseband, automotive driver-assistance subsystems, and low-cost ASIC prototyping. The wide VCCIO support enables direct bridging between 3.3 V legacy peripherals and 1.8 V modern serializer/deserializer links without external level shifters.
When designing with the EP3C80F484I7N, ensure that the Quartus II toolchain (version 13.0sp1 or later with device support, or Quartus Prime 17.0 legacy mode) is used; that all VCCINT and VCCIO rails are decoupled per the AN 529 design guidelines; and that JTAG and configuration pin pull-ups are correctly placed for the selected configuration mode (AS, PS, JTAG, or Fast Passive Parallel).
This page synthesizes distributor pricing, verified drop-in equivalents within the Cyclone III family, and practical Quartus design notes that are not duplicated in any single manufacturer document - giving procurement and design engineers a single landing page for the EP3C80F484I7N.
Drop-in alternatives for EP3C80F484I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C80F484I7N (same form factor and footprint) β differing in Package, Process Technology, Speed Grade, Logic Array Blocks (LABs), Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3C80F484I7
β Drop-Inβ In Stock
$105.3 / Unit
View Datasheet βEP3C80F484C7N
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$306.54 / Unit
View Datasheet βEP3C80F484C8N
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$208.75 / Unit
View Datasheet βEP3C55F484I7N
β Drop-Inβ In Stock
$205.4 / Unit
View Datasheet βEP3C120F484I7N
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$84.7 / Unit
View Datasheet βEP3C80F484I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 81,264 |
| Embedded Memory (RAM bits) | 2,810,880 |
| User I/O Count | 295 |
| Number of Logic Blocks / CLBs | 81,264 |
| Core Supply Voltage VCCINT | 1.15 V to 1.25 V (nominal 1.2 V) |
| I/O Supply Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Maximum Internal Clock Frequency | 472.5 MHz |
| Number of PLLs | 4 |
| Number of 18x18 Multipliers | 244 |
| Process Technology | 60 nm low-power CMOS, SRAM-based |
| Operating Temperature (Junction) | -40C to +100C (industrial I7 grade) |
| Package | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | 3 |
| Configuration Method | AS / PS / JTAG / FPP |
EP3C80F484I7N 484-ball fbga, 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP3C80F484I7N (484-ball fbga, 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C80F484I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C80F484I7N is suitable for 6 applications: Industrial Motor Control and Drive, Video Surveillance and Image Processing, Software-Defined Radio (SDR) Baseband, Automotive Driver-Assistance Systems (ADAS), Low-Cost ASIC Prototyping, Industrial Communication Gateways.
Industrial Motor Control and Drive
The EP3C80F484I7N is well suited to industrial motor control, including field-oriented control (FOC) of three-phase AC induction and PMSM drives. Its 244 dedicated 18x18 multipliers implement Park/Clarke transforms, PI controllers, and SVM modulators in hardware without taxing the soft logic fabric. The 472.5 MHz PLL output drives high-resolution PWM timers down to sub-microsecond switching periods, while the 1.2 V low-power core reduces inverter heat-load. The 295 user I/O in the 484-FBGA package provide ample GPIO for encoder inputs, gate-driver signals, and isolated communication channels. Industrial-grade -40C to +100C operation is critical for cabinet environments near motors and power electronics.
Recommended
Video Surveillance and Image Processing
The EP3C80F484I7N handles real-time video pipelines (deinterlacing, scaling, motion detection, H.264 pre-processing) in cost-sensitive surveillance designs. The 2,810,880 bits of embedded RAM buffer multiple CIF or D1 video frames on-chip, eliminating external SDRAM for many designs. The 244 18x18 multipliers accelerate DCT/IDCT and SAD computations for motion estimation, while 295 user I/O accommodate parallel CMOS sensor inputs, BT.656 streams, and DDR2/DDR3 memory channels. The 1.2 V core plus flexible VCCIO banks interface directly to 3.3 V legacy camera links and 1.8 V modern MIPI bridges without external level shifters.
Recommended
Software-Defined Radio (SDR) Baseband
The EP3C80F484I7N implements the digital baseband of software-defined radios, including channelization, DDC/DUC, and demodulation, when paired with an external ADC/DAC. The 244 hardware multipliers execute polyphase FIR filterbanks and FFT butterfly computations at sample rates up to ~100 MSPS. Four general-purpose PLLs generate baseband clocks, ADC sampling clocks, and data-converter synchronization references, while the 472.5 MHz fabric supports oversampled baseband processing. The wide VCCIO bank support simplifies glueless interfaces to 14-/16-bit ADC/DAC devices from Analog Devices, and the 295 user I/O carry LVDS data and sync signals across the board.
Recommended
Automotive Driver-Assistance Systems (ADAS)
The EP3C80F484I7N is used in entry-level ADAS platforms where cost and density dominate over AEC-Q100 requirements. Designers implement rear-view camera overlays, lane-departure warning preprocessing, and ultrasonic sensor fusion on the device. Its 244 multipliers accelerate Sobel edge detection and optical-flow kernels at 30-60 fps, while 2,810,880 bits of embedded RAM buffer multiple camera frames for latency-tolerant processing pipelines. The 295 user I/O accept LVDS camera inputs and CAN/LIN automotive bus bridges. Note that the EP3C80F484I7N is industrial-grade, not AEC-Q100; AEC-Q100 designs should select the dedicated EP3C80 automotive part instead.
Recommended
Low-Cost ASIC Prototyping
The EP3C80F484I7N serves as a hardware verification platform for ASIC RTL prior to tape-out, especially for SoCs in the 50K-100K gate-equivalent range. The Quartus II toolchain supports rapid design iteration with on-chip SignalTap II logic analyzer debug, allowing real-time visibility into prototype behavior without breaking out I/O. The 484-ball FBGA and 295 user I/O provide sufficient pins for prototyping ASIC pad-limited designs with multiple bus interfaces (parallel DDR, NAND, Ethernet MAC, I2C, SPI). Industrial-grade operation enables prototype verification at environmental extremes.
Recommended
Industrial Communication Gateways
The EP3C80F484I7N powers multi-protocol industrial gateways converting between EtherCAT, PROFINET, EtherNet/IP, Modbus TCP, and serial fieldbuses. The 244 multipliers accelerate CRC and checksum offload, while 295 user I/O accommodate multiple isolated Ethernet PHYs, RS-485 transceivers, and CAN-FD controllers. Four PLLs generate independent clocks for each Ethernet MAC and the time-sensitive networking (TSN) reference. Industrial temperature support (-40C to +100C) enables DIN-rail mounted operation in factory automation cabinets. The low 1.2 V core power reduces thermal load in sealed enclosures without fans.
Recommended
Recommended Products Summary
Engineering reference data for EP3C80F484I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C80F484I7 | EP3C80F484C7N | EP3C80F484C8N | EP3C55F484I7N | EP3C120F484I7N |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA (23x23 mm, 1.0 mm pitch) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 55,856 | 119,088 |
| Embedded RAM (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,396,160 | 3,981,312 |
| User I/O | 295 | 295 | 295 | 295 | 321 | 283 |
| 18x18 Multipliers | 244 | 244 | 244 | 244 | 156 | 288 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Speed Grade | I7 (industrial) | I7 (industrial) | C7 (commercial) | C8 (commercial, faster) | I7 (industrial) | I7 (industrial) |
Key Differentiators
- Highest-density Cyclone III device in the 484-FBGA package (vs EP3C55F484I7N)
- Industrial temperature range vs commercial-only equivalents (vs EP3C80F484C7N)
- 244 18x18 hardware multipliers in the 484-FBGA package (vs EP3C40F484I7N)
Design Notes
The EP3C80F484I7N requires at minimum a 1.2 V VCCINT rail with +/-25 mV tolerance for VCCINT and 2.5 V / 3.3 V rails for VCCA and VCCD_PLL. Apply Intel's recommended decoupling scheme: 1uF and 0.1uF ceramic capacitors per VCCINT pin pair, plus 10uF bulk tantalum or ceramic at the regulator output. Estimate: at 50% toggle rate and typical utilization, ICCINT is approximately 1.0-1.5 A, requiring a switching regulator with at least 3 A peak capability. Skip a linear regulator for VCCINT unless you are operating below 20% utilization - efficiency drops below 50% and thermal dissipation becomes problematic.
The 484-FBGA package has a theta_JA of approximately 12-15 C/W (with 4-layer PCB and adequate thermal vias in the BGA breakout pattern). Estimate: at full utilization (50K LE switching at 200 MHz), internal dissipation can reach 4-6 W, giving junction temperature rise of 50-90 C above ambient. For sealed industrial enclosures with 70C ambient, ensure the PCB has at least 16 thermal vias under the BGA and continuous copper pours on all inner layers connected to GND. Heat sinks are typically not required for Cyclone III devices at commercial workloads, but design the PCB thermal stack-up conservatively.
Use a minimum 4-layer PCB stack-up for the 484-FBGA with 1.0 mm pitch BGA breakout. Fan-out all BGA balls to through-vias with 0.5 mm pad / 0.2 mm hole geometry on the top layer, then escape to inner layers. Maintain at least 4 ground vias within the BGA field to provide a low-impedance return path for high-speed signals. Series-terminate LVDS pairs with 100-ohm differential impedance, and length-match within 150 mils. JTAG and configuration signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) require 4.7 kohm pull-ups per the Cyclone III configuration handbook.
Do not use the EP3C80F484I7N in designs that exceed the -40C to +100C junction range - the I7 suffix denotes industrial (not extended industrial -40C to +125C). Quartus II version 13.0sp1 or Quartus Prime 17.0 legacy mode is required for Cyclone III device support; newer Quartus Prime versions drop Cyclone III from the device list. The MSL3 moisture sensitivity rating requires pre-assembly floor-life tracking and bake-out if exposure exceeds 168 hours - follow JEDEC J-STD-033 handling. When migrating to the C7N or C8N temperature/speed variants, do not assume bitstream compatibility for designs that include temperature-sensitive on-chip sensors or hard IP behavior.
Compliance Information
RoHS compliance and lead-free finish indicated by the 'N' suffix in the part number, per the Altera/Intel ordering information convention. REACH, halogen-free, and conflict-minerals status not present in the verified web data and should be confirmed via Intel's Product Content Declaration database for production designs.
