Intel

EP3CLS150F484C7N - Cyclone III LS FPGA 150K LE | Intel / Altera

MPN: EP3CLS150F484C7N ✓ Active

In Stock Ships in 1-3 business days

1.2 V Vdss 484-pin FBGA (1.0 mm pitch) Package 437.5 MHz Speed 6,137,856 Memory

From $102.75 USD / Unit

MOQ: 1 |

Price updated: 2026-09-09

Volume Pricing

Qty	Unit Price	Extended
1	$142.5	$142.50
10	$128.2	$1,282.00
100	$115	$11,500.00
250	$108.4	$27,100.00
500	$102.75	$51,375.00

ℹ️ All prices are in USD

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EP3CLS150F484C7N Overview

The Intel / Altera (formerly Altera) EP3CLS150F484C7N is a Cyclone III LS family Field-Programmable Gate Array (FPGA) with 150,848 logic elements, fabricated on a low-power 65 nm process and housed in a 484-ball FineLine BGA (FBGA) package. The device integrates 6,137,856 bits of embedded memory, 210 DSP blocks, and supports up to 226 user I/O pins operating at 1.2 V core with 437.5 MHz maximum internal performance.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LABs), programmable routing, and embedded hard IP such as DSP blocks and RAM into a single semiconductor IC. FPGAs sit at the top of the digital logic hierarchy (FPGA -> programmable logic -> ASIC alternative -> semiconductor IC) and are widely used to implement parallel data processing, custom bus interfaces, and hardware acceleration functions without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low-power, security-enhanced applications with features such as bitstream encryption and CRC error detection.

Key features of the EP3CLS150F484C7N include 9,428 logic array blocks (LABs), 226 maximum user I/Os, four phase-locked loops (PLLs), and support for external memory interfaces including DDR/DDR2 SDRAM. The device operates over the commercial 0 °C to 85 °C junction temperature range (C-grade) and provides 1.2 V core operation with hot-socketing support and power-on reset. The 484-FBGA package uses a 1.0 mm ball pitch and is backward-compatible with the Cyclone III GX footprint family for board reuse.

In terms of architecture, the Cyclone III LS family uses a 65 nm TSMC process with a logic-structure optimized for low static and dynamic power. Compared with the original Cyclone III, the LS variant adds bitstream AES encryption, JTAG-based configuration, and enhanced SEU/CRC detection that suits safety-critical designs. Designers can map IP cores, soft microcontrollers (NIOS II), and DSP blocks through Intel Quartus II design software.

Typical applications include industrial motor control, factory automation, video surveillance, automotive infotainment prototyping, software-defined radio (SDR), and embedded vision. Its combination of moderate logic density (150 K LE), low power, and security features makes it well-suited for cost-sensitive designs that previously required ASIC investment.

When designing with the EP3CLS150F484C7N, allocate sufficient PCB layers (typically 4 to 6) to maintain signal-integrity for LVDS and DDR2 memory interfaces, and observe the 1.0 mm BGA pitch clearance for via-in-pad and microvia fan-out. Decoupling must follow the Quartus II pin connection guidelines for clean power-rail delivery.

This page synthesizes distributor stock and pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes not found on the manufacturer product page.

Drop-in alternatives for EP3CLS150F484C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3CLS150F484C7N (same form factor and footprint) — differing in Package, Process Technology, Logic Elements (LE), Operating Temperature, Configuration Method.

EP3C120F484C7N

Intel

Package: 484-ball FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch

Logic Elements (LE): 119,088