EP3SE50F484I3G - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
MPN: EP3SE50F484I3G β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1408.97 | $1,408.97 |
| 10 | $1370 | $13,700.00 |
| 100 | $1300 | $130,000.00 |
| 500 | $1240 | $620,000.00 |
| 1,000 | $1180 | $1,180,000.00 |
EP3SE50F484I3G Overview
A Field Programmable Gate Array (FPGA) is a class of programmable logic device whose interconnect, logic fabric, and I/O behaviour are configured by a customer-supplied configuration bitstream after manufacture. FPGAs sit within the broader taxonomy of programmable logic -> logic devices -> integrated circuits -> semiconductors, and the Stratix III E family is Intel's (formerly Altera's) high-performance 65 nm node targeting DSP, memory-rich, and high-speed transceiver applications.
Key features include 47,500 logic elements / 19,000 ALMs, 5.49 Mbits of embedded block RAM (e.g., M9K blocks), support for up to 296 user I/Os, and a 1.1 V core supply. The Stratix III E device integrates dedicated DSP blocks, embedded memory, and high-speed serial transceiver support (via separate GX variants), making it well suited to signal-processing pipelines. The FCBGA-484 package offers a fine-pitch, low-inductance interconnect for high-speed parallel interfaces.
Architecturally, the device is built on a 65 nm low-power CMOS process and uses logic-array-block (LAB) tiling with adaptive logic modules that combine fracturable LUTs, dedicated carry chains, and register files. Configuration is stored in SRAM cells, allowing unlimited re-programmability in the field. The Stratix III E family also adds enhanced SEU mitigation features (CRC, parity, scrubbing IP), which is critical for telecom and aerospace applications.
Typical applications include high-throughput DSP (radar, software-defined radio, video broadcast processing), ASIC prototyping and emulation, high-speed networking line cards, test and measurement back-end processing, and military/aerospace signal processing. The Stratix III E family is also frequently used in medical imaging front-ends and high-end industrial imaging systems where low-latency parallel processing is required.
When designing with this device, verify power-rail sequencing, decoupling, and thermal dissipation early. The 484-ball FCBGA package has specific via-in-pad and thermal via requirements, and the Quartus II / Quartus Prime toolchain must be used for synthesis, place-and-route, and timing closure. PCB stack-up should be tuned for the LVDS and DDR memory interface rates used.
This page synthesizes distributor pricing across DigiKey, Mouser, and authorized brokers, drop-in same-package alternatives drawn from the Stratix III E family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP3SE50F484I3G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F484I3G (same form factor and footprint) β differing in Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SE50F484C3N
β Drop-Inβ In Stock
$832.1 / Unit
View Datasheet βEP3SE50F484I3
β Drop-Inβ In Stock
$188 / Unit
View Datasheet βEP3SE50F484C3
β Drop-Inβ In Stock
$820 / Unit
View Datasheet βEP3SE50F484C4N
β Drop-Inβ In Stock
$468.11 / Unit
View Datasheet βEP3SE50F484C3G
β Drop-Inβ In Stock
$205 / Unit
View Datasheet βEP3SE50F484I3G Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Series | Stratix III |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 ALM |
| Embedded Memory | 5.49 Mbit |
| Number of User I/Os | 296 I/O |
| Operating Supply Voltage (Core) | 1.1 V |
| Package | 484-BBGA, FCBGA |
| Mounting Type | SMD/SMT |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Node | 65 nm |
| Configuration Memory | SRAM-based, in-field re-programmable |
| RoHS Status | RoHS Compliant |
| Lead-Free | Yes |
| Supplier Device Package | 484-FCBGA |
EP3SE50F484I3G 484-fcbga Pin Configuration Guide
Pin configuration for EP3SE50F484I3G (484-fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F484I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F484I3G is suitable for 6 applications: High-Throughput DSP (Radar / Software-Defined Radio), ASIC Prototyping and Emulation, High-Speed Networking Line Cards, Test and Measurement Back-End Processing, Medical Imaging Front-Ends (Ultrasound / CT), Military / Aerospace Signal Processing.
High-Throughput DSP (Radar / Software-Defined Radio)
The EP3SE50F484I3G's 19,000 ALMs and dedicated DSP blocks deliver the multiply-accumulate density needed for high-throughput DSP pipelines such as radar beamforming and software-defined radio baseband processing. The 5.49 Mbits of block memory provides low-latency data buffering between FFT and modulation stages, while the 296 user I/Os enable wide parallel data paths to high-speed ADCs/DACs. Placed on a 1.1 V core rail with independent PLL synthesis, this device can sustain real-time signal processing at hundreds of MSPS. Compared with a DSP-processor approach, the FPGA solution offers 10-50x higher sample rate per channel at lower deterministic latency, which is critical for phased-array radar and cognitive-radio applications.
Recommended
ASIC Prototyping and Emulation
The EP3SE50F484I3G is well suited to ASIC prototyping because it provides mid-volume logic capacity (47,500 LEs) plus rich embedded memory for mapping SoC subsystems. Designers partition the target ASIC into FPGA slices, leveraging the 296 user I/Os and the 484-FCBGA package to bring out debug, scan, and trace signals for ASIC bring-up. The Stratix III E family's Quartus II tool flow supports rapid synthesis iterations, while soft-processor cores (Nios II) can run testbench code for full chip-level emulation. Compared with ASIC tape-out, this approach cuts prototyping cost by 50-100x and shortens bring-up by weeks. Use the EP3SE110 or EP3SE260 variants when the target ASIC exceeds 60K-100K gates.
Recommended
High-Speed Networking Line Cards
The EP3SE50F484I3G is used in telecom line cards for packet classification, traffic management, and custom protocol offload. Its 296 user I/Os interface to multiple SGMII/XAUI PHYs and DDR2/3 memory, while the 5.49 Mbits of block RAM hosts queue descriptors and lookup tables. The 1.1 V core combined with Stratix III E low-power design techniques keeps card-level power budget manageable across multi-port designs. For 10G/40G aggregation, designers typically pair this device with a higher-density Stratix IV/V variant; for access-side line cards the EP3SE50 provides the right cost/perf balance. The industrial temperature range also suits outdoor hardened enclosures.
Recommended
Test and Measurement Back-End Processing
Instruments such as logic analyzers, protocol testers, and oscilloscope back-ends rely on FPGAs like the EP3SE50F484I3G to perform trigger sequencing, state decoding, and pre-display DSP on captured samples. The 19,000 ALMs and embedded block memory allow deep trace buffers while sustaining multi-GSPS sample acquisition rates through the 296 I/Os. Industrial temperature grading makes the device viable for ruggedized portable instruments. Compared with custom ASIC alternatives, the EP3SE50 cuts product development time and supports post-launch feature updates via reconfiguration in the field.
Recommended
Medical Imaging Front-Ends (Ultrasound / CT)
The EP3SE50F484I3G serves as the beamforming and image-reconstruction engine in ultrasound and CT imaging front-ends. Its 19,000 ALMs and DSP blocks execute per-channel beamforming FIRs at low latency, while the 5.49 Mbits of block RAM holds channel data and coefficient sets. The 296 I/Os connect to multi-channel ADC front-ends and to the image-display pipeline, and the industrial temperature range supports reliable operation in hospital and clinical environments. Compared with DSP-processor alternatives, the FPGA path reduces frame reconstruction time by 5-20x, which is critical for real-time 3D/4D imaging modes.
Recommended
Military / Aerospace Signal Processing
The EP3SE50F484I3G is used in defense signal-processing subsystems where moderate logic density, low power, and extended temperature tolerance are critical. Its 47,500 LEs and embedded memory support channelization, encryption, and protocol handling on platform electronics, while the SRAM-based configuration memory enables in-field firmware updates for mission-specific waveforms. The Stratix III E family incorporates SEU mitigation features (CRC, parity, optional scrubbing IP) suitable for radiation-tolerant designs when combined with appropriate firmware-level mitigation. Industrial temperature range (-40C to +100C) supports ground-vehicle and avionics platforms; for full space-grade applications an additional rad-hard companion part is typically paired with the EP3SE50.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F484I3G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F484C3N | EP3SE50F484I3 | EP3SE50F484C3 | EP3SE50F484C4N | EP3SE50F484C3G |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FCBGA | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same |
| Logic Elements | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE |
| ALMs | 19,000 ALM | 19,000 ALM | 19,000 ALM | 19,000 ALM | 19,000 ALM | 19,000 ALM |
| Embedded Memory | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | I3 (industrial, tier 3) | C3 (commercial, tier 3) | I3 (industrial, tier 3) | C3 (commercial, tier 3) | C4 (commercial, tier 4, slower) | C3 (commercial, tier 3) |
| User I/Os | 296 I/O | 296 I/O | 296 I/O | 296 I/O | 296 I/O | 296 I/O |
| RoHS / Lead-Free Status | RoHS Compliant ('G' suffix) | RoHS Compliant | SnPb lead finish (non-G) | RoHS Compliant | RoHS Compliant | RoHS Compliant |
Key Differentiators
- Industrial temperature grade with I3 speed-grade timing (vs EP3SE50F484C3N)
- Pb-Free / RoHS-compliant G lead-finish (vs EP3SE50F484I3)
- Drop-in compatible with C3/C4 commercial siblings (vs EP3SE50F484C4N)
Design Notes
The 484-FCBGA package uses a fine-pitch ball grid that requires via-in-pad microvia construction for reliable assembly. Use a high-density-interconnect (HDI) PCB stack-up with 1-2-1 or 1-2-1-2 microvia layers, and place a thermal-via array (typically 0.3 mm drill, 1.0 mm pitch) directly under the package center to extract heat. Per JEDEC J-STD-020, this FCBGA is moisture-sensitive (MSL typically 3 or 4) - bake components before reflow if the floor-life has been exceeded. Estimated: the 484-FCBGA pad pitch is 1.0 mm with 0.6 mm ball diameter; verify against the manufacturer package drawing before finalizing stack-up.
The EP3SE50F484I3G requires multiple supply rails (1.1 V core, 2.5 V/3.3 V I/O, PLL analog supply) with strict power-on sequencing to prevent latch-up. Per Altera's Stratix III Power Management Design Guidelines, the 1.1 V core must ramp before the I/O supplies, and a POR (power-on reset) supervisor is recommended to ensure clean startup. Decoupling must include bulk 220-470 uF polymer capacitors plus 0.1 uF / 1 uF / 10 uF ceramic capacitors placed adjacent to each power pin. Estimated quiescent current at idle: 0.5-1.5 A on the 1.1 V core, but can spike to 3-5 A during dynamic configuration; size the regulator with 30% headroom.
Stratix III E devices dissipate 5-15 W typical under full DSP utilization; the 484-FCBGA's thermal resistance theta_JB is approximately 4-8 C/W (per Intel package thermal model). At 10 W dissipation, junction-to-PCB delta is roughly 50C - the PCB thermal via array plus bottom-side copper spreader is essential. Industrial-temperature parts must keep junction below 100C; use a 6-8 layer PCB with solid ground/power planes and ensure chassis airflow of at least 1-2 m/s in enclosed housings. Estimated: at 10 W with theta_JA ~12 C/W (typical 8-layer board), junction rises 120C above 25C ambient - confirm with vendor thermal sims.
Common pitfalls when using the EP3SE50F484I3G include: (1) forgetting that Stratix III configuration is SRAM-based - the device loses its design on power-down and requires a configuration EEPROM or flash plus configuration controller; (2) using the wrong Quartus II version - Stratix III E requires Quartus II 9.1 SP2 or later with device support files; (3) ignoring pin-out file revision differences between speed grades that can shift I/O bank assignments; (4) mixing 'G' (Pb-Free) and non-G (SnPb) variants on the same assembly line can cause solder-joint reliability problems. Always validate timing closure in Quartus TimeQuest before tape-out.
LVDS, DDR2/DDR3, and source-synchronous interfaces on the EP3SE50F484I3G require matched-length routing and controlled-impedance traces (50 ohm single-ended, 100 ohm differential). Use the Stratix III EMIF toolkit to verify DDR read/write deskew calibration and run HyperLynx or Mentor Graphics signal-integrity simulations before layout freeze. Keep differential pairs length-matched to within 50 mil and route over a continuous reference plane to avoid impedance discontinuities. Estimated: at 533 Mbps DDR2, signal skew budget per byte lane is approximately 50-100 ps - allocate to package, PCB, and driver skew proportionally.
Compliance Information
RoHS compliance confirmed by 'G' suffix per JEDEC JEP95. Reach, halogen-free, and conflict-mineral declarations were not found in the verified data; see manufacturer for full compliance documentation.
