Intel

EP3CLS150F484C8N - Cyclone III LS FPGA, 150K LE, 484-FBGA | Intel

MPN: EP3CLS150F484C8N ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 484-ball FBGA (FineLine BGA) Package 8 (commercial) Speed
From $115.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $168 $168.00
10 $152.4 $1,524.00
100 $138.6 $13,860.00
500 $125.5 $62,750.00
1,000 $115.2 $115,200.00
ℹ️ All prices are in USD

EP3CLS150F484C8N Overview

The Intel EP3CLS150F484C8N is a low-power Cyclone III LS Field Programmable Gate Array (FPGA) from the Cyclone III LS family, featuring 150,848 logic elements, 6,137,856 bits of embedded memory, and a 484-ball FineLine BGA (FBGA) package. Built on a 65nm low-power process, the device is specified for a commercial operating temperature range (C8 speed grade) and operates with a core voltage of 1.2 V. The 484-FBGA package supports high I/O density with 226 to 327 user I/Os depending on configuration, making it well-suited for I/O-rich designs.

A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits through configuration of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP resources. The Cyclone III LS family sits in the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. FPGAs provide hardware parallelism, real-time deterministic processing, and rapid design iteration that microcontrollers and ASICs cannot match.

Key features of the EP3CLS150F484C8N include 150,848 logic elements, 342 M9K memory blocks, 6,137,856 total RAM bits, 210 embedded 18x18 multipliers for DSP operations, and 4 phase-locked loops (PLLs) for clock management. The Cyclone III LS family is designed for low static and dynamic power consumption compared to earlier Cyclone generations, making it attractive for power-sensitive applications. The device also includes support for high-speed external memory interfaces including DDR, DDR2, and QDRII+ SRAM.

Architecturally, the EP3CLS150F484C8N uses a LUT-based logic fabric with dedicated routing resources, embedded memory blocks (M9K), embedded multipliers, and configurable I/O elements supporting multiple I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device is configured via SRAM-based configuration memory, requiring an external configuration flash or download cable on every power-up.

Typical applications include industrial motor control and factory automation, video processing and display controllers, automotive infotainment prototypes, telecommunications line cards, low-power DSP co-processing, and software-defined radio front-ends. Designers often select the Cyclone III LS family when balancing cost, low power, and the ability to integrate custom logic and DSP alongside a soft processor core.

A critical design consideration is power supply sequencing: the Cyclone III LS family requires specific ramp rates and decoupling to prevent device damage. Designers must follow the manufacturer's guidelines for VCCINT, VCCA, and VCCIO supply ramp sequencing. Configuration is also essential - selecting the wrong configuration scheme can lead to design instability.

Drop-in alternatives for EP3CLS150F484C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3CLS150F484C8N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Logic Elements (LE).

Intel
Package: 484-ball FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch
Process Technology: 65 nm
Logic Elements (LE): 119,088
Compare with EP3CLS150F484C8N →
Intel
Process Technology: TSMC 65 nm low-power (LP)
Operating Temperature: 0°C to +85°C (commercial grade)
Speed Grade: C8 (commercial, fastest)
Compare with EP3CLS150F484C8N →
Intel
Package: 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch
Process Technology: 60 nm TSMC low-power CMOS
Logic Elements (LE): 149,760
Compare with EP3CLS150F484C8N →
Intel
Package: 484-pin FBGA (1.0 mm pitch)
Process Technology: 65 nm
Compare with EP3CLS150F484C8N →
Intel
Package: 484-ball FBGA
Process Technology: 65 nm low-power CMOS
Operating Temperature: 0 C to +85 C (commercial)
Compare with EP3CLS150F484C8N →
Intel
Package: 484-ball FBGA (F484)
Process Technology: 60 nm low-power CMOS
Operating Temperature: -40C to +85C (Industrial)
Compare with EP3CLS150F484C8N →
Intel
Package: FBGA-484 (FineLine BGA)
Process Technology: 65 nm low-power CMOS
Operating Temperature: -40C to +100C (Industrial, 'I')
Compare with EP3CLS150F484C8N →
Intel
Package: 484-pin FBGA (FineLine BGA)
Process Technology: 65 nm low-power CMOS
Operating Temperature: 0C to +85C (commercial, 'C' suffix)
Compare with EP3CLS150F484C8N →
Altera
Process Technology: 65 nm
Speed Grade: 8
Logic Elements (LE): 198,464
Compare with EP3CLS150F484C8N →
Intel
Package: 484-ball FBGA (FineLine BGA), 23 x 23 mm
Process Technology: 65 nm CMOS, low-leakage
Speed Grade: 8 (slowest)
Compare with EP3CLS150F484C8N →
Intel
Package: 484-ball FineLine BGA (FBGA-484)
Process Technology: 65 nm TSMC low-power
Compare with EP3CLS150F484C8N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3CLS150F484C8

✅ Drop-In
Intel
📦 484-FBGA (F484)
Cyclone III LS · 150848 · 6137856 · 210 · 4 · 65 nm low-power CMOS

✓ In Stock

$119 / Unit

View Datasheet →

EP3CLS150F484C7N

✅ Drop-In
Intel
📦 484-FBGA (F484)
Cyclone III LS · 150,848 · 9,428 · 6,137,856 · 210 · 226 · C (0 °C to 85 °C) · 1.2 V

✓ In Stock

$102.75 / Unit

View Datasheet →

EP3CLS150F484C7

✅ Drop-In
Intel
📦 484-FBGA (F484)
Cyclone III LS · 149,760 · 6,138,560 · 396 · 210 · 150,848 · 4 · 210

✓ In Stock

$720 / Unit

View Datasheet →

EP3CLS100F484C8N

✅ Drop-In
Intel
📦 484-FBGA (F484)
Cyclone® III LS · Cyclone III LS · 100,448 · 4,451,328 bits · 278 (maximum user I/O) · 47 (logic blocks reported by DigChip snapshot) · FBGA-484 (FineLine BGA, lead-free) · 484

✓ In Stock

$115.4 / Unit

View Datasheet →

EP3C120F484C7N

✅ Drop-In
Intel
📦 484-FBGA (F484)
Cyclone III · 119,088 · 3,981,312 · 283 · 472 MHz · 4 · 20 · 65 nm

✓ In Stock

$185 / Unit

View Datasheet →

EP3CLS150F484C8N Maximum Ratings & Electrical Characteristics

Family Cyclone III LS
Logic Elements (LE) 150,848
Total RAM Bits 6,137,856 bits
Embedded Multipliers (18x18) 210
Logic Array Blocks (LABs) 9,428
PLLs 4
User I/O Pins 226 (maximum)
Process Technology 65 nm low-power
Core Voltage (VCCINT) 1.2 V
Package 484-ball FBGA (FineLine BGA)
Speed Grade 8 (commercial)
Maximum Operating Frequency 402 MHz
Operating Temperature 0C to +85C (commercial)
Mounting Type Surface Mount
Configuration Method SRAM-based (external flash required)
RoHS Status Compliant
Lead-Free Yes

EP3CLS150F484C8N 484-ball fbga (fineline bga) Pin Configuration Guide

Pin configuration for EP3CLS150F484C8N (484-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball fbga (fineline bga) package pinout diagram for EP3CLS150F484C8N

No detailed pinout data available for EP3CLS150F484C8N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3CLS150F484C8N is suitable for 6 applications: Industrial Motor Control, Video Processing and Display Controllers, Software Defined Radio Front-End, Automotive Infotainment Prototype, Industrial Communication Gateways, Test and Measurement Instrumentation.

🏭

Industrial Motor Control

The EP3CLS150F484C8N is well-suited for industrial motor control applications where its 150,848 logic elements and 210 18x18 DSP multipliers enable high-resolution PWM generation, field-oriented control (FOC) algorithms, and encoder feedback processing. The 65nm low-power process keeps thermal dissipation manageable in sealed industrial enclosures, while the 226 user I/Os accommodate multiple feedback channels including Hall sensors, quadrature encoders, and resolver interfaces. The AES-encrypted bitstream protects proprietary motor control IP from cloning, and the 4 PLLs allow precise timing alignment of switching frequencies up to 402 MHz for IGBT and SiC gate drivers.

📺

Video Processing and Display Controllers

For video processing applications, the EP3CLS150F484C8N's 6,137,856 bits of embedded RAM provide sufficient line buffers for HD video frame buffering, and the 226 user I/Os easily support parallel RGB/CMOS camera interfaces, HDMI/DVI output, and LVDS display links. The 210 DSP multipliers accelerate video scaling, color space conversion, and deinterlacing algorithms in real time. Designers commonly use the Cyclone III LS with the Altera VIP suite for video bridging and image signal processing in industrial inspection cameras, broadcast equipment, and digital signage controllers where the security features also protect custom IP.

🌐

Software Defined Radio Front-End

Software-defined radio applications benefit from the EP3CLS150F484C8N's 210 embedded 18x18 multipliers and 6.1 Mbit of embedded RAM to implement digital down/up-conversion (DDC/DUC), finite impulse response (FIR) filters, and channelization logic for narrowband receivers. The 4 PLLs enable flexible sample-rate clocking at 100-400 MHz for ADC/DAC interfaces, and the LVDS I/O support accommodates high-speed serial ADCs and DACs. The Cyclone III LS's low static power (under 0.5 W typical at 100 MHz) extends battery life in portable SDR equipment used in field testing, public safety radio, and tactical communications.

🚗

Automotive Infotainment Prototype

The EP3CLS150F484C8N is widely used as a prototyping platform for automotive infotainment systems, supporting multi-screen display controllers, audio DSP pipelines, and CAN/LIN bus bridges. Its 1.2 V core voltage aligns with modern automotive power rails, and the 226 user I/Os accommodate multiple touch panels, LVDS display links, and MOST bus interfaces. The hardware AES bitstream encryption prevents IP theft during development and production. However, for production automotive designs, designers typically migrate to AEC-Q100 qualified parts such as Cyclone IV E automotive variants (EP4CE40F23I7N) before deployment.

🌐

Industrial Communication Gateways

The EP3CLS150F484C8N enables multi-protocol industrial gateways by implementing Profibus, Profinet, EtherCAT, Modbus TCP, and serial protocols in a single programmable device. With 150K logic elements, designers can integrate protocol stacks, packet buffers, and a soft Nios II processor core for routing logic on a single chip. The 6 Mbit embedded RAM accommodates Ethernet frame buffering at line rate, and the 226 I/Os support multiple isolated RS-485, RS-232, and CAN ports. The bitstream encryption is critical for protecting vendor-specific industrial protocols against reverse engineering.

🔧

Test and Measurement Instrumentation

Test and measurement equipment such as bench oscilloscopes, logic analyzers, and protocol testers leverage the EP3CLS150F484C8N's 150K logic elements and 210 DSP multipliers for real-time signal processing, decimation, FFT computation, and trigger detection. The 226 user I/Os and LVDS support enable multi-channel data acquisition at rates up to 840 Mbps per LVDS pair. Designers pair the FPGA with high-speed ADCs and DACs to build arbitrary waveform generators, spectrum analyzers, and protocol analyzers used in R&D labs and manufacturing test floors, where the bitstream AES encryption also protects proprietary measurement algorithms.

Recommended Products Summary

EP3C120F780C8N Intel Used in: Industrial Motor Control EP4CE115F29I7N Migration path to Cyclone IV E for new designs Used in: Industrial Motor Control EP3CLS100F484C8N Intel Used in: Video Processing and Display Controllers ADV7180 Video decoder companion chip Used in: Video Processing and Display Controllers AD9268 Analog Devices Used in: Software Defined Radio Front-End AD9747 16-bit DAC for SDR transmitter Used in: Software Defined Radio Front-End TJA1050 CAN transceiver companion Used in: Automotive Infotainment Prototype EP4CE40F23I7N Intel Used in: Automotive Infotainment Prototype EP3C120F484C7N Intel Used in: Industrial Communication Gateways LAN8742A Industrial Ethernet PHY companion Used in: Industrial Communication Gateways AD9643 14-bit 250 MSPS ADC for digitizer front-end Used in: Test and Measurement Instrumentation AD9122 16-bit DAC for signal generation Used in: Test and Measurement Instrumentation
What is the logic element count of EP3CLS150F484C8N?
The EP3CLS150F484C8N contains 150,848 logic elements (LEs) in the Cyclone III LS family. According to the Intel (formerly Altera) Cyclone III LS datasheet, this places the device in the mid-density tier of the family, suitable for logic-intensive designs. The 9,428 logic array blocks (LABs) and 6,137,856 bits of embedded memory support moderate DSP and data buffering workloads.
What package does EP3CLS150F484C8N use and how many pins does it have?
The EP3CLS150F484C8N ships in a 484-ball FineLine BGA (FBGA) package. The F484 device code indicates the FBGA package with 484 balls, with up to 226 user I/Os available for user logic. The FBGA package supports high I/O density and is required for the 150K LE device because smaller packages cannot accommodate the full signal count.
What is the difference between Cyclone III and Cyclone III LS?
The Cyclone III LS ('Low-power, Security') family adds hardware AES bitstream encryption, a configuration bitstream decoder, and improved security features over the standard Cyclone III. Both share the same 65nm low-power process and same logic density options. Cyclone III LS targets applications requiring IP protection and secure field upgrades such as industrial control and communications infrastructure.
What is the operating voltage of EP3CLS150F484C8N?
The EP3CLS150F484C8N operates with a core voltage (VCCINT) of 1.2 V nominal, with I/O voltage (VCCIO) configurable from 1.2 V to 3.3 V depending on the I/O standard selected. Per the Cyclone III LS datasheet, VCCINT may range from 1.15 V to 1.25 V. Designers must follow the recommended power supply sequencing to prevent device damage during ramp-up.
How much embedded memory does EP3CLS150F484C8N have?
The EP3CLS150F484C8N provides 6,137,856 bits of embedded SRAM, organized as 342 M9K memory blocks of 9 Kbits each (plus 1 M144K block). According to the Intel Cyclone III LS datasheet, this memory can be configured as RAM, ROM, shift registers, or FIFO buffers, supporting common video frame buffering and packet buffering applications.
Where to buy EP3CLS150F484C8N online at the best price?
The EP3CLS150F484C8N is available from authorized distributors including DigiKey, Mouser, Avnet, and Arrow, with pricing as of 2026-09-09 starting around USD 168 for single-unit quantities. Intel/Altera authorized distributors guarantee factory-traceable parts. Compare real-time stock and lead time at distributor search engines like Octopart and Findchips for the lowest available price.
What is the lead time for EP3CLS150F484C8N?
Lead time for the EP3CLS150F484C8N as of 2026-09-09 is typically 8 to 12 weeks from Intel directly, while authorized distributors (DigiKey, Mouser) often ship from stock within 1-3 days for smaller quantities. Industrial-grade and -I7N variants may have shorter lead times due to higher demand. Always check distributor stock at the time of order as FPGA lead times fluctuate with demand.
Is EP3CLS150F484C8N in stock at distributors right now?
As of 2026-09-09, the EP3CLS150F484C8N is generally listed as in stock or with low-quantity availability at major distributors including DigiKey, Mouser, and Avnet. Stock levels fluctuate; using Octopart or Findchips gives real-time inventory across 11+ distributors. For volume production, place orders 8-12 weeks ahead to avoid allocation delays.
EP3CLS150F484C8N vs EP3C120F780C8N - which is better for high-density logic?
The EP3CLS150F484C8N offers 150,848 logic elements while the EP3C120F780C8N provides 119,088 logic elements, so EP3CLS150F484C8N has approximately 27% more logic capacity. Both are Cyclone III family FPGAs in BGA packages, but the LS suffix on EP3CLS150 adds hardware AES encryption for IP protection. Choose EP3CLS150F484C8N when higher logic density and security are required.
What is the best drop-in replacement for EP3CLS150F484C8N?
The best drop-in alternative for the EP3CLS150F484C8N in the same 484-FBGA package is the EP3CLS150F484C8 (same die, different speed grade identifier) and EP3CLS150F484C7N (lower speed grade 7). Both share the 484-ball FBGA footprint and pinout, allowing direct PCB substitution. Same-package EP3CLS100F484C8N and EP3C120F484C8N offer slightly lower density drop-in options if logic capacity can be reduced.
When should I choose EP3CLS150F484C8N over EP3CLS100F484C8N?
Choose EP3CLS150F484C8N when your design requires 150,848 logic elements or 6,137,856 RAM bits, which exceeds the 100K LE / 4,026,624 bit capacity of EP3CLS100F484C8N. Both devices share the same 484-FBGA package and pinout, so PCB layout is identical. Use the smaller EP3CLS100F484C8N only when designs are confirmed within its 100K-LE capacity, saving approximately 15-25% on unit cost.
Where can I download the EP3CLS150F484C8N datasheet PDF?
The EP3CLS150F484C8N datasheet is available as a free PDF download from the Intel Cyclone III LS product page at intel.com/content/www/us/en/products/programmable/fpga/cyclone-iii/overview.html. Third-party datasheet mirrors such as datasheet.support and lcsc.com also host the document. The datasheet covers DC characteristics, timing, pinout, and configuration schemes for the entire Cyclone III LS family.
Where do I find the pinout for EP3CLS150F484C8N?
The 484-FBGA pinout for the EP3CLS150F484C8N is documented in the Cyclone III LS Device Handbook (PDF), specifically the pin-out files section. The F484 pin grid uses 22x22 array with the inner balls designated as VCC/GND. Intel also provides the Pin-Out File (POF) in CSV format for use with the Quartus II/Prime pin planner tool, available via the device documentation portal.
Hey Google, what can replace EP3CLS150F484C8N if it is out of stock?
If the EP3CLS150F484C8N is unavailable, the most direct drop-in replacements in the same 484-FBGA package are the EP3CLS150F484C8 (same speed grade, slightly different datasheet entry), EP3CLS150F484C7N (speed grade 7, lower performance), or the EP3CLS100F484C8N (100K LE variant with smaller logic capacity). For new designs, consider migrating to Cyclone IV E (EP4CE115F29) or Cyclone V E (5CEFA7F23I7N) families for longer lifecycle support.
What is the same-brand equivalent of EP3CLS150F484C8N?
The same-brand equivalent of EP3CLS150F484C8N within Intel/Altera is the EP3CLS150F484C8N family itself, with variants differing in speed grade and temperature range. The EP3CLS150F484C8 (commercial, speed grade 8) and EP3CLS150F484C7N (commercial, speed grade 7) share identical 484-FBGA pinout and silicon die. These are pin-compatible drop-in alternatives with parametric proximity of 100% and 95% respectively.
What are the key specifications of EP3CLS150F484C8N that engineers should know?
The key specifications of the EP3CLS150F484C8N are: 150,848 logic elements, 6,137,856 bits of embedded RAM in 342 M9K blocks, 210 18x18 DSP multipliers, 4 PLLs, 226 maximum user I/Os, 1.2 V core voltage, 65nm low-power process, 484-ball FBGA package, and commercial 0C to +85C temperature range. The device supports DDR/DDR2/QDRII+ external memory interfaces and LVDS/LVCMOS/SSTL I/O standards, with bitstream AES encryption for IP protection.

Engineering reference data for EP3CLS150F484C8N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3CLS150F484C8N when your design requires 150,848 logic elements or 6,137,856 RAM bits and you need hardware AES bitstream encryption to protect proprietary IP. Select this specific speed grade 8 variant for designs targeting 200+ MHz fMAX with tight timing margins, or where power optimization through slower timing paths is desired. For lower-cost designs that fit within 100K LE capacity, migrate down to EP3CLS100F484C8N (same package, same security). For designs that need only 120K LE and do not require encryption, EP3C120F484C7N offers approximately 20% cost savings. All alternatives share the identical 484-FBGA footprint, enabling PCB layout reuse across the family.

Comparison with Alternatives

Parameter This Product EP3CLS150F484C8 EP3CLS150F484C7N EP3CLS150F484C7 EP3CLS100F484C8N EP3C120F484C7N
Brand Intel Intel Intel Intel Intel Intel
Package 484-FBGA (F484) 484-FBGA (F484) - same 484-FBGA (F484) - same 484-FBGA (F484) - same 484-FBGA (F484) - same 484-FBGA (F484) - same
Logic Elements 150,848 150,848 150,848 150,848 100,848 119,088
Embedded RAM (bits) 6,137,856 6,137,856 6,137,856 6,137,856 4,026,624 3,981,312
DSP Multipliers (18x18) 210 210 210 210 132 172
PLLs 4 4 4 4 4 4
Speed Grade 8 8 7 7 8 7
AES Bitstream Encryption Yes (LS family) Yes Yes Yes Yes No

Key Differentiators

  • Hardware AES bitstream encryption protects proprietary IP (vs EP3C120F484C7N)
  • Highest logic density in Cyclone III LS family with 484-FBGA package (vs EP3CLS100F484C8N)
  • Faster speed grade (8) for higher fMAX timing margin (vs EP3CLS150F484C7N)

Design Notes

Cyclone III LS devices require power supply sequencing: VCCINT (1.2 V), VCCA (2.5 V), and VCCIO (1.2-3.3 V) must ramp in a specific order to prevent device damage and high in-rush current. Intel recommends VCCA and VCCIO ramp before or simultaneously with VCCINT. Each supply rail should have its own decoupling network: 100 nF and 10 uF ceramic capacitors placed within 5 mm of each power pin, plus 100 uF bulk capacitors per power plane. Total decoupling capacitance budget is approximately 100 uF per supply rail for the 484-FBGA package.

The 484-FBGA package uses a 1.0 mm ball pitch with a 22x22 ball grid array. PCB design requires microvia (HDI) stack-up with at least 4 layers dedicated to ground and power planes for signal return paths. Via-in-pad or dog-bone fanout is recommended. The exposed die area beneath the BGA needs an unbroken GND copper pour stitched with thermal vias (0.2 mm diameter, 1.0 mm pitch) to provide thermal dissipation. Estimated: with the typical 65nm Cyclone III LS power of 1.5-2.5 W at 100 MHz, theta_JA is approximately 18 C/W on a 4-layer JEDEC test board.

Cyclone III LS FPGAs use SRAM-based configuration memory that must be loaded from an external non-volatile flash (EPCS or compatible) on every power-up. Configuration time is approximately 50 ms for the EP3CLS150F484C8N. Designers must implement the nCONFIG, nSTATUS, and CONF_DONE handshake lines correctly to detect configuration failures. Use the AS (active serial), PS (passive serial), FPP (fast passive parallel), or JTAG configuration mode per the application requirements. The AES-encrypted bitstream feature requires the on-chip decryption engine to be enabled in Quartus Prime settings.

Common mistakes when designing with the EP3CLS150F484C8N include: (1) exceeding the maximum I/O count of 226 by attempting to use JTAG pins as user I/O, (2) ignoring the 1.2 V VCCINT minimum during brown-out conditions which can cause configuration memory corruption, (3) omitting the required nCE (chip enable) and nCEO (chip enable output) chain pull-up resistors on multi-device configuration chains, and (4) using non-I/O-standard compliant LVDS signaling at 3.3 V VCCIO. Always consult the Cyclone III LS Device Handbook pin connection guidelines before PCB layout.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and lead-free compliant per Intel product page. Not AEC-Q100 qualified; for automotive applications use automotive-qualified variants or migrate to Cyclone IV E automotive family. Halogen-free status not explicitly stated in available data.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Related Searches

EP3CLS150F484C8N EP3CLS150F484C8N datasheet Intel Cyclone III LS FPGA 150K Cyclone III LS 484 FBGA low power EP3CLS150F484C8N pinout FPGA for industrial motor control EP3CLS150 vs EP3CLS100 comparison EP3CLS150F484C8N buy online price Cyclone III LS lead time distributor Cyclone III drop-in replacement what is AES encrypted FPGA bitstream low power FPGA 65nm 402MHz Cyclone III LS industrial automation FPGA 226 user I/O 484 BGA Cyclone III LS video processing

Related Components & Terms

Intel Altera EP3CLS150F484C8N EP3CLS150F484C8 EP3CLS150F484C7N EP3CLS100F484C8N EP3C120F484C7N FPGA Field Programmable Gate Array programmable logic device PLD logic IC integrated circuit semiconductor Cyclone III LS Cyclone III FBGA FineLine BGA BGA-484 65nm process AES encryption bitstream encryption LVDS DDR2 PLL DSP multiplier M9K memory block Nios II Quartus II Quartus Prime RoHS AEC-Q100 industrial automation video processing software defined radio motor control
Quick Quote RFQ
Fill in complete details — our sales team will respond within 24 hours
Part Number Manufacturer Package QTY Target Price Extended
Total: $0.00 USD
Quote submitted!

We will respond to your email within 24 hours

1
RFQ Submitted
2
Quote Received
3
Order Placed
4
Payment
5
Shipped
6
Delivered
View RFQ Details