EP3SL70F484C2N - 67.5K LEs, 296 I/O Stratix III FPGA | Intel
MPN: EP3SL70F484C2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $215 | $215.00 |
| 10 | $198.5 | $1,985.00 |
| 100 | $178 | $17,800.00 |
| 500 | $162.75 | $81,375.00 |
| 1,000 | $149.5 | $149,500.00 |
EP3SL70F484C2N Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (LBs/LEs) interconnected by a programmable routing fabric, surrounded by programmable I/O cells and hardened peripherals such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the broader taxonomy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix III family uses a low-power 65nm process with programmable power-rail gating to reduce static consumption versus prior 90nm Stratix II.
Key features of the EP3SL70F484C2N include 2,700 LABs (Logic Array Blocks), embedded multipliers, and a high-speed I/O architecture supporting common single-ended and differential signaling standards used in telecom, broadcast, and high-performance DSP. The device is part of the Stratix III L (logic-rich) variant, which maximizes logic density and on-chip memory rather than transceiver count, making it suitable for ASIC prototyping and complex state-machine designs.
The 484-pin FC-FBGA package provides a 1.0 mm ball pitch and a flip-chip land-side thermal path, which yields a junction-to-board thermal resistance that enables high-utilization designs without an external heatsink in most commercial-temperature applications. The C2 speed grade and N suffix denote a lead-free, commercial-temperature, non-RoHS-exempt (Pb-free reflow compatible) order code.
Typical applications include ASIC and ASSP prototyping, high-speed DSP pipelines, test and measurement equipment, video processing, motor control, and telecom baseband logic. The device is also widely used in legacy industrial, aerospace, and defense programs where the long-life-cycle Stratix III silicon continues to ship. Designers can use the Quartus II design software (Web Edition or Subscription Edition) for synthesis, place-and-route, and timing closure.
When designing with the EP3SL70F484C2N, plan power sequencing for the 1.1V core and 2.5V/3.3V I/O rails and provide a sufficient via array under the package thermal pad. Pin-compatible same-footprint Stratix III family members enable capacity scaling on the same PCB.
This page synthesizes Stratix III family parametric data, distributor availability across DigiKey/Mouser/Octopart, and FPGA design considerations not consolidated in a single vendor document.
Drop-in alternatives for EP3SL70F484C2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F484C2N (same form factor and footprint) — differing in Speed Grade, Operating Temperature, Package, Family, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL70F484C2G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$240 / Unit
View Datasheet →EP3SL70F484C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$980 / Unit
View Datasheet →EP3SL70F484I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$855 / Unit
View Datasheet →EP3SL70F484C3N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP3SL70F484C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$580 / Unit
View Datasheet →EP3SL50F484C2N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP3SL70F484C2N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L (logic-rich) |
| Logic Elements | 67,500 |
| Logic Array Blocks (LABs) | 2,700 |
| Total Embedded Memory | 2,699,264 bits |
| User I/Os | 296 |
| Core Voltage | 1.1 V |
| Fabric Speed (max) | 600 MHz |
| Process Technology | 65 nm |
| Package | 484-ball FC-FBGA |
| Ball Pitch | 1.0 mm |
| Operating Temperature (C2 grade) | 0C to +85C |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| Lead-Free / Pb-Free Reflow | Yes |
| RoHS Status | Compliant |
EP3SL70F484C2N 484-ball fc-fbga Pin Configuration Guide
Pin configuration for EP3SL70F484C2N (484-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL70F484C2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL70F484C2N is suitable for 7 applications: ASIC and ASSP Prototyping, High-Speed DSP Pipelines, Test and Measurement Equipment, Telecom Baseband and Protocol Processing, Industrial Motor Control, Video Processing and Broadcast, Legacy Aerospace and Defense Sustainment.
ASIC and ASSP Prototyping
The EP3SL70F484C2N is widely used as an ASIC prototyping vehicle because its 67,500 LEs, 2,699,264 embedded memory bits, and Quartus II tool flow map closely to ASIC gate-equivalent capacity. The 484-ball FC-FBGA package exposes 296 user I/Os - more than enough to break out typical ASIC prototype pin counts - while the C2 commercial speed grade supports up to 600 MHz fabric operation, sufficient for emulating most ASIC clock domains at full speed.
Recommended
High-Speed DSP Pipelines
Stratix III L-series devices embed dedicated 18x18 multipliers and DSP blocks alongside the 67,500 LEs, making the EP3SL70F484C2N suitable for high-speed DSP pipelines such as radar signal processing, software-defined radio baseband, and video codec acceleration. The fabric runs up to 600 MHz, and the abundant block RAM (2.7 Mb total) enables multi-stage FIR/FFT implementations without external memory round-trips.
Recommended
Test and Measurement Equipment
The EP3SL70F484C2N serves as the timing controller and DSP core in test-and-measurement instruments such as oscilloscopes, logic analyzers, and protocol testers. Its 296 user I/Os can drive multiple high-speed ADC/DAC interfaces (LVDS, DDR), and the 1.1V core with programmable power gating reduces thermal load in fanless chassis designs. The C2 commercial grade is sufficient for lab bench equipment operating at room temperature.
Recommended
Telecom Baseband and Protocol Processing
Telecom equipment uses the EP3SL70F484C2N for baseband processing, MAC-layer protocol handling, and framer/mapper functions where the 67.5K LEs map cleanly to multi-channel 10G/40G datapaths. The 484-ball FC-FBGA package supports the SERDES reference clocks and multiple LVDS lanes typical of telecom line cards. Designers typically pair the FPGA with external PHY and optics modules on the same board.
Recommended
Industrial Motor Control
In industrial servo drives and motor controllers, the EP3SL70F484C2N implements field-oriented control (FOC), encoder interfaces (EnDat, BISS, SSI), and safety logic in a single device. Its 296 user I/Os handle multi-axis encoder feedback, while the 65nm process provides predictable latency for deterministic control loops. The industrial variant EP3SL70F484I4N is preferred for factory-floor temperature ranges.
Recommended
Video Processing and Broadcast
Broadcast video routers, format converters, and multi-viewer systems rely on the EP3SL70F484C2N's combination of high fabric speed (600 MHz), abundant block RAM for line buffers, and 296 user I/Os for SDI/HDMI/DVI signal routing. The Stratix III fabric supports the multi-standard I/O required for SDI (SMPTE 259M/292M/424M) at the LVDS levels typical of serializer/deserializer (SerDes) companion chips.
Recommended
Legacy Aerospace and Defense Sustainment
Long-life-cycle aerospace and defense programs continue to specify the EP3SL70F484C2N because the Stratix III silicon is well-characterized, has mature Quartus II support, and remains on authorized distributor allocation lists. Military and aerospace board designs use the C2 commercial temperature grade for ground systems and the I4 industrial grade for airborne platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F484C2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F484C2G | EP3SL70F484C2 | EP3SL70F484I4N | EP3SL70F484C3N | EP3SL50F484C2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 33,000 (-51%) |
| Embedded Memory | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | ~1,349,632 bits (approx -50%) |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 (same package) |
| Speed Grade | C2 (commercial) | C2 | C2 | I4 (industrial) | C3 (slower) | C2 (same) |
| Temperature Grade | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Process / Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lead-Free / RoHS | Yes (N suffix) | Yes (G suffix) | Legacy finish | Yes | Yes | Yes |
Key Differentiators
- Highest logic density in the 484-ball FC-FBGA Stratix III family (vs EP3SL50F484C2N)
- Commercial C2 speed grade - faster than industrial I4 (vs EP3SL70F484I4N)
- RoHS-compliant lead-free finish (N suffix) (vs EP3SL70F484C2)
- Logic-rich L-series with 2.7 Mb embedded memory (vs EP3SE80F780C2N)
Design Notes
The Stratix III core runs at 1.1V and the I/O rails at 2.5V/3.3V with auxiliary voltages for PLL and transceiver supplies. Power sequencing must ramp VCCINT (1.1V) before VCCIO to avoid I/O driving into unpowered silicon. The 65nm process with programmable power gating can reduce static consumption by 40-60% versus Stratix II; use the Quartus II PowerPlay analyzer to estimate per-rail current before PCB layout. Decoupling: place 0.1uF X7R MLCCs within 5 mm of every VCCINT pin and 10uF bulk capacitors on each supply plane.
The 484-ball FC-FBGA package uses a flip-chip land-side thermal path. The PCB land pattern must include a thermal via array (0.3 mm drill, 0.5 mm pitch, 1 oz copper fill) directly under the die shadow to maintain theta_JB within the datasheet spec. Without thermal vias, junction temperature can exceed the 85C C-grade limit at high utilization. Estimated: a typical 67K-LE design at 60% utilization and 500 MHz draws ~3-5W; with proper thermal vias the 484-FBGA easily handles this without an external heatsink.
PCB layout for the 484-ball FC-FBGA at 1.0 mm ball pitch requires 4 mil (0.1 mm) trace-and-space rules with laser-drilled microvias. Use 8-layer stack-up with two solid ground planes adjacent to the BGA fan-out area for return-path integrity on high-speed LVDS pairs. Match lengths within +/- 50 mil for DDR/Source-Synchronous interfaces; the Quartus II pin planner will report required tsu/th margins once place-and-route is complete.
Do not assume all 484-ball FBGA Stratix III parts are interchangeable: EP3SL (logic-rich), EP3SE (DSP-rich), and EP3SGX (with transceivers) share the same package but have different ball maps for power, GND, and special-function pins - swapping an L for an E without re-routing will fail. Always verify the ball map from the device handbook before PCB respin. Also note: the C2 speed grade is commercial-only; for industrial temperature, choose I4 or I5.
Compliance Information
RoHS compliant per the 'N' suffix on the order code (Pb-free ball finish). Lead-free reflow compatible per JEDEC J-STD-020 MSL-3. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-grade IC.
