EP3CLS70U484C7 - Cyclone III LS FPGA 70K LE UFBGA-484
MPN: EP3CLS70U484C7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.4 | $78.40 |
| 10 | $71.2 | $712.00 |
| 100 | $64.85 | $6,485.00 |
| 250 | $60.1 | $15,025.00 |
| 500 | $55.75 | $27,875.00 |
EP3CLS70U484C7 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit in the broader programmable logic device (PLD) hierarchy, alongside CPLDs, and are positioned between fixed-function ASICs and software-driven microcontrollers for applications requiring hardware parallelism, deterministic latency, and post-production flexibility. The Cyclone III LS family specifically optimizes for low static and dynamic power, making it the lowest-power member of the Cyclone III generation.
Key features of the EP3CLS70U484C7 include 70,208 logic elements, approximately 3.07 Mbits of embedded RAM, dedicated 18x18 multipliers for DSP, and 4 phase-locked loops (PLLs) for clock management. The 484-ball UFBGA package provides 278 usable user I/Os and a compact 19 mm x 19 mm body, suitable for space-constrained boards. The LS variant adds dedicated security and anti-tamper features, including configuration bitstream encryption and JTAG security, which distinguishes it from the standard Cyclone III family.
Technically, the device supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI), on-chip termination (OCT), and hot-socketing capability, allowing live insertion into backplane systems. The 65 nm process, combined with an efficient clock network and low-leakage transistors, reduces total power consumption by up to 50% compared to earlier 90 nm Cyclone II devices.
Typical applications include industrial motor control, video processing pipelines, low-cost test and measurement equipment, communications protocol bridging, and portable or battery-powered embedded systems. The anti-tamper features make the LS family particularly attractive for defense, secure communications, and industrial control designs requiring bitstream confidentiality.
When designing with this FPGA, ensure adequate power decoupling (typically 100 nF and 10 uF bulk caps per supply rail), follow Intel's recommended PCB layout guidelines for BGA packages, and use the Quartus II design software for synthesis, place-and-route, and configuration bitstream generation. Verify that your chosen configuration mode (AS, PS, JTAG, or FPP) is supported by the U484 device variant.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with a consolidated reference for sourcing and substitution decisions.
Drop-in alternatives for EP3CLS70U484C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70U484C7 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Embedded Memory, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS100U484C7
✅ Drop-In✓ In Stock
$520 / Unit
View Datasheet →EP3CLS100U484C7N
✅ Drop-In✓ In Stock
$412.65 / Unit
View Datasheet →EP3CLS70F484C7
✅ Drop-In✓ In Stock
$148.75 / Unit
View Datasheet →EP3CLS70F484C7N
✅ Drop-In✓ In Stock
$96.3 / Unit
View Datasheet →EP3C80U484C7
✅ Drop-In✓ In Stock
$113.5 / Unit
View Datasheet →EP3C80U484C7N
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Contact for price
View Datasheet →EP3C55U484C7
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →EP3CLS70U484C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements | 70,208 |
| Embedded Memory (bits) | 3,068,928 |
| User I/O Count | 278 |
| Package | 484-ball UFBGA (U484, 19x19 mm) |
| Core Supply Voltage | 1.2 V |
| Process Technology | 65 nm low-power CMOS |
| Maximum Internal Frequency | 437.5 MHz |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Configuration Schemes | AS, PS, JTAG, FPP |
| Operating Temperature | 0C to +85C (commercial, C7 speed grade) |
| Speed Grade | 7 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
EP3CLS70U484C7 484-ball ufbga (u484, 19x19 mm) Pin Configuration Guide
Pin configuration for EP3CLS70U484C7 (484-ball ufbga (u484, 19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS70U484C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS70U484C7 is suitable for 6 applications: Industrial Motor Control, Video Processing Pipelines, Low-Cost Test and Measurement, Communications Protocol Bridging, Portable / Battery-Powered Embedded Systems, Secure Defense and Industrial Control.
Industrial Motor Control
The EP3CLS70U484C7 fits industrial motor control designs due to its 437.5 MHz maximum internal frequency, dedicated 18x18 multipliers for Park/Clark transforms and PID loops, and 278 user I/Os supporting LVDS encoder feedback and SSTL memory interfaces. The Cyclone III LS low-power architecture reduces thermal dissipation in sealed IP65 enclosures, while the 65 nm process keeps junction temperatures within industrial 0C to +85C operating limits. Four on-chip PLLs allow precise generation of PWM carrier frequencies and resolver excitation signals. The dedicated security features (bitstream AES encryption) protect proprietary motor-control firmware from reverse engineering, a critical requirement in competitive servo-drive markets.
Recommended
Video Processing Pipelines
The EP3CLS70U484C7 enables real-time video processing at resolutions up to 1080p60 thanks to its 70,208 logic elements and 3.07 Mbits of embedded RAM, sufficient for line buffers, frame buffers, and intermediate pixel-domain storage. The 278 I/Os support parallel CMOS camera interfaces (typically 16-24 bits at 148.5 MHz for HD-SDI) and BT.656 / BT.1120 streaming inputs. Embedded 18x18 multipliers accelerate 2D FIR filters, scaling kernels, and color-space conversion (RGB to YCbCr). The LS variant's bitstream encryption protects licensed video codec IP (H.264 baseline, MJPEG) embedded in the fabric, valuable for surveillance OEMs.
Recommended
Low-Cost Test and Measurement
The EP3CLS70U484C7 is well-matched to mid-range test and measurement instruments such as data loggers, protocol analyzers, and logic analyzers with up to 200 channels. The 70K logic elements accommodate complex trigger sequencers and protocol decode state machines, while the 278 I/Os provide sufficient channels for mixed-signal probing. PLLs generate precise sample clocks from 1 kHz to over 400 MHz. The low-power 65 nm process enables fanless benchtop instrument designs. Cyclone III LS security protects proprietary calibration constants and measurement IP from extraction, important for ISO 17025 accredited calibration laboratories.
Recommended
Communications Protocol Bridging
The EP3CLS70U484C7 excels at industrial communications bridging between protocols such as EtherCAT, PROFINET, CANopen, Modbus TCP, and serial interfaces, leveraging its 70K logic elements and 3.07 Mbits of embedded memory for frame buffering. The four PLLs allow independent clock domains for each protocol stack. The 278 I/Os support multiple MII/RGMII Ethernet PHYs, SPI flashes, UART transceivers, and CAN-FD controllers in parallel. The Cyclone III LS bitstream encryption protects OEM protocol firmware stacks from cloning, critical for industrial gateway vendors competing against reference designs.
Recommended
Portable / Battery-Powered Embedded Systems
The EP3CLS70U484C7's 65 nm low-power process and Cyclone III LS architecture deliver up to 50% lower static power than the prior 90 nm Cyclone II generation, making it suitable for handheld instruments, portable medical devices, and battery-powered field equipment. The 70K logic elements support complete system-on-chip integration including processor soft-cores (Nios II), custom peripherals, and signal processing pipelines in a single device. The compact 19x19 mm U484 BGA package suits space-constrained handheld form factors. Hot-socketing capability simplifies battery-pack hot-swap designs.
Recommended
Secure Defense and Industrial Control
The EP3CLS70U484C7 targets defense, aerospace, and critical infrastructure applications requiring bitstream confidentiality and tamper resistance. The Cyclone III LS family adds AES-128/256 bitstream encryption, JTAG port disable, and tamper-detection pins, all absent in the standard Cyclone III line. The 70K logic elements support encryption accelerators, secure boot logic, and command-authentication state machines for SCADA and secure communications systems. The 65 nm process and 278 I/Os in the U484 package enable system consolidation while maintaining cryptographic isolation between security domains.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70U484C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS100U484C7 | EP3CLS100U484C7N | EP3CLS70F484C7 | EP3CLS70F484C7N | EP3C80U484C7 | EP3C80U484C7N | EP3C55U484C7 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | UFBGA-484 (U484) | UFBGA-484 (U484) - same | UFBGA-484 (U484) - same | FBGA-484 (F484) - pin-compatible | FBGA-484 (F484) - pin-compatible | UFBGA-484 (U484) - same | UFBGA-484 (U484) - same | UFBGA-484 (U484) - same |
| Logic Elements | 70,208 | 100,448 | 100,448 | 70,208 | 70,208 | 81,264 | 81,264 | 55,856 |
| Embedded Memory (bits) | 3,068,928 | 4,437,888 | 3,068,928 | 2,810,880 | 2,396,160 | |||
| User I/O Count | 278 | 278 | 278 | 278 | 278 | |||
| Family / Security | Cyclone III LS (security) | Cyclone III LS (security) | Cyclone III LS (security) | Cyclone III (standard) | Cyclone III (standard) | |||
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | |||
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
Key Differentiators
- Embedded security features not present in standard Cyclone III (vs EP3C80U484C7)
- Higher logic density at same price tier vs standard Cyclone III (vs EP3C55U484C7)
- Pin-compatible with 100K LE upgrade path (vs EP3CLS100U484C7)
Design Notes
Decouple each power pin (VCCINT, VCCA, VCCD_PLL, VCCIO banks 1-8) with 100 nF ceramic caps placed within 100 mils of the respective ball. Add 10 uF bulk caps at each supply rail entry point. Estimated: at 50% toggle rate and typical utilization, total core current is approximately 500-800 mA at 1.2 V; budget 1.5 A per rail during in-rush. Use a TI TPS7A4701 or equivalent LDO for the analog VCCA rail to minimize PLL jitter.
BGA-484 with 1.0 mm pitch requires 4-6 layer PCB stackup with microvia or via-in-pad construction for inner-row ball escape. Use Intel's recommended Cyclone III board design guidelines for layer stackup, impedance control (50 ohm single-ended, 100 ohm differential), and length matching. Estimated: 4 mil trace/space with 8 mil drill microvias achieves clean breakout from inner balls. Apply solder mask defined (SMD) pads for better joint reliability.
Do not leave MSEL[0..3] pins floating; strap them to VCCIO or GND via 10 kohm resistors to select the configuration mode (AS, PS, JTAG, FPP). The CONFIG_DONE, nSTATUS, and nCONFIG pins require external 10 kohm pull-ups to VCCIO. Cyclone III LS security requires MSEL configuration matching the expected bitstream encryption mode, or the device will fail to configure. Verify all JTAG pins (TCK, TMS, TDI, TDO) are routed with impedance-controlled traces if JTAG programming is used in production.
At maximum utilization (70K LE, 50% toggle, 437 MHz), estimated power dissipation is approximately 1.5-2 W. The UFBGA-484 with standard JEDEC JESD51 test board achieves theta_JA around 15-20 C/W. Ensure adequate airflow or thermal vias under the package center pad for reliable operation in sealed enclosures. For commercial 0C to +85C ambient, junction temperature must stay below 100C per Intel's reliability derating curves.
Compliance Information
RoHS compliant per Intel Cyclone III product family documentation. Lead-free finish per UFBGA package. REACH compliance should be confirmed with Intel for EU-bound shipments. AEC-Q100 not applicable (FPGA not automotive-qualified). Industrial temperature variants (I7 suffix) available separately for harsh-environment designs.
