EP3C55U484C7N - Cyclone III FPGA, 55K LE, 484-UBGA | Intel / Altera
MPN: EP3C55U484C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $232.81 | $232.81 |
| 10 | $215 | $2,150.00 |
| 100 | $188.5 | $18,850.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $140.25 | $140,250.00 |
EP3C55U484C7N Overview
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks, and dedicated multiplier/PLL resources on a single die. FPGAs sit in the broader hierarchy of digital semiconductor devices between Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers, and are widely used as prototyping platforms, hardware accelerators, and glue-logic bridges. The Cyclone III family specifically targets cost-sensitive, power-sensitive, high-volume applications, offering a balance of logic density, embedded RAM, and DSP blocks at lower static and dynamic power than prior generations.
Key features of the EP3C55U484C7N include 55,856 logic elements, 234 embedded 18 × 18 multipliers (DSP blocks), 4 PLLs, and 56 embedded 9-Kbit M9K memory blocks (totalling 2,396,160 bits, or about 2.4 Mbit). The device supports industry-standard I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL through 8 I/O banks, enabling direct interfacing with DDR/DDR2 SDRAM memories. Configuration can be loaded via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG modes, supporting in-field updates and secure bitstream programming.
Typical applications span industrial motor control, video surveillance and image processing, automotive infotainment pre-production prototypes, telecom line cards, test and measurement instrumentation, and consumer electronics requiring parallel processing or custom interfacing. The Cyclone III 65 nm process gives the EP3C55 a typical static power well under 100 mW at 25 °C, making it suitable for fanless or sealed enclosures.
When designing with this FPGA, always respect the I/O-bank VCCIO grouping rules and provide a clean 1.2 V VCCINT rail with adequate decoupling. Quartus II (or its newer Intel Quartus Prime equivalent) is the supported development environment; legacy designs targeting this device should be re-validated against the latest Quartus version for timing closure, since the part is approaching end-of-life for new designs but is still broadly available in the distribution channel.
Drop-in alternatives for EP3C55U484C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55U484C7N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Embedded Memory.
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EP3C55U484C6N
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View Datasheet →EP3C55U484C7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Logic Elements | 55,856 |
| Embedded Memory Bits | 2,396,160 (2.4 Mbit) |
| Maximum User I/Os | 327 |
| I/O Banks | 8 |
| PLLs | 4 |
| M9K Memory Blocks | 260 |
| Process Technology | 65 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Maximum Internal Clock Frequency | 437.5 MHz |
| Package | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm |
| Mounting Type | Surface Mount (BGA) |
| Configuration Modes | AS, PS, FPP, JTAG |
| RoHS Status | Compliant |
EP3C55U484C7N 484-pin ubga (ultra fineline bga), 19 mm × 19 mm Pin Configuration Guide
Pin configuration for EP3C55U484C7N (484-pin ubga (ultra fineline bga), 19 mm × 19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55U484C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55U484C7N is suitable for 6 applications: Industrial Motor Control and Drive, Video Surveillance and Image Processing, Telecom Line Card and Protocol Bridging, Test and Measurement Instrumentation, Automotive Infotainment Prototyping, Medical Imaging and Patient Monitoring.
Industrial Motor Control and Drive
The EP3C55U484C7N fits industrial motor control and AC-drive applications where multiple encoder inputs, PWM outputs, and fieldbus interfaces must be processed in parallel. With 55,856 logic elements, 156 18×18 hardware multipliers, and 4 PLLs, the FPGA can implement a complete vector-control loop for 3-phase PMSM or induction motors at switching frequencies up to 20 kHz. The 327 user I/Os in 8 banks accept 3.3 V LVTTL encoder signals and 5 V-tolerant inputs through resistor dividers, while the 1.2 V core keeps total dynamic power around 1-1.5 W for a fully utilized design. This makes the device suitable for fan-less IP65 drive enclosures where 65 nm low-power technology is essential.
Recommended
Video Surveillance and Image Processing
The EP3C55U484C7N is a strong fit for multi-channel video surveillance and real-time image processing where multiple PAL/NTSC camera inputs must be scaled, filtered, and stitched. Its 2.4 Mbit of embedded M9K RAM holds several lines of 720p video for Sobel, Laplacian, or motion-detection kernels running in the 156 hardware multipliers. The 4 PLLs generate independent pixel clocks for two cameras, and the 8 I/O banks support LVDS or sub-LVDS serializer/deserializer interfaces for direct MIPI bridge chips. Industrial-grade temperature variants exist (I-grade), but the commercial-temperature EP3C55U484C7N is sufficient for indoor NVR and DVR designs.
Recommended
Telecom Line Card and Protocol Bridging
The EP3C55U484C7N serves telecom line cards that need to bridge between legacy T1/E1, HDB3, and modern Ethernet or PCIe fabrics. With 55K logic elements and 4 PLLs, the FPGA can run several soft-core CPUs (Nios II) concurrently, handle DMA into DDR2, and provide glue-logic between PHYs. The 484-UBGA exposes 327 I/Os - enough for 8 T1/E1 links (8 bits each plus framing), an SPI bus, and JTAG, all on a single device. The 1.2 V core plus 8 I/O banks operating at independent 1.5/1.8/2.5/3.3 V enable direct connection to legacy 5 V-tolerant logic via external level shifters.
Recommended
Test and Measurement Instrumentation
The EP3C55U484C7N is widely adopted in mid-range bench instruments such as logic analyzers, protocol analyzers, and arbitrary waveform generators. Its 327 user I/Os allow parallel sampling of up to 64 channels at 200 MHz, while 156 18×18 multipliers enable on-chip FFT, FIR filtering, or DDC/DUC in a single device. The 2.4 Mbit embedded RAM stores deep sample buffers without external memory, and Quartus II's built-in SignalTap logic analyzer simplifies prototype debug. Commercial-grade 0-85 °C operation is sufficient for laboratory environments, and the part is well supported by reference designs and IP cores from Altera/Intel.
Recommended
Automotive Infotainment Prototyping
The EP3C55U484C7N is used in pre-production automotive infotainment systems where CAN, LIN, MOST, and LVDS video must be multiplexed onto a single head-unit. With 55,856 logic elements, the FPGA can host 2-3 Nios II soft processors plus dedicated DMA engines for video, and the 484-UBGA exposes enough I/Os for two LVDS display links and a 16-bit parallel RGB output. While the commercial-temperature grade is acceptable for cabin prototypes, production designs should migrate to AEC-Q100-qualified Cyclone IV or Cyclone 10 LP parts. Per the Cyclone III datasheet, the device is NRD but well-supported by long-lifecycle distributors.
Recommended
Medical Imaging and Patient Monitoring
The EP3C55U484C7N is suitable for medical imaging pre-processing, ultrasound beamforming front-ends, and multi-parameter patient monitors that require deterministic real-time DSP. Its 156 18×18 multipliers support ultrasound delay-and-sum beamforming, while the 4 PLLs generate the precise phase-shifted clocks required by 16-32 channel transducer arrays. The 327 user I/Os connect to multi-channel ADCs, and the 2.4 Mbit embedded RAM holds line buffers for B-mode image reconstruction. The commercial temperature grade is acceptable for indoor clinical equipment, and the long-life availability in distribution channels supports medical product certification cycles.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55U484C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55U484C6N | EP3C55U484C7 | EP3C55U484C6 | EP3C55F484C7N | EP3C55F484C6N |
|---|---|---|---|---|---|---|
| Package | 484-UBGA (U-package, 19x19 mm) | 484-UBGA - same | 484-UBGA - same | 484-UBGA - same | 484-FBGA - different footprint | 484-FBGA - different footprint |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Speed Grade | C7 (faster) | C6 (slower, ~10%) | C7 (same) | C6 (slower) | C7 (same, F-package) | C6 (slower, F-package) |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits |
| User I/Os | 327 | 327 | 327 | 327 | 327 (F-package pinout) | 327 (F-package pinout) |
| Process / Core Voltage | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Pin-to-pin speed-grade flexibility within the same 484-UBGA footprint (vs EP3C55U484C6N)
- Higher I/O count than 484-FBGA sibling (vs EP3C55F484C7N)
- Long-term distributor availability for NRD parts (vs EP4CE55F23I7N (Cyclone IV E))
Design Notes
The EP3C55U484C7N requires a clean 1.2 V VCCINT rail capable of delivering 1-2 A peak during configuration, plus 1.5/1.8/2.5/3.3 V VCCIO rails for each of the 8 I/O banks. Use a low-dropout regulator (e.g., TI TPS74401) for the core supply with 22 uF + 0.1 uF decoupling per bank. Estimated: at 50% toggle rate and 100 MHz core, total power is about 1.2-1.5 W. Bulk decoupling must be placed within 5 mm of the BGA balls, with a 0.1 uF cap directly under each power pin pair.
Per the Cyclone III Device Handbook, the 484-UBGA package has a theta-JA of approximately 17 C/W on a 4-layer JEDEC test board. Estimated: at 1.5 W dissipation the junction rises 25 C above ambient. For sealed enclosures, provide a 25x25 mm copper pour on top and inner layers, and consider a small 10 mm BGA heatsink if junction-to-ambient must stay below 70 C in a 55 C ambient environment.
The 484-UBGA uses 1.0 mm ball pitch - PCB fabrication must support 0.4 mm laser-drilled microvias with 0.2 mm pad capture. Escape routing requires 4-5 routing layers with the top layer dedicated to the BGA fan-out. Use a high-Tg FR-4 (Tg > 170 C) and ENIG surface finish. Ground via stitching every 2-3 mm around the BGA improves signal integrity and thermal dissipation.
Do not confuse the U-package (UBGA, 19x19 mm) with the F-package (FBGA) - their ball maps are different. When migrating designs between Cyclone III and Cyclone IV E, verify each I/O standard support and any clock-pin placement changes; Cyclone IV E removed some of the LVDS channels. Always generate a fresh .sof for each speed grade - the bitstream embeds the IDCODE and timing model, so a C6 bitstream will not run on a C7 device.
Compliance Information
RoHS compliant per the 'N' suffix in the MPN. Not AEC-Q100 qualified - the C-grade commercial temperature variant is 0 to +85 C only; for automotive, use EP3C55U484I7N (industrial) or migrate to AEC-Q100 Cyclone IV/10 parts. Halogen-free status not specifically stated in available data - [DATA_NEEDED: confirm halogen-free status from manufacturer datasheet].
